CN1923670B - Modified SU8 electric heating micro-performer with multi-arc structure for straight line propulsion - Google Patents

Modified SU8 electric heating micro-performer with multi-arc structure for straight line propulsion Download PDF

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Publication number
CN1923670B
CN1923670B CN2006101162920A CN200610116292A CN1923670B CN 1923670 B CN1923670 B CN 1923670B CN 2006101162920 A CN2006101162920 A CN 2006101162920A CN 200610116292 A CN200610116292 A CN 200610116292A CN 1923670 B CN1923670 B CN 1923670B
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conductive layer
modification
cantilever beam
glue
contiguous block
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CN1923670A (en
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张卫平
陈实
陈文元
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Shanghai Jiaotong University
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Shanghai Jiaotong University
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Abstract

This is a modified SU8 electric heat micro performer for multi arc straight line thrusting device, and it belongs to the MEMS micro manufacturing techniques. Comprised of the SU8 cantilever beam, the left conductive layer connected to the outside circuit, and the right conductive layer, its SU8 cantilever beam is multi arc structured for straight line trusting, made on the glass base and the beamis made of the SU8 glue blended with nanometer carbon tube, and the top of the SU8 glue cantilever beam of the left and right conductive layers connect with the glass base through the left conductivelayer and the right conductive layer in the below. This cantilever structure is highly increased in mechanical intensity and conductivity and it is beneficial to reduce the operating current and operating temperature.

Description

The modification SU8 electric heating microactrator that is used for the multi sphere structure of linear advancement
Technical field
What the present invention relates to is the device in a kind of MEMS micro-fabrication technology field, a kind of specifically modification SU8 electric heating microactrator that is used for the multi sphere structure of linear advancement.
Background technology
Microactrator is one of Primary Component of MEMS (MEMS).Microactrator based on various principles has obtained extensive studies at home and abroad at present, using more little actuating mode has electrostatically actuated, piezoelectric actuated, Electromagnetically actuated, thermal actuation and marmem actuating etc., adopts the actuating mode of electric or magnetic to have complex manufacturing technology, driving voltage is too high, driving force is non-linear, too small or the like the deficiency of driving force.Comparatively speaking, hot type of drive is because physical dimension is little, and technology is simple and have stronger attraction, and it also has that driving voltage is low, driving force is big, simple in structurely be easy to characteristics such as integrated.Utilizing expansion principle to activate is a kind of of hot type of drive, by to actuator material energising heating, makes the approximate and linear deformation of temperature of material production, can be made into the miniature actuator that electric heating activates.Electric heating activates mode can overcome electrostatically actuated and Electromagnetically actuated weakness, has the big characteristics of active force, and its active force can reach more than hundreds of little oxen.
Find by literature search, domestic patent publication No. CN1768003A discloses a kind of asymmetric MEMS thermal actuator device, the open date is 2006.5.3, name is called " thermal actuator ", this thermal actuator is made up of a baseplate part, an actuator and an outstanding radiating part that is positioned at the actuating unit side, wherein actuating unit is made of two parallel not wide arms, when electric current by the time produces bending because degree of heat is different.This thermal actuator is because the modified difference that adopts two parallel not wide arm Si beam current flow heats to produce is finished displacement action.The occasion of wanting in big displacement, because the thermal deformation coefficient of silicon is little, often need by strengthening electric current, thereby heating Si member, and then the method that obtains big thermal deformation realizes, have that driving voltage is too high, temperature height during when work especially big displacement, big to the operating environment influence, and then limited deficiency such as its application.
Summary of the invention
The objective of the invention is to overcome deficiency of the prior art, a kind of modification SU8 electric heating microactrator that is used for the multi sphere structure of linear advancement is provided.Make it based on the electric heating active principle, operating current is little, operating temperature is low, little to ambient influnence, be used for the switch of movable part in the microfluid system such as micro valve is controlled, the automation mechanized operations such as driving, control and sealing that can be fluid in the microfluid system provide new approach, and have expanded its application scenario.
The present invention is achieved by the following technical solutions, the present invention is made of SU8 glue cantilever beam, the left conductive layer that is connected with external circuit, right conductive layer, the SU8 cantilever beam is shaped as multi sphere shape structure, be used for linear advancement, be the cantilever beam structures of making on the substrate of glass, cantilever beam beam body is the SU8 glue that mixes CNT, and the top of left conductive layer and right conductive layer SU8 glue cantilever beam links to each other with substrate of glass with right conductive layer by following left conductive layer.
SU8 glue cantilever beam is made of left pedestal, bottom left contiguous block, left arc beam body, left top contiguous block, forward block, right top contiguous block, right arc beam body, right bottom contiguous block, right pedestal, its annexation: left pedestal is connected by the bottom left contiguous block with left arc beam body, left side arc beam body is connected by left top contiguous block with forward block, forward block is connected by right top contiguous block with right arc beam body, and right arc beam body is connected by right bottom contiguous block with right pedestal; Left side conductive layer and right conductive layer lay respectively at the top of left pedestal and right pedestal.
The SU8 cantilever beam is used for linear advancement, cantilever beam structures can be unloaded from substrate of glass, is installed on the micro electromechanical structure and uses.
When the present invention works, be that electrode feeds electric current in SU8 glue cantilever beam,, change size of current and can change the flexible degree of beam body, thereby make that the electrothermal drive microactrator is controlled because the electric heating effect makes the beam body expand deformation with left conductive layer and right conductive layer.
The miniature actuator operating voltage of electrothermal drive of the present invention is low, makes that the temperature of working environment is lower.By the operating current of control, can continuous control pass through the fluid flow of little valve, thereby be the control of fluid in the microfluid system, the operation that sealing provides automation by cantilever beam.
The present invention has significantly useful effect: 1. by add CNT in the SU8 photoresist, can obtain the cantilever beam structures that mechanical strength and electric conductivity increase greatly, help reducing the electric current of work simultaneously and reduce operating temperature; 2. cantilever beam adopts the multi sphere structure to help for actuator provides bigger displacement output, and it is big to adopt electric heating to activate mode output action power, reliable in action; 3. operating current is less, and temperature is lower, and is little to ambient influnence, and adaptability is strong.
Description of drawings
Fig. 1 is an overall structure schematic diagram of the present invention.
Fig. 2 is a cantilever beam structures schematic diagram of the present invention.
Fig. 3 is two conductive coating structure schematic diagrames of the present invention.
Fig. 4 is used to control flow embodiment schematic diagram by little valve liquid for the present invention.
Fig. 5 conducts electricity SU8 electric heating microactrator processing technology block diagram for the present invention.
The specific embodiment
As shown in Figure 1, 2, 3, the embodiment of the invention is by constituting as lower member: SU8 glue cantilever beam 1, the left conductive layer 2 that is connected with external circuit, right conductive layer 3; SU8 glue cantilever beam 1 comprises: left pedestal 4, bottom left contiguous block 5, left arc beam body 6, left top contiguous block 7, forward block 8, right top contiguous block 9, right arc beam body 10, right bottom contiguous block 11, right pedestal 12, to be left pedestal 4 be connected by bottom left contiguous block 5 with left arc beam body 6 its annexation, left side arc beam body 6 is connected by left top contiguous block 7 with forward block 8, forward block 8 is connected by right top contiguous block 9 with right arc beam body 10, and right arc beam body 10 is connected by right bottom contiguous block 11 with right pedestal 12; Left side conductive layer 2 and right conductive layer 3 lay respectively at the top of left pedestal 4 and right pedestal 12.SU8 cantilever beam 1 is shaped as multi sphere shape structure, is used for linear advancement.Adopt the MEMS process technology, process following (showing) as Fig. 5:
1. at first on substrate of glass sputter one deck Cr/Cu (thickness is Cr5~10nm, Cu200~250nm, present embodiment is Cr8nm, Cu220nm) metal level is as plating seed layer;
2. the positive glue of spin coating one deck PMMA (thickness is 10~15 μ m, and present embodiment is 10 μ m) on Seed Layer, photoetching development;
3. the window that utilizes previous step to leave is electroplated one deck Cu as aerial lug on Seed Layer, after the leveling positive glue and Seed Layer are removed;
4. the polyimides that spin coating one deck is thicker (thickness is 50~80 μ m, and present embodiment is 60 μ m) is as the sacrifice layer of actuator.Etch behind the aligning and the line graph of a correspondence;
5. the SU8 glue (thickness is 200~250 μ m, and present embodiment is 200 μ m) after will filling a prescription well is spin-coated on the sacrifice layer photoetching, development;
6. discharging polyimide sacrificial layer with NaoH solution at last gets final product.
Wherein Seed Layer sputter thickness is respectively Cr5~10nm, Cu200~250nm, and the positive glue thickness of PMMA is 10~15 μ m, and the polyimides layer thickness is 50~80 μ m, and SU8 mixed layer thickness is 200~250 μ m, and the volume fraction of CNT is about 31%.
The preparation method of modification SU8 glue is as follows: the carbon nanotube filler of proper volume mark is added in the SU8 colloid, makes solvent with dimethylbenzene, mechanical agitation evenly after, put into ultrasonic wave and carry out about 15 minutes processing and get final product.
During present embodiment work, be that electrode feeds electric current in SU8 glue cantilever beam,, change size of current and can change the flexible degree of beam body, thereby make that the electrothermal drive microactrator is controlled because the electric heating effect makes the beam body expand deformation with left conductive layer and right conductive layer.
Be illustrated in figure 4 as a flow controllable valve that is used for microfluid system, the SU8 glue electric heating microactrator of present embodiment has the electric heating actuation effect, can be installed in to be used for the switch of by-pass valve control on the movable part of valve.In the present embodiment, have the movable part of the PDMS film of big coefficient of elasticity, and have certain clearance between the following substrate for the control fluid flow.The forward block of electric heating micro-actuator is connected with the PDMS film, promotes the PDMS film during microactrator work following microfluidic channel is diminished up to realizing choked flow completely, microactrator shrinks when not working, and the PDMS film restores to the original state, little valve opening.

Claims (5)

1. modification SU8 electric heating microactrator that is used for the multi sphere structure of linear advancement, it is characterized in that, constitute by modification SU8 glue cantilever beam, the left conductive layer that is connected with external circuit, right conductive layer, modification SU8 glue cantilever beam is shaped as multi sphere shape structure, be used for linear advancement, be the cantilever beam structures of making on the substrate of glass, cantilever beam beam body is the modification SU8 glue that mixes CNT, left side conductive layer and right conductive layer are positioned at the top of modification SU8 glue cantilever beam, link to each other with substrate of glass with right conductive layer modification SU8 glue cantilever beam by left conductive layer;
Described modification SU8 is meant: with volume parts is that 31% carbon nanotube filler adds in the SU8 colloid, makes solvent with dimethylbenzene, mechanical agitation evenly after, put into the processing that ultrasonic wave carried out 15 minutes and obtain.
2. the modification SU8 electric heating microactrator that is used for the multi sphere structure of linear advancement according to claim 1, it is characterized in that, described modification SU8 glue cantilever beam is by left pedestal, the bottom left contiguous block, left side arc beam body, top, left side contiguous block, forward block, right top contiguous block, right arc beam body, right bottom contiguous block, right pedestal constitutes, its annexation: left pedestal is connected by the bottom left contiguous block with left arc beam body, left side arc beam body is connected by left top contiguous block with forward block, forward block is connected by right top contiguous block with right arc beam body, and right arc beam body is connected by right bottom contiguous block with right pedestal.
3. the modification SU8 electric heating microactrator that is used for the multi sphere structure of linear advancement according to claim 2 is characterized in that described left conductive layer and right conductive layer lay respectively at the top of left pedestal and right pedestal.
4. according to claim 1 or the 2 described modification SU8 electric heating microactrators that are used for the multi sphere structure of linear advancement, it is characterized in that, described modification SU8 glue cantilever beam is used for linear advancement, cantilever beam structures can be unloaded from substrate of glass, is installed on the micro electromechanical structure and uses.
5. the modification SU8 electric heating microactrator that is used for the multi sphere structure of linear advancement according to claim 1 is characterized in that, described left conductive layer and right conductive layer are that electrode feeds electric current in modification SU8 glue cantilever beam.
CN2006101162920A 2006-09-21 2006-09-21 Modified SU8 electric heating micro-performer with multi-arc structure for straight line propulsion Expired - Fee Related CN1923670B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107934909B (en) * 2016-10-12 2019-07-12 清华大学 A kind of preparation method of the actuator based on carbon nanotube
CN109095433A (en) * 2018-08-28 2018-12-28 苏州大学 Electric heating micro clamping device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6531947B1 (en) * 2000-09-12 2003-03-11 3M Innovative Properties Company Direct acting vertical thermal actuator with controlled bending
CN1642849A (en) * 2002-03-28 2005-07-20 株式会社尼康 Micro actuator and optical switch using the actuator
CN1675728A (en) * 2002-08-14 2005-09-28 英特尔公司 Buckling beam bi-stable microelectromechanical switch using electro-thermal actuation
CN1689959A (en) * 2004-04-21 2005-11-02 中国科学院沈阳自动化研究所 Thermal driven mini-type actuator
CN1768003A (en) * 2003-04-08 2006-05-03 布克哈姆技术公共有限公司 Thermal actuator

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6531947B1 (en) * 2000-09-12 2003-03-11 3M Innovative Properties Company Direct acting vertical thermal actuator with controlled bending
CN1642849A (en) * 2002-03-28 2005-07-20 株式会社尼康 Micro actuator and optical switch using the actuator
CN1675728A (en) * 2002-08-14 2005-09-28 英特尔公司 Buckling beam bi-stable microelectromechanical switch using electro-thermal actuation
CN1768003A (en) * 2003-04-08 2006-05-03 布克哈姆技术公共有限公司 Thermal actuator
CN1689959A (en) * 2004-04-21 2005-11-02 中国科学院沈阳自动化研究所 Thermal driven mini-type actuator

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
US 2003/0002133 A1,全文.

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