CN200976343Y - Device for clearing remnant glue on semiconductor element - Google Patents
Device for clearing remnant glue on semiconductor element Download PDFInfo
- Publication number
- CN200976343Y CN200976343Y CN 200620036412 CN200620036412U CN200976343Y CN 200976343 Y CN200976343 Y CN 200976343Y CN 200620036412 CN200620036412 CN 200620036412 CN 200620036412 U CN200620036412 U CN 200620036412U CN 200976343 Y CN200976343 Y CN 200976343Y
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- cull
- synchronous transmission
- transmission band
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- parts
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Abstract
The utility model discloses a device for removing the adhesive residues on semi-conductor components, mainly relating to the semi-conductor manufacturing industry. The utility model is designed to provide a device for the removal of the adhesive residues on the semi-conductor components, thus the utility model is characterized in saving water resources, simple operation, and environmental protection. The technical proposal adopted by the utility model is that: the removal devices for the adhesive residues on the semi-conductor components comprise sequentially arranged adhesive residue cutting unit and brushing unit; wherein, the cutting unit comprises an adhesive residue cutting tool (4) and other corresponding devices; the brushing unit comprises a brush (5) for brushing the adhesive residues, a waste collection device and other corresponding devices; guide-ways (8) are arranged between the first synchronous transmission belt (1) and the second synchronous transmission belt (2) of the brushing unit. The utility model is used mainly for the removal of the adhesive residues on semi-conductor components.
Description
Technical field
The utility model relates to semiconductor manufacturing industry, particularly a kind of device of removing cull on the semiconductor components and devices.
Background technology
At present, in traditional plastic package die cull is handled, need to carry out artificial treatment, need use special mould, then, carry out acidleach and handle with forcing press, cull is softening, carry out water under high pressure at last towards handling.In this processing mode, wasted a large amount of electric energy, increased people's work safety hidden danger again, also increased processing cost.Simultaneously, the components and parts after acidleach along with the processing that water under high pressure dashes, have not only been wasted water resources but also environment has been caused irreversible pollution.In water resources day by day deficient today, this will limit semiconductor enterprise and stop in many places.
The utility model content
Problem to be solved in the utility model provides the device of cull on the removing semiconductor components and devices of a kind of conserve water resource, simple to operate, environmental protection.
The utility model is provided with cutting remaining glue unit, brushing remaining glue unit for the technical scheme that solves above-mentioned technical problem and provide for comprising order; Wherein the cutting remaining glue unit comprises the first synchronous transmission band, at least two alignment sensors that are arranged at first synchronous transmission band top that do not overlap, the components and parts positioner that is arranged at first synchronous transmission band top, the cutter that is arranged at first synchronous transmission band top and control corresponding unit and at least two first repoussage wheels that are arranged at first synchronous transmission band top, and cutter is arranged at excision components and parts cull place; The brushing remaining glue unit comprises the second synchronous transmission band, is arranged at the hairbrush of second synchronous transmission band top, is arranged at the components and parts positioner of second synchronous transmission band top, at least two cull waste material collection devices that second repoussage that is arranged at second synchronous transmission band top is taken turns and is arranged at second synchronous transmission band below, hairbrush is arranged on and brushes components and parts cull place, brushing the residing position of cull on the components and parts cull place corresponding element device, generally is the position of cull of the pin of corresponding element device; Be provided with guide rail between the second synchronous transmission band of first synchronous transmission band of cutting remaining glue part and brushing remaining glue part.Semiconductor components and devices is delivered on the first synchronous transmission band, the residing position of cull on the excision components and parts cull place corresponding element device, it generally is the position of cull of the pin of corresponding element device, the transducer anchor point carries out the sensing location then, determine that components and parts are in the position of cull on the excision components and parts, control cutter accurately by control unit again the cull on the semiconductor is excised, first, second repoussage wheel is used for controlling the position of semiconductor components and devices, and semiconductor components and devices can not upwarped.To semiconductor components and devices finish the cutting after, semiconductor components and devices will be transferred to the second synchronous transmission band by guide rail, the cull that will still remain on the components and parts with hairbrush brushes then, and the cull garbage collection that will brush generation when brushing cull is in the cull waste material collection device.
Described cull waste material collection device comprises a funnelform cull garbage collection passage and corresponding cull garbage collection container.Funnelform cull garbage collection passage is convenient to waste material and is fallen in the corresponding cull garbage collection container, and in the income container that waste material is unified, can be more convenient waste material be handled will well prevent the waste material contaminated environment.
Described components and parts positioner is a positioning track.
Described hairbrush is a rotating brushes, is more prone to the cull on the components and parts is removed.
In sum, owing to adopted the device of cull on the removing semiconductor components and devices of the present utility model, abandoned traditional processing mode fully.Both without the punching press artificial treatment, again without acidleach, water under high pressure dashes to be handled.Manpower, water resources have been saved greatly.Automatic processing is cleaned in excision with water, allow the whole operation process becomes be more prone to and simple.Poisonous and hazardous cull focuses on, and also allows the very environmental protection that becomes of whole process.
Below in conjunction with specification drawings and specific embodiments the present invention is further described.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is the vertical view of Fig. 1;
Fig. 3 is the first cutter front view;
Fig. 4 is Fig. 4 left view;
Fig. 5 is the second cutter front view;
Fig. 6 is the left view of Fig. 6;
Fig. 7 is the semiconductor structure schematic diagram.
Fig. 8 is the control unit flow chart;
Embodiment
Introduce preferred embodiment of the present utility model below in conjunction with Figure of description.
With reference to Fig. 1, Fig. 2, the preferred embodiment that the utility model is removed the device of cull on the semiconductor components and devices is: described equipment comprises cutting remaining glue unit, the brushing remaining glue unit that order is provided with; Wherein the cutting remaining glue unit comprises the first synchronous transmission band 1, two alignment sensors 6 that are arranged at the first synchronous transmission band, 1 top that do not overlap, alignment sensor is a Fibre Optical Sensor, be arranged at the components and parts positioner of the first synchronous transmission band, 1 top, line between two anchor points synchronous transport tape 1 of failing in exam is parallel, be arranged at the top tool 4 and the control corresponding unit of the first synchronous transmission band 1, two first repoussage wheels 7 that are arranged at the top that is positioned at the first synchronous transmission band 1, cutter is in the position of excision components and parts cull; The brushing remaining glue unit comprises the second synchronous transmission band 2, two are crisscross arranged in the hairbrush 5 of the second synchronous transmission band, 2 tops, hairbrush 5 is a rotating brushes, hairbrush is for containing the special-purpose hairbrush of the husky wear-resisting polishing of Buddha's warrior attendant, two hairbrush are crisscross arranged in the second synchronous transmission band, 2 tops, hairbrush is arranged on and brushes components and parts cull place, be arranged at the components and parts positioner of the second synchronous transmission band, 2 tops, the components and parts positioner is a track 12, be arranged at second repoussage wheel 11 of the second synchronous transmission band, 2 tops and the cull waste material collection device that is arranged at the second synchronous transmission band, 2 belows, the cull waste material collection device comprises a funnelform cull garbage collection passage 9 and corresponding cull garbage collection container 10.Cutter 4 is by synchronous power take-off control.The special equipment surface adopts electrostatic spraying to handle.Be provided with guide rail 8 between first synchronous transmission band 1 of cutting remaining glue unit and the second synchronous transmission band 2 of brushing remaining glue unit.Track 12 is used for the position of controlling parts components and parts can be offset, and cuts components and parts to prevent cutter 4 mistakes.
With reference to Fig. 3, Fig. 4, Fig. 5, Fig. 6, cutter can be according to the situation setting of concrete components and parts, for the unidirectional components and parts that cull is arranged, Yi Bian just Tool Design can be become be provided with first cutter of the knife edge 41, for the different components and parts of distance, only need to change the distance of 41 on the adjacent knife edge.To two to or two to the above components and parts that cull is arranged, cutter can be arranged to the secondth cutter, second cutter below is provided with the above knife edge 41 of two rows, for the different components and parts of distance, only needs to change the distance of 41 on the adjacent knife edge.
With reference to Fig. 7, track 12 is used for the position of controlling parts needing first seamed edge, 13, the second seamed edges 14 on the components and parts are clipped in the track 12, and components and parts can be offset, and cuts components and parts to prevent cutter 4 mistakes.
The course of work of removing the device of cull on the semiconductor components and devices is: components and parts are delivered on the first synchronous transmission band 1, after alignment sensor determines that components and parts arrive preposition then, the motor of the order control first synchronous transmission band 1 stops, the control cutter cuts the cull of components and parts downwards, after cutting is finished, cutter is mentioned, the motor of the order control first synchronous transmission band 1 starts, 1 motion of the first synchronous transmission band, components and parts are sent on the second synchronous transmission band 2 by guide rail 8, in the process of the second synchronous transmission band, 2 motions, 5 pairs of components and parts culls of rotating brushes brush, waste material under will brushing when brushing cull is received corresponding cull garbage collection container 10 by funnelform cull garbage collection passage 9, and then will finish the cutting cull and brush cull and dispose.The preferable time range that components and parts transmit on the second synchronous transmission band 2 is 8 to 15 seconds, and hairbrush is 16 to 28 newton to the preferred range of components and parts pressure.The semiconductor components and devices that to finish above-mentioned two steps by guide rail is sent to the 3rd synchronous transmission band 3 of collecting components and parts automatically then, takes off semiconductor components and devices then.
With reference to Fig. 8, the course of work of the control unit of cutter is: transducer receives the signal that components and parts are in the tram, signal is passed to the FPGA (Field Programmable Gate Array) control section, the FPGA (Field Programmable Gate Array) control section is controlled electromagnetically operated valve then, and electromagnetically operated valve is given cylinder charge, and cylinder control cutter cuts the cull on the components and parts downwards, after cutting is finished, FPGA (Field Programmable Gate Array) control section control electromagnetically operated valve, electromagnetically operated valve is given reciprocal gas effect of cylinder, and cylinder will be mentioned cutter.
For dissimilar semiconductor components and devices, only need to adjust the position of cutter and the position and the number of number and hairbrush, this technical staff to the semiconductor manufacturing is conspicuous, so here just be not repeated.The utility model mainly is protection by cutting, cleans the device of cull on the removing semiconductor components and devices of the cull of handling on the semiconductor components and devices with water, any based on execution mode of the present utility model all within protection range of the present utility model.
In a word, the above is preferred embodiment of the present utility model only, is not to be used to limit protection range of the present utility model.
Claims (4)
1. device of removing cull on the semiconductor components and devices is characterized in that: described special equipment comprises cutting remaining glue unit, the brushing remaining glue unit that order is provided with; Wherein the cutting remaining glue unit comprises the first synchronous transmission band (1), at least two alignment sensors (6) that are arranged at the first synchronous transmission band (1) top that do not overlap, the components and parts positioner that is arranged at the first synchronous transmission band (1) top, the cutter (4) that is arranged at the first synchronous transmission band (1) top and control corresponding unit and at least two first repoussage wheels (7) that are arranged at the first synchronous transmission band (1) top, and cutter (4) is arranged at excision components and parts cull place; The brushing remaining glue unit comprises the second synchronous transmission band (2), is arranged at the hairbrush (5) of the second synchronous transmission band (2) top, is arranged at the components and parts positioner of the second synchronous transmission band (2) top, at least two cull waste material collection devices that second repoussage that is arranged at the second synchronous transmission band (2) top is taken turns (11) and is arranged at the second synchronous transmission band (2) below, and hairbrush is arranged on and brushes components and parts cull place; Be provided with guide rail (8) between first synchronous transmission band (1) of cutting remaining glue unit and the second synchronous transmission band (2) of brushing remaining glue unit.
2. according to the device of cull on the described removing semiconductor components and devices of claim 1, it is characterized in that: described cull waste material collection device comprises a funnelform cull garbage collection passage (9) and corresponding cull garbage collection container (10).
3. the device of cull on the removing semiconductor components and devices according to claim 1 is characterized in that: described components and parts positioner is positioning track (12).
4. the device of cull on the removing semiconductor components and devices according to claim 1 is characterized in that: described hairbrush (5) is a rotating brushes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620036412 CN200976343Y (en) | 2006-11-27 | 2006-11-27 | Device for clearing remnant glue on semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620036412 CN200976343Y (en) | 2006-11-27 | 2006-11-27 | Device for clearing remnant glue on semiconductor element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN200976343Y true CN200976343Y (en) | 2007-11-14 |
Family
ID=38902624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620036412 Expired - Fee Related CN200976343Y (en) | 2006-11-27 | 2006-11-27 | Device for clearing remnant glue on semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN200976343Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102896722A (en) * | 2012-11-05 | 2013-01-30 | 艾尔发（苏州）自动化科技有限公司 | Automatic cropping equipment |
| CN104157555B (en) * | 2014-08-28 | 2017-02-22 | 南通康比电子有限公司 | Resist remover |
| CN106876282A (en) * | 2016-12-20 | 2017-06-20 | 杰群电子科技（东莞）有限公司 | A kind of heat sink of semiconductor devices except gluing method and except adhesive dispenser |
| WO2019010598A1 (en) * | 2017-07-12 | 2019-01-17 | 沈长明 | Glue removal machine |
-
2006
- 2006-11-27 CN CN 200620036412 patent/CN200976343Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102896722A (en) * | 2012-11-05 | 2013-01-30 | 艾尔发（苏州）自动化科技有限公司 | Automatic cropping equipment |
| CN104157555B (en) * | 2014-08-28 | 2017-02-22 | 南通康比电子有限公司 | Resist remover |
| CN106876282A (en) * | 2016-12-20 | 2017-06-20 | 杰群电子科技（东莞）有限公司 | A kind of heat sink of semiconductor devices except gluing method and except adhesive dispenser |
| CN106876282B (en) * | 2016-12-20 | 2019-08-02 | 杰群电子科技（东莞）有限公司 | A kind of heat sink of semiconductor devices except gluing method and remove adhesive dispenser |
| WO2019010598A1 (en) * | 2017-07-12 | 2019-01-17 | 沈长明 | Glue removal machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: CHENGDU HUAGUAN SEIKO MACHINERY PROCESSING CO.LTD Free format text: FORMER OWNER: CHENGDU HUAGUAN SEIKO ELECTRONIC MACHINERY CO.LTD. Effective date: 20080523 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20080523 Address after: Chengdu, Sichuan province hi tech Industrial Park, 13 West high tech Industrial Zone, West China, 610000 Patentee after: Chengdu Crown Precision Electron Mechanical Co., Ltd. Address before: Sichuan Province, Chengdu City, KELONG Road No. 130 Sichuan University of science and technology innovation center room 416, zip code: 610000 Patentee before: Chengdu Crown Precision Electron Mechanical Co., Ltd. |
|
| DD01 | Delivery of document by public notice |
Addressee: Chengdu Crown Precision Electron Mechanical Co., Ltd. Document name: Notification of Termination of Patent Right |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071114 Termination date: 20151127 |