CN1997851B - 具有热界面的冷却设备以及用于再冷凝低温气体的方法 - Google Patents

具有热界面的冷却设备以及用于再冷凝低温气体的方法 Download PDF

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CN1997851B
CN1997851B CN2005800166491A CN200580016649A CN1997851B CN 1997851 B CN1997851 B CN 1997851B CN 2005800166491 A CN2005800166491 A CN 2005800166491A CN 200580016649 A CN200580016649 A CN 200580016649A CN 1997851 B CN1997851 B CN 1997851B
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sealing
condensation
condensation chamber
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freezer
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T·J·休格赫斯
K·怀特
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Siemens AG
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Abstract

一种可拆装的致冷器(4)与有待由所述致冷器进行冷却的物件(10)之间的热界面。所述热界面包括充注有气体(12)的再冷凝室，所述再冷凝室与所述致冷器的冷却面(9)以及有待冷却的物件(10)以界面方式热接触。

Description

具有热界面的冷却设备以及用于再冷凝低温气体的方法
技术领域
本发明涉及具有热界面的冷却设备以及用于再冷凝低温气体的方法。
背景技术
MRI(核磁共振成像)***用于医学诊断。MRI磁体的要求是提供稳定、均匀的磁场。为了获得稳定性，通常使用在极低温度下运行的超导磁体***，通常通过将超导体浸入如液态氦、液态氖、液态氢或液态氮之类的处于低温下的低温液体进行冷却，保持所述温度。低温液体费用昂贵，并且期望按照使低温液体的用量降低至最小值的方式对磁体***进行设计和运行。
超导磁体***通常包括一系列容纳在低温恒温器内的用于产生磁场的超导线圈。所述低温恒温器通常包括低温液体容器，其容纳有超导线圈、一个或多个完全包围所述低温液体容器的热屏蔽件，以及完全包围所述一个或多个热屏蔽件的真空护套。为了降低低温容器上的热负荷，使用致冷器将热屏蔽件冷却至低温是普遍做法。使用致冷器直接制冷低温容器以降低或消除低温液体的损耗也是公知的。
MRI磁体***使用致冷器以降低低温容器上的热负荷，从而减少或消除低温液体的消耗。所述致冷器必须与有待冷却的物体形成良好热接触，同时易于取出和更换以便维护。
致冷器由于易于磨损因而必须在一定时间后对致冷器定期维护并予以更换并且保持适当的***性能。因此，致冷器以可拆装地***磁体***的方式安置。
在低温下获得良好的热接触是困难的，与此同时，在热屏蔽件温度下使用加压触点可获得适当的热接触，一旦例如依据维护的需要取出和更换致冷器，则难以重制这些加压触点。所提供的热接触必须允许这样的取出和更换而不导致所述热接触的热传导率的显著劣化，否则在极低温度下获得理想的制冷效果将变得更为困难。
在例如美国专利US 5,782,095，US 5,613,367，US 5,918,470，以及欧洲专利申请EP 0720024A1中论述了已知的方案。
在每个上述方案中，均设置有可拆装地安装在套筒内的低温致冷器。在每种情况下，所述套筒都终止于散热器，所述散热器以某种方式热连接到暴露于低温容器的再冷凝面上。在美国专利US 5,613,367中，再冷凝面32直接暴露于所述低温容器的内部。在上述其他的每个方案中，都设置有与散热器毗邻的单独的再冷凝室。设置有气源和液体回流管用以连接所述再冷凝室和所述低温容器。在每个所述方案中，需要在所述致冷器和所述散热器之间提供有效热界面。在美国专利US 5,918,470和欧洲专利申请EP 0720024中，此点是通过一铟垫圈实现的。在美国专利US 5,613,367中，相应的热界面依赖于机械接触部件的有效清洁。
由于所述致冷器和所述散热器之间的热耦合可能劣化，或者至少是难以保持，在取出和更换致冷器时就会遇到问题。当所述致冷器从其套筒中取出时，所述套筒的内部就暴露在空气中。热交换器必将处在极低温度下，其难以防止空气气体在所述套筒内冷凝或冻结。这种冷凝物可以通过使所述套筒的温度达到环境温度而清除，但这将导致所述致冷器的取出和更换过程更加漫长，并可能导致不必要的低温剂损耗。而且每次取出和更换致冷器都需要使用新的铟垫圈。铟垫圈会经受蠕变，也就是说，用以提供所述致冷器和所述热交换器之间的所述热接触的铟垫圈会随时间发生变形，结果将导致所述热界面的劣化。此外，当所述致冷器被取出以便维护时，在安装新的铟垫圈之前难以清除旧的铟垫圈遗留下的所有痕迹。先前的垫圈的任何残留物都将导致在后的垫圈的不均的压缩，结果产生不合乎标准的热界面。
发明内容
因此，本发明的目的在于提供有效的热界面，以便用于在可拆装的致冷器与热交换器之间传导热，从而使所述热界面简便地形成，且不会随时间或所述致冷器的反复取出而劣化。
在一种应用场合中，本发明的目的在于，在有待冷却的低温气体与用于冷却的致冷器之间提供适当的热接触，同时保证所述致冷器易于取出以便维护，并消除由于所述致冷器的取出而使空气进入所述低温容器的可能性。
本发明相应地提供了如所附权利要求所限定的方法和装置。
附图说明
考虑以下结合附图对其中一些实施例所做的详细说明，本发明上述的以及更进一步的目的、优点以及细节将显而易见，其中：
图1示出了MRI***的示意性剖视图；以及
图2示出了安装在致冷器套筒内的致冷器，其中包括本发明实施例所述的热界面。
具体实施方式
如上所述，通过使致冷器作用于低温气体从而实现再冷凝的技术本身是已知的。例如，可以通过将致冷器的冷却部件放置在低温气体内实现用于冷却低温剂的致冷器与有待冷却的气体之间的有效的界面接触。在致冷器的冷却部件上发生冷凝，并且被再冷凝的低温剂重新落回低温容器内。
图1示出了安装有致冷器4的已知MRI磁体***的示意图。致冷器包括盛有超导磁体(未示出)和液化低温剂16的液体低温剂容器1，致冷器由一个或多个热屏蔽件2包围，其中热屏蔽件2又由真空护套3完全包围。致冷器4可拆装地安装在磁体***上，该致冷器通过界面接触套筒5与低温剂再冷凝室11以界面方式热接触，从而冷却热屏蔽件以及使低温气体再冷凝并通过管6将其送回低温容器1。
参照附图1所讨论的MRI***是使用需要处于液态氦温度的超导体的典型MRI***。在备选***中，也可以使用所谓的高温超导体。在这样的***中，低温剂可以是液态氮。不再需要热屏蔽件2，但是通常用多层绝热层取而代之。单级致冷器4就足以使用。
本发明提供一种改进的热界面，特别适用于可拆装的致冷器和有待冷却的物件之间，例如在图1所示的MRI***中界面接触套筒5处。本发明的热界面最好包括充注有气体的再冷凝室，所述再冷凝室与致冷器的冷却面以及有待冷却的物件热接触。
根据本发明的一实施例，为了在低温容器1内进行低温气体的再冷凝，冷凝过程在邻接的室中进行两次，从而所述致冷器能够与用于冷却超导磁体的气态或液态低温剂隔离，同时提供不随时间或致冷器的反复取出和更换而劣化的有效热界面。
图2示出了本发明实施例所述的热界面。所述界面接触套筒5的底部以密封***漏的方式终止于热传导基座10，该基座10密封所述套筒，并使其与低温容器1内的低温液体或气体隔离。因此，基座10既构造成低温容器1的壁的一部分，也构造成套筒5的壁的一部分。基座10最好也以密封***漏的方式连接以便形成所述再冷凝室11的壁的一部分。再冷凝室11环围与所述基座10热接触的再冷凝器11a，并通过气态低温剂入口/液态低温剂出口管6与低温容器1连通。两级致冷器4安置在致冷器界面接触套筒5内。所述致冷器4的第一级热交换器12a与热屏蔽件2热接触。该接触可以是如图所示的直接接触或者通过如柔性铜编织物之类的已知介质形成。致冷器4的第二级热交换器7位于致冷器界面接触套筒5的下部8中。第二级7终止于冷却级9，该冷却级由所述致冷器冷却至低温，例如大约4K。此段中所描述的特征是常规的，与美国专利5,918,470所示的装置对应。
根据本发明的另一方面，套筒5充注有低温气体。冷却级9最好不与基座10形成机械接触。冷却级9工作，以将低温气体冷却至其液化温度。冷却级9最好是有散热片的，从而改善再冷凝的热传递。正如本领域技术人员所能理解的，以及根据本发明的一个方面，套筒5的内部设置为次级再冷凝室。
冷却级9在所述套筒5内液化所述气体。因此，产生的液态低温剂12部分充注至套筒5的底部并提供热传递介质，所述介质通过在基座10处沸腾并在冷却级9处再冷凝，用于将热量从低温容器1中的来自再冷凝室11的气态低温剂经再冷凝器11a和基座10传递至次级再冷凝器9。
基座10最好由高导热材料制成，通常用铜制成，并且提供从其与低温液体12接触的上表面10a至其下表面并至再冷凝器11a的良好的热传导。低温液体12的上表面最好不与所述第二级冷凝器9接触，这是由于会降低可用于再冷凝的面积，从而也降低热传递率。液态低温剂12及与其相对应的气态低温剂在冷却级9和基座10之间提供一非接触式的(‘再冷凝器’)热界面。
基座10的上表面10a可以是带散热片的或机加工或制备成增大用于沸腾的传热面积，但是所述表面的制备应使其允许液体12的自由流通过基座10的上表面10a。
以下将详细描述本发明的热界面的操作。致冷器和套筒之间的第一级热交换器12a设置有至少一个气体通道13，从而气体能够在界面接触套筒5的上部和下部之间通过，以便抽空所述套筒，用低温气体对其进行再充注，并且在适当的时候释放低温气体。
在首次将所述致冷器放置在所述界面接触套筒5内时，在致冷器和磁体***较热的情况下，空气通过进出口14从接触套筒5抽出，随后通过进出口14，该界面接触套筒再次充注清洁的低温气体。所述过程可重复进行多次以确保留存在所述接触套筒内的低温剂的纯度。
在将磁体***和致冷器冷却至运行温度的过程中，或者在磁体***和致冷器已经冷却至运行温度时，可允许更多的低温气体缓慢地通过进出口14进入该界面接触套筒。允许气体缓慢进入，从而致冷器能够对其适当地进行冷却和液化。测量被允许进入的气体数量，从而使适量的液体12在所述套筒的所述底部冷凝。
在随后的取出、维护以及更换致冷器的的环节之后，如果所述磁体***已经冷却，而所述致冷器仍然(相对于低温容器1的温度)较热，则空气通过进出口14从界面接触套筒5抽出，所述套筒随后再次被充注进清洁的低温气体。过程可重复进行多次以确保留存在所述接触套筒5内的气体的纯度。随后启动致冷器4，并允许其冷却至运行温度。当所述致冷器完全冷却时，或在冷却过程中，允许一定量的低温气体缓慢通过进出口14进入套筒。缓慢地允许气体进入，从而致冷器能够对其适当地进行冷却和液化。测量被允许进入的气体量，从而在所述套筒的所述底部冷凝适量的液体12。
当关闭致冷器进行维护时，或者如果无意中关闭或停止致冷器时，液述低温剂12将沸腾并挥发。减压阀15安装在所述接触套筒5上，以防止上述情况下在套筒内产生过压。或者，由于液态低温剂12的量很小，所以允许其蒸发到储存器中，然后当所述致冷器再次启动时再冷凝。约2升的容量加压至2巴(2×105Pa)左右将足以提供充足的气体，用以冷凝成热传递液体12。
本发明的所述界面接触可用于致冷器4与再冷凝器11a的界面接触。尽管任何适宜的气体均可用于所述次级冷凝器9，5，但是次级冷凝器内的气体12的沸点应不高于再冷凝室11和低温容器1内气体的沸点。可在两个冷凝器内使用相同的气体。如果使用了具有不同沸点的气体，将在所述热通道10中形成热阻，从而提高所述再冷凝器11a的效率。
根据本发明的一个方面，封闭的再冷凝室提供了冷却级9和有待冷却的所述物体10之间的热界面。当取出致冷器进行维护时，次级再冷凝室8开启。然而，并未对所述再冷凝室11产生影响。
尽管结合有限的具体实施例对本发明进行了详细说明，但是对本领域技术人员而言，可在本发明的范围之内做出各种更改和改变是显而易见的。
例如，在特别描述的实施例中，所述冷却物体10本身可构造成再冷凝室的一部分。然而，本发明并不限于为再冷凝室提供热界面。事实上，本发明有益地发现了其中致冷器可能需要毫无困难地定期取出并更换且不会导致所述致冷器与有待冷却的所述物体之间的热界面的劣化的任何一种情形下的应用。由于本发明的热界面是可预知的且易于建立，本发明也可有益地应用于其中致冷器不必反复取出的情形。本发明对热界面依赖于精确的机械接触或者铟垫圈的***的实例所需的机械精度没有要求。

Claims (9)

1.一种冷却设备，其包括可拆装的低温致冷器(4)以及该可拆装的低温致冷器(4)和将由该低温致冷器冷却的物件之间的热界面，其中，所述热界面包括在封闭的再冷凝室内与该低温致冷器的冷却级(9)保持热接触的气体，并且所述物件(10)可形成为该封闭的再冷凝室的壁，并且经由热传导来进行冷却。
2.根据权利要求1所述的冷却设备，其特征在于，所述低温致冷器安装在套筒(5)内，并且所述套筒和所述低温致冷器之间的空间形成所述封闭的再冷凝室。
3.根据前述任一权利要求所述的冷却设备，其特征在于，所述气体在所述冷却级(9)上冷凝形成液体(12)并在重力作用下下落从而与所述封闭的再冷凝室的所述壁(10)接触。
4.根据权利要求1所述的冷却设备，其特征在于，所述封闭的再冷凝室的所述壁(10)与另一再冷凝室(11)热接触，所述再冷凝室(11)设置用于对低温气体再冷凝，并与所述界面的封闭的再冷凝室密封隔开。
5.根据权利要求1所述的冷却设备，其特征在于，所述冷却级(9)设置有散热片。
6.一种低温恒温器，其包括盛有液化低温剂(16)的低温容器(1)，并包括暴露于低温容器(1)内部的再冷凝器(11a)，所述再冷凝器被连接成便于借助如权利要求1-5中任意一项所述的冷却设备进行冷却。
7.一种MRI***，其包括盛放在权利要求6所述的低温恒温器内的超导线圈。
8.一种热界面，其包括封闭的再冷凝室，封闭的再冷凝室位于套筒(5)和再冷凝致冷器(4)之间并经由该封闭的再冷凝室的壁(10)与有待冷却的部件热接触，所述封闭的再冷凝室充注有气体，所述气体由再冷凝致冷器再冷凝成液体(12)，使得通过该气体的再冷凝并借助该封闭的再冷凝室的壁来提供再冷凝致冷器与所述部件之间的热接触。
9.一种用于再冷凝低温恒温器(1)内的低温气体(16)的方法，其包括以下步骤：
-提供再冷凝面(11a)，所述再冷凝面(11a)暴露于所述低温恒温器内的低温气体并设置成与如权利要求8所述的热界面的封闭的再冷凝室的壁热接触；及
-通过经由该热界面的该封闭的再冷凝室的壁冷却所述部件，从而对所述再冷凝面进行冷却。
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