CN1909763B - 多层印刷配线板 - Google Patents

多层印刷配线板 Download PDF

Info

Publication number: CN1909763B
Authority: CN; China
Prior art keywords: resin; hole; layer; insulating layers; mentioned
Prior art date: 1999-10-26
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

CN2006101001609A

Other languages

English (en)

Chinese (zh)

Other versions

CN1909763A (zh

Inventor

川崎洋吾

佐竹博明

岩田丰

田边哲哉

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Ibiden Co Ltd

Original Assignee

Ibiden Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1999-10-26

Filing date

2000-10-10

Publication date

2010-11-10

1999-10-26 Priority claimed from JP30330699A external-priority patent/JP2001127435A/ja

1999-10-26 Priority claimed from JP30330799A external-priority patent/JP2001127436A/ja

2000-02-08 Priority claimed from JP2000029988A external-priority patent/JP2001223466A/ja

2000-10-10 Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd

2007-02-07 Publication of CN1909763A publication Critical patent/CN1909763A/zh

2010-11-10 Application granted granted Critical

2010-11-10 Publication of CN1909763B publication Critical patent/CN1909763B/zh

2020-10-10 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

Images

Landscapes

Production Of Multi-Layered Print Wiring Board (AREA)
Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

CN2006101001609A 1999-10-26 2000-10-10 多层印刷配线板 Expired - Lifetime CN1909763B (zh)

Applications Claiming Priority (8)

Application Number	Priority Date	Filing Date	Title
JP303306/1999		1999-10-26
JP303307/1999		1999-10-26
JP30330599A JP4832621B2 (ja)	1999-10-26	1999-10-26	多層プリント配線板
JP303305/1999		1999-10-26
JP30330699A JP2001127435A (ja)	1999-10-26	1999-10-26	多層プリント配線板及び多層プリント配線板の製造方法
JP30330799A JP2001127436A (ja)	1999-10-26	1999-10-26	多層プリント配線板の製造方法
JP29988/2000		2000-02-08
JP2000029988A JP2001223466A (ja)	2000-02-08	2000-02-08	プリント配線板の製造方法

Related Parent Applications (2)

Application Number	Title	Priority Date	Filing Date
CNB2005100526249A Division CN100521868C (zh)	1999-10-26	2000-10-10	多层印刷配线板及多层印刷配线板的制造方法
CNB008023913A Division CN1199536C (zh)	1999-10-26	2000-10-10	多层印刷配线板及多层印刷配线板的制造方法

Publications (2)

Publication Number	Publication Date
CN1909763A CN1909763A (zh)	2007-02-07
CN1909763B true CN1909763B (zh)	2010-11-10

Family

ID=17919367

Family Applications (3)

Application Number	Title	Priority Date	Filing Date
CN2006101001596A Expired - Lifetime CN1909762B (zh)	1999-10-26	2000-10-10	多层印刷配线板
CN2006101001717A Expired - Lifetime CN1909764B (zh)	1999-10-26	2000-10-10	多层印刷配线板
CN2006101001609A Expired - Lifetime CN1909763B (zh)	1999-10-26	2000-10-10	多层印刷配线板

Family Applications Before (2)

Application Number	Title	Priority Date	Filing Date
CN2006101001596A Expired - Lifetime CN1909762B (zh)	1999-10-26	2000-10-10	多层印刷配线板
CN2006101001717A Expired - Lifetime CN1909764B (zh)	1999-10-26	2000-10-10	多层印刷配线板

Country Status (2)

Country	Link
JP (1)	JP4832621B2 (ja)
CN (3)	CN1909762B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2014216375A (ja)	2013-04-23	2014-11-17	イビデン株式会社	プリント配線板及び多層コア基板の製造方法
CN106898594A (zh) *	2017-02-28	2017-06-27	美的智慧家居科技有限公司	用于无线保真***级封装芯片的基板及其形成方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN1140008A (zh) *	1994-12-01	1997-01-08	揖斐电株式会社	多层印刷电路板及其制造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN1004987B (zh) *	1985-02-07	1989-08-09	马克艾尔艾恩公司	作印刷电路板用的覆金属叠层板的生产方法
JPH0651010Y2 (ja) *	1989-12-22	1994-12-21	富士通株式会社	プリント配線板構造
JPH07283538A (ja) *	1994-04-14	1995-10-27	Ibiden Co Ltd	多層プリント配線板の製造方法
JPH09148748A (ja) *	1995-11-20	1997-06-06	Taiyo Ink Mfg Ltd	多層プリント配線板及びその製造方法並びにそれに用いる樹脂絶縁層形成用組成物
JPH09331152A (ja) *	1996-06-11	1997-12-22	Tokuyama Corp	回路基板の製造方法
JP3050812B2 (ja) *	1996-08-05	2000-06-12	イビデン株式会社	多層プリント配線板
US5891606A (en) *	1996-10-07	1999-04-06	Motorola, Inc.	Method for forming a high-density circuit structure with interlayer electrical connections method for forming
JPH10200265A (ja) *	1997-01-06	1998-07-31	Ibiden Co Ltd	多層プリント配線板
JPH1140949A (ja) *	1997-07-23	1999-02-12	Hitachi Aic Inc	多層配線板と面付部品の実装構造
JPH1187930A (ja) *	1997-09-11	1999-03-30	Hitachi Aic Inc	多層印刷配線板の製造方法
JP3408417B2 (ja) *	1998-03-17	2003-05-19	イビデン株式会社	スルーホール充填用樹脂組成物および多層プリント配線板
JPH11177237A (ja) *	1997-12-16	1999-07-02	Hitachi Chem Co Ltd	ビルドアップ多層プリント配線板とその製造方法
JPH11204944A (ja) *	1998-01-12	1999-07-30	Hitachi Chem Co Ltd	多層印刷配線板の製造方法
JPH11214846A (ja) *	1998-01-28	1999-08-06	Ibiden Co Ltd	多層プリント配線板

1999
- 1999-10-26 JP JP30330599A patent/JP4832621B2/ja not_active Expired - Lifetime
2000
- 2000-10-10 CN CN2006101001596A patent/CN1909762B/zh not_active Expired - Lifetime
- 2000-10-10 CN CN2006101001717A patent/CN1909764B/zh not_active Expired - Lifetime
- 2000-10-10 CN CN2006101001609A patent/CN1909763B/zh not_active Expired - Lifetime

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN1140008A (zh) *	1994-12-01	1997-01-08	揖斐电株式会社	多层印刷电路板及其制造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
CN 1140008 A,附图5.

Also Published As

Publication number	Publication date
JP2001127434A (ja)	2001-05-11
CN1909762A (zh)	2007-02-07
CN1909763A (zh)	2007-02-07
CN1909764B (zh)	2010-11-10
CN1909762B (zh)	2012-05-30
CN1909764A (zh)	2007-02-07
JP4832621B2 (ja)	2011-12-07

Legal Events

Date	Code	Title	Description
2007-02-07	C06	Publication
2007-02-07	PB01	Publication
2007-04-04	C10	Entry into substantive examination
2007-04-04	SE01	Entry into force of request for substantive examination
2010-11-10	C14	Grant of patent or utility model
2010-11-10	GR01	Patent grant
2020-10-30	CX01	Expiry of patent term
2020-10-30	CX01	Expiry of patent term	Granted publication date: 20101110

Publication	Publication Date	Title
CN100521868C (zh)	2009-07-29	多层印刷配线板及多层印刷配线板的制造方法
CN101826496B (zh)	2015-03-18	印刷线路板及其制造方法
CN1319157C (zh)	2007-05-30	多层电路板和半导体装置
CN100387103C (zh)	2008-05-07	多层印刷电路板和半导体器件
CN100461383C (zh)	2009-02-11	多层印刷线路板
EP1030544B1 (en)	2009-12-30	Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole
CN102084731B (zh)	2013-04-03	印刷电路板及其制造方法
TW200529722A (en)	2005-09-01	Multilayer printed wiring board
KR20010053157A (ko)	2001-06-25	다층 프린트 배선판 및 그 제조방법
CN102170752A (zh)	2011-08-31	印刷电路板
CN101478861B (zh)	2013-03-27	多层印刷电路板
CN101267717B (zh)	2011-03-30	多层叠合电路板
CN1909763B (zh)	2010-11-10	多层印刷配线板
JP4707273B2 (ja)	2011-06-22	多層プリント配線板の製造方法
CN101471323B (zh)	2011-08-03	多层印刷线路板
JP4748889B2 (ja)	2011-08-17	多層プリント配線板の製造方法
JP4275369B2 (ja)	2009-06-10	多層プリント配線板
JP2002319765A (ja)	2002-10-31	埋め込み樹脂
JP2003017622A (ja)	2003-01-17	半導体チップの製造方法及び半導体チップ