CN1905220A - LED packaging structure - Google Patents
LED packaging structure Download PDFInfo
- Publication number
- CN1905220A CN1905220A CNA2005100895474A CN200510089547A CN1905220A CN 1905220 A CN1905220 A CN 1905220A CN A2005100895474 A CNA2005100895474 A CN A2005100895474A CN 200510089547 A CN200510089547 A CN 200510089547A CN 1905220 A CN1905220 A CN 1905220A
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- CN
- China
- Prior art keywords
- led
- carrier
- package structure
- light
- emitting diode
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15158—Shape the die mounting substrate being other than a cuboid
- H01L2924/15159—Side view
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- Led Device Packages (AREA)
Abstract
The invention is a LED packing structure, comprising a carrier and a LED chip, where the surface of the carrier is provided with an insulating layer and a conducting layer and is concave to compose a concave cup part, the bottom of the concave cup part rises to form a raised seat, the top surface of the raised seat is as high as or higher than the surface of the conducting layer; the LED chip is arranged on the top surface of the raised seat and has better light emitting and heat radiating effects; a packing resin seals and protects the LED chip, and a light collecting cover body is fixed on the carrier, corresponding to the packing resin.
Description
Technical field
The present invention refers to a kind of package structure for LED especially relevant for a kind of encapsulating structure, can promote the luminous and radiating effect of light-emitting diode.
Background technology
Because light-emitting diode (Light Emitting Diode, LED) have long useful life, and its power consumption is lower, especially under the surging gradually situation of present energy expenditure, light-emitting diode more is subjected to the attention and the utilization of industrial circle, so as to replacing other bigger luminescence component of power consumption in the past.
Seeing also shown in Figure 1ly, is a kind of generalized section of existing package structure for LED.Existing package structure for LED 1 includes: a carrier 11, a light-emitting diode chip for backlight unit 12 and a potting resin 13.Carrier 11 surfaces have an insulating barrier 111, and are provided with the conductive layer 112 that is made of the conducting wire at surface of insulating layer, and carrier surface constitutes a concave cup part 113 to lower recess; Light-emitting diode chip for backlight unit 12 is arranged at the bottom 114 of concave cup part 113, and other is provided with between two electrodes and conductive layer 112 that two leads 121 are connected in light-emitting diode chip for backlight unit 12; 13 sealed light emitting diode chips 12 of potting resin and lead 121 thereof.Light-emitting diode chip for backlight unit 12 is by its lead 121 and conductive layer 112 energisings, and by the end face of light-emitting diode chip for backlight unit 12 and around the side outwards emit beam.
But, above-mentioned existing package structure for LED 1, because its light-emitting diode chip for backlight unit 12 is located at the bottom 114 of concave cup part 113, the light that light-emitting diode chip for backlight unit 12 is launched is not except the light that its end face produced is understood directly the outwards emission because of hindered by concave cup part 113; Most of light that is produced by light-emitting diode chip for backlight unit 12 sides is more arranged in addition, can be via outwards emission after the reflection of concave cup part 113 inwalls 115, yet because the incidence angle and the angle of reflection of each position light have nothing in common with each other, therefore, in the middle of the advancing of light, can cause interference and produce loss incidence angle and other different light of angle of reflection angle, just its luminous flux be relatively poor.In other words, because the influence of reflection interference and loss, existing package structure for LED 1 is by its light-emitting diode chip for backlight unit 12 luminous luminous fluxes that produce, 90% outwards emission only can be arranged under the optimal cases, light partly is the mutual interference in reflection process and losing, thereby has reduced the outwards brightness of emission light of light-emitting diode chip for backlight unit 12.
Moreover, when light-emitting diode chip for backlight unit converts luminous energy to by electric energy when using, can produce heat and high temperature, during 1 ℃ of its every rising, the brightness of light-emitting diode chip for backlight unit will descend 0.9%, this shows that temperature-rise effect is very important to the influence of light-emitting diode luminance.
Above-mentioned existing package structure for LED 1, its light-emitting diode chip for backlight unit 12 is located at the bottom 114 of concave cup part 113 and is contacted each other, and therefore, the bottom 114 of concave cup part 113 and inwall 115 can be used as the surface area of light-emitting diode chip for backlight unit 12 heat radiations.It is limited that yet cooling surface area still belongs to, and therefore, its radiating effect still cannot not belong to clearly, also reduces the luminosity of light-emitting diode chip for backlight unit 12 relatively.
Summary of the invention
Main purpose of the present invention is to provide a kind of package structure for LED, can reduce reflection loss and preferable luminous flux is provided, and then promote illumination effect.
Another object of the present invention is to provide a kind of package structure for LED, and preferable thermal diffusivity can be provided, and then promotes illumination effect and increase useful life.
For reaching above-mentioned purpose, the invention provides a kind of package structure for LED, it includes a carrier and a light-emitting diode chip for backlight unit.This carrier surface has an insulating barrier, and be provided with a conductive layer at surface of insulating layer, carrier surface constitutes a concave cup part to lower recess, and the bottom of concave cup part swells upward and form a protruding seat, and the apical side height preferably of protruding seat is contour or is higher than the level height of conductive layer surface; And light-emitting diode chip for backlight unit is arranged at the end face of protruding seat.According to this, light-emitting diode chip for backlight unit end face and the light that is produced all around are not subjected to reflection loss to have preferable luminous flux because of reached by the concave cup part obstruction, thereby promote illumination effect; And, increased the cooling surface area of light-emitting diode chip for backlight unit with the surface area of protruding seat, and preferable thermal diffusivity is provided, and then promoted the illumination effect of light-emitting diode and increase useful life relatively.
For reaching above-mentioned purpose, the invention provides the package structure for LED of another embodiment, it includes: a carrier, a light-emitting diode chip for backlight unit and a potting resin.Carrier surface has an insulating barrier, and be provided with a conductive layer at surface of insulating layer, carrier surface constitutes a concave cup part to lower recess, and the bottom of concave cup part swells upward and form a protruding seat, and the apical side height preferably of protruding seat is contour or is higher than the level height of conductive layer surface; Light-emitting diode chip for backlight unit is arranged at the end face of protruding seat; Potting resin seals and the protection light-emitting diode chip for backlight unit.According to this, light-emitting diode chip for backlight unit end face and the light that is produced all around are not subjected to reflection loss to have preferable luminous flux because of reached by the concave cup part obstruction, thereby promote illumination effect; And, increased the cooling surface area of light-emitting diode chip for backlight unit with the surface area of protruding seat, and preferable thermal diffusivity is provided, and then promoted the illumination effect of light-emitting diode and increase useful life relatively.
For reaching above-mentioned purpose, the invention provides the package structure for LED of an embodiment again, it includes: a carrier, a light-emitting diode chip for backlight unit, a potting resin and an optically focused cover body.Carrier surface has an insulating barrier, and be provided with a conductive layer at surface of insulating layer, carrier surface constitutes a concave cup part to lower recess, and the bottom of concave cup part swells upward and form a protruding seat, and the apical side height preferably of protruding seat is contour or is higher than the level height of conductive layer surface; Light-emitting diode chip for backlight unit is arranged at the end face of protruding seat; Potting resin seals and the protection light-emitting diode chip for backlight unit; The optically focused cover body corresponds to potting resin and is fixedly arranged on carrier, in order to promote the optically focused effect.According to this, light-emitting diode chip for backlight unit end face and the light that is produced all around are not subjected to reflection loss to have preferable luminous flux because of reached by the concave cup part obstruction, thereby promote illumination effect; And, increased the cooling surface area of light-emitting diode chip for backlight unit with the surface area of protruding seat, and preferable thermal diffusivity is provided, and then promoted the illumination effect of light-emitting diode and increase useful life relatively.
Description of drawings
Fig. 1 is a kind of generalized section of existing package structure for LED.
Fig. 2 is the generalized section of the package structure for LED of first embodiment of the invention.
Fig. 3 is the generalized section of the package structure for LED of second embodiment of the invention.
Fig. 4 is the generalized section of the package structure for LED of third embodiment of the invention.
Description of reference numerals:
1 existing package structure for LED
11 carriers
111 insulating barriers
112 conductive layers
113 concave cup parts
114 bottoms
115 inner edges
12 light-emitting diode chip for backlight unit
121 leads
13 potting resins
2 package structure for LED of the present invention
21 carriers
211 insulating barriers
212 conductive layers
213 concave cup parts
214 bottoms
215 inner edges
216 protruding seats
217 end faces
Sidewall around 218
219 perforation
22 light-emitting diode chip for backlight unit
221 leads
23 potting resins
24 optically focused cover bodies
241 pins
242 internal faces
243 outside wall surface
Embodiment
For making your juror can further understand structure of the present invention, feature and effect thereof, show being described in detail as follows with accompanying drawing and preferred embodiment.
Seeing also shown in Figure 2ly, is the generalized section of the package structure for LED of first embodiment of the invention.As shown in the figure, package structure for LED 2 of the present invention includes a carrier 21 and a light-emitting diode chip for backlight unit 22.
Above-mentioned carrier 21 is the base material of high-cooling property, for example base material or alloys such as gold, silver, copper, tungsten, molybdenum, tin, zinc, indium, aluminium.Carrier 21 surfaces have an insulating barrier 211, and are provided with one by conductive layer 212 that the conducting wire constituted at surface of insulating layer; Carrier 21 surfaces constitute a concave cup part 213 to lower recess.These structures are with existing identical.But the present invention is further swelled upward in the bottom 214 of concave cup part 213 and is formed a protruding seat 216.The end face 217 height preferablies of protruding seat are contour or are higher than the level height on conductive layer 212 surfaces.
Above-mentioned light-emitting diode chip for backlight unit 22 is arranged at the end face 217 of protruding seat 216, and other is provided with between the conductive layer 212 that two leads 221 are connected in two electrodes of light-emitting diode chip for backlight unit 22 and carrier 21.Just, light-emitting diode chip for backlight unit 22 is connected with conductive layer 212 by lead 221, and when the circuit of conductive layer 212 was switched on, the side outwards emitted beam around light-emitting diode chip for backlight unit 22 can be reached by its end face.
And package structure for LED 2 of the present invention, because its light-emitting diode chip for backlight unit 22 is located at the end face 217 of protruding seat 216, improve light emitting source focal length point, and the height of end face 217 is higher than concave cup part 213, therefore, reach the light that the side produced all around by light-emitting diode chip for backlight unit 22 end faces, be not subjected to the obstruction of concave cup part 213 inwalls 215, and the reflection interference and the loss that are not subjected to concave cup part 213 inwalls 215, the loss that makes light-emitting diode chip for backlight unit 22 outwards launch light is reduced to minimum, and the raising luminous flux, thereby promote luminosity and effect.
Moreover, because the present invention wherein light-emitting diode chip for backlight unit 22 is located at the end face 217 of protruding seat 216 and contacts each other, therefore with end face 217 consecutive protruding seats 216 around sidewall 218, concave cup part 213 bottoms 214 and concave cup part 213 inwalls 215, the promptly common cooling surface area that forms light-emitting diode chip for backlight unit 22, cooling surface area is obviously more existing vast, thereby promote its thermal diffusivity, and then promote the illumination effect of light-emitting diode chip for backlight unit 22, and increase the useful life of light-emitting diode chip for backlight unit 22 relatively.
Fig. 3 is the generalized section of the package structure for LED of second embodiment of the invention.As shown in the figure, second embodiment of the invention has outside the structure identical with above-mentioned first embodiment, further is provided with a potting resin 23, and it is in order to sealing and protection light-emitting diode chip for backlight unit 22 and lead 221 thereof.The package structure for LED of second embodiment of the invention has illumination effect and the radiating effect identical with above-mentioned first embodiment.
Fig. 4 is the generalized section of the package structure for LED of third embodiment of the invention.As shown in the figure, the present invention the 3rd embodiment has outside the structure identical with above-mentioned second embodiment, further is provided with an optically focused cover body 24, and it is to correspond to potting resin 23 and be fixedly arranged on carrier 21.Optically focused cover body 24 can laminating type or chimeric mode be fixedly arranged on carrier 21.
With laminating type, optically focused cover body 24 with its bottom surface in for example deadlocked or bonding mode and with carrier 21 surface engagement.In chimeric mode, for example the bottom of optically focused cover body 24 is provided with a plurality of pins 241, and be equipped with a plurality of perforation 219 in corresponding carrier 21 positions, pin 241 penetrate from top to bottom and protrude in the perforation 219 surface below, and the pin end be heated melting and the sclerosis and fix with carrier 21 lower surfaces.
The top of above-mentioned optically focused cover body 24 has internal face 242 and outside wall surface 243, and inside and outside wall can be selected one by curved surface, parabola or sphere etc. and constitute, and has spotlight effect.And the package structure for LED of third embodiment of the invention has illumination effect and the radiating effect identical with above-mentioned first and second embodiment.
Though the present invention has borrowed above-mentioned preferred embodiment to be described in detail, and is above-described,, be not to be used for limiting scope of the invention process only in order to the present invention to be described, to make that knowing present technique person can be easier to understand the present invention.So all equalizations of doing according to described shape structural feature of claim scope of the present invention and spirit change and modify, and all should be contained in the claim protection range of the present invention.
Claims (10)
1. a package structure for LED is characterized in that, this package structure for LED includes:
One carrier, its surface has an insulating barrier, and is provided with a conductive layer at surface of insulating layer, and carrier surface constitutes a concave cup part to lower recess, and the bottom of concave cup part is swelled upward and formed a protruding seat; And
One light-emitting diode chip for backlight unit is arranged at the end face of protruding seat, and other is provided with between two electrodes and conductive layer that two leads are connected in light-emitting diode chip for backlight unit.
2. package structure for LED as claimed in claim 1 is characterized in that, described carrier is the base material of high-cooling property.
3. package structure for LED as claimed in claim 2 is characterized in that, described carrier is be selected from base materials such as gold, silver, copper, tungsten, molybdenum, tin, zinc, indium, aluminium or alloy wherein at least a.
4. package structure for LED as claimed in claim 1 is characterized in that, the end face of described protruding seat is contour or is higher than the level height of conductive layer surface.
5. package structure for LED as claimed in claim 1 is characterized in that described encapsulating structure further includes a potting resin, and this potting resin is sealed light emitting diode chip and these leads.
6. package structure for LED as claimed in claim 5 is characterized in that, described encapsulating structure further includes an optically focused cover body, and this optically focused cover body is to correspond to potting resin and be fixedly arranged on carrier.
7. package structure for LED as claimed in claim 6 is characterized in that, described snoot body fits in carrier.
8. package structure for LED as claimed in claim 7 is characterized in that, described optically focused cover body with its bottom surface in deadlocked or bonding mode and engage with carrier surface.
9. package structure for LED as claimed in claim 6 is characterized in that, described optically focused cover body is embedded in carrier.
10. package structure for LED as claimed in claim 9, it is characterized in that, the bottom of described optically focused cover body is provided with a plurality of pins, and be equipped with a plurality of perforation in corresponding carrier positions, pin penetrates from top to bottom and protrudes in the perforation surface below, and the pin end be heated melting and the sclerosis and fix with the carrier lower surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005100895474A CN1905220A (en) | 2005-07-29 | 2005-07-29 | LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005100895474A CN1905220A (en) | 2005-07-29 | 2005-07-29 | LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1905220A true CN1905220A (en) | 2007-01-31 |
Family
ID=37674413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2005100895474A Pending CN1905220A (en) | 2005-07-29 | 2005-07-29 | LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1905220A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101615644B (en) * | 2008-06-24 | 2010-11-10 | 陈永华 | Thin LED and manufacture method thereof |
| CN102185081A (en) * | 2011-04-07 | 2011-09-14 | 深圳市华星光电技术有限公司 | Light-emitting diode packaging structure |
| CN102646774A (en) * | 2011-02-18 | 2012-08-22 | 奇力光电科技股份有限公司 | Light emitting diode element and manufacturing method thereof |
| US8426873B2 (en) | 2011-04-07 | 2013-04-23 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | LED package structure |
| CN106129225A (en) * | 2016-08-26 | 2016-11-16 | 常州市武进区半导体照明应用技术研究院 | A kind of flexible LED light source of reconfigurable and preparation method thereof |
-
2005
- 2005-07-29 CN CNA2005100895474A patent/CN1905220A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101615644B (en) * | 2008-06-24 | 2010-11-10 | 陈永华 | Thin LED and manufacture method thereof |
| CN102646774A (en) * | 2011-02-18 | 2012-08-22 | 奇力光电科技股份有限公司 | Light emitting diode element and manufacturing method thereof |
| CN102185081A (en) * | 2011-04-07 | 2011-09-14 | 深圳市华星光电技术有限公司 | Light-emitting diode packaging structure |
| US8426873B2 (en) | 2011-04-07 | 2013-04-23 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | LED package structure |
| CN106129225A (en) * | 2016-08-26 | 2016-11-16 | 常州市武进区半导体照明应用技术研究院 | A kind of flexible LED light source of reconfigurable and preparation method thereof |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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