CN200965968Y - Chip carrier - Google Patents
Chip carrier Download PDFInfo
- Publication number
- CN200965968Y CN200965968Y CN 200620047236 CN200620047236U CN200965968Y CN 200965968 Y CN200965968 Y CN 200965968Y CN 200620047236 CN200620047236 CN 200620047236 CN 200620047236 U CN200620047236 U CN 200620047236U CN 200965968 Y CN200965968 Y CN 200965968Y
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- CN
- China
- Prior art keywords
- chip
- base plate
- framework
- chip carrier
- projection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a chip bearing device for bearing a chip, which comprises a base plate that can selectively fix a frame; wherein, an insulating socket is arranged between the base plate and the frame, and the middle part of the socket is provided with a receiving hole, which is used for holding and arranging the pin of the chip and further positioning the chip. Furthermore, the base plate is provided with an absorption hole that is respectively communicated with the receiving hole and a vacuum system and the absorption effect of the vacuum system is acted on the pin of the insulating socket. The utility model at first arranges a chip in the insulating socket and then arranges the insulating socket between the base plate and the frame; while pressing down the edge of the insulating socket with the frame, the utility model acts on the insulating socket with the absorption effect of the vacuum system and then fixes the chip on the chip loading device. When dissembling, the chip can be taken out from the insulating socket only by unlocking the frame. The structure of the utility model is simple and the disassembly is easy.
Description
[technical field]
The utility model relates to a kind of chip carrier, especially a kind of simple in structure and can fix easily with the dismounting one chip chip carrier.
[background technology]
Early stage integrated circuit (IC) directly is fixedly arranged on the circuit board, but raising along with user's request, often need chip is upgraded, and above-mentioned integrated circuit directly is welded on the replacement work that way on the circuit board is unfavorable for chip, particularly trend maximizes, the central processing unit that many pins direction develops (CPU), more need a kind of media to be fixed and be electrically connected on the computer motherboard, so propose the notion of a kind of " chip bearing seat ", earlier this chip bearing seated connection is placed on the circuit board, chip is inserted on this chip bearing seat again, utilizes radiator at last successively with chip, load bearing seat is pressed on the circuit board and with screw and locks.
This load bearing seat has expanded to test, the area of maintenance of chip simultaneously, but it is temporary transient fixing and need the frequent changes electrical connection that the requirement in this field only needs this chip is done, therefore the above-mentioned fixed form significant discomfort that compresses chip with other parts is closed, and existing " the ZIF chip bearing seat " that chip is fixed on the circuit board seems that then structure is numerous and diverse.
Therefore, be necessary in fact to provide a kind of chip carrier of simple in structure, easy accessibility.
[summary of the invention]
Therefore, the purpose of this utility model promptly provides a kind of chip carrier of simple in structure, easy accessibility, avoids the chip of damaging, so that carry out test, the maintenance work of chip.
For reaching above-mentioned purpose, the utility model provides a kind of chip carrier, in order to carry a chip, it comprises a base plate, and optionally fix a framework on this base plate, and between this base plate and this framework insulated receptacle is set, this insulated receptacle middle part is offered one and is held the cave, in order to being installed with the pin of a chip, and then locate this chip.
In addition, also can on this base plate, offer an adsorption hole, hold the cave and a vacuum system is communicated with above-mentioned respectively, utilize the pin of suction in this insulated receptacle of this vacuum system.
Compared to prior art, the utility model places an insulated receptacle with a chip earlier, this insulated receptacle is placed between a base plate and the framework again, one side utilizes this framework pressing the edge of this insulated receptacle, and another side, and then is fixed in this chip on this chip carrier in this insulated receptacle with the suction of vacuum system, and desire when dismounting, also only need the release framework from insulated receptacle, to take out chip, simple in structure, easy accessibility.
[description of drawings]
Fig. 1 is the cutaway view of the user mode of first embodiment of the present utility model.
Fig. 2 is the three-dimensional exploded view of first embodiment of the present utility model.
Fig. 3 is the structure cutaway view in the jack of a pin of the chip socket that is inserted in first embodiment of the present utility model.
Fig. 4 is the cutaway view of the version of first embodiment of the present utility model.
Fig. 5 is the cutaway view of the user mode of second embodiment of the present utility model.
Fig. 6 is the cutaway view of the user mode of the 3rd embodiment of the present utility model.
Fig. 7 is the cutaway view of the user mode of the 4th embodiment of the present utility model.
[embodiment]
Consult Fig. 1, cutaway view for the user mode of first preferred embodiment of chip carrier of the present utility model, wherein, be convexly equipped with a screw hole column 11 respectively around one base plate 10, in order to set up and to fix a framework 30, and an insulated receptacle 20 is set between this base plate 10 and this framework 30, offer some jacks 21 in this insulated receptacle 20, be installed with the pin 41 of a chip 40, and then locate this chip 40, because the thickness of this insulated receptacle 20 is not less than the length of this pin 41, so this pin 41 can not contact this pin 41 of avoiding damaging with base plate 10.
Please participate in Fig. 2 in the lump, this base plate 10 comprises an adsorption hole 13, be connected with vacuum system (not illustrating), and this base plate 10 at least the both sides correspondence be convexly equipped with at least one screw hole column 11, and these screw hole columns 11 definition one spaces 12 are in order to settle an insulated receptacle 20.
These insulated receptacle 20 corresponding above-mentioned adsorption holes 13 are offered one and are held cave 23, in order to be installed with the pin 41 at a chip 40 middle parts, and this insulated receptacle 20 also comprises some jacks 21, the usefulness that the pin 41 at these chip 40 edges of confession plugs, preferably, consult Fig. 3, the sidewall of these jacks 21 extends two shell fragments 22 in opposite directions, mutual clamping pin 41, and then locate this chip 40.
This chip carrier also comprises a framework 30, an opening 32 is offered at these framework 30 middle parts, wear for the top of chip 40, and the screw hole column 11 that this framework 30 mutually should base plate 10 offers some through holes 31, cooperate screw 50 that this framework 30 is locked on the screw hole column 11 of base plate 10.
During the desire use, with reference to Fig. 1, earlier chip 40 is mounted in the insulated receptacle 20, then also quilt spy sheet 22 clampings of pin 41 insertion jacks 21 at edge, and the pin 41 at middle part enter holds cave 23; Then, this chip 40 and the combination of this insulated receptacle 20 are inserted in the space 12 of base plate 10, then insulated receptacle 20 is positioned at adsorption hole 13 tops of base plate 10, the suction of being convenient to vacuum system acts on the pin 41 of this insulated receptacle 20 and chip 40 by this adsorption hole 13, and then decides this chip 40 together; At last, 30 of frameworks are locked on screw hole column 11 and with screw 50, then this framework 30 is being pressed the portion of putting forth effort 42 of chip 40 peripheries, and then this chip 40 is fixed between this framework 30 and this base plate 10.
In order to use all pins 41 of a chip 40, this insulated receptacle 20 and base plate 10 are done as the respective change among Fig. 4: the screw hole column 11 of this base plate 10 is respectively to these space 12 prominent one first lugs 14 of establishing, and this insulated receptacle 20 is frame-like and (promptly removes jack 21, cave 23 is held in expansion), and these insulated receptacle 20 edges are set up on above-mentioned first lug 14, to expose all pins 41 of this chip 40, and hold 23 tops, cave in what use that season, these pins 41 were suspended on base plate 10, be convenient to test, maintenance work.
Consult Fig. 5, in a second embodiment, these base plate 10 both sides are convexly equipped with first, second projection 15,16 respectively, one second lug 161 is extended to the outside in space 12 in these second projection, 16 tops, and these first projection, 15 both sides are extended a pivot 151 respectively, and these framework 30 1 ends offer two pivot holes (indicate), are installed with this pivot 151, and these framework 30 other ends are bent into one first trip 33 to base plate 10 directions, catch on above-mentioned second lug 161.
Consult Fig. 6, in the 3rd embodiment, this base plate 10 both sides at least is convexly equipped with one the 3rd projection 17 respectively, these the 3rd projection 17 top end faces become an inclined-plane 172 to the one side in this space 12, be convenient to initial alignment to this insulated receptacle 20, and these the 3rd projection 17 top another sides extend one the 3rd lug 171, and these framework 30 two ends are bent into second trip 34 to base plate 10 directions, catch on above-mentioned the 3rd lug 171.
Consult Fig. 7, in the 4th embodiment, this base plate 10 both sides at least is convexly equipped with one the 4th projection 18 respectively, these the 4th projection 18 symmetry depressions, one grooves (not indicating), and these framework 30 two ends are bent into a radian 35 respectively, and the top of this two radian 35 is embedded in the above-mentioned groove, so that utilize the elastic force of this radian 35 that this framework 30 is sandwiched between these the 4th projections 18.
Version with reference to first embodiment of Fig. 4, above-mentioned second, third, the 4th embodiment also can do identical variation: prominent respectively one the 4th lug of establishing between first, second projection 15,16 in second embodiment, prominent respectively one the 5th lug of establishing between the 3rd projection 17 in the 3rd embodiment, prominent respectively one the 6th lug of establishing between the 4th projection 18 in the 4th embodiment, frame firmly plugs the edge of the insulated receptacle 20 of chip 40, at this moment, because the pin 41 of chip 40 is unsettled, then the thickness of this insulated receptacle 20 can be less than the length of this pin 41.
In sum, the utility model places an insulated receptacle with a chip earlier, this insulated receptacle is placed between a base plate and the framework again, one side utilizes this framework pressing the edge of this insulated receptacle, and another side, and then is fixed in this chip on this chip carrier in this insulated receptacle with the suction of vacuum system, and desire when dismounting, also only need the release framework from insulated receptacle, to take out chip, simple in structure, easy accessibility.
Claims (8)
1, a kind of chip carrier in order to carry a chip, is characterized in that: comprising:
One base plate;
One framework optionally is fixed on this base plate;
One insulated receptacle is located between this base plate and this framework, and plugs said chip in this insulated receptacle.
2, chip carrier as claimed in claim 1 is characterized in that: an adsorption hole is offered at this base plate middle part.
3, chip carrier as claimed in claim 2 is characterized in that: a cave that holds that is installed with the chip pin is offered at this insulated receptacle middle part, is communicated with above-mentioned adsorption hole.
4, as claim 1,2 or 3 described chip carrier, it is characterized in that: this base plate both sides at least is convexly equipped with a screw hole column, and this framework should be offered some through holes by screw hole column mutually.
5, chip carrier as claimed in claim 4 is characterized in that: this screw hole column is convexly equipped with one first lug respectively in opposite directions.
6, as claim 1,2 described chip carrier, it is characterized in that: these base plate both sides are convexly equipped with first, second projection respectively, this second projection top extends outward one second lug, and these first projection both sides are extended a pivot respectively, and this framework one end is offered two pivot holes, and the other end is bent into one first trip.
7, as claim 1,2 described chip carrier, it is characterized in that: this base plate both sides at least is convexly equipped with one the 3rd projection respectively, and one the 3rd lug is extended on these the 3rd projection tops, and these framework two ends are bent into second trip to the base plate direction.
8, as claim 1,2 described chip carrier, it is characterized in that: this base plate both sides at least is convexly equipped with one the 4th projection respectively, these the 4th projections symmetry depression one grooves, and these framework two ends are bent into a radian respectively, and this two radians top is embedded in this groove.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200620047236 CN200965968Y (en) | 2006-10-27 | 2006-10-27 | Chip carrier |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200620047236 CN200965968Y (en) | 2006-10-27 | 2006-10-27 | Chip carrier |
Publications (1)
Publication Number | Publication Date |
---|---|
CN200965968Y true CN200965968Y (en) | 2007-10-24 |
Family
ID=38869987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200620047236 Expired - Fee Related CN200965968Y (en) | 2006-10-27 | 2006-10-27 | Chip carrier |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN200965968Y (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106099586A (en) * | 2016-06-01 | 2016-11-09 | 环胜电子(深圳)有限公司 | The attachment means used in chip imprinting operation |
CN109001499A (en) * | 2018-07-24 | 2018-12-14 | 苏州创瑞机电科技有限公司 | One kind having the semi-automatic staight needle test jack of adsorption function |
-
2006
- 2006-10-27 CN CN 200620047236 patent/CN200965968Y/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106099586A (en) * | 2016-06-01 | 2016-11-09 | 环胜电子(深圳)有限公司 | The attachment means used in chip imprinting operation |
CN106099586B (en) * | 2016-06-01 | 2018-06-19 | 环胜电子(深圳)有限公司 | The attachment device used in chip imprinting operation |
CN109001499A (en) * | 2018-07-24 | 2018-12-14 | 苏州创瑞机电科技有限公司 | One kind having the semi-automatic staight needle test jack of adsorption function |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071024 Termination date: 20131027 |