CN101428967A

CN101428967A - Leadless glass envelope for electronic product

Info

Publication number: CN101428967A
Application number: CNA2008102041689A
Authority: CN
Inventors: 姜荣庆
Original assignee: Individual
Current assignee: Individual
Priority date: 2008-12-08
Filing date: 2008-12-08
Publication date: 2009-05-13

Abstract

The invention discloses a lead-free glass shell used for an electronic product, which comprises the following compositions in weight percentage: 40 to 50 percent of SiO2, 3 to 5 percent of K2O, 1 to 3 percent of Al2O3, 18 to 22 percent of B2O3, 6 to 10 percent of Na2O, 8 to 12 percent of ZnO, and 10 to 15 percent of Li2O. The lead-free glass shell has the advantages that the B2O3, the Na2O, the ZnO, the Li2O and so on are used to replace PbO, so that lead free of the glass shell for the electronic product can be realized while lower temperature for softening the glass is maintained. The B2O3, the Na2O, the ZnO and the Li2O and other substitutes of the PbO used by the lead-free glass shell have the advantages of wide source and low cost, and can be accepted by wide users.

Description

A kind of leadless glass envelope for electronic product

Technical field

The present invention relates to a kind of use for electronic products glass bulb.

Background technology

Glass has two kinds of high temp glass and low temperature glass, and high temp glass uses in as family purposes such as glass door and window, because of not leaded, softening temperature is 700 ℃---800 ℃, melting temperature is 1400 ℃---1500 ℃.This glass is too high because of softening temperature, is not suitable in the electronic product, especially semi-conductor.Because of semi-conductor need spread phosphorus and boron (about 700 ℃ of the temperature of diffusion) in process of production, make its form become positive and negative electrode with special oxide treatment (about 600 ℃) again and become diode in the semi-conductor, and change at 700 ℃ because of this high temp glass softening temperature---800 ℃, can destroy diode characteristic as using in diode, so just develop low temperature glass on the market, its softening temperature is at 500 ℃---and 600 ℃, melting temperature is 1100 ℃---1200 ℃, can use at diode temperature and just not destroy its characteristic.But, all containing plumbous oxide in the low temperature glass bulb that uses at present, composition is as follows:

Low temperature is made up of the lead glass ratio:

SiO ₂ 32％

K ₂O 4％

Al ₂O ₃ 2％

PbO 62％

Mix above ratio and stir, found through 1200 ℃, diode glass shell technological process of production figure makes the glass shell finished product at last.

On August 13rd, 2005, the environmental protection instruction WEEE of European Union aspect electronic apparatus formally carries out.Simultaneously, the ROHS instruction of European Union's objectionable impurities forbidding in electronic product also will be in execution on July 1 then.How two instructions cross over it just as green together threshold, are just testing China's electronics manufacturing.According to statistics, in the annual packaged material that uses of global electronic information products 20,000 tons lead is nearly arranged at present.How effectively the plumbous use of restriction has become the important topic that current electronics and information industry must be faced, and environment is human conditions on which persons or things depend for existence, and electronics and information industry is the growth point of global economy, and we are indispensable in these two aspects.Expert introduction is considered based on environmental protection at present, and European Union is with beautiful, and it is the Environmental policy of guiding that countries such as day implement in the past few years one after another with the green product, actively promotes unleaded relevant criterion and bill.European Union announces to completely forbid in 2006 leaded electronic product input, and the U.S. is then in conjunction with electronics manufacturer, government, and supplier and academic institution etc. carries out the research project of unleaded project, and Japan is also estimating to abolish in 2007 years the use of lead in the electronic product.

Summary of the invention

Contain plumbous shortcoming at existing use for electronic products glass bulb, the invention provides a kind of leadless glass envelope for electronic product, this glass bulb B ₂O ₃, Na ₂O, ZnO, Li ₂O etc. replace PbO, can realize that the electronic product glass bulb is unleaded in the lower glass transition temperature of maintenance.

To achieve these goals, the measure taked of the present invention is:

A kind of leadless glass envelope for electronic product comprises the component of following weight ratio: sio ₂40-50%, k ₂O 3-5%, AL ₂O ₃1-3%, B ₂O ₃18--22%, Na ₂O 6-10%, ZnO 8-12%, Li ₂O 10-15%;

Each composition optimum value: sio wherein ₂45.5%, k ₂O 4.5%, AL ₂O ₃2%, B ₂O ₃20%, Na ₂O 8%, ZnO 9%, Li ₂O 11%.

Beneficial effect of the present invention: the present invention B ₂O ₃, Na ₂O, ZnO, Li ₂O etc. replace PbO, can realize that the electronic product glass bulb is unleaded, the B that the present invention is used in the lower glass transition temperature of maintenance ₂O ₃, Na ₂O, ZnO, Li ₂The surrogate of PbO such as O, wide material sources, cost are not high, can be accepted by users.

Embodiment

A kind of leadless glass envelope for electronic product comprises the component of following weight ratio: sio ₂40-50%, k ₂O 3-5%, AL ₂O ₃1-3%, B ₂O ₃18--22%, Na ₂O 6-10%, ZnO 8-12%, Li ₂O 10-15%; Each composition optimum value: sio wherein ₂45.5%, k ₂O 4.5%, AL ₂O ₃2%, B ₂O ₃20%, Na ₂O 8%, ZnO 9%, Li ₂O 11%.Press the diode glass shell technological process of production above metal oxide stirring and through 1200 ℃ of high temperature melt, make the glass shell finished product at last, above glass shell promptly meets unleaded green glass shell (European Union's requirement).

Embodiment: a kind of leadless glass envelope for electronic product comprises following component:

SiO ₂ 45.5％

K ₂O 4.5％

Al ₂O ₃ 2％

B ₂O ₃ 20％

Na ₂O 8％

ZnO 9％

Li ₂O 11％。

Claims

1, a kind of leadless glass envelope for electronic product comprises the component of following weight ratio: sio ₂40-50%, k ₂O 3-5%, AL ₂O ₃1-3%, B ₂O ₃18--22%, Na ₂O 6-10%, ZnO 8-12%, Li ₂O 10-15%.

2, a kind of leadless glass envelope for electronic product according to claim 1, its optimum value is respectively: sio ₂45.5%, k ₂O 4.5%, AL ₂O ₃2%, B ₂O ₃20%, Na ₂O 8%ZnO 9%, Li ₂O 11%.