CN1897171B - 电气电子设备用Cu-Zn-Sn合金 - Google Patents
电气电子设备用Cu-Zn-Sn合金 Download PDFInfo
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- CN1897171B CN1897171B CN2006101056762A CN200610105676A CN1897171B CN 1897171 B CN1897171 B CN 1897171B CN 2006101056762 A CN2006101056762 A CN 2006101056762A CN 200610105676 A CN200610105676 A CN 200610105676A CN 1897171 B CN1897171 B CN 1897171B
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- 229910001128 Sn alloy Inorganic materials 0.000 title description 2
- 238000005452 bending Methods 0.000 claims abstract description 25
- 229910052718 tin Inorganic materials 0.000 claims abstract description 20
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000010949 copper Substances 0.000 claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- 239000012535 impurity Substances 0.000 claims abstract description 6
- 238000005096 rolling process Methods 0.000 claims description 54
- 229910045601 alloy Inorganic materials 0.000 claims description 50
- 239000000956 alloy Substances 0.000 claims description 50
- 238000000137 annealing Methods 0.000 claims description 40
- 239000013081 microcrystal Substances 0.000 claims description 24
- 239000010813 municipal solid waste Substances 0.000 claims description 20
- 239000013078 crystal Substances 0.000 claims description 18
- 238000005097 cold rolling Methods 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000001953 recrystallisation Methods 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 238000002441 X-ray diffraction Methods 0.000 claims description 9
- 229910007610 Zn—Sn Inorganic materials 0.000 claims description 9
- 238000003754 machining Methods 0.000 claims description 8
- 238000013459 approach Methods 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 229910052790 beryllium Inorganic materials 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 229910052726 zirconium Inorganic materials 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 26
- 230000010485 coping Effects 0.000 abstract 1
- 238000005549 size reduction Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- 238000001556 precipitation Methods 0.000 description 8
- 208000037656 Respiratory Sounds Diseases 0.000 description 7
- 238000005275 alloying Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 229910001369 Brass Inorganic materials 0.000 description 6
- 239000010951 brass Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000005728 strengthening Methods 0.000 description 6
- 229910017518 Cu Zn Inorganic materials 0.000 description 5
- 229910017752 Cu-Zn Inorganic materials 0.000 description 5
- 229910017943 Cu—Zn Inorganic materials 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 description 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229910021484 silicon-nickel alloy Inorganic materials 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 2
- 244000137852 Petrea volubilis Species 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229960002163 hydrogen peroxide Drugs 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910017532 Cu-Be Inorganic materials 0.000 description 1
- 229910017945 Cu—Ti Inorganic materials 0.000 description 1
- 229910017985 Cu—Zr Inorganic materials 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 241001274660 Modulus Species 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910000905 alloy phase Inorganic materials 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000006477 desulfuration reaction Methods 0.000 description 1
- 230000023556 desulfurization Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 230000003467 diminishing effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/60—Compounds characterised by their crystallite size
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/40—Electric properties
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C2202/00—Physical properties
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005207556 | 2005-07-15 | ||
JP2005207556 | 2005-07-15 | ||
JP2005-207556 | 2005-07-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1897171A CN1897171A (zh) | 2007-01-17 |
CN1897171B true CN1897171B (zh) | 2012-11-28 |
Family
ID=37609650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006101056762A Active CN1897171B (zh) | 2005-07-15 | 2006-07-17 | 电气电子设备用Cu-Zn-Sn合金 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100792653B1 (zh) |
CN (1) | CN1897171B (zh) |
TW (1) | TW200706661A (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5339995B2 (ja) * | 2009-04-01 | 2013-11-13 | Jx日鉱日石金属株式会社 | Cu−Zn−Sn系合金板及びCu−Zn−Sn系合金Snめっき条 |
JP5140171B2 (ja) * | 2011-03-18 | 2013-02-06 | Jx日鉱日石金属株式会社 | 充電用電池タブ材に用いられる銅合金条 |
CN103460327A (zh) * | 2011-04-15 | 2013-12-18 | 小松电子部品有限公司 | 热保护器及使用该热保护器的蓄电池 |
JP6029296B2 (ja) * | 2012-03-08 | 2016-11-24 | Jx金属株式会社 | 電気電子機器用Cu−Zn−Sn−Ca合金 |
JP6111028B2 (ja) * | 2012-03-26 | 2017-04-05 | Jx金属株式会社 | コルソン合金及びその製造方法 |
JP5130406B1 (ja) * | 2012-03-29 | 2013-01-30 | Jx日鉱日石金属株式会社 | Cu−Zn−Sn系銅合金条 |
JP5826160B2 (ja) * | 2012-04-10 | 2015-12-02 | Jx日鉱日石金属株式会社 | 圧延銅箔、銅張積層板、フレキシブルプリント配線板及びその製造方法 |
WO2014115307A1 (ja) * | 2013-01-25 | 2014-07-31 | 三菱伸銅株式会社 | 端子・コネクタ材用銅合金板及び端子・コネクタ材用銅合金板の製造方法 |
JP2015086452A (ja) * | 2013-11-01 | 2015-05-07 | 株式会社オートネットワーク技術研究所 | 銅合金線、銅合金撚線、被覆電線、ワイヤーハーネス及び銅合金線の製造方法 |
JP6101750B2 (ja) * | 2015-07-30 | 2017-03-22 | 三菱マテリアル株式会社 | 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品および端子 |
US11732329B2 (en) * | 2019-11-29 | 2023-08-22 | Mitsubishi Materials Corporation | Copper alloy, copper alloy plastic-processed material, component for electronic and electric devices, terminal, bus bar, and heat-diffusing substrate |
CN114507828B (zh) * | 2022-02-17 | 2022-12-02 | 贵溪奥泰铜业有限公司 | 一种导电优良的磷青铜合金及生产方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1358875A (zh) * | 2000-12-15 | 2002-07-17 | 古河电气工业株式会社 | 高机械强度的铜合金 |
CN1403609A (zh) * | 2001-09-07 | 2003-03-19 | 同和矿业株式会社 | 连接器用铜合金及其制造方法 |
CN1624177A (zh) * | 2004-12-08 | 2005-06-08 | 昆明贵金属研究所 | 高致密、无偏析、耐磨铜合金及其制备方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3105392B2 (ja) * | 1994-03-18 | 2000-10-30 | 同和鉱業株式会社 | コネクタ用銅基合金の製造法 |
-
2006
- 2006-07-13 KR KR1020060065780A patent/KR100792653B1/ko active IP Right Grant
- 2006-07-14 TW TW095125880A patent/TW200706661A/zh unknown
- 2006-07-17 CN CN2006101056762A patent/CN1897171B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1358875A (zh) * | 2000-12-15 | 2002-07-17 | 古河电气工业株式会社 | 高机械强度的铜合金 |
CN1403609A (zh) * | 2001-09-07 | 2003-03-19 | 同和矿业株式会社 | 连接器用铜合金及其制造方法 |
CN1624177A (zh) * | 2004-12-08 | 2005-06-08 | 昆明贵金属研究所 | 高致密、无偏析、耐磨铜合金及其制备方法 |
Non-Patent Citations (1)
Title |
---|
JP平5-311288A 1993.11.22 |
Also Published As
Publication number | Publication date |
---|---|
KR100792653B1 (ko) | 2008-01-09 |
CN1897171A (zh) | 2007-01-17 |
TW200706661A (en) | 2007-02-16 |
TWI327173B (zh) | 2010-07-11 |
KR20070009433A (ko) | 2007-01-18 |
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ASS | Succession or assignment of patent right |
Owner name: JX NIPPON MINING + METALS CO., LTD. Free format text: FORMER OWNER: NIPPON MINING + METALS CO., LTD. Effective date: 20101227 |
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Effective date of registration: 20101227 Address after: Tokyo, Japan, Japan Applicant after: JX Nippon Mining & Metals Co., Ltd. Address before: Tokyo, Japan, Japan Applicant before: Nippon Mining & Metals Co., Ltd. |
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CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX Nippon Mining & Metals Co., Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX NIPPON MINING & METALS CORPORATION |
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CP01 | Change in the name or title of a patent holder | ||
CP02 | Change in the address of a patent holder |
Address after: No. 10-4, erdingmu, tiger gate, Tokyo port, Japan Patentee after: JKS Metal Co.,Ltd. Address before: Tokyo, Japan Patentee before: JKS Metal Co.,Ltd. |
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