CN200965879Y - 一种发光二极管 - Google Patents

一种发光二极管 Download PDF

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Publication number
CN200965879Y
CN200965879Y CNU2006200178217U CN200620017821U CN200965879Y CN 200965879 Y CN200965879 Y CN 200965879Y CN U2006200178217 U CNU2006200178217 U CN U2006200178217U CN 200620017821 U CN200620017821 U CN 200620017821U CN 200965879 Y CN200965879 Y CN 200965879Y
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CNU2006200178217U
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黄科
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Shenzhen Jiuzhou Optoelectronics Technology Co Ltd
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SHENZHEN JIUZHOU PHOTOELECTRON CO Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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Abstract

本实用新型属于一种发光元件，涉及一种发光二极管。发光二极管为椭圆形，包括发光芯片、金属框架、管脚和树脂封装外套，所述的发光芯片采用红、蓝、绿二极管晶片，所述的封袋外套为椭圆形弧，其中长弧面的上部弧所对应半径为2.6mm，其下部弧对应半径为2.48mm，其短弧面的上部弧对应半径为1.5mm，其下部弧对应半径为2.05mm。发光芯片采用红、蓝、绿二极管晶片后，其芯片上发光极呈四方排列由左至右排为红、绿、蓝、红序列。树脂外套弧度的设计，优化了产品几何形状，更符合人体视觉，红、蓝、绿三种颜色光学曲线更加重叠，减少整批产品的平均每度偏差，使整屏视觉更加明亮、柔和，从各个角度观看都具有很好的一致性和良好的灰度级。

Description

一种发光二极管
技术领域
本实用新型属于一种发光元件，涉及一种发光二极管。
背景技术
在发光元件中，发光二极管(LED)具有亮度高，耗电量低微，寿命长，识别性好的优点。由于LED本身为单色光源，具有光效率高、节能的特点。这种新型发光元件受到普遍的重视，应用范围广泛。
LED包括作为发光体的管芯片，用树脂材料制作的外套，金属框架和管脚。这些组成部分的质量，材料或形状均与LED的效率和质量有关。例如制作LED显示屏，LED的亮度既要明亮，还需柔和。要得到这样的效果，就要改善光学曲线的输出，包括外套的几何形状和弧度。
实用新型内容
本实用新型的目的是提供一种亮度更高，光学曲线更加重叠，更省电，亮度衰减率更小的发光二极管。
实现本实用新型的目的，采取的技术分案是：
发光二极管为椭圆形，包括发光芯片、金属框架、管脚和树脂封装外套，所述的发光芯片采用红、蓝、绿二极管晶片，所述的封装外套的椭圆型面部弧度采用新的设计。
所述的封袋外套为椭圆形弧，其长弧面的上部弧所对应半径为2.6MM，下部弧对应半径为2.48MM，其短弧面的上部弧对应半径为1.5MM，下部弧对应半径为2.05MM。
所述的发光芯片采用红、蓝、绿二极管晶片后，其芯片上发光极呈四方排列由左至右排为红、绿、蓝、红序列。
框架和管脚采用镀银的铜材料制做。
本实用新型产品具有以下有益效果：
1、由于采用高品质红、蓝、绿晶片，大大提高了产品信赖度，在1000小时的持续点亮过程中亮度衰减率比双电极蓝、绿低10-15％，同时还可以抵抗大于2000V的静电电压。
2、树脂外套(罩)弧度的设计，优化了产品几何形状，更符合人体视觉，红、蓝、绿三种颜色光学曲线更加重叠，减少整批产品的平均每度偏差，使整屏视觉更加明亮、柔和，从各个角度观看都具有很好的一致性和良好的灰度级。
3、由于使用的铜管脚经过镀银处理，使管脚的电阻率更小，在使用过程中发热量更小，这意味着产品组装使用时更加省电和安全。
下面结合附图对本实用新型做进一步说明。
附图说明
附图1为本实用新型产品的立体示意图；
附图2为本实用新型产品的结构示意图：
附图3为本实用新型产品的外套正面示意图；
附图4为本实用新型产品的侧面示意图；
附图5是图3的仰视图。
具休实施方式
图1显示了本实用新型产品的外型。管脚4共2支，较长的1支为正极接入端，另一只为负极接入端。图2显示了本实用新型产品的内部结构，封装外套1由环氧树脂制作，内部框架2连接管脚4为一体的，框架2在管腔内为扁平片状，上端嵌置发光芯片3，也称为晶片。采用红、蓝、绿二极管晶片，发光极呈四方形排列，左至右排列为红、绿、蓝、红序列。
图3、图4和图5显示本实用新型产品的外型，特别是椭圆形封装外套1的弧度，其椭圆形长弧面上的上部的弧对应的半径为2.6MM，下部的弧对应的半径为2.48MM，在图4所示短弧面上部弧对应的半径为1.5MM，下部弧对应的半径为2.05MM，在发光二极管的外部设有“J”字形标志。图5所示为本实用新型产品的椭圆形状截面。椭圆形上部的弧度是本实用新型的设计要点，这样的设计更加符合人体视觉，树脂封装外套(罩)的弧度，优化了产品几何形状，红、绿、蓝、三种颜色光学曲线更加重叠，减少整批产品的平均量度偏差，使整屏视觉更加明亮、柔和，从几何角度观看都具有很好的一致性和良好的灰度级。
另外，本实用新型采用抗紫外环氧树脂封装，可以在任何日照高紫外线区使用。

Claims (3)

1、一种发光二极管，为椭圆形，包括发光芯片(3)，金属框架(2)、管脚(4)和树脂封装外套(1)，其特征在于所述的发光芯片(3)采用红、蓝、绿二极管晶片，所述的封袋外套为椭圆形弧，其长弧面的上部弧所对应半径为2.6MM，下部弧对应半径为2.48MM，其短弧面的上部弧对应半径为1.5MM，下部弧对应半径为2.05MM。
2、根据权利要求1所述的一种发光二极管，其特征在于发光芯片(3)上发光极呈四方排列由左至右排为红、绿、蓝、红序列。
3、根据权利要求1所述的一种发光二极管，其特征在于管脚(4)采用镀银的铜材料制做。
CNU2006200178217U 2006-08-18 2006-08-18 一种发光二极管 Expired - Fee Related CN200965879Y (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101752490B (zh) * 2009-12-25 2012-09-19 彩虹集团公司 一种led用封装浆料及其制备方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101752490B (zh) * 2009-12-25 2012-09-19 彩虹集团公司 一种led用封装浆料及其制备方法

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Patentee after: Shenzhen Jiuzhou Optoelectronics Technology Co., Ltd.

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