CN1909218A

CN1909218A - Integrated liquid cooling heat abstractor

Info

Publication number: CN1909218A
Application number: CN 200510036388
Authority: CN
Inventors: 刘泰健; 杨志豪; 童兆年; 侯春树
Original assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2005-08-03
Filing date: 2005-08-03
Publication date: 2007-02-07
Anticipated expiration: 2025-08-03
Also published as: CN100444368C

Abstract

The invention relates to an integrated liquid cooling heat emitter, which comprises: a pump, a heat adsorption plate, a heat radiator and a liquid storage groove, wherein the pump and the heat adsorption plate are integrated; the heat radiator and the liquid storage groove are integrated; the base and the heat radiator are combined without any fitting tube, to simply the structure and reduce the element number.

Description

Integral liquid cooling heat radiator

[technical field]

The present invention system via the design of component moduleization, can make up required integral liquid cooling heat radiator about a kind of heat abstractor according to real space.

[background technology]

Fast development along with electronics and information industry, the high-tech electronic product is just towards more frivolous small and exquisite, many merit, computing trend development fast, the system radiating load is continued to increase, also under electronic building brick operation frequency and the continuous lifting of speed, make its heat that disengages also more and more high, the running performance and the stability of serious threat electronic building brick, even Yin Gaowen and burn these expensive electronic building bricks; To directly influence the life-span and the running quality of electronic building brick based on the quality of heat abstractor, must to heat generating component itself and product systems are carried out effectively and heat radiation fast.

Only known techniques is to stack the forced air-cooled heat abstractor of aluminium extruded type radiator and fan on the central processing unit (CPU), to be difficult to satisfy the radiating requirements of following high-frequency high-speed electronic building brick and production development.

Though and the heat dissipation of known liquid cooling heat radiation system is better than forced air-cooled heat abstractor, but also owing to constitute four basic modules (group Pu of this system, absorber plate, reservoir and radiator) independent separately and must be communicated with one by one with pipe fitting, so that the entire heat dissipation device takes up room greatly, be difficult for according to the existing small space configuration of product, and avoid the curved obstruction of pipe fitting pleat when installing for the cooperation small space, often must be configured as complicated 3D shape and increase difficulty on the processing procedure with the hard pipe fitting, also because pipe fitting and piece-ups are many, not only assemble complicated consuming time taking a lot of work, and because pipe arrangement has consumed a certain proportion of lift in group Pu (head), cause heat dissipation to reduce, more increase the risk that cooling fluid is leaked and reliability reduces owing to piece-ups, again owing to installation and dismounting in computer system all need each partly individual processing, not only operate and loaded down with trivial details and consuming timely take a lot of work and increase cost, above-mentioned shortcoming is unfavorable for that cost reduces, heat dispersion, reliability promotes, space utilization, dismounting, and volume production processing procedure, therefore, be necessary present liquid cooling heat radiation system is made improvements.

[summary of the invention]

Real be necessary to provide at this by group Pu and the absorber plate formed base that is integrated, with be positioned at base top and directly combine by radiator (radiator) and reservoir (reserve tank) the formed radiator that is integrated, the integral liquid cooling cooling system of forming a modularization, and base does not need any pipe arrangement with combining of radiator, with simplied system structure, simplify the number of components, be easy to install; Have that above-mentioned liquid-cooling heat radiator through modularized design has economic benefit, reliability height concurrently, simplifies processing procedure, heat dissipation significantly promotes and to cooperating the product confined space person of making full use of.

Real be necessary to provide at this, make the cooling fluid of the absorber plate of flowing through directly be pressed close to the rapid migration radiator in group Pu of absorber plate, reach the reinforcement cooling performance, simplify the effect of system configuration by group Pu and the design means that absorber plate is integrated.

Provide the design means that is integrated by radiator and reservoir this real being necessary, further reach the reinforcement cooling performance, simplify the effect of system configuration.

By the technological means of the structure of further understanding the present invention, utilization is promptly expected the effect of reaching, now lift several preferred embodiments and cooperate diagram to be described in detail as follows, believe the present invention's goal of the invention, feature and other characteristics, when can going deep into therefrom and concrete understanding.

[description of drawings]

Fig. 1: be to see schematic perspective view outside the first embodiment of the invention.

Fig. 2: the three-dimensional exploded view that is first embodiment of the invention.

Fig. 3: another angle schematic perspective view that is first embodiment of the invention.

Fig. 4: be to see schematic perspective view outside the second embodiment of the invention.

[embodiment]

Please refer to first figure to the, three figure, it is first embodiment of the invention, present embodiment comprises one in order to group Pu 11, an absorber plate 12 in order to absorption heat generating component heat that the drives liquid circulation formed base 10 that is integrated, with be arranged in base 10 tops by a radiator 21 that sheds in order to the heat that will import system into, and a cooling fluid in order to stocking system first reservoir 22 that reaches certain storage and the second reservoir 23 formed radiator 20 that is integrated directly combine, form the integral liquid cooling heat radiator of a modularization.

One accommodation chamber 101 is set in this base 10, be respectively equipped with two parallel first collecting tray 102 and second collecting traies 103 in accommodation chamber 101 2 sides, and between accommodation chamber 101 and two collecting traies, be provided with and be connected 104, the channel that exchanges mutually as cooling liquid, this group Pu 11 is set in the accommodation chamber 101 of this base 10, going into of these group Pu 11 2 sides, outlet 111,112 are located at being connected in 104 with respect to first collecting tray 102 and second collecting tray 103 respectively, going into of this group Pu 11, outlet 111,112 respectively fill up piece 113 with one is fixed in this two connections road 104, making this two collecting tray become cooling fluid advances, go out to help the Pu to go into, outlet converge groove, these two collecting traies be opening up, and should help the ccontaining absorber plate 12 in side under the Pu 11, can be affixed on the heat generating component (CPU), ccontaining this group Pu 11 is with a kind of material that is easy to be shaped with the base 10 of this absorber plate 12, plastics for example, PE, mats such as ABS penetrate, punching press, forming modes such as casting are made, and absorber plate 12 lockings made from high heat conducting material or the gummed purpose that reaches sealing.In addition, the both sides of this base 10 are established an attaching clamp 105 with two fixing holes 106 respectively, reach convenient by the locked instrument that is arranged in this fixing hole 106 motherboard and casing are fixed in the present invention, and simultaneously absorber plate 12 and heat generating component are located, and make its close thermal contact.The locked instrument of the above is compositions such as spring 107, screw 108 and C shape ring 109.

This radiator 20 is to be arranged on the base 10, to help Pu 11 to be arranged at therebetween, two sides of the radiator 21 of this radiator 20 have first reservoir 22 and second reservoir 23, this two reservoirs opening makes reservoir be connected with collecting tray with corresponding with respect to the opening of first collecting tray 102 and second collecting tray 103.

During use, hot interface material (TIM) (figure does not draw) will be coated earlier between absorber plate 12 and the heat generating component, radiator 20 directly is arranged on the base 10 again, first reservoir 22 of this radiator 20 is combined with the opening of second collecting tray 103 with first collecting tray 102 of base 10 with the opening of second reservoir 23, and by spring 107, screw 108 and C shape are encircled locked instruments such as 109 motherboard and casing are fixed in the present invention, and simultaneously absorber plate 12 and heat generating component are located, and make its close thermal contact, the heat transferred that makes the heat generating component generation is to absorber plate 12, reach the cooling fluid in the group Pu 11 again, the cooling fluid of this high enthalpy value (enthalpy) by group Pu 11 in the pressurization, impel coolant flow circulation of the present invention, the heat that will import cooling fluid into directly imports radiator 21 via first collecting tray 102 and first reservoir, 22 backs, by the fin on the radiator 21 heat is shed, the cooling fluid of low heat enthalpy value of leaving radiator 21 this moment imports absorber plate 12 heat absorptions of group 11 belows, Pu after via second reservoir 23 and second collecting tray 103 once again, so goes round and begins again to constitute a cooling system that drives liquid circulation.

In addition, the present invention makes the cooling fluid of the absorber plate 12 of flowing through directly be pressed close to the group Pu 11 rapid migration radiators of absorber plate 12, and the bottom enclosure at this group Pu 11 can adopt thermal conductivity good metal plate to make, and makes this metallic plate have group's Pu 11 base plates and absorber plate function concurrently.

In addition, consulting the 4th figure is the present invention's second embodiment, present embodiment is similar to the basic comprising of first embodiment, only, base 10a is different with the thickness of radiator 20a, this base 10a is thick than radiator 20a, so that the fan 30 of radiator 20a can be set up on the base 10a, by fan 30 brushes the fin (figure does not draw) on the radiator 20a heat is shed, thereby constitute a thickness near consistent integral liquid cooling heat radiator, more can make full use of product confined space performance high cooling efficiency.

Claims

1. integral liquid cooling heat radiator, comprise: a gang of Pu is set in the base, and this bottom surface, group Pu is provided with an absorber plate, and a heat radiation system with radiator is arranged on the base.

2. integral liquid cooling heat radiator according to claim 1, the absorber plate that the base of wherein ccontaining this group Pu and this absorber plate and high heat conducting material are made reaches sealing.

3. integral liquid cooling heat radiator according to claim 1, wherein in this base an accommodation chamber is set, be respectively equipped with two parallel first collecting tray and second collecting traies in accommodation chamber two sides, these two collecting traies be opening up, radiator two sides of this radiator have first reservoir and second reservoir, and this two reservoirs opening is corresponding with the opening of collecting tray and be connected.

4. as the integral liquid cooling heat radiator as described in the claim 3, wherein be provided with between the accommodation chamber in this base and two collecting traies and be connected, the channel that exchanges mutually as cooling liquid.

5. as the integral liquid cooling heat radiator as described in the claim 4, wherein these group Pu two sides goes into, exports to be located at respectively with respect in being connected of first collecting tray and second collecting tray, the going into of this group Pu, export each and fill up piece with one and be fixed in this and two connect in road, make this two collecting tray become the groove that converges that cooling fluid goes into, exports into and out of the group Pu.

6. integral liquid cooling heat radiator according to claim 1, wherein the side of this base is established an attaching clamp with plural fixing hole respectively, gives in fixing by the locked instrument that is arranged in this fixing hole.

7. as the integral liquid cooling heat radiator as described in the claim 6, wherein this locked instrument is formed by spring, screw and C shape ring.

8. integral liquid cooling heat radiator, mainly on a base, be provided with a radiator, the one group Pu with absorber plate function is set in this base, two sides are respectively equipped with first and second collecting tray in base, its opening up, this radiator has first reservoir and second reservoir that radiator and this radiator are included in radiator two sides, and its opening is corresponding with the opening of collecting tray down and be connected.

9. as the integral liquid cooling heat radiator as described in the claim 8, wherein the bottom enclosure at this group Pu adopts thermal conductivity good metal plate to make, make this metallic plate have group Pu base plate and absorber plate function concurrently, can make the cooling fluid of the absorber plate of flowing through directly be pressed close to the rapid migration radiator in group Pu of absorber plate.

10. as the integral liquid cooling heat radiator as described in the claim 9, wherein ccontaining should group Pu and the base of this absorber plate, the absorber plate made from high heat conducting material reaches sealing.

11. as the integral liquid cooling heat radiator as described in the claim 8, the accommodation chamber of a ccontaining group Pu and this absorber plate is set in this base wherein, first collecting tray and second collecting tray are arranged on two sides of accommodation chamber.

12. as the integral liquid cooling heat radiator as described in the claim 11, wherein be provided with between the accommodation chamber in this base and two collecting traies and be connected, the channel that exchanges mutually as cooling liquid.

13. as the integral liquid cooling heat radiator as described in the claim 12, wherein these group Pu two sides goes into, exports to be located at respectively with respect in being connected of first collecting tray and second collecting tray, the going into of this group Pu, export each and fill up piece with one and be fixed in this and two connect in road, make this two collecting tray become the groove that converges that cooling fluid goes into, exports into and out of the group Pu.

14. as the integral liquid cooling heat radiator as described in the claim 8, wherein the side of this base is established an attaching clamp with plural fixing hole respectively, gives in fixing by the locked instrument that is arranged in this fixing hole.

15. as the integral liquid cooling heat radiator as described in the claim 14, wherein this locked instrument is formed by spring, screw and C shape ring.