CN1893804A - 散热片材和散热结构体 - Google Patents
散热片材和散热结构体 Download PDFInfo
- Publication number
- CN1893804A CN1893804A CNA2006100959733A CN200610095973A CN1893804A CN 1893804 A CN1893804 A CN 1893804A CN A2006100959733 A CNA2006100959733 A CN A2006100959733A CN 200610095973 A CN200610095973 A CN 200610095973A CN 1893804 A CN1893804 A CN 1893804A
- Authority
- CN
- China
- Prior art keywords
- elastic layer
- fin material
- graphite flake
- thermal conductivity
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 134
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 133
- 239000010439 graphite Substances 0.000 claims abstract description 133
- 239000000945 filler Substances 0.000 claims abstract description 67
- 239000000203 mixture Substances 0.000 claims abstract description 29
- 239000002245 particle Substances 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims description 128
- 230000004888 barrier function Effects 0.000 claims description 27
- 229920000307 polymer substrate Polymers 0.000 claims description 17
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 10
- 229920000058 polyacrylate Polymers 0.000 claims description 8
- 239000005030 aluminium foil Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 229920005987 OPPANOL® Polymers 0.000 claims description 4
- 229920000800 acrylic rubber Polymers 0.000 claims description 4
- 229920002379 silicone rubber Polymers 0.000 claims description 4
- 235000014692 zinc oxide Nutrition 0.000 claims description 4
- 239000011787 zinc oxide Substances 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 230000005012 migration Effects 0.000 claims description 3
- 238000013508 migration Methods 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 229910017083 AlN Inorganic materials 0.000 claims description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 2
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 2
- 239000010445 mica Substances 0.000 claims description 2
- 229910052618 mica group Inorganic materials 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 229920002050 silicone resin Polymers 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 148
- 230000000052 comparative effect Effects 0.000 description 26
- 239000000919 ceramic Substances 0.000 description 22
- 238000009434 installation Methods 0.000 description 12
- 229920002725 thermoplastic elastomer Polymers 0.000 description 12
- 238000012360 testing method Methods 0.000 description 10
- 238000009825 accumulation Methods 0.000 description 6
- 238000009499 grossing Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229920001971 elastomer Polymers 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- 210000002268 wool Anatomy 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 3
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- 235000019593 adhesiveness Nutrition 0.000 description 2
- 239000002969 artificial stone Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910021382 natural graphite Inorganic materials 0.000 description 2
- -1 olefin hydrocarbons Chemical class 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000011469 building brick Substances 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229920006235 chlorinated polyethylene elastomer Polymers 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229920005555 halobutyl Polymers 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 229920002681 hypalon Polymers 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229920003049 isoprene rubber Polymers 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 1
- 229920003225 polyurethane elastomer Polymers 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
- Y10T428/24967—Absolute thicknesses specified
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31931—Polyene monomer-containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31935—Ester, halide or nitrile of addition polymer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
- Resistance Heating (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
实施例1 | 实施例2 | 实施例3 | 实施例4 | 实施例5 | 实施例6 | 实施例7 | ||
导热性填料 | 平均粒径(μm) | 3.5 | 3.5 | 3.5 | 8 | 3.5 | 10 | 3.5 |
大于或等于95%的粒径的比例(%) | 0.1 | 0 | 0 | 0 | 0 | 0 | 0 | |
含量(体积%) | 54 | 54 | 54 | 71 | 54 | 67 | 67 | |
平均厚度(μm) | 石墨片 | 80 | 80 | 80 | 80 | 80 | 130 | 130 |
阻挡层 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | |
弹性层 | 20 | 120 | 280 | 120 | 120 | 120 | 100 | |
弹性层硬度(A型) | 23 | 23 | 23 | 26 | 40 | 24 | 24 | |
导热系数(W/m·k) | 石墨片(表面) | 240 | 240 | 240 | 240 | 240 | 240 | 500 |
石墨片(厚度) | 7 | 7 | 7 | 7 | 7 | 7 | 5 | |
弹性层 | 1.5 | 1.5 | 1.5 | 8 | 1.5 | 3 | 3 | |
热阻值(℃/W) | 0.77 | 0.92 | 1.45 | 0.50 | 1.48 | 1.08 | 0.95 | |
体积电阻率(欧姆·厘米) | 1.0×1010 | 大于等于1.0×1010 | 大于等于1.0×1010 | 大于等于1.0×1010 | 大于等于1.0×1010 | 大于等于1.0×1010 | 大于等于1.0×1010 | |
热扩散性 | 在中心B的温度(℃) | 106.1 | 105.4 | 106.3 | 97.7 | 106.5 | 102.3 | 100.9 |
ΔT1(℃) | 9.3 | 10.1 | 12.3 | 7.2 | 11.2 | 9.8 | 9.6 | |
ΔT2(℃) | 33.1 | 33.3 | 32.9 | 33.4 | 33.5 | 33.3 | 28.8 | |
柔性 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | |
形状追随性 | 2 | 3 | 3 | 3 | 2 | 3 | 3 | |
粘着性 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | |
表面平滑性 | 2 | 3 | 3 | 3 | 3 | 3 | 3 | |
处理性 | 2 | 3 | 3 | 3 | 3 | 3 | 3 |
实施例8 | 实施例9 | 实施例10 | 实施例11 | 实施例12 | 实施例13 | ||
导热性填料 | 平均粒径(μm) | 8 | 45 | 45 | 3.5 | 8 | 3.5 |
大于或等于95%的粒径的比例(%) | 0 | 0 | 13 | 0 | 0 | 0 | |
含量(体积%) | 71 | 67 | 67 | 54 | 71 | 54 | |
平均厚度(μm) | 石墨片 | 130 | 130 | 130 | 80 | 80 | 80 |
阻挡层 | 5 | 5 | 5 | 5 | 5 | 15 | |
弹性层 | 170 | 100 | 100 | 120 | 120 | 120 | |
弹性层硬度(A型) | 26 | 25 | 26 | 60 | 72 | 23 | |
导热系数(W/m k) | 石墨片(表面) | 500 | 500 | 500 | 240 | 240 | 240 |
石墨片(厚度) | 5 | 5 | 5 | 7 | 7 | 7 | |
弹性层 | 8 | 3 | 3 | 1.5 | 8 | 1.5 | |
热阻值(℃/W) | 0.75 | 0.98 | 1.02 | 1.92 | 1.67 | 1.23 | |
体积电阻率(欧姆·厘米) | 大于等于1.0×1010 | 大于等于1.0×1010 | 大于等于1.0×1010 | 大于等于1.0×1010 | 大于等于1.0×1010 | 大于等于1.0×1010 | |
热扩散性 | 在中心B的温度(℃) | 98.8 | 101.0 | 101.2 | 110.6 | 109.6 | 110.2 |
ΔT1(℃) | 7.8 | 10.0 | 10.8 | 12.6 | 11.5 | 13.0 | |
ΔT2(℃) | 29.3 | 28.7 | 29.1 | 33.7 | 33.5 | 32.9 | |
柔性 | 3 | 3 | 3 | 2 | 2 | 3 | |
形状追随性 | 3 | 3 | 3 | 2 | 2 | 3 | |
粘着性 | 3 | 3 | 3 | 2 | 2 | 3 | |
表面平滑性 | 3 | 3 | 3 | 3 | 3 | 3 | |
处理性 | 3 | 3 | 3 | 3 | 3 | 3 |
对比例1 | 对比例2 | 对比例3 | 对比例4 | 对比例5 | 对比例6 | 对比例7 | ||
导热性填料 | 平均粒径(μm) | - | - | 3.5 | 3.5 | - | - | 55 |
大于或等于95%的粒径的比例(%) | - | - | 0 | 0 | - | - | 17 | |
含量(体积%) | - | - | 54 | 27 | - | - | 54 | |
平均厚度(μm) | 石墨片 | 130 | 510 | 510 | 80 | 130 | 130 | 80 |
阻挡层 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | |
弹性层 | - | - | 80 | 120 | - | - | 120 | |
弹性层硬度(A型) | - | - | 23 | 23 | - | - | 23 | |
导热系数(W/m·k) | 石墨片(表面) | 240 | 240 | 240 | 240 | 500 | 120 | 240 |
石墨片(厚度) | 7 | 7 | 7 | 7 | 5 | 16 | 7 | |
弹性层 | - | - | 1.5 | 0.3 | - | - | 1.5 | |
热阻值(℃/W) | 0.80 | 3.88 | 1.71 | 3.16 | 1.09 | 0.55 | 1.11 | |
体积电阻率(欧姆·厘米) | 1.0×102 | 1.0×102 | 大于等于1.0×1010 | 大于等于1.0×1010 | 1.0×102 | 1.0×102 | 大于等于1.0×1010 | |
热扩散性 | 在中心B的温度(℃) | 108.7 | 106.5 | 105.9 | 109.8 | 107.6 | 111.3 | 109.8 |
ΔT1(℃) | 10.8 | 15.1 | 13.5 | 12.3 | 11.1 | 8.5 | 11.2 | |
ΔT2(℃) | 32.9 | 33.4 | 32.7 | 33.5 | 28.9 | 49.3 | 33.0 | |
柔性 | 3 | 1 | 1 | 1 | 3 | 2 | 3 | |
形状追随性 | 1 | 1 | 3 | 3 | 1 | 1 | 1 | |
粘着性 | 1 | 1 | 3 | 3 | 1 | 1 | 3 | |
表面平滑性 | 2 | 2 | 3 | 3 | 2 | 2 | 1 | |
处理性 | 2 | 2 | 3 | 3 | 2 | 2 | 3 |
对比例8 | 对比例9 | 对比例10 | 对比例11 | 对比例12 | 对比例13 | 对比例14 | ||
导热性填料 | 平均粒径(μm) | 2 | - | - | 10 | 60 | 45 | - |
大于或等于95%的粒径的比例(%) | 4 | - | - | 0 | 0 | 22 | - | |
含量(体积%) | 46 | - | - | 67 | 67 | 67 | - | |
平均厚度(μm) | 石墨片 | 100 | 200 | 300 | - | 130 | 130 | - |
阻挡层 | 3 | 5 | 5 | - | 5 | 5 | - | |
弹性层 | 8 | - | - | 200 | 100 | 100 | - | |
弹性层硬度(A型) | - | - | - | 24 | 27 | 27 | - | |
导热系数(W/m·k) | 石墨片(表面) | 240 | 240 | 240 | - | 500 | 500 | - |
石墨片(厚度) | 7 | 7 | 7 | - | 5 | 5 | - | |
弹性层 | 1.0 | - | - | 3 | 3 | 3 | - | |
热阻值(℃/W) | 0.98 | 1.65 | 2.11 | 0.45 | 1.29 | 1.31 | - | |
体积电阻率(欧姆·厘米) | 1.0×104 | 1.0×102 | 1.0×102 | 大于等于1.0×1010 | 大于等于1.0×1010 | 大于等于1.0×1010 | - | |
热扩散性 | 在中心B的温度(℃) | 109.1 | 107.8 | 106.9 | 123.7 | 108.1 | 108.3 | 127.1 |
ΔT1(℃) | 10.5 | 11.7 | 13.1 | 6.5 | 11.5 | 12.0 | - | |
ΔT2(℃) | 34.2 | 34.4 | 34.3 | 83.4 | 28.5 | 28.6 | - | |
柔性 | 3 | 3 | 2 | 3 | 3 | 3 | - | |
形状追随性 | 1 | 1 | 1 | 3 | 1 | 1 | - | |
粘着性 | 3 | 1 | 1 | 3 | 3 | 3 | - | |
表面平滑性 | 2 | 2 | 2 | 3 | 1 | 1 | - | |
处理性 | 2 | 2 | 2 | 1 | 3 | 3 | - |
Claims (12)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005192438A JP2007012913A (ja) | 2005-06-30 | 2005-06-30 | 放熱シート及び放熱構造 |
JP2005192438 | 2005-06-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1893804A true CN1893804A (zh) | 2007-01-10 |
CN100499984C CN100499984C (zh) | 2009-06-10 |
Family
ID=37026980
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006100959733A Active CN100499984C (zh) | 2005-06-30 | 2006-06-29 | 散热片材和散热结构体 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7419722B2 (zh) |
EP (1) | EP1739745A3 (zh) |
JP (1) | JP2007012913A (zh) |
KR (1) | KR100822114B1 (zh) |
CN (1) | CN100499984C (zh) |
TW (1) | TWI325752B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102833984A (zh) * | 2011-06-17 | 2012-12-19 | 索尼公司 | 散热结构和显示单元 |
CN104125749A (zh) * | 2013-04-25 | 2014-10-29 | 苏州沛德导热材料有限公司 | 一种新型石墨导热装置 |
CN106105412A (zh) * | 2014-03-20 | 2016-11-09 | 高通股份有限公司 | 用于电子设备的多层散热装置 |
CN108770294A (zh) * | 2018-06-11 | 2018-11-06 | Oppo广东移动通信有限公司 | 一种散热组件以及电子装置 |
CN109133877A (zh) * | 2017-06-19 | 2019-01-04 | 佛山市顺德区美的电热电器制造有限公司 | 氧化铝陶瓷锅体及其制备方法、陶瓷镶嵌金属内锅和烹饪器具 |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4801537B2 (ja) | 2005-10-13 | 2011-10-26 | ポリマテック株式会社 | キーシート |
KR20080006304A (ko) * | 2006-07-12 | 2008-01-16 | 삼성전자주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
JP2009076657A (ja) * | 2007-09-20 | 2009-04-09 | Nitto Shinko Kk | 熱伝導シート |
JP2009081253A (ja) * | 2007-09-26 | 2009-04-16 | Nitto Shinko Kk | 絶縁シート |
US7764493B2 (en) | 2008-01-04 | 2010-07-27 | Apple Inc. | Systems and methods for cooling electronic devices using airflow dividers |
JP4881971B2 (ja) * | 2009-03-26 | 2012-02-22 | 株式会社豊田自動織機 | 半導体装置 |
US20100321897A1 (en) * | 2009-06-17 | 2010-12-23 | Laird Technologies, Inc. | Compliant multilayered thermally-conductive interface assemblies |
US8081468B2 (en) | 2009-06-17 | 2011-12-20 | Laird Technologies, Inc. | Memory modules including compliant multilayered thermally-conductive interface assemblies |
JP5788760B2 (ja) | 2011-10-19 | 2015-10-07 | 日東電工株式会社 | 熱伝導性シート、led実装用基板およびledモジュール |
KR101161735B1 (ko) * | 2012-01-31 | 2012-07-03 | (주)메인일렉콤 | 잠열을 이용한 지연 방열시트 |
JP5978457B2 (ja) * | 2012-03-19 | 2016-08-24 | パナソニックIpマネジメント株式会社 | 熱伝導体 |
KR101335528B1 (ko) * | 2012-05-02 | 2013-12-03 | 김선기 | 자기 점착력을 갖는 열 전도성 판상 시트 |
KR101994931B1 (ko) | 2012-07-19 | 2019-07-01 | 삼성전자주식회사 | 기억 장치 |
TWI503656B (zh) * | 2012-09-07 | 2015-10-11 | Inventec Corp | 散熱結構 |
CN103781329A (zh) * | 2012-10-26 | 2014-05-07 | 史广洲 | 一种石墨铝箔导热材料 |
CN104097361A (zh) * | 2013-04-02 | 2014-10-15 | 苏州沛德导热材料有限公司 | 新型石墨片 |
KR101400030B1 (ko) * | 2013-04-04 | 2014-05-28 | 김선기 | 열 전도성 적층체 |
CN103231554B (zh) * | 2013-04-24 | 2016-06-01 | 碳元科技股份有限公司 | 层叠型高导热石墨膜结构 |
KR102095815B1 (ko) * | 2013-08-20 | 2020-04-14 | 엘지전자 주식회사 | 열 확산 시트 |
US9741635B2 (en) * | 2014-01-21 | 2017-08-22 | Infineon Technologies Austria Ag | Electronic component |
WO2015151613A1 (ja) | 2014-03-31 | 2015-10-08 | デクセリアルズ株式会社 | 熱拡散シート |
JP2015218086A (ja) * | 2014-05-16 | 2015-12-07 | トヨタ自動車株式会社 | グラファイトシート |
TWI564533B (zh) * | 2014-09-11 | 2017-01-01 | 奇鋐科技股份有限公司 | 手持裝置散熱結構 |
JP2016066485A (ja) * | 2014-09-24 | 2016-04-28 | 信越ポリマー株式会社 | 放熱性ライトバルブおよびそれを備えるライト部材 |
JP6469402B2 (ja) * | 2014-09-30 | 2019-02-13 | 信越ポリマー株式会社 | ライト部材 |
TW201704713A (zh) | 2015-03-31 | 2017-02-01 | Dexerials Corp | 熱擴散片 |
JP6502183B2 (ja) * | 2015-06-05 | 2019-04-17 | 日立化成株式会社 | 熱放射用塗膜、及びその塗膜を有する発光ダイオード(led)照明、ヒートシンク、太陽電池モジュール用バックシート |
JP6517086B2 (ja) * | 2015-06-05 | 2019-05-22 | 日立化成株式会社 | 熱放射性塗膜、及びそれを有する発光ダイオード(led)照明、ヒートシンク、太陽電池モジュール用バックシート |
US11367669B2 (en) * | 2016-11-21 | 2022-06-21 | Rohm Co., Ltd. | Power module and fabrication method of the same, graphite plate, and power supply equipment |
CN114555714B (zh) | 2019-11-01 | 2023-05-09 | 积水保力马科技株式会社 | 导热片及其制造方法 |
JP7353233B2 (ja) * | 2020-05-14 | 2023-09-29 | 三菱電機株式会社 | 半導体装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2654387B1 (fr) * | 1989-11-16 | 1992-04-10 | Lorraine Carbone | Materiau multicouche comprenant du graphite souple renforce mecaniquement, electriquement et thermiquement par un metal et procede de fabrication. |
US5198063A (en) * | 1991-06-03 | 1993-03-30 | Ucar Carbon Technology Corporation | Method and assembly for reinforcing flexible graphite and article |
JP3345986B2 (ja) | 1993-10-15 | 2002-11-18 | 松下電器産業株式会社 | グラファイト熱伝導体およびそれを用いたコールドプレート |
JP3885246B2 (ja) * | 1996-01-12 | 2007-02-21 | 松下電器産業株式会社 | プラズマディスプレイパネル |
JPH1158591A (ja) | 1997-08-22 | 1999-03-02 | Furukawa Electric Co Ltd:The | 熱伝導シート |
JP2001287298A (ja) * | 2000-04-05 | 2001-10-16 | Fuji Kobunshi Kogyo Kk | 接着構造体及びその製造方法 |
JP2004518294A (ja) * | 2001-01-22 | 2004-06-17 | パーカー−ハニフイン・コーポレーシヨン | クリーンなレリースの、相変化のターミナルインターフエース |
JP2002361772A (ja) * | 2001-06-04 | 2002-12-18 | Suzuki Sogyo Co Ltd | 熱伝導性シート |
JP4714371B2 (ja) * | 2001-06-06 | 2011-06-29 | ポリマテック株式会社 | 熱伝導性成形体及びその製造方法 |
JP3938681B2 (ja) * | 2001-11-21 | 2007-06-27 | 信越化学工業株式会社 | 放熱構造体 |
JP2003168882A (ja) | 2001-11-30 | 2003-06-13 | Sony Corp | 熱伝導性シート |
JP3807995B2 (ja) * | 2002-03-05 | 2006-08-09 | ポリマテック株式会社 | 熱伝導性シート |
JP4075481B2 (ja) * | 2002-06-20 | 2008-04-16 | ソニー株式会社 | 金属−グラファイトシート複合体および電子機器 |
JP4572056B2 (ja) | 2002-10-04 | 2010-10-27 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム複合シート |
JP4068983B2 (ja) * | 2003-02-13 | 2008-03-26 | 株式会社タイカ | 熱伝導性シート |
US6982874B2 (en) * | 2003-11-25 | 2006-01-03 | Advanced Energy Technology Inc. | Thermal solution for electronic devices |
-
2005
- 2005-06-30 JP JP2005192438A patent/JP2007012913A/ja active Pending
-
2006
- 2006-06-28 EP EP20060253357 patent/EP1739745A3/en not_active Withdrawn
- 2006-06-28 US US11/478,465 patent/US7419722B2/en not_active Expired - Fee Related
- 2006-06-29 KR KR1020060059473A patent/KR100822114B1/ko not_active IP Right Cessation
- 2006-06-29 TW TW95123497A patent/TWI325752B/zh not_active IP Right Cessation
- 2006-06-29 CN CNB2006100959733A patent/CN100499984C/zh active Active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102833984A (zh) * | 2011-06-17 | 2012-12-19 | 索尼公司 | 散热结构和显示单元 |
CN104125749A (zh) * | 2013-04-25 | 2014-10-29 | 苏州沛德导热材料有限公司 | 一种新型石墨导热装置 |
CN106105412A (zh) * | 2014-03-20 | 2016-11-09 | 高通股份有限公司 | 用于电子设备的多层散热装置 |
CN109133877A (zh) * | 2017-06-19 | 2019-01-04 | 佛山市顺德区美的电热电器制造有限公司 | 氧化铝陶瓷锅体及其制备方法、陶瓷镶嵌金属内锅和烹饪器具 |
CN108770294A (zh) * | 2018-06-11 | 2018-11-06 | Oppo广东移动通信有限公司 | 一种散热组件以及电子装置 |
Also Published As
Publication number | Publication date |
---|---|
TW200711562A (en) | 2007-03-16 |
JP2007012913A (ja) | 2007-01-18 |
EP1739745A2 (en) | 2007-01-03 |
US20070003721A1 (en) | 2007-01-04 |
KR20070003629A (ko) | 2007-01-05 |
US7419722B2 (en) | 2008-09-02 |
TWI325752B (en) | 2010-06-01 |
KR100822114B1 (ko) | 2008-04-15 |
CN100499984C (zh) | 2009-06-10 |
EP1739745A3 (en) | 2008-06-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1893804A (zh) | 散热片材和散热结构体 | |
CN107871721B (zh) | 导热性片材及其制备方法、以及半导体装置 | |
US9922901B2 (en) | Heat conduction sheet, heat conduction sheet manufacture method, heat radiation member, and semiconductor device | |
KR101594973B1 (ko) | 태양전지 셀 전극의 접속용 시트, 태양전지 모듈의 제조 방법 및 태양전지 모듈 | |
TWI658550B (zh) | 熱傳導片之製造方法、熱傳導片、及散熱構件 | |
JP4572056B2 (ja) | 熱伝導性シリコーンゴム複合シート | |
JP5407120B2 (ja) | 熱伝導シート、その製造方法およびこれを用いた放熱装置 | |
TWI643946B (zh) | 熱傳導片之製造方法、熱傳導片、及散熱構件 | |
TWI770063B (zh) | 具有高耐負荷性及高熱傳導性之散熱片 | |
CN1893806A (zh) | 导热件和采用该导热件的冷却*** | |
CN1262002C (zh) | 电子部件的散热结构体和用于该散热结构体的散热片材 | |
TWI251320B (en) | Thermal conductive composition, a heat-dissipating putty sheet and heat-dissipating structure using the same | |
JP6136952B2 (ja) | 熱伝導性複合シリコーンゴムシート | |
WO2016111139A1 (ja) | 蓄熱性熱伝導シート | |
JP2003060134A (ja) | 熱伝導性シート | |
JP2007184392A (ja) | 熱伝導構造体、それを用いた放熱部材及び電子機器 | |
KR20160085253A (ko) | 히트 싱크 | |
WO2013015233A1 (ja) | 熱伝導性組成物及びこれを加工した熱伝導性シート | |
US6760214B2 (en) | Electrostatic chuck for ion injector | |
JP2022542444A (ja) | 熱界面材料 | |
WO2020196477A1 (ja) | 熱伝導性樹脂シート、積層放熱シート、放熱性回路基板、及び、パワー半導体デバイス | |
JP2021155737A (ja) | 樹脂組成物、熱伝導性樹脂シート、積層放熱シート、放熱性回路基板及びパワー半導体デバイス | |
CN116964731A (zh) | 导热性树脂片 | |
JP2021036560A (ja) | 放熱シートとその製造方法 | |
JP7137365B2 (ja) | 熱伝導性シート |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: OTSUKA ELECTRIC CO., LTD. |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20100629 Address after: Tokyo, Japan Patentee after: Polymatech Co., Ltd., Address before: Tokyo, Japan Co-patentee before: Big electrical machine Corporation Patentee before: Polymatech Co., Ltd., |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160202 Address after: Saitama Prefecture, Japan Patentee after: Polymatech Japan Co Ltd Address before: Tokyo, Japan Patentee before: Polymatech Co., Ltd., |
|
CP01 | Change in the name or title of a patent holder |
Address after: Saitama Prefecture, Japan Patentee after: Jishui Baoli Ma Technology Co., Ltd. Address before: Saitama Prefecture, Japan Patentee before: Polymatech Japan Co Ltd |
|
CP01 | Change in the name or title of a patent holder |