CN1937856A - 基于金属基板的稀土厚膜电路用稀土贱金属电阻浆料及其制备工艺 - Google Patents
基于金属基板的稀土厚膜电路用稀土贱金属电阻浆料及其制备工艺 Download PDFInfo
- Publication number
- CN1937856A CN1937856A CNA2006100367158A CN200610036715A CN1937856A CN 1937856 A CN1937856 A CN 1937856A CN A2006100367158 A CNA2006100367158 A CN A2006100367158A CN 200610036715 A CN200610036715 A CN 200610036715A CN 1937856 A CN1937856 A CN 1937856A
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- Prior art keywords
- rare earth
- thick film
- film circuit
- composite powder
- powder
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- Granted
Links
- 229910052761 rare earth metal Inorganic materials 0.000 title claims abstract description 63
- 150000002910 rare earth metals Chemical class 0.000 title claims abstract description 60
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 24
- 239000002184 metal Substances 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title description 6
- 230000008569 process Effects 0.000 title description 6
- -1 Rare earth basic-metal Chemical class 0.000 title 1
- 229910052728 basic metal Inorganic materials 0.000 title 1
- 239000000843 powder Substances 0.000 claims abstract description 44
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 239000011521 glass Substances 0.000 claims abstract description 32
- 239000002131 composite material Substances 0.000 claims abstract description 28
- 238000005516 engineering process Methods 0.000 claims abstract description 25
- 239000010953 base metal Substances 0.000 claims abstract description 24
- 238000002360 preparation method Methods 0.000 claims abstract description 23
- 239000003960 organic solvent Substances 0.000 claims abstract description 11
- 239000002002 slurry Substances 0.000 claims description 52
- HLZWDTGLZQJWNL-UHFFFAOYSA-N [Zn].[Cu].[Y] Chemical compound [Zn].[Cu].[Y] HLZWDTGLZQJWNL-UHFFFAOYSA-N 0.000 claims description 18
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 17
- 239000012071 phase Substances 0.000 claims description 14
- 229910052746 lanthanum Inorganic materials 0.000 claims description 13
- ZFOZVQLOBQUTQQ-UHFFFAOYSA-N Tributyl citrate Chemical compound CCCCOC(=O)CC(O)(C(=O)OCCCC)CC(=O)OCCCC ZFOZVQLOBQUTQQ-UHFFFAOYSA-N 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 8
- 238000012856 packing Methods 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 8
- 239000011701 zinc Substances 0.000 claims description 8
- 229910052725 zinc Inorganic materials 0.000 claims description 8
- 239000004359 castor oil Substances 0.000 claims description 7
- 235000019438 castor oil Nutrition 0.000 claims description 7
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims description 7
- 238000005984 hydrogenation reaction Methods 0.000 claims description 7
- 239000002904 solvent Substances 0.000 claims description 7
- IIZPXYDJLKNOIY-JXPKJXOSSA-N 1-palmitoyl-2-arachidonoyl-sn-glycero-3-phosphocholine Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@H](COP([O-])(=O)OCC[N+](C)(C)C)OC(=O)CCC\C=C/C\C=C/C\C=C/C\C=C/CCCCC IIZPXYDJLKNOIY-JXPKJXOSSA-N 0.000 claims description 6
- 239000001856 Ethyl cellulose Substances 0.000 claims description 6
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 6
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 6
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 6
- 229910052797 bismuth Inorganic materials 0.000 claims description 6
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 6
- 229920001249 ethyl cellulose Polymers 0.000 claims description 6
- 235000010445 lecithin Nutrition 0.000 claims description 6
- 239000000787 lecithin Substances 0.000 claims description 6
- 229940067606 lecithin Drugs 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 6
- RBNWAMSGVWEHFP-UHFFFAOYSA-N trans-p-Menthane-1,8-diol Chemical compound CC(C)(O)C1CCC(C)(O)CC1 RBNWAMSGVWEHFP-UHFFFAOYSA-N 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 239000007790 solid phase Substances 0.000 claims description 5
- 238000003723 Smelting Methods 0.000 claims description 4
- 238000000498 ball milling Methods 0.000 claims description 4
- 239000000470 constituent Substances 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- 239000002893 slag Substances 0.000 claims description 4
- 239000002562 thickening agent Substances 0.000 claims description 4
- 238000012360 testing method Methods 0.000 claims description 3
- 239000013008 thixotropic agent Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000003349 gelling agent Substances 0.000 claims description 2
- 239000000156 glass melt Substances 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 238000003801 milling Methods 0.000 claims description 2
- 239000003595 mist Substances 0.000 claims description 2
- 239000004094 surface-active agent Substances 0.000 claims description 2
- 239000012467 final product Substances 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 10
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 9
- 239000010935 stainless steel Substances 0.000 abstract description 8
- 229910000859 α-Fe Inorganic materials 0.000 abstract description 3
- 239000000969 carrier Substances 0.000 abstract 1
- 229910052727 yttrium Inorganic materials 0.000 description 13
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 7
- 238000005245 sintering Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 5
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 238000005485 electric heating Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229910017083 AlN Inorganic materials 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000005469 granulation Methods 0.000 description 2
- 230000003179 granulation Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229910018580 Al—Zr Inorganic materials 0.000 description 1
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011267 electrode slurry Substances 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 238000004017 vitrification Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/06553—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of a combination of metals and oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
- H01C17/06546—Oxides of zinc or cadmium
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Glass Compositions (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
Description
方阻 | 分辨率 | TCR/ppm/℃ | 老化强度 |
100±2mΩ/□ | 0.2mm | 1500±150ppm×10-6/℃ | >10(N/mm2) |
流变特性 | 电阻层厚度 | 浆料粘度 | 单位用量 |
触变宜网印 | 12±2μm | 160±20Pas/10RPM | 88cm2/克 |
方阻 | 分辨率 | TCR/ppm/℃ | 老化强度 |
150±2mΩ/□ | 0.2mm | 1500±150ppm×10-6/℃ | >10(N/mm2) |
流变特性 | 电阻层厚度 | 浆料粘度 | 单位用量 |
触变宜网印 | 12±2μm | 170±20Pas/10RPM | 88cm2/克 |
Claims (8)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2006100367158A CN1937856B (zh) | 2006-07-28 | 2006-07-28 | 基于金属基板的稀土厚膜电路用稀土贱金属电阻浆料及其制备工艺 |
PCT/CN2007/002224 WO2008014678A1 (fr) | 2006-07-28 | 2007-07-23 | Boue de résistance métallique à base de terres rares destinée à un circuit à couche épaisse basé sur un substrat métallique et procédé de production correspondant |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2006100367158A CN1937856B (zh) | 2006-07-28 | 2006-07-28 | 基于金属基板的稀土厚膜电路用稀土贱金属电阻浆料及其制备工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1937856A true CN1937856A (zh) | 2007-03-28 |
CN1937856B CN1937856B (zh) | 2010-12-15 |
Family
ID=37955049
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006100367158A Active CN1937856B (zh) | 2006-07-28 | 2006-07-28 | 基于金属基板的稀土厚膜电路用稀土贱金属电阻浆料及其制备工艺 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN1937856B (zh) |
WO (1) | WO2008014678A1 (zh) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101868064A (zh) * | 2010-06-21 | 2010-10-20 | 陕西科技大学 | 环保型石墨电阻浆料及其制备方法 |
CN103165212A (zh) * | 2011-12-14 | 2013-06-19 | 上海宝银电子材料有限公司 | 一种片式电阻器用贱金属浆料及其制备方法 |
WO2013177838A1 (zh) * | 2012-05-29 | 2013-12-05 | 佛山市海辰科技有限公司 | 一种ptc稀土厚膜电路智能电热元件及其制备方法 |
CN104318979A (zh) * | 2014-09-19 | 2015-01-28 | 王晨 | 复合材料基厚膜电路稀土介质浆料及其制备工艺 |
CN104575670A (zh) * | 2013-10-23 | 2015-04-29 | 宁波市万泓电器科技有限公司 | 一种基板厚膜电路电阻浆料及其制备方法 |
CN104916345A (zh) * | 2015-05-25 | 2015-09-16 | 电子科技大学 | 一种厚膜电阻浆料及其制备方法 |
CN105472791A (zh) * | 2015-12-23 | 2016-04-06 | 东莞珂洛赫慕电子材料科技有限公司 | 一种稀土掺杂半导体红外辐射厚膜电子浆料及其制备方法 |
CN105810291A (zh) * | 2016-04-07 | 2016-07-27 | 东莞珂洛赫慕电子材料科技有限公司 | 一种中低阻段大功率厚膜电路稀土电阻浆料及其制备方法 |
CN106131982A (zh) * | 2016-07-08 | 2016-11-16 | 东莞珂洛赫慕电子材料科技有限公司 | 一种高温大功率稀土电阻浆料及其制备方法 |
CN108314895A (zh) * | 2018-02-06 | 2018-07-24 | 合肥东恒锐电子科技有限公司 | 一种强粘耐候高稳环保电阻浆料及其制备方法 |
CN110519870A (zh) * | 2018-05-21 | 2019-11-29 | 中南大学 | 一种石墨烯/贱金属合金导电材料、电阻浆料、发热体及其制备和应用 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5928546A (ja) * | 1982-08-05 | 1984-02-15 | Furukawa Electric Co Ltd:The | 自動車ラジエ−タ−のフイン用銅合金 |
JPS6017041A (ja) * | 1983-07-08 | 1985-01-28 | Sumitomo Electric Ind Ltd | ワイアカツト放電加工用電極線 |
JPS61130475A (ja) * | 1984-11-29 | 1986-06-18 | Inoue Japax Res Inc | 高張力銅合金材の製造方法 |
JP3105392B2 (ja) * | 1994-03-18 | 2000-10-30 | 同和鉱業株式会社 | コネクタ用銅基合金の製造法 |
JP2002367804A (ja) * | 2001-06-11 | 2002-12-20 | K-Tech Devices Corp | 抵抗器 |
CN1215484C (zh) * | 2002-12-30 | 2005-08-17 | 中国人民解放军国防科学技术大学 | 基于不锈钢基板的大功率厚膜电路用介质浆料及其制备工艺 |
CN1216381C (zh) * | 2002-12-30 | 2005-08-24 | 中国人民解放军国防科学技术大学 | 基于不锈钢基板的大功率厚膜电路用导电浆料及其制备工艺 |
CN1216380C (zh) * | 2002-12-30 | 2005-08-24 | 中国人民解放军国防科学技术大学 | 基于不锈钢基板的大功率厚膜电路用电阻浆料及其制备工艺 |
CN1273560C (zh) * | 2003-09-01 | 2006-09-06 | 王培英 | 半导瓷厚膜发热材料 |
CN100386829C (zh) * | 2004-07-28 | 2008-05-07 | 王克政 | Ptc厚膜电路可控电热元件 |
-
2006
- 2006-07-28 CN CN2006100367158A patent/CN1937856B/zh active Active
-
2007
- 2007-07-23 WO PCT/CN2007/002224 patent/WO2008014678A1/zh active Application Filing
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101868064A (zh) * | 2010-06-21 | 2010-10-20 | 陕西科技大学 | 环保型石墨电阻浆料及其制备方法 |
CN103165212B (zh) * | 2011-12-14 | 2016-01-13 | 上海宝银电子材料有限公司 | 一种片式电阻器用贱金属浆料及其制备方法 |
CN103165212A (zh) * | 2011-12-14 | 2013-06-19 | 上海宝银电子材料有限公司 | 一种片式电阻器用贱金属浆料及其制备方法 |
WO2013177838A1 (zh) * | 2012-05-29 | 2013-12-05 | 佛山市海辰科技有限公司 | 一种ptc稀土厚膜电路智能电热元件及其制备方法 |
CN104575670A (zh) * | 2013-10-23 | 2015-04-29 | 宁波市万泓电器科技有限公司 | 一种基板厚膜电路电阻浆料及其制备方法 |
CN104575670B (zh) * | 2013-10-23 | 2017-02-22 | 宁波市万泓电器科技有限公司 | 一种基板厚膜电路电阻浆料及其制备方法 |
CN104318979A (zh) * | 2014-09-19 | 2015-01-28 | 王晨 | 复合材料基厚膜电路稀土介质浆料及其制备工艺 |
CN104916345A (zh) * | 2015-05-25 | 2015-09-16 | 电子科技大学 | 一种厚膜电阻浆料及其制备方法 |
CN105472791A (zh) * | 2015-12-23 | 2016-04-06 | 东莞珂洛赫慕电子材料科技有限公司 | 一种稀土掺杂半导体红外辐射厚膜电子浆料及其制备方法 |
CN105810291A (zh) * | 2016-04-07 | 2016-07-27 | 东莞珂洛赫慕电子材料科技有限公司 | 一种中低阻段大功率厚膜电路稀土电阻浆料及其制备方法 |
CN106131982A (zh) * | 2016-07-08 | 2016-11-16 | 东莞珂洛赫慕电子材料科技有限公司 | 一种高温大功率稀土电阻浆料及其制备方法 |
CN108314895A (zh) * | 2018-02-06 | 2018-07-24 | 合肥东恒锐电子科技有限公司 | 一种强粘耐候高稳环保电阻浆料及其制备方法 |
CN110519870A (zh) * | 2018-05-21 | 2019-11-29 | 中南大学 | 一种石墨烯/贱金属合金导电材料、电阻浆料、发热体及其制备和应用 |
CN110519870B (zh) * | 2018-05-21 | 2020-06-26 | 中南大学 | 一种石墨烯/贱金属合金导电材料、电阻浆料、发热体及其制备和应用 |
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