CN1920094B - 膜形成装置、膜形成方法及压电致动器的制造方法 - Google Patents
膜形成装置、膜形成方法及压电致动器的制造方法 Download PDFInfo
- Publication number
- CN1920094B CN1920094B CN2006101256203A CN200610125620A CN1920094B CN 1920094 B CN1920094 B CN 1920094B CN 2006101256203 A CN2006101256203 A CN 2006101256203A CN 200610125620 A CN200610125620 A CN 200610125620A CN 1920094 B CN1920094 B CN 1920094B
- Authority
- CN
- China
- Prior art keywords
- aforementioned
- chamber
- measuring
- filming
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 98
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000000758 substrate Substances 0.000 claims abstract description 241
- 239000000443 aerosol Substances 0.000 claims abstract description 62
- 230000008569 process Effects 0.000 claims abstract description 59
- 230000007246 mechanism Effects 0.000 claims abstract description 51
- 239000002245 particle Substances 0.000 claims abstract description 51
- 239000000463 material Substances 0.000 claims abstract description 41
- 238000005259 measurement Methods 0.000 claims abstract description 16
- 230000015572 biosynthetic process Effects 0.000 claims description 106
- 239000012528 membrane Substances 0.000 claims description 72
- 238000002347 injection Methods 0.000 claims description 28
- 239000007924 injection Substances 0.000 claims description 28
- 239000007921 spray Substances 0.000 claims description 14
- 238000001514 detection method Methods 0.000 claims description 13
- 238000005192 partition Methods 0.000 claims description 12
- 239000012190 activator Substances 0.000 claims description 11
- 238000005507 spraying Methods 0.000 claims description 10
- 238000012360 testing method Methods 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 230000000903 blocking effect Effects 0.000 abstract description 2
- 230000032258 transport Effects 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 description 63
- 239000007789 gas Substances 0.000 description 37
- 230000005540 biological transmission Effects 0.000 description 11
- 230000006837 decompression Effects 0.000 description 11
- 238000000151 deposition Methods 0.000 description 10
- 238000011109 contamination Methods 0.000 description 9
- 230000008021 deposition Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 230000008859 change Effects 0.000 description 7
- 239000012467 final product Substances 0.000 description 7
- 239000012159 carrier gas Substances 0.000 description 6
- 238000011144 upstream manufacturing Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 239000004479 aerosol dispenser Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000009183 running Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/02—Coating starting from inorganic powder by application of pressure only
- C23C24/04—Impact or kinetic deposition of particles
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Spray Control Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
Claims (22)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005243130 | 2005-08-24 | ||
JP2005243130 | 2005-08-24 | ||
JP2005-243130 | 2005-08-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1920094A CN1920094A (zh) | 2007-02-28 |
CN1920094B true CN1920094B (zh) | 2010-05-12 |
Family
ID=37526963
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006101256203A Expired - Fee Related CN1920094B (zh) | 2005-08-24 | 2006-08-24 | 膜形成装置、膜形成方法及压电致动器的制造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7908993B2 (zh) |
EP (1) | EP1757373B1 (zh) |
CN (1) | CN1920094B (zh) |
AT (1) | ATE552918T1 (zh) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090194505A1 (en) * | 2008-01-24 | 2009-08-06 | Microcontinuum, Inc. | Vacuum coating techniques |
US8383202B2 (en) | 2008-06-13 | 2013-02-26 | Kateeva, Inc. | Method and apparatus for load-locked printing |
US9604245B2 (en) | 2008-06-13 | 2017-03-28 | Kateeva, Inc. | Gas enclosure systems and methods utilizing an auxiliary enclosure |
US12018857B2 (en) | 2008-06-13 | 2024-06-25 | Kateeva, Inc. | Gas enclosure assembly and system |
US8899171B2 (en) | 2008-06-13 | 2014-12-02 | Kateeva, Inc. | Gas enclosure assembly and system |
US11975546B2 (en) | 2008-06-13 | 2024-05-07 | Kateeva, Inc. | Gas enclosure assembly and system |
US10442226B2 (en) | 2008-06-13 | 2019-10-15 | Kateeva, Inc. | Gas enclosure assembly and system |
US10434804B2 (en) | 2008-06-13 | 2019-10-08 | Kateeva, Inc. | Low particle gas enclosure systems and methods |
US9048344B2 (en) | 2008-06-13 | 2015-06-02 | Kateeva, Inc. | Gas enclosure assembly and system |
JP5107285B2 (ja) * | 2009-03-04 | 2012-12-26 | 東京エレクトロン株式会社 | 成膜装置、成膜方法、プログラム、およびコンピュータ可読記憶媒体 |
JP5921093B2 (ja) * | 2010-12-10 | 2016-05-24 | 株式会社東芝 | 試料汚染方法 |
US9120344B2 (en) | 2011-08-09 | 2015-09-01 | Kateeva, Inc. | Apparatus and method for control of print gap |
KR101903921B1 (ko) | 2011-08-09 | 2018-10-02 | 카티바, 인크. | 하향 인쇄 장치 및 방법 |
CN102433533B (zh) * | 2011-12-26 | 2013-08-28 | 东北大学 | 一种制备高分子功能薄膜的真空喷射镀膜机 |
CN102534511B (zh) * | 2012-02-28 | 2013-10-16 | 东北大学 | 一种气相沉积薄膜的装置及其使用方法 |
JP6392874B2 (ja) | 2013-12-26 | 2018-09-19 | カティーバ, インコーポレイテッド | 電子デバイスの熱処理のための装置および技法 |
CN107256840B (zh) | 2014-01-21 | 2019-05-31 | 科迪华公司 | 用于电子装置封装的设备和技术 |
US9343678B2 (en) | 2014-01-21 | 2016-05-17 | Kateeva, Inc. | Apparatus and techniques for electronic device encapsulation |
KR102059313B1 (ko) | 2014-04-30 | 2019-12-24 | 카티바, 인크. | 가스 쿠션 장비 및 기판 코팅 기술 |
KR20200008041A (ko) | 2014-11-26 | 2020-01-22 | 카티바, 인크. | 환경적으로 제어되는 코팅 시스템 |
DE102015012425A1 (de) | 2015-09-25 | 2017-03-30 | Michaela Bruckner | Vorrichtung zur aerosolbasierten Kaltabscheidung ( Aerosol-Depositions-Methode, ADM) |
KR102117068B1 (ko) * | 2018-01-30 | 2020-05-29 | (주)에스티아이 | 잉크젯 인쇄장치 및 이를 이용한 인쇄방법 |
CN110370818B (zh) * | 2019-07-26 | 2020-10-13 | 深圳市华星光电半导体显示技术有限公司 | 一种喷墨打印装置及方法 |
KR102649715B1 (ko) * | 2020-10-30 | 2024-03-21 | 세메스 주식회사 | 표면 처리 장치 및 표면 처리 방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030157255A1 (en) * | 2002-02-15 | 2003-08-21 | Canon Kabushiki Kaisha | Manufacturing methods of water repellent member and inkjet head |
CN1491293A (zh) * | 2001-02-07 | 2004-04-21 | ������������ʽ���� | 溅射装置及溅射成膜方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5868854A (en) * | 1989-02-27 | 1999-02-09 | Hitachi, Ltd. | Method and apparatus for processing samples |
US5358806A (en) | 1991-03-19 | 1994-10-25 | Hitachi, Ltd. | Phase shift mask, method of correcting the same and apparatus for carrying out the method |
US5439763A (en) | 1991-03-19 | 1995-08-08 | Hitachi, Ltd. | Optical mask and method of correcting the same |
JPH04289649A (ja) | 1991-03-19 | 1992-10-14 | Hitachi Ltd | 集束イオンビーム加工方法及びその装置 |
US5364225A (en) * | 1992-06-19 | 1994-11-15 | Ibm | Method of printed circuit panel manufacture |
US5975740A (en) * | 1996-05-28 | 1999-11-02 | Applied Materials, Inc. | Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme |
US20030198551A1 (en) * | 1997-12-15 | 2003-10-23 | Schmidt Wayne J. | Robots for microelectronic workpiece handling |
US6390019B1 (en) * | 1998-06-11 | 2002-05-21 | Applied Materials, Inc. | Chamber having improved process monitoring window |
JP3916468B2 (ja) * | 2002-01-11 | 2007-05-16 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
US6701972B2 (en) * | 2002-01-11 | 2004-03-09 | The Boc Group, Inc. | Vacuum load lock, system including vacuum load lock, and associated methods |
JP2003293159A (ja) * | 2002-04-04 | 2003-10-15 | Hitachi Metals Ltd | 超微粒子の成膜方法およびその成膜装置 |
JP3862596B2 (ja) * | 2002-05-01 | 2006-12-27 | 東京エレクトロン株式会社 | 基板処理方法 |
US6755339B2 (en) * | 2002-06-21 | 2004-06-29 | Delphi Technologies, Inc. | Fluxing apparatus for applying powdered flux |
JP3980948B2 (ja) * | 2002-06-25 | 2007-09-26 | 株式会社日立ハイテクノロジーズ | 不良解析方法及び不良解析システム |
US7579251B2 (en) * | 2003-05-15 | 2009-08-25 | Fujitsu Limited | Aerosol deposition process |
JP4111276B2 (ja) | 2004-02-26 | 2008-07-02 | Tdk株式会社 | 磁気記録媒体及び磁気記録再生装置 |
-
2006
- 2006-08-23 US US11/466,665 patent/US7908993B2/en not_active Expired - Fee Related
- 2006-08-23 AT AT06017585T patent/ATE552918T1/de active
- 2006-08-23 EP EP06017585A patent/EP1757373B1/en not_active Not-in-force
- 2006-08-24 CN CN2006101256203A patent/CN1920094B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1491293A (zh) * | 2001-02-07 | 2004-04-21 | ������������ʽ���� | 溅射装置及溅射成膜方法 |
US20030157255A1 (en) * | 2002-02-15 | 2003-08-21 | Canon Kabushiki Kaisha | Manufacturing methods of water repellent member and inkjet head |
Also Published As
Publication number | Publication date |
---|---|
EP1757373B1 (en) | 2012-04-11 |
ATE552918T1 (de) | 2012-04-15 |
EP1757373A1 (en) | 2007-02-28 |
CN1920094A (zh) | 2007-02-28 |
US20070044713A1 (en) | 2007-03-01 |
US7908993B2 (en) | 2011-03-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1920094B (zh) | 膜形成装置、膜形成方法及压电致动器的制造方法 | |
US7654291B2 (en) | Purging apparatus and purging method | |
TWI475595B (zh) | 基板運送裝置 | |
US7834994B2 (en) | Sensors for dynamically detecting substrate breakage and misalignment of a moving substrate | |
TWI550760B (zh) | 基板處理裝置、基板處理方法、基板保持機構及基板保持方法 | |
CN102649624B (zh) | 涂布装置和涂布方法 | |
US8184283B2 (en) | Optical defect inspection apparatus | |
KR101641390B1 (ko) | 반도체 기판을 이송하는데 사용되는 인클로저의 오염 측정을 위한 스테이션 및 방법 | |
KR101222387B1 (ko) | 기판 도포 장치 및 기판 도포 방법 | |
JP4943063B2 (ja) | 成膜装置及び成膜方法 | |
JP2011088101A (ja) | 液滴吐出装置 | |
CN1997576A (zh) | 浮动搬送装置及浮动搬送方法 | |
TW201127500A (en) | Droplet discharge device and method for controlling droplet discharge device | |
CN101465280A (zh) | 基板处理装置 | |
TWI720603B (zh) | 基板處理裝置 | |
JP2007084926A (ja) | 膜形成装置および膜形成方法 | |
JP6745627B2 (ja) | 錠剤印刷装置 | |
CN106662536A (zh) | 在纺纱准备或轧棉中用于识别并剔除在纤维材料之中或之间的杂质的设备 | |
JP5380980B2 (ja) | ワーク移動テーブルおよびこれを備えた液滴吐出装置 | |
US20210131949A1 (en) | Optical sensor window cleaner | |
CN112384482B (zh) | 针对玻璃瓶成型用模具的脱模剂涂布装置 | |
CN112997287B (zh) | 利用对称气体喷射的颗粒去除装置 | |
JPH1144634A (ja) | 検出器のエアパージ機構 | |
JP2003098109A (ja) | 検査用搬送装置 | |
JP2001002232A (ja) | ガラスびん排除装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: INDUSTRIAL COMPREHANSIVE TECHNOLOGLES INST. Effective date: 20131025 Owner name: INDUSTRIAL COMPREHANSIVE TECHNOLOGLES INST. Free format text: FORMER OWNER: BROTHER KOGYO KABUSHIKI KAISHA Effective date: 20131025 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20131025 Address after: Tokyo, Japan, Japan Patentee after: Independent Administrative Corporation Industrial Comprehansive Technologles Institute Address before: Nagoya City, Aichi Prefecture, Japan Patentee before: Brother Industries, Ltd. Patentee before: Independent Administrative Corporation Industrial Comprehansive Technologles Institute |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100512 Termination date: 20200824 |