CN1908063A - High dielectric organic/inorganic blending material composition with flexibility and high heat endurance and hardening material thereof - Google Patents
High dielectric organic/inorganic blending material composition with flexibility and high heat endurance and hardening material thereof Download PDFInfo
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- CN1908063A CN1908063A CN 200510088767 CN200510088767A CN1908063A CN 1908063 A CN1908063 A CN 1908063A CN 200510088767 CN200510088767 CN 200510088767 CN 200510088767 A CN200510088767 A CN 200510088767A CN 1908063 A CN1908063 A CN 1908063A
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Abstract
the invention discloses an organic/inorganic mixing material composition with flexible, high-temperature dielectric adhering layer, which comprises the following parts: (a) epoxide resin system with high glass transmitting temperature (Tg); (b) strong dielectric ceramic powder with two or more grain distributions, wherein one grain distribution is nanometer powder; (c) conductive powder, such as conductive carbon black; (d) at least one macromolecular flexibilizer; (e) macromolecular disperser; (f) other addictive, such as diluent, adhesion promoter, hardener, hardening accelerator and organic solvent.
Description
Technical field
The invention relates to a kind of high dielectric organic/inorganic and blend together material composite, it can be used for preparing a high dielectric tie coat (bonding layer) with flexibility, high heat resistance.
Background technology
U.S. Patent Publication US2002/0048137A1 case has disclosed an a kind of electric capacity paper tinsel (capacitor foil) that is used to make two-layer embedded electric capacity (two-layered embedded capacitor), comprise a conductive layer and be formed at the part sclerosis tie coat (bondinglayer) that has high-k on this conductive layer, wherein this tie coat is formed by the Resins, epoxy that is added with capacitive character ceramic powder (capacitive ceramicparticles).The tie coat of this electric capacity paper tinsel is fitted in a substrate with style Copper Foil, can prepare the printed circuit board (PCB) intermediates with embedded electric capacity, wherein this style Copper Foil is a ground plane (ground plane) of this electric capacity, and this conductive layer is voltage plane (powerplane).
United States Patent (USP) discloses a kind of passive electrical goods (passive electricalarticle) No. 6274224, comprises the first layer substrate, second layer substrate and intervenient electrical isolation or the conductive layer that contains a polymkeric substance.One specific embodiment of this patent is embedded electric capacity, wherein uses one to be dispersed with the epoxy resin component of ceramic powder as the middle layer.The employed Resins, epoxy of this constituent can be mix (blend) of bis phenol-a epoxy resins with phenolic resin varnish (novolac epoxy), and ceramic powder can be barium titanate (barium titanate).The preparation method of this constituent can be with barium titanate powder, and an organic solution of Resins, epoxy and a dispersion agent are mixed together and prepare.What this dispersion agent was preferable is anionic dispersing agent, and a co-polymer of polyester and polyamines (polyamine) for example can be from ICI Americas, Wilmington, and Del., " Hypermer PS3 " buys with a trade(brand)name.The epoxy resin component of this patent still has the space that further is enhanced.
Disclose a kind of high dielectric polymer matrix material and manufacture method thereof U.S. Patent Publication the 2003/0006402nd A1 number.This high dielectric polymer matrix material has the specific inductivity greater than 200, and it comprises a fluoropolymer resin and conductive material, and wherein this conductive material can be powder, carbon black, carbon fiber or the graphite of the alloy of transition metal powder, transition metal.Yet the high dielectric polymer matrix material of this patent has very large dispersion factor (Dissipation factor), particularly frequency more than 1MHz, and too high to the frequency interdependence, does not have use value.And this patent application case is not illustrated thermotolerance, agglutinating value(of coal) and the processibility of this high dielectric polymer matrix material.Therefore, the space that further is enhanced is still arranged.
Summary of the invention
Emphasis of the present invention is being emphasized the material prescription technology that blendes together of macromolecule resin and ceramic powder, makes this material have high dielectric property, high heat resistance, good agglutinating value(of coal) and excellent processability (flexibility) etc. simultaneously.
Not mentioned but the considerable material prescription technology of case institute before the present invention will disclose, to solve the contingent problem of composite of Resins, epoxy/high dielectric ceramic powder/conductive material, to comprise the agglutinating value(of coal) problem improved between thermotolerance problem, fragility problem and Copper Foil, big dispersion factor and to process compatibility etc. with tradition (have) PCB processing procedure.The means that adopt comprise: 1) select suitable Resins, epoxy to form, come balance thermotolerance and agglutinating value(of coal) simultaneously; 2) fill a high dielectric property ceramic powder in the Resins, epoxy, improve the specific inductivity of composite, and size distribution at least two or more, and wherein must contain a kind of nano-powder, phase can be under the high dielectric characteristics of tool, adds can have good gummosis man-hour again to guarantee the quality of baseplate material; 3) Resins, epoxy and partly conductive powder body (surperficial tool functional group's carbon black) reaction form part epoxy and coat carbon black to reduce dispersion factor (Dissipation factor); 4) select suitable high-molecular type dispersing agent, can improve the low heat resistant of low molecule-type dispersiveness on the one hand, the soldering resistance of substrate particularly, also can significantly promote the future products reliability of applying on the one hand, its principle mainly is by special high-molecular type dispersing agent, can be attached to inorganic powder surface easily, have and organic resin between have good compatibility even a little reactivity, can effectively solve the shortcoming of low molecule-type dispersion agent; 5) the suitable softening agent of interpolation solves ceramic powder too much (in order effectively the to improve specific inductivity) substrate that causes and crosses the crisp shortcoming that can't process; And 6) add other additive to improve the viscosity problem or further to promote agglutinating value(of coal) in good time.Resulting high dielectric composite can be made and have high glass tansition temperature (Tg＞180 ℃) by traditional glass cloth impregnation mode, accurate coating technique or web plate/steel plate printing technology, and (＞4lb/in) the tie coat (bonding layer) of the good agglutinating value(of coal) of tool between Copper Foil.The embedded electric capacity that the present invention makes has specific inductivity 30～150 under the 1MHz frequency, and dispersion factor (Dissipation factor) is between 0.02～0.07.
A kind of organic/inorganic of finishing according to content of the present invention blendes together material composite, comprises:
A) epoxy resin system of a high Tg, it comprises the Resins, epoxy of array structure under the tool:
B) the last one dielectricity ceramic powder contains two or more particle size distribution range, and first particle size distribution range wherein is 1～100 nanometer, and one second particle size distribution range is 300 nanometers～5 micron; And
C) an electroconductibility powder.
Preferable, this electroconductibility powder comprises powder, carbon black or the carbon fiber of the alloy of transition metal powder, transition metal, and wherein this electroconductibility powder accounts for 0.01～20 weight % of the total solids composition of this constituent.Better, this electroconductibility powder is a carbon black.Best, this carbon black comprises the carbon black that an electrical conductivity Carbon black and a surface have carboxyl or hydroxyl.
Preferable, this strong dielectricity ceramic powder contains two kinds of main particle size distribution ranges, first particle size distribution range wherein is 50～100 nanometers, reaching second particle size distribution range is 0.3～5 micron, and the strong dielectricity ceramic powder of this first particle size distribution range accounts for 1～40 weight % of all strong dielectricity ceramic powders.
Preferable, this strong dielectricity ceramic powder accounts for 50～95 weight % of the total solids composition of this constituent.
Preferable, this strong dielectricity ceramic powder is BaTiO
3, SrTiO
3, Ba (Sr) TiO
3, or their implanted metal ion person.
Preferable, this epoxy resin system further comprises one or more Resins, epoxy that is selected from following group, and this group is by bis phenol-a epoxy resins, the cycloaliphatic epoxy resin, contain naphthalene nucleus Resins, epoxy, two benzyl ring epoxy resins, and phenolic varnish (Novolac) Resins, epoxy is formed.
Preferable, this epoxy resin system further comprises a kind of macromolecule dispersing agent.Better, this macromolecule dispersing agent is a polyester, polymeric amide, or their multipolymer, and this macromolecule dispersing agent accounts for 0.1～5.0 weight % of this constituent total solids composition.
Preferable, this epoxy resin system further comprises a kind of polymer softening agent.Better, this polymer softening agent is polyester (polyester), polymeric amide (polyamide), polyamide-imide (polyamide-imide), polyvinyl butyral (polyvinyl butyral), synthetic rubber, polycaprolactone (polycaprolactone), or fatty chain Resins, epoxy, and this polymer softening agent accounts for 0.5～20 weight % of this constituent total solids composition.
Preferable, this epoxy resin system further comprises a kind of thinner (diluent) or increases cakingagent (adhesion promoter).Better, this thinner or to increase cakingagent be shown below
Preferable, in this epoxy resin system further comprise a kind of stiffening agent, it can be polyamines (polyamine), phenolic resin (phenol resin) or acid anhydrides (acid anhydride).The consumption of this stiffening agent is about identical equivalent with this epoxy resin system.
Preferable, this high epoxy resin system further comprises a hardening accelerator.Preferable, this hardening accelerator accounts for 0.01～5 weight % of this stiffening agent.
Preferable, this epoxy resin system further comprises a kind of silicane coupler (Silane Couplingagent), to improve the dispersiveness of dielectricity ceramic powder in this constituent with compatible.Better, this silicane coupler is epoxy silane (epoxysilane) or amino containing silane (Aminosilane).
Preferable, this high epoxy resin system further comprises a catalyzer.Better, this catalyzer comprises the Phenylphosphine compound, and this catalyzer accounts for 0.01～5 weight % of the total solids composition of this constituent.
Preferable, this epoxy resin system further comprises a kind of organic solvent.
The present invention also provides a kind of hardened organic/inorganic to blend together material simultaneously, and it is to be formed by constituent sclerosis of the present invention.Preferable, this sclerosis is to be undertaken by this constituent of heating.Better, this heating is to carry out 2～6 hours in 160～200 ℃.Preferable, this contains the epoxy resin system of high Tg of catalyzer and the carbon black that this surface has carboxyl or hydroxyl reacted 3～6 hours in 100～130 ℃ before carrying out this sclerosis.
Embodiment
Main points of the present invention can be applicable to communication, information or the digital household appliances product of high-frequency high-speed promptly at the baseplate material of making high-k, low the scatter and disappear factor and high heat resistance (high Tg), comprise the manufacturing of embedded electric capacity.Employed raw material comprises the epoxy resin system of (a) high Tg; (b) the last one dielectricity ceramic powder contains two or more size distribution, and wherein must contain a kind of nano-powder; (c) carbon black, it can contain one or more dissimilar carbon blacks, comprise electrical conductivity Carbon black and have-COOH or-OH functional group's carbon black; (d) at least a polymer softening agent; (e) macromolecule dispersing agent; (f) for example initiator (initiator), thinner (diluent) of other additive increases cakingagent (adhesion promoter), catalyzer and organic solvent etc.
The program of making is as follows:
1. placing reactor to be heated to 90～95 ℃ Resins, epoxy and solvent makes it to dissolve fully.
2. Resins, epoxy after will dissolving adds an amount of carbon black, uses homogenizer high-speed stirring carbon blacks, disperses the back to add catalyzer temperature-elevating to 100～130 ℃, reacts 3～6 hours.
3. add an amount of stiffening agent and hardening accelerator, after treating fully to dissolve, add an amount of dispersion agent, softening agent and other additive again.
4. add the high dielectric powder of an amount of different big or small particle diameter ratios in above-mentioned solution, then high-speed stirring is even.The content of the high dielectric powder that is added accounts for 20～70 volume % or 50～95 weight % of total solids composition greatly, and big particle diameter (0.3～5 μ m) and small particle size (＜100nm) ratio is 100: 1～60: 40.
With the organic-inorganic mixture that obtains disperseing 12～36 hours with ball mill, can obtain finely disseminated composite masking liquid.
6. above-mentioned masking liquid is made substrate in order to electrical measurement, production method has following three kinds:
(1) glass cloth impregnation processing procedure: make glass cloth and masking liquid preimpregnation material earlier, via about three hours of 200 ℃ of pressing programs, can obtain copper clad laminate again.
(2) accurate coating process: first processing procedure gum Copper Foil (RCC) is pressed into copper clad laminate with itself and Copper Foil again.
(3) on substrate, print masking liquid by half tone/steel version printing process, metal cladding again behind pressing metal level or the high-temperature maturing (curing) again, and form substrate with upper/lower electrode.
7. the substrate that makes is after electrically measuring, and the different resulting dielectric constant values scope of forming part according to material is about 30～150 under the 1MHz frequency, and dispersion factor is about 0.02～0.07.
8. in the thermal properties test, except can testing by 288 ℃ anti-scolding tin, Tg is also 180～220 ℃ of scopes.
Typical feedstock used in the present invention is as follows:
◆ Resins, epoxy
Wherein n is 0～10;
(b) bis phenol-a epoxy resins (Diglycidyl ether of bisphenol A epoxy)
(c) tetrabormated bis phenol-a epoxy resins (Tetrabromo bisphenol A diglycidyl etherepoxy)
(d) cycloaliphatic epoxy resin (Cyclo aliphatic epoxy resin)
For example, two pentamethylene Resins, epoxy (dicyclopentadiene epoxy resin)
(e) contain naphthalene nucleus Resins, epoxy (Naphthalene epoxy resin)
(f) two benzyl ring epoxy resins (Diphenylene epoxy resin)
(g) phenolic resin varnish (Phenolic novolac epoxy resin)
(h) o-Hydroxytoluene Novolac (Novolac) Resins, epoxy (o-cresol Novolac epoxy resin)
◆ stiffening agent
(a) diamine (diamine): H
2N-R
1-NH
2
R
1Can be aromatic base, fatty group, cycloaliphatic base or contain the silane fatty group, for example
R
2:-, CH
2, SO
2, O, S, or C (CH
3)
2
R
3～R
10: H, CH
3, C
2H
5, C
3H
7, or C (CH
3)
3
(b) phenolic resin (phenol resin)
Resol (Phenolic resin)
For example
Aphthols resin (Naphthol based resin)
For example
Terpene resol (Terpene phenol resin)
Two pentamethylene resins (Dicyclopentadiene resin)
Four oxybenzene ethane (Tetra phenylolethane)
Four hydroxyl dimethylbenzene ethane (Tetraxylenol ethane)
◆ hardening accelerator
(a) positively charged ion is a catalyst
The wrong thing of boron trifluoride is as RNH
2BF
3, R
2NHBF
3, R
3NBF
3Deng, wherein R can be aromatic base, fatty group or cycloaliphatic base
(b) negatively charged ion is a catalyst
The coordination anion catalyst of tertiary amine, metal hydroxides, monoepoxide is as R
3N, NCH
2C-C (NH)-N (CH
3)
2Deng, wherein R can be aromatic base, fatty group or cycloaliphatic base
(c) imidazoles (Imidazole)
1-Methylimidazole (1-methylimidazole)
1,2 dimethylimidazole (1,2-dimethylimidazole)
2-pentadecyl imidazoles (2-heptadecylimidazole)
2-ethyl-4-methylimidazole (2-ethyl-4-methylimidazole)
◆ catalyzer
The Phenylphosphine compound
Triphenylphosphine (triphenylphosphine)
◆ carbon black
1. electrical conductivity Carbon black
2. the carbon black that has COOH or OH functional group
◆ inorganic filler
Be mainly strong dielectricity (Ferroelectric) ceramic powder of high dielectric, for example: BaTiO
3, SrTiO
3, Ba (Sr) TiO
3, implanted metal ionic BaTiO
3, SrZrO
3Deng
◆ softening agent
Can be applicable to softening agent of the present invention and comprise polyester (polyester), polymeric amide (polyamide), polyamide-imide (polyamide-imide), polyvinyl butyral (polyvinyl Butyral), synthetic chloroprene rubber (Carboxyl-Terminated Butadiene Acrylonitrile for example, CTBN), polycaprolactone (polycaprolactone, (R-[-O[-CO (CH
2)
5-O-]
n-]
f), fatty chain Resins, epoxy etc.
Fat chain Resins, epoxy:
More than these different sorts softening agents, owing to structurally difference makes the reactivity and the compatibility of itself and resin system that difference be arranged, gain to flexibility also has difference, therefore also can adopt and mix use-pattern and be embodied as gentle remollescent purpose, so that take into account processibility when making simultaneously and the thermotolerance of last copper clad laminate comprises soldering resistance and Tg temperature.
◆ dispersion agent
Adopt high-molecular type dispersing agent among the present invention, make itself and inorganic powder have good tack, and again and good compatible and a little reactivity is arranged between organic resin, can significantly promote the thermotolerance and the reliability of substrate.Spendable macromolecule dispersing agent includes copolymerization ester-acid amide, polyester or polymeric amide etc.
◆ other additive
Or amino containing silane (Aminosilane) etc.
The present invention will further be understood by the following example, these embodiment only as an illustration it, but not be used to limit the scope of the invention.
Embodiment
Embodiment and comparative example:
The use different material is formed, its content as shown in Table 1, embodiment 1 and 2 way at first add an amount of Resins, epoxy in reactor, comprise bis phenol-a epoxy resins (bisphenol-A diglycidylether) (Epoxy 1) (code name 188EL, Changchun resin company, TaiWan, China), tetrabormated bis phenol-a epoxy resins (tetrabromo disphenol-A diglcidyl ether) (Epoxy 2) (code name BEB-350, Changchun company, TaiWan, China), cycloaliphatic epoxy resin (cyclo aliphatic epoxy) (Epoxy 3) (code name HP-7200, DIC company, Japan), polyfunctional epoxy resin (Multifunctional epoxy) is (aforementioned epoxy resins (a) (Epoxy4), available from Nippon Kayaku K. K), add an amount of dimethyl formamide (dimethylformamide; DMF), then being heated to 90 ℃～95 ℃ dissolves Resins, epoxy fully.Resins, epoxy after the dissolving is added an amount of carbon black, and (code name that Degussa company produces is the carbon black of XE-2B, and the code name that Cabot company produces is the carbon black of M800, the weight ratio of these two kinds of carbon blacks is 1: 1), use homogenizer high-speed stirring carbon blacks, disperse the back to add triphenylphosphine 0.1 weight %, be warmed up to 105 ℃, reacted 4 hours.Add an amount of stiffening agent 4 again, 4 '-stretch methyldiphenylamine (4,4 '-Methylenedianiline) (ACROS company, the U.S.), and suitable hardening accelerator 2-ethyl-4-methylimidazole (2-Ethyl-4-methylimidazole) (ACROS company, the U.S.).When stiffening agent and hardening accelerator are dissolved in the epoxy resin solution fully, add an amount of high-molecular type dispersing agent Hypermer (Uniqema company again, the U.S.), and different softening agents such as polyvinyl butyral (polyvinylButyral) (PVB, Changchun resin company, TaiWan, China) (softening agent 1), CTBN (ZEON Chemical company, the U.S.) (softening agent 2) dissolve it fully and then reduce to room temperature.The high dielectric filler that adds an amount of different size particle diameters subsequently is (as BaTiO
3A:BaTiO
3Median size 0.8 μ m; BaTiO
3B:BaTiO
3Median size 60nm), even with high-speed stirring, form resin/BaTiO
3/ carbon black blendes together solution.
The solution that blendes together of comparative example 1 to 5 uses the step of similar embodiment 1 and 2 but adds according to the prescription of table one and gives preparation, wherein the carbon black of comparative example 4 for directly make an addition to resin not heat react with Resins, epoxy.
The solution that blendes together with the different compositions of different ratios that table one is prepared, use ball mill to disperse respectively, to disperse the formed organic/inorganic in back to blend together solution again uses scraper to coat on the Copper Foil, and heated baking is removed (100 ℃ of solvents, 3 hours), make it partially hardened (partially cure) and form so-called gum Copper Foil RCC (Resin Coated Copper), and respectively with these gum Copper Foils and Copper Foil high temperature pressing sclerosis (about 200 ℃ of pressing-in temp, 2.5 hour), form organic/inorganic and blend together copper foil base plate materials, test its rerum natura at last respectively, list in table two.
Table one
| Form | Comparative example 1 | Comparative example 2 | Comparative example 3 | Comparative example 4 | Comparative example 5 | Embodiment 1 | Embodiment 2 |
| Epoxy 1(g) | 7.22 | 6.63 | 7.73 | 8.28 | 8.90 | 8.28 | 8.00 |
| Epoxy 2(g) | 5.18 | 4.95 | 5.77 | 6.18 | 6.80 | 6.18 | 5.97 |
| Epoxy 3(g) | 1.05 | 1.04 | 1.21 | 1.30 | 1.92 | 1.30 | 1.26 |
| Epoxy 4(g) | 1.50 | 1.50 | 1.75 | 1.88 | 0 | 1.88 | 1.82 |
| Stiffening agent (g) | 3.78 | 3.42 | 3.99 | 4.28 | 4.1 | 4.28 | 4.14 |
| Hardening accelerator (g) | 0.06 | 0.06 | 0.06 | 0.07 | 0.07 | 0.07 | 0.07 |
| Dispersion agent (g) | 3.60 | 3.61 | 4.20 | 4.50 | 4.50 | 4.50 | 4.32 |
| Carbon black (g) | 0 | 0 | 0 | 0.88 | 0 | 0.88 | 1.71 |
| Softening agent 1 (g) | 0 | 0 | 0 | 1.50 | 1.50 | 1.50 | 0 |
| Softening agent 2 (g) | 0 | 1.00 | 1.41 | 0 | 0 | 0 | 1.45 |
| BaTiO 3 A(g) | 120.00 | 120.00 | 120.00 | 128.56 | 128.45 | 128.56 | 124.28 |
| BaTiO 3 B(g) | 0 | 0 | 20.00 | 21.43 | 21.41 | 21.43 | 20.72 |
Table two
| Characteristic | Comparative example 1 | Comparative example 2 | Comparative example 3 | Comparative example 4 | Comparative example 5 | Embodiment 1 | Embodiment 2 |
| Tg(℃) | 203 | 197 | 189 | 186 | 158 | 192 | 189 |
| Specific inductivity (1Mz) | 30.02 | 33.12 | 35.53 | 118.52 | 37.62 | 58.86 | 102.65 |
| Dispersion factor (1Mz) | 0.0232 | 0.0243 | 0.0252 | 0.152 | 0.0262 | 0.0287 | 0.042 |
| Stripping strength a) (lb/in) | 2.2 | 3.6 | 5.2 | 4.1 | 5.8 | 5.3 | 4.8 |
| Flexibility b) | Difference | Excellent | Excellent | Excellent | Excellent | Excellent | Excellent |
| PCB processing procedure processibility c) | Easily embrittlement | Well | Well | Well | Well | Well | Well |
| Soldering resistance d) | Do not survey | Failure | Qualified | Failure | Qualified | Qualified | Qualified |
A)Stripping strength is measured according to the IPC-650 method
B)Flexibility is assessed according to the IPC-650 method
C)Existing PCB processing procedure processing
D)Soldering resistance is at 2atm, and 110 ℃ are heated 2 hours down again in 288 ℃ of tests 3 minutes
Comparative example 1 and 2 uses the BaTiO of single kind of particle diameter
3, do not add BaTiO
3Nano-powder is at identical BaTiO
3Under the ratio, its processing procedure poor in processability and stripping strength (peeling strength) are all not good; If can add an amount of softening agent (comparative example 2), then can improve flexibility and processing procedure processibility, stripping strength is still not good only, mainly from due to the gummosis quantity not sufficient.The BaTiO of different-grain diameter
3Interpolation can increase BaTiO
3Tap density, improve specific inductivity, and because BaTiO
3The increase of nano-powder can improve the gummosis amount, increase and cohere, and soldering resistance also is enhanced in addition, can be by finding out in the comparative example 2,3.The important factor that certain Tg raises up is the selection of epoxy resin system, adds polyfunctional epoxy resin in principle and could significantly improve Tg.In addition, carbon black is for directly making an addition to resin not heat and Resins, epoxy reaction in the comparative example 4, and its dispersion factor is high a lot of than embodiment 1,2, can reduce the lost factor so carbon black and Resins, epoxy react in advance.
Learn by above result, obtain " the high dielectric organic/inorganic composite of high heat resistance " that a class has the well processed applicability, the high dielectric ceramic powder that must contain Resins, epoxy, carbon black, carbon black and the Resins, epoxy pre-reaction of high Tg, suitable softening agent, high-molecular type dispersing agent and at least two kinds of size in its prescription simultaneously, and wherein must contain a kind of nano-powder or the like, so just can make the baseplate material that a class really has the high dielectric of using value.
The present invention is described in, and person skilled in the art scholar still can make multiple variation and the modification that does not break away from following claim.
Claims (25)
1. an organic/inorganic blendes together material composite, comprises:
A) epoxy resin system of a high Tg, it comprises the Resins, epoxy of array structure under the tool:
Wherein n is 0～10;
B) the last one dielectricity ceramic powder contains two or more particle size distribution range, and first particle size distribution range wherein is 1～100 nanometer, and one second particle size distribution range is 300 nanometers～5 micron; And
C) an electroconductibility powder.
2. constituent as claimed in claim 1, wherein this electroconductibility powder comprises powder, carbon black or the carbon fiber of the alloy of transition metal powder, transition metal, and wherein this electroconductibility powder accounts for 0.01～20 weight % of the total solids composition of this constituent.
3. constituent as claimed in claim 2, wherein this electroconductibility powder is a carbon black.
4. constituent as claimed in claim 3, wherein this carbon black comprises the carbon black that an electrical conductivity Carbon black and a surface have carboxyl or hydroxyl.
5. constituent as claimed in claim 1, wherein this strong dielectricity ceramic powder contains two kinds of main particle size distribution ranges, first particle size distribution range wherein is 50～100 nanometers, reaching second particle size distribution range is 0.3～5 micron, and the strong dielectricity ceramic powder of this first particle size distribution range accounts for 1～40 weight % of all strong dielectricity ceramic powders.
6. as each described constituent in the claim 5, wherein this strong dielectricity ceramic powder accounts for 50～95 weight % of the total solids composition of this constituent.
7. as each described constituent in the claim 1, wherein this strong dielectricity ceramic powder is BaTiO
3, SrTiO
3, Ba (Sr) TiO
3, or their implanted metal ion person.
8. as each described constituent in the claim 1, wherein this epoxy resin system further comprises one or more Resins, epoxy that is selected from following group, this group is by bis phenol-a epoxy resins, the cycloaliphatic epoxy resin, contain naphthalene nucleus Resins, epoxy, two benzyl ring epoxy resins, and phenolic varnish (Novolac) Resins, epoxy is formed.
9. as each described constituent in the claim 1, wherein this epoxy resin system further comprises a kind of macromolecule dispersing agent.
10. constituent as claimed in claim 9, wherein this epoxy resin system further comprises a kind of polymer softening agent.
11. constituent as claimed in claim 10, wherein this epoxy resin system further comprises a kind of thinner (diluent) or increases cakingagent (adhesion promoter).
12. constituent as claimed in claim 10, wherein this epoxy resin system further comprises a kind of stiffening agent, and it is polyamines (polyamine), phenol resins (phenol resin) or acid anhydrides (acidanhydride).
13. constituent as claimed in claim 9, wherein this macromolecule dispersing agent is a polyester, polymeric amide, or their multipolymer, and this macromolecule dispersing agent accounts for 0.1～5.0 weight % of this constituent total solids composition.
14. constituent as claimed in claim 10, wherein this polymer softening agent is polyester (polyester), polymeric amide (polyamide), polyamide-imide (polyamide-imide), polyvinyl butyral (polyvinyl Butyral), synthetic rubber, polycaprolactone (polycaprolactone), or fatty chain Resins, epoxy, and this polymer softening agent accounts for 0.5～20 weight % of this constituent total solids composition.
15. constituent as claimed in claim 11, wherein this thinner or to increase cakingagent be shown below
16. constituent as claimed in claim 10, wherein this epoxy resin system further comprises a kind of silicane coupler (Silane Coupling agent), to improve the dispersiveness of dielectricity ceramic powder in this constituent with compatible.
17. constituent as claimed in claim 10, wherein this silicane coupler is epoxy silane (epoxysilane) or amino containing silane (Aminosilane).
18. constituent as claimed in claim 12, wherein this high epoxy resin system further comprises a hardening accelerator, and wherein this hardening accelerator accounts for 0.01～5 weight % of this stiffening agent, and the consumption and the identical equivalent of this epoxy resin system tool of this stiffening agent.
19. constituent as claimed in claim 4, wherein this high epoxy resin system further comprises the catalyzer of a Phenylphosphine compound, and this catalyzer accounts for 0.01～5 weight % of the total solids composition of this constituent.
20. constituent as claimed in claim 10, wherein this epoxy resin system further comprises a kind of organic solvent.
21. a hardened organic/inorganic blendes together material, it is by forming as each described constituent sclerosis in the claim 1 to 20.
22. hardened organic/inorganic as claimed in claim 21 blendes together material, wherein this sclerosis is to be undertaken by this constituent of heating.
23. hardened organic/inorganic as claimed in claim 22 blendes together material, wherein this heating is to carry out 2～6 hours at 160～200 ℃.
24. hardened organic/inorganic as claimed in claim 21 blendes together material, wherein this contains the epoxy resin system of high Tg of catalyzer of Phenylphosphine compound and the carbon black that this surface has carboxyl or hydroxyl reacted 3～6 hours in 100～130 ℃ before carrying out this sclerosis.
25. hardened organic/inorganic as claimed in claim 21 blendes together material, it has under the 1MHz frequency, and specific inductivity is 30～150, and dispersion factor is between 0.02～0.07, and high glass tansition temperature is between 170～230 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510088767 CN1908063A (en) | 2005-08-01 | 2005-08-01 | High dielectric organic/inorganic blending material composition with flexibility and high heat endurance and hardening material thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN 200510088767 CN1908063A (en) | 2005-08-01 | 2005-08-01 | High dielectric organic/inorganic blending material composition with flexibility and high heat endurance and hardening material thereof |
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| CN101550279B (en) * | 2008-04-01 | 2011-07-27 | 财团法人工业技术研究院 | Composition of organic/inorganic dielectric hybrid material with electrostatic discharge protective characteristic |
| US8138263B2 (en) | 2007-12-28 | 2012-03-20 | Industrial Technology Research Institute | Flexible, low dielectric loss composition and method for preparing the same |
| CN101503558B (en) * | 2008-02-04 | 2012-04-25 | 财团法人工业技术研究院 | Deflectivity and low dielectric loss composition and preparation thereof |
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| CN101503558B (en) * | 2008-02-04 | 2012-04-25 | 财团法人工业技术研究院 | Deflectivity and low dielectric loss composition and preparation thereof |
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| CN103547548A (en) * | 2011-03-23 | 2014-01-29 | 密苏里大学学监 | High dielectric constant composite materials and methods of manufacture |
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| CN103374202A (en) * | 2012-04-23 | 2013-10-30 | 富葵精密组件(深圳)有限公司 | Epoxy resin composite material, film and circuit board |
| CN103387736A (en) * | 2012-05-11 | 2013-11-13 | 富葵精密组件(深圳)有限公司 | Epoxy resin composite material and preparation method thereof |
| CN104870559B (en) * | 2012-11-09 | 2019-02-15 | Sika技术股份公司 | The polycarboxylic acid of epoxy resin is used for as dispersing agent |
| CN110193989A (en) * | 2019-07-09 | 2019-09-03 | 郭凯华 | Lithium battery heat-resistant fireproof self-heating Soft Roll material fabrication process |
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