CN1921743A - Integrated liquid cooling heat abstractor - Google Patents

Integrated liquid cooling heat abstractor Download PDF

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Publication number
CN1921743A
CN1921743A CN 200510036847 CN200510036847A CN1921743A CN 1921743 A CN1921743 A CN 1921743A CN 200510036847 CN200510036847 CN 200510036847 CN 200510036847 A CN200510036847 A CN 200510036847A CN 1921743 A CN1921743 A CN 1921743A
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CN
China
Prior art keywords
radiator
group
liquid cooling
reservoir
cooling heat
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Granted
Application number
CN 200510036847
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Chinese (zh)
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CN100493316C (en
Inventor
刘泰健
杨志豪
童兆年
侯春树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Application filed by Fuzhun Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Fuzhun Precision Industry Shenzhen Co Ltd
Priority to CNB2005100368476A priority Critical patent/CN100493316C/en
Publication of CN1921743A publication Critical patent/CN1921743A/en
Application granted granted Critical
Publication of CN100493316C publication Critical patent/CN100493316C/en
Expired - Fee Related legal-status Critical Current
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Abstract

The invention relates to an integrated liquid-cooling heat radiator, which comprises a pump, a heat adsorption groove, a heat radiator, and a liquid storage groove. Wherein, it uses the heat adsorption groove and the base containing the hollow forming element of heat adsorption groove, and the heat radiator formed by pump, heat radiator and liquid storage groove. The invention can avoid any fitting tube, to simplify the structure and support installment.

Description

Integral liquid cooling heat radiator
[technical field]
The present invention system via the design of component moduleization, can make up required integral liquid cooling heat radiator about a kind of heat abstractor according to real space.
[background technology]
Fast development along with electronics and information industry, the high-tech electronic product is just towards more frivolous small and exquisite, many merit, computing trend development fast, the system radiating load is continued to increase, also under electronic building brick operation frequency and the continuous lifting of function, make its heat that disengages also more and more high, the performance of serious threat electronic building brick and stability, even Yin Gaowen and burn these expensive electronic building bricks; Directly influence the life-span and the running quality of electronic building brick based on the good and bad  of heat abstractor, must to heat generating component itself and product systems are carried out effectively and heat radiation fast.
Only, known techniques is to stack the forced air-cooled heat abstractor of aluminium extruded type radiator and fan on the central processing unit, to be difficult to satisfy the radiating requirements that high-frequency high-speed electronic building brick and production development are come in the end; Though and the heat dissipation of known liquid-cooling heat radiator is better than forced air-cooled heat abstractor, but also because to constitute four basic modules (group Pu, heat absobing channel, reservoir and radiator) of this system independent separately and must be communicated with one by one with pipe fitting, so that the entire heat dissipation device takes up room greatly, is difficult for according to the existing small space configuration of product; And avoid the curved obstruction of pipe fitting pleat when installing, often must be configured as complicated 3D shape, consequently increase the degree of difficulty on the processing procedure with the hard pipe fitting for the cooperation small space; Also, not only assemble complicated consuming time taking a lot of work, and, cause heat dissipation to reduce because pipe arrangement has consumed a certain proportion of lift in group Pu because pipe fitting and joint number are many; More increase the risk that cooling fluid is leaked and reliability reduces owing to the joint number; Again owing to all need each partly individual processing, not only operate and loaded down with trivial details and consuming timely take a lot of work and increase cost in the installation of computer system and dismounting; Above-mentioned shortcoming is unfavorable for cost reduction, heat dispersion improvement, reliability lifting, space utilization, dismounting and volume production processing procedure, therefore, is necessary present liquid cooling heat radiation system is made improvements.
[summary of the invention]
The base that empty drip molding is formed among this is necessary to provide by heat absobing channel and ccontaining this heat absobing channel in fact, with be positioned at the direct combination of radiator that base top is integrated and is formed by group Pu, radiator and reservoir, because any pipe arrangement of tool does not become the integral liquid cooling heat radiator once modularized design.
Be necessary in fact to provide by helping Pu radiator and reservoir to be combined into the design means of a radiator at this, reach the effect that further enhance heat cools off, simplifies system configuration.
By the technological means of the structure of further understanding the present invention, utilization is promptly expected the effect of reaching, now lift several preferred embodiments and cooperate diagram to be described in detail as follows, believe the present invention's goal of the invention, feature and other characteristics, when can going deep into therefrom and concrete understanding.
[description of drawings]
Fig. 1: be to see schematic perspective view outside the embodiment of the invention.
Fig. 2: the three-dimensional exploded view that is the embodiment of the invention.
Fig. 3: another  degree three-dimensional exploded view that is the embodiment of the invention.
Fig. 4: the base schematic perspective view that is the embodiment of the invention.
Fig. 5: the cutaway view that is embodiment of the invention radiator.
Fig. 6: another embodiment schematic diagram that is base of the present invention and absorber plate.
[embodiment]
Please refer to Fig. 1 to Fig. 6, liquid-cooling heat radiator of the present invention comprises a gang of Pu 15, pressurize in the cavity at group Pu by the wheel blade that rotates, impel the coolant flow circulation in this heat abstractor, one heat absobing channel 11, it is a cavity that can supply cooling fluid to pass through, the heat-absorbent surface of its bottom is close to the heating face of heat generating component in order to absorb the heat of heat generating component, one radiator 21, shed by brushing of fan (figure does not show) from the cooling fluid heat that heat absobing channel 11 imports in the liquid-cooling heat radiator in order to , and first, two reservoirs 22,23, make it reach certain storage in order to the cooling fluid that stores in this heat abstractor, and as supplying the cooling fluid runner pipe 210 of coolant flow going in this radiator 21, the cross over pipe of the port of export makes the heat radiation load that is dispensed to each cooling fluid runner pipe even.
One heat absobing channel 11 is set in this base 10, be respectively equipped with first collecting tray 121 and second collecting tray 122 in base 10 2 sides, these two collecting traies be opening outwardly, and between heat absobing channel 11 and two collecting traies, respectively be provided with and be connected 101, the passage that exchanges mutually as cooling liquid, the ccontaining group Pu 15 of being somebody's turn to do in first collecting tray 121 of this base 10, two sides of the Pu l5 of this group be respectively equipped with into, outlet 151,152, and the inlet 151 at this group Pu 15 with one fill up piece 153 be fixed in make in first collecting tray 121 this first collecting tray 121 become cooling fluid enter group Pu 15 inlet 151 converge groove.
Heat absobing channel 11 be one have into, the heat absorption cavity that outlet is passed through for cooling fluid, the runner 111 of the cooling fluid that is evenly distributed also can be set, this runner 111 can be formed by the dividing plate 112 of standard cooling fluid flow path, runner 111 belows of this cooling fluid are provided with the absorber plate l3 of a high heat-transfer metal making and the heating face of heat generating component closely contacts, and in contact-making surface adding hot interface material (TIM), heat with abundant absorption heat generating component generation, and by runner 111 by being evenly distributed, cooling fluid is kept somewhere in the time of heat absobing channel 11 lengthening, with and the bigger area of dissipation that provided, reach the effect that strengthens hot transfer efficiency: runner 111 versions of this heat absobing channel 11 comprise the level and smooth wall (shown in Fig. 4) of Clothoid type or rotary type runner, also or make the wall of these runners have rough heat to pass and strengthen structure, the former has the characteristic of low flow resistance, the latter has increases the characteristic that the flow field local dip strengthens hot transfer efficiency: the circle of the shape of this absorber plate 13 in diagram, can also cooperate the situation of heat generating component to adopt other shape: this runner 111 can adopt integrally formed processing procedure with hollow forming spare, this runner 31 also can be located at (as shown in Figure 6) on the absorber plate 30, the heat absobing channel 41 of this base 40 only is a cistern, need not to be provided with runner, this absorber plate 30 directly is placed in the heat absobing channel 41, can reaches the characteristic of flow resistance equally.Under this heat absobing channel 11 side this ccontaining absorber plate 13 can be affixed on the heat generating component, for reaching the demand of simplifying processing and reducing cost, the base 10 of ccontaining this absorber plate 13 can also adopt a kind of material that is easy to be shaped, for example plastics, PE, ABS etc. make by forming modes such as ejaculation, punching press, casting or machinings, and absorber plate 13 lockings made from high heat conducting material or the gummed purpose that reaches sealed against leakage.
In addition, flange 16 is set, combines, form the structure of agreeing with of base 10 and radiator 20, strengthen the integrative-structure of base 10 and radiator 20 with these radiator 20 bottom peripheral edge at the lateral margin of this base 10.The side of this base 10 is provided with the attaching clamp 17 with plurality of fixed hole 171 respectively, and setting can be arranged in the locked instrument 18 of this fixing hole 171, this locked instrument 18 is the device of being made up of spring 181, screw 182 and C shape ring 183 or fastener etc., reach and make things convenient for  the present invention to be fixed in motherboard and casing, and simultaneously absorber plate 13 and heat generating component are located, and are made its close thermal contact.
Radiator 20 is to be arranged on the base 10, this radiator 20 is made up of radiator 21 and first reservoir 22 and second reservoir 23 that are positioned at two sides of radiator 21, this two reservoir 22, the opening of 23 opening and two collecting traies 121,122 is corresponding and interconnect, and respectively is provided with flange 24 at the reservoir opening part, make by flange 24, the opening driving fit of the opening of this two reservoir 22,23 and two collecting traies 121,122.In addition, in this first reservoir 22, be provided with an accommodation chamber 25, but  group Pu 15 be placed in the accommodation chamber 25, and correspond to opening part at accommodation chamber 25 and be provided with an inlet 26, wear for the outlet 152 at group Pu 15.
Being integrated of the group Pu 15 and first reservoir 22, then be by near opening part one accommodation chamber 25 being set in first reservoir 22, group Pu 15 be located in it and the inlet 151 by group Pu 15 and outlet 152 reach the effect of circulation of fluid respectively with the cooling fluid in first reservoir 22; Wherein, the inlet 151 at group Pu 15 is arranged in supporting seat 153 and uses fixing seal in the opening near first collecting tray 121, the outlet 152 at group Pu 15 be arranged in accommodation chamber 25 inlet 26 and with first reservoir, 22 UNICOMs, integrate with the outlet 152 at group Pu 15 in the fluid passage that makes first reservoir, 22 openings.
During this creation operation, coat hot interface material (figure does not draw) between elder generation's  absorber plate 13 and the heat generating component, and motherboard and casing are fixed in 18  the present invention by locked instrument, and  absorber plate 13 is located with heat generating component simultaneously, and make its close thermal contact, the heat transferred that makes the heat generating component generation is to absorber plate 13, and by runner 111 by being evenly distributed, cooling fluid is kept somewhere in the time of heat absobing channel 12 lengthening, with and the bigger area of dissipation that provided, reach the effect that strengthens hot transfer efficiency, reach the cooling fluid of helping in the Pu 15 via first collecting tray 121 again, the cooling fluid of this high enthalpy value (enthalpy) is by 15 pressurizations of group Pu, impel coolant flow circulation of the present invention, the heat that  imports cooling fluid into directly imports radiator 21 via first reservoir, 22 backs, the  heat sheds by the fin on the radiator 21, the cooling fluid of low heat enthalpy value of leaving radiator 21 this moment imports absorber plate 13 heat absorptions of heat absobing channel 12 belows after via second reservoir 23 and second collecting tray 122 once again, so goes round and begins again to constitute a cooling system that drives liquid circulation.
Above-mentioned group Pu and the relevant structure that is placed in first reservoir also can change in group's Pu accommodation chamber of being located at second reservoir, reach along the purpose of same loop direction (i.e. counter clockwise direction), that is the outlet (i.e. the opening of second collecting tray) at  group Pu and the inlet wall that connects second collecting tray of heat absobing channel respectively and be arranged in this group Pu accommodation chamber makes by helping the Pu to have that the cooling fluid of low heat enthalpy value is first to be derived by second reservoir, and make it enter the heat absorption of heat absobing channel  heat generating component and become cooling fluid with high enthalpy value, import each pipeline of radiator via first reservoir and shunting again and the  heat sheds, the heat that above-mentioned cooling fluid with low heat enthalpy value enters heat absobing channel  heat generating component once again effectively imports this liquid-cooling heat radiator into, reaches the purpose of efficiently radiates heat; In like manner, above-mentioned this group Pu that is installed in first reservoir or second reservoir, the direction of its inlet and outlet also can be arranged to reach identical cool cycles radiating effect with aforementioned opposite direction (being clockwise direction); That is the group Pu outlet wear a supporting seat, and use fixing seal in the approaching wherein opening of a collecting tray, the inlet at group Pu then be arranged in accommodation chamber inlet and with corresponding reservoir UNICOM, the inlet at the fluid passage that makes this reservoir opening and group Pu integrates.

Claims (13)

1. integral liquid cooling heat radiator, it comprises: a base, ccontaining absorber in it; One radiator; This radiator have radiator with at the reservoir of radiator two sides and the group Pu in reservoir, and in the base combination; It is characterized in that: an accommodation chamber is set in this reservoir, is placed in the reservoir for this group Pu.
2. integral liquid cooling heat radiator according to claim 1, the base of wherein ccontaining this absorber is for a kind of material that is easy to be shaped.
3. integral liquid cooling heat radiator according to claim 1 wherein is respectively equipped with two collecting traies in absorber two sides, these two collecting traies be opening outwardly, this two reservoirs opening and the corresponding connection of the opening of two collecting traies.
4. as the integral liquid cooling heat radiator as described in the claim 3, wherein this reservoir opening part respectively is provided with flange, makes the reservoir opening and corresponding to the opening driving fit of collecting tray by flange.
5. as the integral liquid cooling heat radiator as described in the claim 3, wherein be provided with between the absorber in this base and two collecting traies and be connected, the passage that exchanges mutually as cooling liquid.
6. as the integral liquid cooling heat radiator as described in the claim 3, wherein these group Pu two sides have into, the outlet, inlet at the group Pu wears a supporting seat, and use fixing seal in the approaching wherein opening of a collecting tray, the outlet at group Pu then be arranged in accommodation chamber inlet and with corresponding reservoir UNICOM, integrate with the outlet at group Pu in the fluid passage that makes this reservoir opening.
7. as the integral liquid cooling heat radiator as described in the claim 3, wherein these group Pu two sides have into, the outlet, outlet at the group Pu wears a supporting seat, and use fixing seal in the approaching wherein opening of a collecting tray, the inlet at group Pu then be arranged in accommodation chamber inlet and with corresponding reservoir UNICOM, the inlet at the fluid passage that makes this reservoir opening and group Pu integrates.
8. integral liquid cooling heat radiator according to claim 1, wherein this absorber is one to have the heat absorption cavity that passes through for cooling fluid into, outlet, the cooling liquid flowing channel that is evenly distributed is set in it, this runner can be formed by the dividing plate of standard cooling fluid flow path, the runner below of this cooling fluid is provided with the absorber plate of a high heat-transfer metal making and the heating face of heat generating component closely contacts, and in contact-making surface adding hot interface material, with the heat of abundant absorption heat generating component generation.
9. as the integral liquid cooling heat radiator as described in the claim 8, wherein this runner can be located on the absorber plate, also can adopt integrally formed processing procedure with base.
10. as the integral liquid cooling heat radiator as described in the claim 9, the runner version of this absorber comprises the level and smooth wall of Clothoid type or rotary type runner, also or make the wall of these runners have rough heat to pass and strengthen structure.
11. integral liquid cooling heat radiator according to claim 1, wherein the lateral margin of this base is provided with flange, combines with this radiator bottom peripheral edge, forms the structure of agreeing with of base and radiator, strengthens the integrative-structure of base and radiator.
12. integral liquid cooling heat radiator according to claim 1, wherein the side of this base is established an attaching clamp with plural fixing hole respectively, gives fixing by the locked instrument that is arranged in this fixing hole.
13. as the integral liquid cooling heat radiator as described in the claim 12, wherein this locked instrument is included as one of spring, screw, C shape ring and fastener etc.
CNB2005100368476A 2005-08-25 2005-08-25 Integrated liquid cooling heat abstractor Expired - Fee Related CN100493316C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB2005100368476A CN100493316C (en) 2005-08-25 2005-08-25 Integrated liquid cooling heat abstractor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2005100368476A CN100493316C (en) 2005-08-25 2005-08-25 Integrated liquid cooling heat abstractor

Publications (2)

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CN1921743A true CN1921743A (en) 2007-02-28
CN100493316C CN100493316C (en) 2009-05-27

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102883590A (en) * 2012-10-19 2013-01-16 郑宏杰 Heat exchanger and water pump integrated water-cooling radiator
CN104201158A (en) * 2014-08-28 2014-12-10 中国电子科技集团公司第二十九研究所 Integrated cooling device of silicon-based micro-channel radiator
CN108566768A (en) * 2018-06-01 2018-09-21 深圳市研派科技有限公司 A kind of no pipe liquid cooling heat radiation system
CN108808525A (en) * 2018-07-03 2018-11-13 马伟超 A kind of outdoor electric cabinet based on optimization wiring technique
CN110494023A (en) * 2019-09-16 2019-11-22 合肥天鹅制冷科技有限公司 A kind of liquid cooling equipment suitable for multi-model
WO2019232813A1 (en) * 2018-06-03 2019-12-12 东莞昂湃实业有限公司 Integrated liquid cooling system

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102883590A (en) * 2012-10-19 2013-01-16 郑宏杰 Heat exchanger and water pump integrated water-cooling radiator
CN104201158A (en) * 2014-08-28 2014-12-10 中国电子科技集团公司第二十九研究所 Integrated cooling device of silicon-based micro-channel radiator
CN108566768A (en) * 2018-06-01 2018-09-21 深圳市研派科技有限公司 A kind of no pipe liquid cooling heat radiation system
WO2019227531A1 (en) * 2018-06-01 2019-12-05 深圳市研派科技有限公司 Pipeless liquid-cooled heat dissipation system
WO2019232813A1 (en) * 2018-06-03 2019-12-12 东莞昂湃实业有限公司 Integrated liquid cooling system
CN108808525A (en) * 2018-07-03 2018-11-13 马伟超 A kind of outdoor electric cabinet based on optimization wiring technique
CN108808525B (en) * 2018-07-03 2019-12-10 广东电网有限责任公司电力科学研究院 Outdoor electric power cabinet based on optimize wiring technology
CN110494023A (en) * 2019-09-16 2019-11-22 合肥天鹅制冷科技有限公司 A kind of liquid cooling equipment suitable for multi-model

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Granted publication date: 20090527

Termination date: 20110825