CN1935515A - Orifice slice and its preparing process - Google Patents
Orifice slice and its preparing process Download PDFInfo
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- CN1935515A CN1935515A CN 200610007603 CN200610007603A CN1935515A CN 1935515 A CN1935515 A CN 1935515A CN 200610007603 CN200610007603 CN 200610007603 CN 200610007603 A CN200610007603 A CN 200610007603A CN 1935515 A CN1935515 A CN 1935515A
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- layer
- ejection layer
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- spray nozzle
- nozzle sheet
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- 238000000034 method Methods 0.000 title claims description 62
- 230000008569 process Effects 0.000 title description 10
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 63
- 229910052751 metal Inorganic materials 0.000 claims abstract description 42
- 239000002184 metal Substances 0.000 claims abstract description 42
- 239000007921 spray Substances 0.000 claims description 116
- 238000000059 patterning Methods 0.000 claims description 56
- 238000012545 processing Methods 0.000 claims description 42
- 239000000758 substrate Substances 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 14
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 8
- 229910052804 chromium Inorganic materials 0.000 claims description 8
- 239000011651 chromium Substances 0.000 claims description 8
- 239000010936 titanium Substances 0.000 claims description 8
- 229910052719 titanium Inorganic materials 0.000 claims description 8
- 230000003746 surface roughness Effects 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 239000005304 optical glass Substances 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 16
- 238000005516 engineering process Methods 0.000 description 9
- 230000008901 benefit Effects 0.000 description 7
- 238000013461 design Methods 0.000 description 5
- 238000005323 electroforming Methods 0.000 description 5
- 230000002950 deficient Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
The present invention relates to a jet orifice chip and its production process. Said production process includes the following steps: firstly, providing a base plate on which a metal layer is formed, forming a patterned photoresist layer on said metal layer, and forming a jet orifice layer between the metal layer and the patterned photoresist layer. Said jet orifice layer possesses several jet orifices, these jet orifices can make partial patterned photoresist layer be exposed, finally separating jet orifice layer from metal layer and removing said patterned photoresist layer.
Description
Technical field
The present invention relates to a kind of porous metals sheet and processing procedure thereof, particularly relate to a kind of Production Time short, cost is low, the spray nozzle sheet of spray orifice inner wall smooth (nozzle plate) and processing procedure thereof.
Background technology
The practice of existing spray nozzle sheet can be divided into two kinds.One is holed one by one on a metallic plate for application laser drill technology and is made.Yet along with the increase of nozzle hole number, the made spray nozzle sheet of this application laser drill technology will expend more time and more cost of manufacture.Therefore, develop and the another kind of manufacture of semiconductor technology of using, to form spray nozzle sheet.This manufacture method is the photoresist layer (photoresist layer) that elder generation's formation one on a metallic plate has a plurality of perforates, relends the metallic sheet material that is removed a plurality of tappings by etching technique, so that form a plurality of spray orifices on the metallic plate.
Yet, though above-mentioned application etching technique the manufacturing process of spray nozzle sheet to use the spray nozzle sheet of laser drill technology quick, but in etching process, the aperture size of spray orifice is wayward, and the success rate of perforation also is difficult for grasping.In addition, no matter be to use laser drill or use etch process, the surface of spray orifice inwall is all comparatively coarse, and comparatively coarse spray orifice inwall will influence outgoing track and the fluid properties such as outgoing speed of fluid when passing through spray orifice.
This shows that above-mentioned existing spray nozzle sheet and processing procedure thereof obviously still have inconvenience and defective, and demand urgently further being improved in structure and use.In order to solve the problem that spray nozzle sheet and processing procedure thereof exist, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of novel spray nozzle sheet and processing procedure thereof, just become the current industry utmost point to need improved target.
Because the defective that above-mentioned existing spray nozzle sheet and processing procedure thereof exist, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of novel spray nozzle sheet and processing procedure thereof, can improve general existing spray nozzle sheet and processing procedure thereof, make it have more practicality.Through constantly research, design, and after studying sample and improvement repeatedly, create the present invention who has practical value finally.
Summary of the invention
The objective of the invention is to, overcome the defective that existing spray nozzle sheet processing procedure exists, and provide a kind of new spray nozzle sheet processing procedure, technical problem to be solved is to make it can shorten the processing procedure time, has preferable Production Time benefit and preferable cost of manufacture benefit, and also can be manufactured with the spray nozzle sheet of more level and smooth spray orifice inwall, thereby be suitable for practicality more.
Another object of the present invention is to, overcome the defective that existing spray nozzle sheet exists, and a kind of spray nozzle sheet of new structure is provided, technical problem to be solved is to make it have more level and smooth spray orifice inwall, thereby is suitable for practicality more.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to the spray nozzle sheet processing procedure that the present invention proposes, it may further comprise the steps: a substrate is provided, and has formed a metal level on this substrate; On this metal level, form one first patterning photoresist layer; On this metal level and this first patterning photoresist layer, form one first ejection layer, wherein this first ejection layer has most spray orifices, expose this first patterning photoresist layer of part, and respectively the aperture of this spray orifice increases gradually from the upper surface of past this first ejection layer of lower surface of this first ejection layer; Separate this first ejection layer and this metal level; And remove this first patterning photoresist layer.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid spray nozzle sheet processing procedure, wherein said substrate are Silicon Wafer or optical glass substrate.
Aforesaid spray nozzle sheet processing procedure, the material of wherein said metal level are chromium or titanium.
Aforesaid spray nozzle sheet processing procedure, wherein said after forming this first ejection layer, more comprise: form one second patterning photoresist layer on this first ejection layer and this first patterning photoresist layer, wherein this second patterning photoresist layer covers these spray orifices; On the zone that this first ejection layer is not covered by this second patterning photoresist layer, form one second ejection layer; And when removing this first patterning photoresist layer, remove this second patterning photoresist layer simultaneously.
The object of the invention to solve the technical problems also adopts following technical scheme to realize.Spray nozzle sheet according to the present invention's proposition, it comprises: one first ejection layer, have most grooves and most spray orifices that are communicated to these grooves respectively, wherein respectively the aperture of this spray orifice increases gradually from the upper surface of past this first ejection layer of lower surface of this first ejection layer, and the average surface roughness of the lower surface of this first ejection layer is less than 0.4 micron.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid spray nozzle sheet, it more comprises most metallics, is disposed on the lower surface of this first ejection layer, and is positioned at the periphery of these grooves.
Aforesaid spray nozzle sheet, the material of wherein said metallic are chromium or titanium.
Aforesaid spray nozzle sheet, the material of wherein said first ejection layer are nickel.
Aforesaid spray nozzle sheet, the minimum-value aperture of wherein said spray orifice deduct the twice of difference of the degree of depth of the maximum ga(u)ge of this first ejection layer and this groove for the diameter of this groove.
Aforesaid spray nozzle sheet, it more comprises one second ejection layer, be disposed on the upper surface of this first ejection layer, and this second ejection layer has most perforations, is connected to these spray orifices respectively.
The present invention compared with prior art has tangible advantage and beneficial effect.By above technical scheme as can be known, major technique of the present invention thes contents are as follows:
The present invention proposes a kind of spray nozzle sheet processing procedure, the steps include: at first, a substrate (substrate) is provided, and has formed a metal level (metal layer) on substrate.Then, on metal level, form one first patterning photoresist layer (patterned photoresist layer).And then, on the metal level and the first patterning photoresist layer, form one first ejection layer (nozzle layer), wherein first ejection layer has most spray orifices (nozzle), these spray orifices expose the part first patterning photoresist layer, and the aperture of each spray orifice increases gradually from the upper surface of past first ejection layer of lower surface of first ejection layer.At last, first ejection layer is separated with metal level, and remove the first patterning photoresist layer.
According to the embodiment of the invention, substrate for example is Silicon Wafer or optical glass substrate.
According to the embodiment of the invention, the material of metal level for example is chromium or titanium.
According to the embodiment of the invention, after forming first ejection layer, for example more comprise the following steps.Form one second patterning photoresist layer on first ejection layer and the first patterning photoresist layer, wherein the second patterning photoresist layer covers above-mentioned spray orifice.Then, on the zone that first ejection layer is not covered by the second patterning photoresist layer, form one second ejection layer.At last, when removing the first patterning photoresist layer, remove the second patterning photoresist layer simultaneously.
In order to achieve the above object, the present invention reintroduces a kind of spray nozzle sheet, it comprises first ejection layer, first ejection layer is to have a plurality of grooves and a plurality of spray orifices that are communicated to these grooves respectively, wherein the aperture of spray orifice increases gradually from the upper surface of past first ejection layer of lower surface of first ejection layer, and the average surface roughness of the lower surface of first ejection layer is less than 0.4 micron (micron).
According to the embodiment of the invention, spray nozzle sheet for example more comprises a plurality of metallics, and these metallics are disposed on the lower surface of first ejection layer, and is positioned at the periphery of these grooves, and wherein the material of these metallics for example is chromium or titanium.
According to the embodiment of the invention, the material of ejection layer for example is a nickel.
According to the embodiment of the invention, the minimum-value aperture of spray orifice for example deducts the twice of difference of the degree of depth of the maximum ga(u)ge of first ejection layer and groove for the diameter of groove.
According to the embodiment of the invention, spray nozzle sheet for example more comprises one second ejection layer, be disposed on the upper surface of first ejection layer, and second ejection layer has a plurality of perforations, is connected to these spray orifices respectively.
By technique scheme, spray nozzle sheet of the present invention and processing procedure thereof have following advantage at least:
The present invention forms the patterning photoresistance earlier on metal level, carry out the electroforming processing procedure then, has the spray nozzle sheet of taper spray orifice with formation.Compared to prior art, because the spray orifice inwall is comparatively level and smooth, therefore when fluid penetrated, fluid had character such as preferable outgoing track and outgoing speed.
In sum, the step of spray nozzle sheet processing procedure of the present invention is: at first, a substrate is provided, and has formed a metal level on substrate.Then, on metal level, form a patterning photoresist layer.And then, on metal level and patterning photoresist layer, form an ejection layer, wherein ejection layer has a plurality of spray orifices, and these spray orifices expose partially patterned photoresist layer, and the aperture of each spray orifice increases gradually from surface on the ejection layer, surface under the ejection layer.At last, ejection layer is separated with metal level, and remove the patterning photoresist layer.The present invention can shorten the processing procedure time, has preferable Production Time benefit and preferable cost of manufacture benefit, and also can be manufactured with the spray nozzle sheet of more level and smooth spray orifice inwall.No matter it all has bigger improvement on product structure, manufacture method or function, have large improvement technically, and produced handy and practical effect, thereby have the extensive value of industry, really be a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Figure 1A to Fig. 1 E is the generalized section of spray nozzle sheet processing procedure first embodiment of the present invention.
Fig. 2 A to Fig. 2 G is the generalized section of spray nozzle sheet processing procedure second embodiment of the present invention.
110: substrate 120: metal level
140: the first ejection layer of 130: the first patterning photoresist layers
140a: lower surface 140b: upper surface
142: spray orifice 144: groove
170: the second ejection layer of 160: the second patterning photoresist layers
172: perforation m: groove diameter
D: spray orifice minimum-value aperture h: ejection layer maximum ga(u)ge
A: depth of groove
The specific embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to spray nozzle sheet and its specific embodiment of processing procedure, structure, manufacture method, step, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
See also shown in Figure 1A to Fig. 1 E, the spray nozzle sheet processing procedure of preferred embodiment of the present invention, it mainly may further comprise the steps:
At first, see also shown in Figure 1A, a substrate 110 is provided, and has formed a metal level 120 on the substrate 110.Yet, also can provide substrate 110 earlier, on substrate 110, form metal level 120 then, wherein the formation method of metal level 120 for example is a sputter process.In addition, substrate 110 for example is Silicon Wafer or the optical glass substrate with low surface roughness.
Then, see also shown in Figure 1B, on metal level 120, form one first patterning photoresist layer 130, and the first patterning photoresist layer 130 position of formed subsequently groove 144 just.At this, be described further at the generation type of the first patterning photoresist layer 130.The generation type of the first patterning photoresist layer 130 for example is to be coated with a photoresist layer earlier on metal level 120.Then, carry out patterning process for this photoresist layer, to form the first patterning photoresist layer 130, wherein patterning process comprises exposure manufacture process and developing manufacture process.
Please then consult shown in Fig. 1 C, carry out an electroforming processing procedure on the metal level 120 and the first patterning photoresist layer 130, to form one first ejection layer 140, and first ejection layer 140 has a plurality of spray orifices 142 (present embodiment only illustrates), and wherein each spray orifice 142 exposes the part first patterning photoresist layer 130.It should be noted that, in the electroforming processing procedure, when the thickness of first ejection layer 140 during greater than the thickness of the first patterning photoresist layer 130, the laterally amplification of first ejection layer 140, that is first ejection layer 140 be that wherein the thickness of first ejection layer 140 and shape all can obtain effective control along the surperficial shrinkage cavity of the first patterning photoresist layer 130.Therefore, the aperture of spray orifice 142 increases gradually from the upper surface 140b of past first ejection layer 140 of the lower surface 140a of first ejection layer 140.In addition, because present embodiment is to use the electroforming processing procedure to make first ejection layer 140, therefore compared to prior art, the hole wall of each spray orifice 142 in first ejection layer 140 is comparatively level and smooth.In addition, compared to the existing laser beam perforation mode that adopts, the time that cost required for the present invention is lower and processing procedure is required is also shorter.
Please then consult again shown in Fig. 1 D, the formed structure of above-mentioned processing procedure is carried out demoulding program, so that first ejection layer 140 is separated with metal level 120.Since between metal level 120 and first ejection layer 140 engaging force a little less than, so first ejection layer 140 can be separated easily with metal level 120.For instance, the material of metal level 120 can be chromium or titanium, and the material of first ejection layer 140 can be a nickel.In addition, the mode of separating first ejection layer 140 and metal level 120 can be to use the mode of knocking or peeling off.At last, shown in Fig. 1 E, remove the first patterning photoresist layer 130.Thus, promptly finish the making of spray nozzle sheet.
See also shown in Fig. 1 E, the spray nozzle sheet of preferred embodiment of the present invention, it mainly comprises: first ejection layer 140, wherein first ejection layer 140 has a plurality of spray orifices 142 and a plurality of grooves 144, and each spray orifice 142 is to be communicated to each groove 144 respectively.Aperture that it should be noted that spray orifice 142 increases gradually from the upper surface 140b of past first ejection layer 140 of the lower surface 140a of first ejection layer 140, and the average surface roughness of the lower surface 140a of first ejection layer 140 is less than 0.4 micron.More specifically, the minimum-value aperture d of spray orifice 142 for example deducts the twice of difference of the degree of depth a of the maximum ga(u)ge h of first ejection layer 140 and groove 144 for the diameter m of groove 144.
On the other hand, because in the demoulding process of the separates metal layers 120 and first ejection layer 140, the material of part metals layer 120 may remain on the lower surface 140a of first ejection layer 140, therefore on the lower surface 140a of first ejection layer 140, also may there be metallic (not illustrating), wherein metallic is to be positioned at each groove 144 periphery, and the material of metallic 150 for example is chromium or titanium.Yet, if carry out surface treatment, for example be etch process for the lower surface 140a of first ejection layer 140, the lower surface 140a of first ejection layer 140 just can remaining metal level 120 metallic.
See also shown in Fig. 2 A to Fig. 2 G, the spray nozzle sheet processing procedure shown in Fig. 2 A to Fig. 2 C is the spray nozzle sheet processing procedure shown in Figure 1A to Fig. 1 C in first embodiment, so do not repeat them here again.Hereinafter will elaborate at the spray nozzle sheet processing procedure shown in Fig. 2 D to Fig. 2 G.
In the spray nozzle sheet processing procedure of present embodiment, after finishing the spray nozzle sheet processing procedure shown in Fig. 2 A to Fig. 2 C (forming first ejection layer), then shown in Fig. 2 D, on first ejection layer 140 and the first patterning photoresist layer 130, form one second patterning photoresist layer 160, and the second patterning photoresist layer 160 covers above-mentioned spray orifice 142, and wherein the generation type of the second patterning photoresist layer 160 is similar to the generation type of the first patterning photoresist layer 130.Then, shown in Fig. 2 E, on the zone that first ejection layer 140 is not covered by the second patterning photoresist layer 160, form one second ejection layer 170, and the method that forms second ejection layer 170 for example is the electroforming processing procedure.
Then, make first ejection layer 140 separate (shown in Fig. 2 F) with metal level 120 by demoulding program.At last, shown in Fig. 2 G, when removing the first patterning photoresist layer 130, remove the second patterning photoresist layer 160 simultaneously.So, promptly finish the making of spray nozzle sheet.Hereinafter will elaborate at the spray nozzle sheet of the spray nozzle sheet processing procedure made of using present embodiment.
See also shown in Fig. 2 G, the spray nozzle sheet of the spray nozzle sheet of present embodiment and first embodiment is similar, and its main difference is that the spray nozzle sheet of present embodiment comprises that more second ejection layer, 170, the second ejection layer 170 are to be disposed on the upper surface 140b of first ejection layer 140.It should be noted that second ejection layer 170 has most perforations 172 (present embodiment only illustrates), these perforations 172 are connected to these spray orifices 142 respectively.
Spray nozzle sheet proposed by the invention and processing procedure thereof for example can be applicable to inkjet technology, give birth to technical that medical technologies art and pharmaceutical technology etc. need spray water or spray such as.Therefore, liquid will reach the more effect of small particle diameter release via the spray orifice ejection.Belong to the selection design as for the nozzle hole number on the spray nozzle sheet, arrangement mode and size, the present invention is not limited at this.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the method that can utilize above-mentioned announcement and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations, but every content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (10)
1, a kind of spray nozzle sheet processing procedure is characterized in that it may further comprise the steps:
One substrate is provided, and on this substrate, has formed a metal level;
On this metal level, form one first patterning photoresist layer;
On this metal level and this first patterning photoresist layer, form one first ejection layer, wherein this first ejection layer has most spray orifices, expose this first patterning photoresist layer of part, and respectively the aperture of this spray orifice increases gradually from the upper surface of past this first ejection layer of lower surface of this first ejection layer;
Separate this first ejection layer and this metal level; And
Remove this first patterning photoresist layer.
2, spray nozzle sheet processing procedure according to claim 1 is characterized in that wherein said substrate is Silicon Wafer or optical glass substrate.
3, spray nozzle sheet processing procedure according to claim 1, the material that it is characterized in that wherein said metal level is chromium or titanium.
4, spray nozzle sheet processing procedure according to claim 1 is characterized in that wherein saidly after forming this first ejection layer, more comprises:
Form one second patterning photoresist layer on this first ejection layer and this first patterning photoresist layer, wherein this second patterning photoresist layer covers these spray orifices;
On the zone that this first ejection layer is not covered by this second patterning photoresist layer, form one second ejection layer; And
When removing this first patterning photoresist layer, remove this second patterning photoresist layer simultaneously.
5, a kind of spray nozzle sheet, it is characterized in that it comprises: one first ejection layer, have most grooves and most spray orifices that are communicated to these grooves respectively, wherein respectively the aperture of this spray orifice increases gradually from the upper surface of past this first ejection layer of lower surface of this first ejection layer, and the average surface roughness of the lower surface of this first ejection layer is less than 0.4 micron.
6, spray nozzle sheet according to claim 5 is characterized in that it more comprises most metallics, is disposed on the lower surface of this first ejection layer, and is positioned at the periphery of these grooves.
7, spray nozzle sheet according to claim 6, the material that it is characterized in that wherein said metallic is chromium or titanium.
8, spray nozzle sheet according to claim 5, the material that it is characterized in that wherein said first ejection layer is a nickel.
9, spray nozzle sheet according to claim 5, the minimum-value aperture that it is characterized in that wherein said spray orifice deduct the twice of difference of the degree of depth of the maximum ga(u)ge of this first ejection layer and this groove for the diameter of this groove.
10, spray nozzle sheet according to claim 5 is characterized in that it more comprises one second ejection layer, be disposed on the upper surface of this first ejection layer, and this second ejection layer has most perforations, is connected to these spray orifices respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610007603 CN1935515A (en) | 2005-09-20 | 2006-02-13 | Orifice slice and its preparing process |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200510103190.0 | 2005-09-20 | ||
| CN200510103190 | 2005-09-20 | ||
| CN 200610007603 CN1935515A (en) | 2005-09-20 | 2006-02-13 | Orifice slice and its preparing process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1935515A true CN1935515A (en) | 2007-03-28 |
Family
ID=37953326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610007603 Pending CN1935515A (en) | 2005-09-20 | 2006-02-13 | Orifice slice and its preparing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1935515A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102152635A (en) * | 2009-12-15 | 2011-08-17 | 佳能株式会社 | Method for manufacturing discharge port member and method for manufacturing liquid discharge head |
| CN105358324A (en) * | 2013-07-09 | 2016-02-24 | 佳能株式会社 | Liquid ejection head and process for producing the same |
| US11603600B2 (en) | 2020-12-07 | 2023-03-14 | Darwin Precisions Corporation | Method of manufacturing metal mask |
-
2006
- 2006-02-13 CN CN 200610007603 patent/CN1935515A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102152635A (en) * | 2009-12-15 | 2011-08-17 | 佳能株式会社 | Method for manufacturing discharge port member and method for manufacturing liquid discharge head |
| US8528209B2 (en) | 2009-12-15 | 2013-09-10 | Canon Kabushiki Kaisha | Method for manufacturing discharge port member and method for manufacturing liquid discharge head |
| CN102152635B (en) * | 2009-12-15 | 2013-11-06 | 佳能株式会社 | Method for manufacturing discharge port member and method for manufacturing liquid discharge head |
| CN105358324A (en) * | 2013-07-09 | 2016-02-24 | 佳能株式会社 | Liquid ejection head and process for producing the same |
| US9895887B2 (en) | 2013-07-09 | 2018-02-20 | Canon Kabushiki Kaisha | Liquid ejection head and process for producing the same |
| US11603600B2 (en) | 2020-12-07 | 2023-03-14 | Darwin Precisions Corporation | Method of manufacturing metal mask |
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