CN1901779A - Package substrate and electronic component packaging method - Google Patents
Package substrate and electronic component packaging method Download PDFInfo
- Publication number
- CN1901779A CN1901779A CNA2006101061370A CN200610106137A CN1901779A CN 1901779 A CN1901779 A CN 1901779A CN A2006101061370 A CNA2006101061370 A CN A2006101061370A CN 200610106137 A CN200610106137 A CN 200610106137A CN 1901779 A CN1901779 A CN 1901779A
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- Prior art keywords
- scolder
- mark
- electronic unit
- printing
- weld pad
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
To provide a packaging method of electronic parts which can suppress occurring of misregistration of electronic parts with low cost and short processing time. A printed circuit board 10 is prepared in which a circuit pattern is formed in the front surface, a packaging position mark 43 and printing portions 41, 42 for soldering on the lands 21, 22 are printed using a mask for solder printing, an electronic part 50 is mounted in a position corresponding to the printing portions 41, 42 for soldering on the basis of the packaging position mark 43, and it is subjected to the reflow processing.
Description
Technical field
The present invention relates to the mounting method of real dress substrate and electronic unit, be specifically related to weld (け is paid in half field) the dress substrate and packing technique in fact in fact of electronic unit.
Background technology
In recent years, along with the real dressization of the high density of the circuit substrate in the electronic equipment, the miniaturization of electronic unit constantly developed.Therefore, on circuit substrate, during real electronic parts, require high positional precision.
As the mounting method of electronic unit, be well known that and on printed wiring board, carry the method that electronic unit welds automatically.
Summary of the invention
To this, the object of the present invention is to provide a kind of following processing time of low cost short, can suppress the parts mounting method and the real dress substrate of circuit substrate of generation of the position deviation of electronic unit.
In order to solve above-mentioned problem, the 1st feature of the present invention is a kind ofly to have by forming from the teeth outwards, welded the real dress substrate of electronic unit above the circuit substrate of the wiring figure that constitutes with the high metal of the associativity of scolder, its main points are, form from the teeth outwards by the fixing weld pad of use of the scolder that constitutes with the wiring figure same material, scolder fixing with weld pad on the reality that constitutes by scolder of formation set a mark.
Also have, the 2nd feature of the present invention is that its main points are to possess: the operation that is ready to have formed from the teeth outwards the circuit substrate of wiring figure; On the surface of circuit substrate, to real set a mark and with the corresponding welding Printing Department of welding presumptive area, carry out the printing process of solder printing with mask with solder printing; And with real to set a mark be benchmark, with after electronic unit has been carried in the above-mentioned welding position corresponding with Printing Department, implement the connection operation of melt solder processing.
The invention related according to the 1st feature, can electron gain the real dress substrate that has been suppressed of position component departure.The invention related according to the 2nd feature can suppress the generation of the position deviation of electronic unit, and short mounting method of low-cost following processing time can be provided.
Description of drawings
Fig. 1 is the flow chart of the mounting method of the related electronic unit of expression embodiments of the present invention.
Fig. 2 is the vertical view of the printed wiring board that mounting method adopted of the related electronic unit of expression the 1st execution mode of the present invention.
Fig. 3 is the vertical view of the solder printing that mounting method adopted of the related electronic unit of expression the 1st execution mode of the present invention with mask.
Fig. 4 is illustrated in the vertical view that has carried out the state of solder printing in the mounting method of the related electronic unit of the 1st execution mode of the present invention on printed wiring board.
Fig. 5 is illustrated in the mounting method of the related electronic unit of the 1st execution mode of the present invention to have carried out having carried the vertical view of the state of electronic unit after the solder printing on printed wiring board.
Fig. 6 is illustrated in the mounting method of the related electronic unit of the 1st execution mode of the present invention to have carried on printed wiring board after the electronic unit, carries out reflow treatment and the vertical view of the real dress substrate made.
Fig. 7 is the A-A profile of Fig. 6.
Fig. 8 is the vertical view of the printed wiring board that mounting method adopted of the related electronic unit of expression the 2nd execution mode of the present invention.
Fig. 9 is the vertical view of the solder printing that mounting method adopted of the related electronic unit of expression the 2nd execution mode of the present invention with mask.
Figure 10 is illustrated in the vertical view that has carried out the state of solder printing in the mounting method of the related electronic unit of the 2nd execution mode of the present invention on printed wiring board.
Figure 11 is illustrated in the mounting method of the related electronic unit of the 2nd execution mode of the present invention to have carried out having carried the vertical view of the state of electronic unit after the solder printing on printed wiring board.
Figure 12 is illustrated in the mounting method of the related electronic unit of the 2nd execution mode of the present invention to have carried on printed wiring board after the electronic unit, carries out reflow treatment and the vertical view of the real dress substrate made.
Figure 13 is the B-B profile of Figure 12.
Figure 14 is the state of electronic unit has been carried in expression on the printed wiring board of having implemented solder printing according to the comparative example 1 of the mounting method of electronic unit a vertical view.
Figure 15 is illustrated in the vertical view of having implemented the state of reflow treatment in the comparative example 1 of mounting method of electronic unit.
Figure 16 is the stagger vertical view of state of scolder position of embodiment and comparative example 2 of expression.
Figure 17 is the vertical view of comparative example 2.
Figure 18 is the vertical view of embodiment.
Embodiment
Below, with reference to accompanying drawing the real details of adorning the mounting method of substrate and electronic unit that embodiments of the present invention are related is described.
(the 1st execution mode)
With Fig. 1～Fig. 7 the real mounting method of adorning substrate and electronic unit that the 1st execution mode is related is described.Herein, accompanying drawing is schematically, and the shape of the weld pad of wiring figure (circuitous pattern) (ラ Application De) portion, size etc. are inequality with the thing of reality, and the number of pad parts 21 has only been represented on the convenience of explanation a pair of.Also have, also comprise relation, the ratio part inequality of size each other at accompanying drawing to each other.
(real dress substrate)
At first, before the explanation of the mounting method of electronic unit, describe for the formation of real dress substrate 60 with Fig. 6 and Fig. 7.
As shown in Figure 6, the related real dress substrate 60 of present embodiment roughly constitutes to possess on the printed wiring board 10 as circuit substrate and connects with solder portion 41A, 42A, scolder mark 43A and various electronic unit 50.
Printed wiring board 10 possesses wiring figure (diagram is omitted), the alignment mark 23 of the circuit substrate that has formed according to circuit design on the surface of insulated substrate 11 and scolder is fixing constitutes with weld pad 24 (with reference to Fig. 7).
As insulated substrate 11, for example can adopt the rigid substrates that has flexible substrate, constitutes by preforming materials such as glass epoxy resins that constitutes by polyimides, liquid crystal polymer etc.
Connecting with solder portion 41A, 42A is the solder layer that has formed on the welding position (carrying out the pad parts of the real dress of parts) at not shown wiring figure, by means of fusion in reflow process scolder oneself's adjustment (セ Le Off ア ラ イ メ Application ト) ability and in position electronic unit 50 is connected on the wiring figure.
The solder printing benchmark of the location of mask when alignment mark 23 becomes on the wiring figure that connection is printed onto printed wiring board 10 with solder portion 41A, 42A.In addition, above-mentioned scolder is fixing is independent of alignment mark 23 and forms with weld pad 24.
And, scolder mark 43A is by being that the solder printing that benchmark has been positioned prints with mask with alignment mark 23, to be printed on scolder fixing with the thing above the weld pad 24, be by means of through above-mentioned reflow process and fusion the self-adjustment capability of scolder covered scolder with concentric shape ground and fixed the thing that has solidified with the state of weld pad 24.In addition, in the present embodiment, wiring figure for example forms copper clad patternsization, and scolder is fixing also to be formed with copper clad patterns with weld pad 24.Therefore, scolder mark 43A be in reflow process fusion state the time, scolder fixing with weld pad 24 with regard to become prevent fusion with the associativity height of scolder the structure that disperses of scolder.And, scolder fixing with weld pad 24 in solder solidification after also keep scolder mark 43A.In addition, this scolder is fixing also can be with copper forming with the high metal of solder bonds in addition with weld pad 24.
In having the real dress substrate 60 of above-mentioned formation, can be that benchmark comes solder printing is carried out position alignment with mask with alignment mark 23, can be with identical solder printing mask, be that benchmark carries out the real of electronic unit 50 and adorns with being connected the scolder mark 43A (state before the reflow process) that has been printed simultaneously with solder portion 41A, 42A.Promptly, the real dress of electronic unit 50 can be that benchmark carries out with scolder mark 43A (state before the reflow process), thereby with solder printing after be that the occasion of the real electronic parts 50 of benchmark is compared with alignment mark 23, can realize having reduced the real dress substrate 60 of position deviation.Therefore, it is effective possessing scolder mark 43A on the real dress substrate 60.
In addition, in the present embodiment, be illustrated, but, certainly the real dress substrate that has formed wiring figure in the two sides side be suitable for the present invention for the occasion that only on a side surface, has formed wiring figure.
(mounting method of electronic unit)
Secondly, describe for the mounting method of the related electronic unit of present embodiment with Fig. 1～Fig. 7.
In addition, the mounting method of the related electronic unit of present embodiment possesses the step S1～S4 shown in the flow chart of Fig. 1 and constitutes.
(1) at first, as shown in Figure 2, be ready to the printed wiring board 10 (step S1) of the circuit substrate that constitutes as on the surface of insulated substrate 11, forming wiring figure.In addition, a pair of pad parts 21,22 of representing wiring figure in the accompanying drawing for the purpose of simplifying the description and only.
As insulated substrate 11, for example can adopt the rigid substrates that has flexible substrate, constitutes by preforming materials such as glass epoxy resins that constitutes by polyimides, liquid crystal polymer etc.
As shown in Figure 2, in the present embodiment, the bight that faces toward each other on printed wiring board 10 has formed as the scolder alignment mark 23 of the 1st identification sign and scolder fixing with weld pad 24 respectively.This scolder alignment mark 23 and scolder are fixing to be to use and the wiring figure identical materials with above-mentioned pad parts 21,22 with weld pad 24, and for example Copper Foil forms.Scolder is fixing with weld pad 24, in order to prevent that the reality as the 2nd identification sign described later from setting a mark 43 and dispersing, gets final product so long as can catch the real size that sets a mark 43, can be less than scolder alignment mark 23.
In addition, the part beyond the pad parts on the wiring figure 21,22 is covered by not shown solder resist.Scolder alignment mark 23 can be covered by solder resist and also can not cover, and can't help the solder resist covering and scolder is fixing with weld pad 24.
(2) secondly, be ready to solder printing shown in Figure 3 mask (metal mask) 30.This solder printing with mask 30 with the corresponding position of pad parts 21,22 above the printed wiring board 10, formed solder printing peristome 31,32, fixing with the corresponding position of weld pad 24, formed and be used to print the real mark peristome 33 that sets a mark 43 with scolder.In addition, mark peristome 33 is fixed with scolder and is compared with weld pad 24 setting in the scope of suitable size of benchmark that a mark 43 be the location with real, and diameter dimension is set greatly.
Is such solder printing benchmark with mask 30 with the scolder alignment mark 23 above the printed wiring board 10, carries out position alignment and dispose (step S2) on printed wiring board 10.
(3) secondly, be used in the solder printing that disposed in the above-mentioned operation with mask 30, as shown in Figure 4, on the pad parts 21,22 of printed wiring board 10, print with the paste scolder and weld usefulness Printing Department 41,42.Simultaneously, also on fixing with weld pad 24, the above-mentioned scolder of printed wiring board 10 prints the real mark 43 (step S3) that sets with the paste scolder.At this moment, as shown in Figure 4, with respect to pad parts 21,22, it is fixing with weld pad 24 with respect to scolder to set a mark 43 in fact, and the possibility that produces position deviation is arranged in the scope of solder printing with the position alignment precision error of mask 30 with Printing Department 41,42 in welding.But, set in fact a mark 43 and compare with weld pad 24 with scolder is fixing, diameter dimension is set greatly, thereby has set for for solder printing with the position deviation in the scope of the position alignment precision of mask 30, can not depart from the fixing weld pad 24 of using of scolder.In addition, just in case the occasion that solder printing has produced with the position deviation of mask 30, because solder printing is used on the mask 30 at same solder printing with peristome 31,32 and mark peristome 33 and is formed, so be printed on the position deviation of printed wiring board 10 top welding just becoming equidirectional and same size with Printing Department 41,42 and the real position deviation that sets a mark 43.
(4) secondly, with real installation, as shown in Figure 5, it is configured to set a mark 43 with the reality that has been formed by the paste scolder is benchmark, is placing the outside terminal (diagram is omitted) of electronic unit 50 with the corresponding position of Printing Department 41,42 with above-mentioned welding.At this moment, electronic unit 50 have real installation with the real possibility that produces position deviation in the scope of position alignment precision error that a mark 43 is a benchmark that sets, but, be benchmark because set a mark 43, so can not depart from welding Printing Department 41,42 greatly with the reality that constitutes by scolder.
By the way, in existing mounting method, solder printing operation and real dress operation be independent separately, is benchmark with the scolder alignment mark 23 that has formed simultaneously with wiring figure, thereby solder printing position and real holding position have the possibility that produces position deviation in direction differing from each other.Therefore, in existing mounting method, the possibility of 2 times position deviation of the mounting method that produces present embodiment is arranged.
After this, implement reflow treatment, electronic unit 50 real being contained in above the pad parts 21,22 (step S4) as the melt solder processing.
Implemented the result of this reflow treatment, as mentioned above, even with respect to pad parts 21,22, welding more or less produces position deviation with Printing Department 41,42, fusion also contact pad portion 21,22 and soak expansion equably of scolder, welding is moved to the position of contact pad portion 21,22 equably respectively with Printing Department 41,42.As a result, welding as shown in Figure 6, is just carried out ego integrity (oneself adjusts) with Printing Department 41,42 on pad parts 21,22, fix as connecting with solder portion 41A, 42A.Accompany therewith, electronic unit 50 moves to the center of gravity (center) that connects with solder portion 41A, 42A by means of the effect of surface of molten solder tension force, carries out ego integrity (oneself adjusts) with respect to pad parts 21,22 to suitable position.Then, fusion solder cools, curing, thereby the real dress of electronic unit 50 finishes, real dress substrate 60 is finished.
In the operation of the lift-launch of above-mentioned electronic unit 50 and welding, setting a mark 43 in fact is printed on above the fixing usefulness of the scolder weld pad 24, even thereby just in case real set that a mark 43 becomes and the fixing state that more or less departs from weld pad 24 of scolder, also can be in fusion state under contact and carry out ego integrity (adjustment) with weld pad 24 equalizations with scolder is fixing.Then, set in fact a mark 43 like this in fusion state under move, solidify by cooling, become scolder mark 43A.Here, scolder is fixing to be that for example copper is formed by the metal high with solder bonds with weld pad 24, thereby scolder mark 43A can combine with weld pad 24 with scolder is fixing.Therefore, prevented that scolder mark 43A from dispersing to peripheral circuit with forms such as solder balls.
As mentioned above, mounting method according to the related electronic unit of present embodiment, positioning reference when the reality that has been formed by scolder is set a mark 43 as the real dress of electronic unit, thereby little with respect to welding with the position deviation of Printing Department 41,42, can be in welding with carrying electronic unit 50 above the Printing Department 41,42 really.Therefore, can realize to suppress the mounting method of electronic unit of generation of the position deviation of electronic unit 50.
Also have, in the present embodiment, do not need to wait the printing deviation that detects scolder, also needn't carry out position revisal computing, thereby the mounting method of short electronic unit of low-cost following processing time can be provided based on camera data with camera head.
Have again, in the present embodiment, print reality with identical paste scolder and set a mark 43 and welding Printing Department 41,42, thereby can reduce number.
In addition, can stay above-mentioned scolder mark 43A, scolder alignment mark 23 on the real dress substrate 60, also can cut off the edge portion of real dress substrate 60 and it is removed.
(the 2nd execution mode)
Secondly, with Fig. 1 and Fig. 8～Figure 13, describe for the mounting method of the related electronic unit of present embodiment.In addition, the mounting method of the related electronic unit of present embodiment possesses the step S1～S4 shown in the flow chart of Fig. 1 and constitutes.
(1) at first, as shown in Figure 8, be ready to the printed wiring board 10 (step S1) of the circuit substrate that constitutes as on the surface of insulated substrate 11, forming wiring figure.In addition, a pair of pad parts 21,22 of representing wiring figure in the accompanying drawing for the purpose of simplifying the description and only.
As insulated substrate 11, for example can adopt the rigid substrates that has flexible substrate, constitutes by preforming materials such as glass epoxy resins that constitutes by polyimides, liquid crystal polymer etc.
As shown in Figure 8, in the present embodiment, the bight that faces toward each other on printed wiring board 10 has formed respectively as the scolder alignment mark 23 of the 1st identification sign and the fixing weld pad 24B that uses of scolder.This scolder alignment mark 23 and scolder are fixing to be to use and the wiring figure identical materials with above-mentioned pad parts 21,22 with weld pad 24B, and for example Copper Foil forms.Scolder is fixing uses weld pad 24B, in order to prevent that the reality as the 2nd identification sign described later from setting a mark 43 and dispersing, preferably can catch the real size that sets a mark 43 fully, greater than scolder alignment mark 23.
In addition, the part beyond the pad parts on the wiring figure 21,22 is covered by not shown solder resist.Scolder alignment mark 23 can be covered by solder resist and also can not cover, and can't help the solder resist covering and scolder is fixing with weld pad 24B.
(2) secondly, be ready to solder printing shown in Figure 9 mask (metal mask) 30.This solder printing with mask 30 with the corresponding position of pad parts 21,22 above the printed wiring board 10, formed solder printing peristome 31,32, fixing with the corresponding position of weld pad 24B, formed and be used to print the real mark peristome 33 that sets a mark 43 with scolder.In addition, mark peristome 33 is fixed with scolder and is compared with weld pad 24B setting in the scope of suitable size of benchmark that a mark 43 be the location with real, and diameter dimension is set for a short time.
Is such solder printing benchmark with mask 30 with the scolder alignment mark 23 above the printed wiring board 10, carries out position alignment and dispose (step S2) on printed wiring board 10.
(3) secondly, be used in the solder printing that disposed in the above-mentioned operation with mask 30, as shown in figure 10, on the pad parts 21,22 of printed wiring board 10, print with the paste scolder and weld usefulness Printing Department 41,42.Simultaneously, also on fixing with weld pad 24B, the above-mentioned scolder of printed wiring board 10 prints the real mark 43 (step S3) that sets with the paste scolder.At this moment, as shown in figure 10, welding with respect to pad parts 21,22, sets a mark 43 with respect to the fixing weld pad 24B that uses of scolder with Printing Department 41,42 in fact, and the possibility that produces position deviation is arranged in the scope of solder printing with the position alignment precision error of mask 30.But, setting a mark 43 in fact compares with weld pad 24B with scolder is fixing, diameter dimension is set for a short time, thereby has set for for solder printing with the position deviation in the scope of the position alignment precision of mask 30, can be from the fixing object line with weld pad 24B of the scolder outside that flies out.In addition, just in case the occasion that solder printing has produced with the position deviation of mask 30, because solder printing is used on the mask 30 at same solder printing with peristome 31,32 and mark peristome 33 and is formed, so be printed on the position deviation of printed wiring board 10 top welding just becoming equidirectional and same size with Printing Department 41,42 and the real position deviation that sets a mark 43.
(4) secondly, with real installation, as shown in figure 11, it is configured to set a mark 43 with the reality that has been formed by the paste scolder is benchmark, is placing the outside terminal (diagram is omitted) of electronic unit 50 with the corresponding position of Printing Department 41,42 with above-mentioned welding.At this moment, electronic unit 50 have real installation with the real possibility that produces position deviation in the scope of position alignment precision error that a mark 43 is a benchmark that sets, but, be benchmark because set a mark 43, so can not depart from welding Printing Department 41,42 greatly with the reality that constitutes by scolder.
By the way, in existing mounting method, solder printing operation and real dress operation be independent separately, is benchmark with the scolder alignment mark 23 that has formed simultaneously with wiring figure, thereby solder printing position and real holding position have the possibility that produces position deviation in direction differing from each other.Therefore, in existing mounting method, the possibility of 2 times position deviation of the mounting method that produces present embodiment is arranged.
After this, implement reflow treatment, electronic unit 50 real being contained in above the pad parts 21,22 (step S4) as the melt solder processing.
Implemented the result of this reflow treatment, as mentioned above, even with respect to pad parts 21,22, welding more or less produces position deviation with Printing Department 41,42, fusion also contact pad portion 21,22 and soak expansion equably of scolder, welding is moved to the position of contact pad portion 21,22 equably respectively with Printing Department 41,42.As a result, welding as shown in Figure 6, is just carried out ego integrity (oneself adjusts) with Printing Department 41,42 on pad parts 21,22, fix as connecting with solder portion 41A, 42A.Accompany therewith, electronic unit 50 moves to the center of gravity (center) that connects with solder portion 41A, 42A by means of the effect of surface of molten solder tension force, carries out ego integrity (oneself adjusts) with respect to pad parts 21,22 to suitable position.Then, fusion solder cools, curing, thereby the real dress of electronic unit 50 finishes, real dress substrate 60 is finished.
In the operation of the lift-launch of above-mentioned electronic unit 50 and welding, setting a mark 43 in fact, to be printed on scolder fixing with above the weld pad 24B, thereby solidify by cooling, becomes scolder mark 43A.Here, scolder is fixing to be that for example copper is formed by the metal high with solder bonds with weld pad 24B, thereby scolder mark 43A can combine with weld pad 24B with scolder is fixing.Therefore, prevented that scolder mark 43A from dispersing to peripheral circuit with forms such as solder balls.
As mentioned above, mounting method according to the related electronic unit of present embodiment, positioning reference when the reality that has been formed by scolder is set a mark 43 as the real dress of electronic unit, thereby little with respect to welding with the position deviation of Printing Department 41,42, can be in welding with carrying electronic unit 50 above the Printing Department 41,42 really.Therefore, can realize to suppress the mounting method of electronic unit of generation of the position deviation of electronic unit 50.
Also have, in the present embodiment, do not need to wait the printing deviation that detects scolder, also needn't carry out position revisal computing, thereby the mounting method of short electronic unit of low-cost following processing time can be provided based on camera data with camera head.
Have again, in the present embodiment, print reality with identical paste scolder and set a mark 43 and welding Printing Department 41,42, thereby can reduce number.
In addition, can stay above-mentioned scolder mark 43A, scolder alignment mark 23 on the real dress substrate 60, also can cut off the edge portion of real dress substrate 60 and it is removed.
(other execution modes)
The argumentation and the accompanying drawing of the part that the formation execution mode that should not be considered as above-mentioned discloses limit this invention.According to this disclosure, those skilled in the art can obtain various replacement execution modes,
Embodiment and application technology.
For example, in the 1st and the 2nd above-mentioned execution mode, setting a mark 43 in fact and be toroidal, but, also can be ellipse, rectangle, other arbitrary shapes.
Also have, in the 1st and the 2nd above-mentioned execution mode, with mask 30, used metal mask as solder printing, but, also can use resinous printing mask, using printing to print with roller also is the scope of application of the present invention.
Have, in the 1st and the 2nd above-mentioned execution mode, used and made the printed wiring board 10 that finishes, but, possessing the operation of making printed wiring board 10 also is the scope of application of the present invention.
Also have, in the 1st and the 2nd above-mentioned execution mode, as circuit substrate, be suitable for printed wiring board, but, the used substrate of glass substrate, plastic base, the organic EL display used applicable to liquid crystal panel of the present invention etc. all follow circuit substrates of real dress of the electronic unit of solder printing in fact.
In addition, in the above-described first embodiment, scolder is fixed with weld pad 24 less than the real mark 43 that sets, particularly, when solder printing has been configured in the error range of positioning accuracy with mask 30, scolder fixing with weld pad 24 so long as do not set the size that the object line of a mark 43 exposes and get final product from reality.Also have, the shape of the fixing usefulness of scolder weld pad 24 is symmetric shapes such as circle, rectangle preferably.
(comparative example 1)
Figure 14 and Figure 15 represent the comparative example 1 of mounting method.As shown in figure 14, the location recognition mark 102 usefulness camera heads that formed simultaneously when the formation of the pad parts (diagram of the part except wiring figure is omitted) 101 of the wiring figure of printed wiring board 100 are made a video recording, thereby detect the position of printed wiring board 100.Detect the result based on this, carry out the position alignment of the printing of solder printing machine with metal mask (diagram is omitted).After this, printing is adjacent to, printing solder Printing Department 103 on the given pad parts of predetermined welding on printed wiring board 100 with metal mask.Secondly, with camera head above-mentioned location recognition mark 102 is made a video recording once more, calculate relative position, calculate the real holding position of each parts, calculate data based on this and come control assembly to carry machine, carry electronic unit 104 with respect to this location recognition mark 102.Then, make melt solder with reflux at last, the electronic unit 104 that has carried on printed wiring board 100 is welded.In reflow solder technique, even electronic unit 104 loading positions more or less depart from, surface tension in the time of also can be by means of the melt solder of solder printing portion 103, expansion is soaked by solder printing portion 103 by the pad parts above printed wiring board 100 101, electronic unit 104 furthers, the result just fixes electronic unit (oneself adjusts), and on regular design attitude, this is its characteristic that has.
In mounting method, solder printing and component mounting this independently two operations be the relative position of calculating independent based on the positional information of identical location recognition mark 102 respectively.Therefore, the occasion that the lift-launch deviation accumulation property ground of the pad parts 101 during in the printing deviation that takes place with the position alignment of metal mask and printed wiring board 100 owing to the printing in the solder printing with at component mounting and the loading position of electronic unit 104 has taken place, with this position deviation amount and the difference of balance (occasion that has surpassed permissible range in the position deviation that has accumulated) of the position of the pad parts 101 that welds, printing solder position, component mounting position, adorn bad will the generation in fact.Shown in the reference example that Figure 14 and Figure 15 represent, only be placed on occasion in side's solder printing portion 103 at electronic unit 104, electronic unit 104 is real suitably to be contained in above the pad parts 101.In addition, the occasion that taken place in the position deviation of accumulation property, the chip that electronic unit 104 becomes the state of being inverted on printed wiring board 100 erects, the failure weldings such as short circuit between component terminal will take place.Such reality is adorned and bad occurred in small-sized light weight electronic unit and have in the connector etc. of thin space lead-in wire more remarkable.
Adorn the system of bad generation as suppressing such reality, behind solder printing, implement the scolder visual examination of two dimension with automatic scolder appearance inspection device, to measuring with the position deviation amount of the barycentric coodinates of printing coordinate in the design of metal mask regulation and the paste scolder that printed by printing.Then, the component mounting position in the design of having calculated in the position of the location recognition mark of the printed wiring board of having discerned according to the component mounting machine, boarded parts on the revisal coordinate of the revisal of the departure that has increased printing solder.At this moment, automatically the scolder appearance inspection device is made a video recording with the common location recognition mark of camera head pair and component mounting machine, and the position on the printed wiring board is discerned.After this, according to the scolder appearance images that is taken into by camera head, the printing solder position is measured as 2-D data with respect to the difference of the bond pad locations in the design, transmitted the revisal data to the component mounting machine, this is its mechanism.To carry out the lift-launch of electronic unit in view of the above to the scolder printing position.Then, in reflow process,, also can improve electronic unit fixing to printed wiring board, suppress failure welding by means of the self-adjustment capability of scolder even produced the occasion of difference in the positional precision of solder printing.
In above-mentioned comparative example 1, be behind solder printing, to carry out the scolder visual examination, the departure of the locational scolder of each component mounting position is transmitted the revisal data as the data of directions X, Y direction, θ direction (rotation direction) etc. to the component mounting machine, make the component mounting position of component mounting machine and the system of printing solder position alignment, thereby the scolder appearance inspection device is necessary automatically, and cost has uprised.In addition, needing to handle huge data volume in the scolder appearance inspection device automatically.Therefore, the processing elapsed time is elongated, and the processing time (throughput) of the real wiring of parts significantly descends, and the restriction in the practicalities such as boarded parts that limit applicable system need be set.Also have, in the occasion of the many printed wiring boards of equipped section number of packages, need increase a lot of data operations unit in the scolder appearance inspection device automatically, further cause cost to increase, this is the problem that exists.
Because such reason, according to the respective embodiments described above, can realize comparing with above-mentioned comparative example 1, the low-cost following processing time is short, the parts mounting method of circuit substrate of generation that can suppress the position deviation of electronic unit, and the real dress substrate that has suppressed the position deviation amount of electronic unit.
(embodiment and comparative example 2)
Figure 16～Figure 18 represents embodiments of the invention and comparative example 2.At first, as shown in figure 16, be ready to as on the surface of insulated substrate 201, forming many to pad parts 21,22 and a plurality of (2) printed wiring board 200 of the circuit substrate that constitutes.In addition, the spacing of pad parts 21,22 is set at directions X 0.65mm, at Y direction 0.55mm.
As these printed wiring boards 200, be ready to shown in Figure 17 only formed as the printed wiring board 200A (comparative example 2) of the scolder alignment mark 23 of the 1st identification sign and formation shown in Figure 180 such 2 kinds of the fixing printed wiring board 200B (embodiment) with weld pad 24 of scolder alignment mark 23 and scolder.
Also have, as shown in figure 16, the pad parts 21,22 with respect to above these printed wiring boards 200 (200A, 200B) respectively moves 0.2mm in directions X, Y direction, welds well with Printing Department 41,42 with the paste solder printing.
As shown in figure 18, in printed wiring board 200B, on fixing with weld pad 24, scolder also prints the real mark 43 that sets with the paste scolder.In addition, as the solder printing machine, used SP-60P-M (PFSC).
Secondly, as real installation, using I-CubeII (YAMAHA system), as shown in figure 17, is that benchmark and electronic unit 50 positioned disposes with scolder alignment mark 23 in comparative example 2.As shown in figure 18, in an embodiment, setting a mark 43 with the reality that has been formed by the paste scolder is benchmark, disposes placing electronic unit 50 with above-mentioned welding with the corresponding position of Printing Department 41,42.After this, implemented the reflow treatment handled as melt solder.
Implemented the result of this reflow treatment, in comparative example shown in Figure 17 2, in 30 electronic units 50, produced position deviation, occurred 3 with respect to pad parts 21,22.By contrast, in an embodiment, electronic unit 50 has produced position deviation with respect to pad parts 21,22, and 1 do not have yet.
Industrial applicibility
As mentioned above, according to the present invention, can obtain to have by forming from the teeth outwards, with scolder The circuit substrate of the wiring pattern that consists of of the high metal of associativity on, welded electronic unit The actual load substrate namely forms from the teeth outwards by the scolder that consists of with the wiring pattern same material is fixing and uses Weld pad at the fixing actual load alignment mark that is made of scolder with weld pad formation of scolder, thereby presses down Made the actual load substrate of the position deviation amount of electronic unit.
Claims (6)
1. adorn substrate in fact for one kind, have by forming on the surface, above the circuit substrate of the wiring figure that constitutes with the high metal of the associativity of scolder, welded electronic unit, it is characterized in that, on described surface, form by the fixing weld pad of use of scolder that constitutes with described wiring figure same material, described scolder fixing with weld pad above the reality that constitutes by scolder of formation set a mark.
2. the mounting method of an electronic unit is characterized in that possessing: the operation that is ready to have formed from the teeth outwards the circuit substrate of wiring figure; On the surface of described circuit substrate, to real set a mark and with the corresponding welding Printing Department of welding presumptive area, carry out the printing process of solder printing with mask with solder printing; And to set a mark with described reality be benchmark, with after electronic unit has been carried in the described welding position corresponding with Printing Department, implements the connection operation that melt solder is handled.
3. the mounting method of electronic unit according to claim 2, it is characterized in that, on the surface of described circuit substrate, possess by the scolder alignment mark that constitutes with described wiring figure same material, with described scolder alignment mark is benchmark, described solder printing is carried out position alignment with mask, print described reality simultaneously with identical scolder and set a mark and described welding Printing Department.
4. according to the mounting method of claim 2 or 3 described electronic units, it is characterized in that, on the surface of described circuit substrate, possess by the fixing weld pad of using of the scolder that constitutes with described wiring figure same material, fixing with described scolder on mask at described solder printing with the corresponding position of weld pad, form the mark peristome that the described reality of printing sets a mark.
5. the mounting method of electronic unit according to claim 4 is characterized in that setting for,
Described scolder is fixing to set a mark with weld pad less than described reality,
With respect to described circuit substrate, when described solder printing was in position deviation state in the positioning accuracy error with mask, described reality set a mark and covers whole described scolder and fixedly use weld pad.
6. the mounting method of electronic unit according to claim 4 is characterized in that setting for,
Described scolder is fixing to set a mark with weld pad greater than described reality,
With respect to described circuit substrate, when described solder printing was in position deviation state in the positioning accuracy error with mask, described reality set a mark and places than the fixing object line with weld pad of described scolder in the inner part.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005209036A JP2007027510A (en) | 2005-07-19 | 2005-07-19 | Packaging substrate and packaging method of electronic part |
| JP2005209036 | 2005-07-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1901779A true CN1901779A (en) | 2007-01-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006101061370A Pending CN1901779A (en) | 2005-07-19 | 2006-07-19 | Package substrate and electronic component packaging method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2007027510A (en) |
| KR (1) | KR20070011168A (en) |
| CN (1) | CN1901779A (en) |
| TW (1) | TW200727757A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI474768B (en) * | 2010-10-01 | 2015-02-21 | Meiko Electronics Co Ltd | A method of manufacturing a substrate having a built-in member, and a substrate for a built-in member manufactured by the method |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008300690A (en) * | 2007-05-31 | 2008-12-11 | Icom Inc | Surface part mounting method and surface part mounting board |
| US9263642B2 (en) | 2010-09-30 | 2016-02-16 | Dowa Electronics Materials Co., Ltd. | III nitride semiconductor light emitting device and method for manufacturing the same |
| EP2624673B1 (en) * | 2010-10-01 | 2017-12-06 | Meiko Electronics Co., Ltd. | Substrate with built-in component and method for manufacturing substrate with built-in component |
| JP6127516B2 (en) * | 2013-01-08 | 2017-05-17 | 株式会社リコー | Optical package, optical unit, optical scanning device, image forming apparatus |
| KR101302122B1 (en) * | 2013-02-08 | 2013-08-30 | 주식회사 케이엘테크 | Method of manufacturing (flexible) printed circuit board |
| JP2016134429A (en) * | 2015-01-16 | 2016-07-25 | 東芝キヤリア株式会社 | Print circuit board and manufacturing method of print circuit board |
| JP2023009751A (en) | 2021-07-08 | 2023-01-20 | 住友電装株式会社 | Circuit configuration and electric connection box |
-
2005
- 2005-07-19 JP JP2005209036A patent/JP2007027510A/en active Pending
-
2006
- 2006-07-18 TW TW095126256A patent/TW200727757A/en unknown
- 2006-07-19 KR KR1020060067435A patent/KR20070011168A/en not_active Application Discontinuation
- 2006-07-19 CN CNA2006101061370A patent/CN1901779A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI474768B (en) * | 2010-10-01 | 2015-02-21 | Meiko Electronics Co Ltd | A method of manufacturing a substrate having a built-in member, and a substrate for a built-in member manufactured by the method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200727757A (en) | 2007-07-16 |
| JP2007027510A (en) | 2007-02-01 |
| KR20070011168A (en) | 2007-01-24 |
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