CN1974451A - No-lead glass for electronic product - Google Patents

No-lead glass for electronic product Download PDF

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Publication number
CN1974451A
CN1974451A CNA2006100977981A CN200610097798A CN1974451A CN 1974451 A CN1974451 A CN 1974451A CN A2006100977981 A CNA2006100977981 A CN A2006100977981A CN 200610097798 A CN200610097798 A CN 200610097798A CN 1974451 A CN1974451 A CN 1974451A
Authority
CN
China
Prior art keywords
glass
electronic product
zno
present
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006100977981A
Other languages
Chinese (zh)
Inventor
沈上达
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JIANDA ELECTRONIC (SUZHOU) CO Ltd
Original Assignee
JIANDA ELECTRONIC (SUZHOU) CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JIANDA ELECTRONIC (SUZHOU) CO Ltd filed Critical JIANDA ELECTRONIC (SUZHOU) CO Ltd
Priority to CNA2006100977981A priority Critical patent/CN1974451A/en
Publication of CN1974451A publication Critical patent/CN1974451A/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/04Glass compositions containing silica
    • C03C3/076Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089Glass compositions containing silica with 40% to 90% silica, by weight containing boron

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Glass Compositions (AREA)

Abstract

The present invention discloses one kind of no-lead glass for electronic product. The no-lead glass consists of SiO2 45-50 %, B2O3 15-20 %, K2O 10-15 %, Na2O 5-10 %, ZnO 10-15 %, and TiO2 5-10 %. The present invention replaces B2O3, Na2O, ZnO, Ti2O, etc for PbO, has relatively low glass softening temperature, and can make the glass casing of electronic product without lead. In addition, B2O3, Na2O, ZnO, Ti2O and other PbO substituent has wide material source and moderate cost.

Description

No-lead glass for electronic product
Technical field
The present invention relates to a kind of no-lead glass for electronic product.
Background technology
Glass has two kinds of high temp glass and low temperature glass, high temp glass, use is purposes such as glass door and window in as family, because of not leaded, softening temperature is 700 ℃~800 ℃, melting temperature is 1400 ℃~1500 ℃, this glass is too high because of softening temperature, be not suitable in the electronic product, especially semi-conductor because of semi-conductor need spread phosphorus and boron (about 700 ℃ of the temperature of diffusion) in process of production, makes its form become positive and negative electrode with special oxide treatment (about 600 ℃) again and becomes diode in the semi-conductor, and change at 700 ℃~800 ℃ because of this high temp glass softening temperature, can destroy diode characteristic as using in diode, so just develop low temperature glass on the market, its softening temperature is at 500 ℃~600 ℃, melting temperature is 1100 ℃~1200 ℃, can use at diode temperature and just not destroy its characteristic.
But, all containing plumbous oxide in the low temperature glass bulb that uses at present, composition is: SiO 232%, K 2O 4%, Al 2O 32%, PbO 62%, mixes above ratio and stirs, and founds through 1200 ℃ again, and diode glass shell technological process of production figure makes the glass shell finished product at last.
According to statistics, in the annual packaged material that uses of global electronic information products 20,000 tons lead is nearly arranged at present.How effectively the plumbous use of restriction has become the important topic that current electronics and information industry must be faced, and environment is human conditions on which persons or things depend for existence, and electronics and information industry is the growth point of global economy, and we are indispensable in these two aspects.Expert introduction is considered based on environmental protection at present, and it is the Environmental policy of guiding that European Union implements with the green product in the past few years one after another with countries such as U.S., days, and long-pending level promotes unleaded relevant criterion and bill.European Union announces to completely forbid in 2006 leaded electronic product input, the U.S. then carries out the research project of unleaded project in conjunction with electronics manufacturer, government, supplier and academic institution etc., Japan is also in the use of estimating to abolish in 2007 lead in the electronic product, China has also announced " the prevention and cure of pollution management methods of electronics and IT products ", everything shows, electronic product is unleaded to have become next step development trend of electronics manufacturing.
Under legislation and the dual driving in market, each link in the electronics manufacturing industry chain without exception be faced with stern challenge, special upstream equipment, the supply of material and components and parts.
Summary of the invention
The present invention seeks to: provide a kind of no-lead glass for electronic product, this glass bulb B 2O 3, Na 2O, ZnO, TiO 2Deng replacing PbO, can in the lower glass transition temperature of maintenance, realize that the electronic product glass bulb is unleaded.
Technical scheme of the present invention is: a kind of no-lead glass for electronic product comprises following component:
SiO 2 45-50%
B 2O 3 15-20%
K 2O 10-15%
Na 2O 5-10%
ZnO 10-15%
TiO 2 5-10%。
Advantage of the present invention is:
1. the present invention B 2O 3, Na 2O, ZnO, TiO 2Deng replacing PbO, can in the lower glass transition temperature of maintenance, realize that the electronic product glass bulb is unleaded.
2. the used B of the present invention 2O 3, Na 2O, ZnO, TiO 2Deng the surrogate of PbO, wide material sources, cost are not high, can be accepted by users.
Below in conjunction with embodiment the present invention is further described:
Embodiment
Embodiment: a kind of no-lead glass for electronic product, adopt following prescription:
SiO 2 46%
B 2O 3 17%
K 2O 12%
Na 2O 7%
ZnO 12%
TiO 2 6%。
Above-mentioned crown glass can be used for making diode glass bulb etc.
Adopt following technology:
------------batching---is founded---glass bulb check---cleaning-drying---glass-tube cutting---glass-tube check---trombone slide moulding---packing warehouse-in---factory inspection---client to formula calculation to chemical analysis to raw material silo in materials procurement.
The present invention has following characteristics:
1, the compound that does not contain Toxic pb and pb in the diode glass bulb, the protection environment.
2, no pb product meets WEEE and two instructions of ROHS, can export the America and Europe.
3, softening temperature: 644 ℃.
4, linear expansivity (20-380 ℃): 90 * 10 -6℃.
The present invention B 2O 3, Na 2O, ZnO, TiO 2Deng replacing PbO, can in the lower glass transition temperature of maintenance, realize that the electronic product glass bulb is unleaded; The B that the present invention is used 2O 3, Na 2O, ZnO, TiO 2Deng the surrogate of PbO, wide material sources, cost are not high, can be accepted by users.

Claims (1)

1. no-lead glass for electronic product comprises following component:
SiO 2 45-50%
B 2O 3 15-20%
K 2O 10-15%
Na 2O 5-10%
ZnO 10-15%
TiO 2 5-10%。
CNA2006100977981A 2006-11-28 2006-11-28 No-lead glass for electronic product Pending CN1974451A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNA2006100977981A CN1974451A (en) 2006-11-28 2006-11-28 No-lead glass for electronic product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNA2006100977981A CN1974451A (en) 2006-11-28 2006-11-28 No-lead glass for electronic product

Publications (1)

Publication Number Publication Date
CN1974451A true CN1974451A (en) 2007-06-06

Family

ID=38124846

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006100977981A Pending CN1974451A (en) 2006-11-28 2006-11-28 No-lead glass for electronic product

Country Status (1)

Country Link
CN (1) CN1974451A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101428967A (en) * 2008-12-08 2009-05-13 姜荣庆 Leadless glass envelope for electronic product

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101428967A (en) * 2008-12-08 2009-05-13 姜荣庆 Leadless glass envelope for electronic product

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20070606