CN1875477A - 在晶片级底层填料应用中含有高Tg、透明和良好可靠性的填料的溶剂改性树脂体系 - Google Patents
在晶片级底层填料应用中含有高Tg、透明和良好可靠性的填料的溶剂改性树脂体系 Download PDFInfo
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- CN1875477A CN1875477A CNA2004800325173A CN200480032517A CN1875477A CN 1875477 A CN1875477 A CN 1875477A CN A2004800325173 A CNA2004800325173 A CN A2004800325173A CN 200480032517 A CN200480032517 A CN 200480032517A CN 1875477 A CN1875477 A CN 1875477A
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- Prior art keywords
- resin
- colloidal silica
- functionalized
- solvent
- dispersion
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/28—Compounds of silicon
- C09C1/30—Silicic acid
- C09C1/3081—Treatment with organo-silicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
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- Crystallography & Structural Chemistry (AREA)
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- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Paints Or Removers (AREA)
Abstract
Description
项号# | 前分散体组成 | 最终分散体浓度 | 分散稳定性 |
(PTS*/100g SiO2) | (wt%SiO2)/wt%总固体) | (在甲氧基丙醇中) | |
1 | 0.028m/100g | 50%SiO2/63% | 沉淀 |
2 | 0.056m/100g | 47%SiO2/60% | 沉淀 |
3 | 0.13m/100g | 53%SiO2/66% | 稳定,透明 |
4 | 0.13m/100g | 60%SiO2/75% | 稳定,透明 |
5 | 0.19m/100g | 50%SiO2/63% | 稳定,透明 |
(在甲氧基丙醇乙酸酯中) | |||
6 | 0.13m/100g | 50%SiO2/63% | 沉淀 |
7 | 0.19m/100g | 50%SiO2/63% | 稳定,透明 |
项号# | 环氧化物(g)* | 硬化剂**(g) | 溶剂***(g) | 催化剂****(g) | FCS量***** | Tg****** |
1 | ECN(3.55) | T758(1.73) | MeOPrOH(2) | TPP(0.12) | 10 | 168 |
2 | ECN(3.55) | T758(1.73) | MeOPrOH(2) | TPP(0.06) | 10 | 165 |
3 | ECN(3.55) | T758(1.73) | MeOPrOH(2) | NMI(0.015) | 10 | 199 |
4 | ECN(3.55) | T758(1.73) | MeOPrOH(2) | NMI(0.018) | 5 | 180 |
5 | ECN (3.55)Epon1002F(0.5) | T758(1.73) | MeOPrOH(2) | TPP(0.06) | 10 | 136 |
6 | ECN (3.55)Epon1002F(0.5) | T758(1.73) | MeOPrOH(2) | NMI(0.03) | 10 | 184 |
7 | ECN(3.55) | T758(1.73) | BuAc(2) | TPP(0.12) | 5 | 171 |
8 | ECN(3.55) | T758(1.73) | 二甘醇二甲醚 | TPP(0.12) | 5 | 171 |
9 | ECN(3.55) | T758(1.73) | BuAc(2) | DiBSn(0.12) | 5 | 104 |
项# | Tg下的CTE(μm/m℃) | Tg上的CTE(μm/m℃) |
未填充树脂 | 70 | 210 |
表2,项1(TPP含量0.015g) | 46 | 123 |
表3,项3(NMI含量0.0075g) | 40 | 108 |
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/654,378 US20050049334A1 (en) | 2003-09-03 | 2003-09-03 | Solvent-modified resin system containing filler that has high Tg, transparency and good reliability in wafer level underfill applications |
US10/654,378 | 2003-09-03 |
Publications (2)
Publication Number | Publication Date |
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CN1875477A true CN1875477A (zh) | 2006-12-06 |
CN100490130C CN100490130C (zh) | 2009-05-20 |
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CNB2004800325173A Expired - Fee Related CN100490130C (zh) | 2003-09-03 | 2004-08-03 | 在晶片级底层填料应用中含有高Tg、透明和良好可靠性的填料的溶剂改性树脂体系 |
CNA2004800326373A Pending CN1875478A (zh) | 2003-09-03 | 2004-08-03 | 溶剂改性树脂组合物及其制备方法 |
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Country | Link |
---|---|
US (2) | US20050049334A1 (zh) |
EP (1) | EP1665376A1 (zh) |
JP (1) | JP2007504321A (zh) |
KR (1) | KR20060093707A (zh) |
CN (2) | CN100490130C (zh) |
AT (1) | ATE446589T1 (zh) |
AU (1) | AU2004271534A1 (zh) |
BR (1) | BRPI0413778A (zh) |
CA (1) | CA2537828A1 (zh) |
DE (1) | DE602004023734D1 (zh) |
MX (1) | MXPA06002522A (zh) |
RU (1) | RU2358353C2 (zh) |
WO (1) | WO2005024939A1 (zh) |
ZA (2) | ZA200602266B (zh) |
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-
2003
- 2003-09-03 US US10/654,378 patent/US20050049334A1/en not_active Abandoned
- 2003-12-16 US US10/737,943 patent/US20050049352A1/en not_active Abandoned
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- 2004-08-03 KR KR1020067006376A patent/KR20060093707A/ko not_active Application Discontinuation
- 2004-08-03 MX MXPA06002522A patent/MXPA06002522A/es unknown
- 2004-08-03 JP JP2006525333A patent/JP2007504321A/ja active Pending
- 2004-08-03 EP EP04779800A patent/EP1665376A1/en not_active Ceased
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- 2004-08-03 CN CNB2004800325173A patent/CN100490130C/zh not_active Expired - Fee Related
- 2004-08-03 BR BRPI0413778-7A patent/BRPI0413778A/pt not_active IP Right Cessation
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CN109504327A (zh) * | 2018-11-13 | 2019-03-22 | 烟台德邦科技有限公司 | 一种高Tg高可靠性的环氧树脂封装导电胶及其制备方法 |
Also Published As
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WO2005024939A1 (en) | 2005-03-17 |
US20050049352A1 (en) | 2005-03-03 |
MXPA06002522A (es) | 2006-06-20 |
ATE446589T1 (de) | 2009-11-15 |
JP2007504321A (ja) | 2007-03-01 |
RU2006110520A (ru) | 2007-10-10 |
EP1665376A1 (en) | 2006-06-07 |
ZA200602267B (en) | 2007-07-25 |
BRPI0413778A (pt) | 2006-10-31 |
KR20060093707A (ko) | 2006-08-25 |
RU2358353C2 (ru) | 2009-06-10 |
AU2004271534A1 (en) | 2005-03-17 |
CN1875478A (zh) | 2006-12-06 |
ZA200602266B (en) | 2007-07-25 |
CA2537828A1 (en) | 2005-03-17 |
US20050049334A1 (en) | 2005-03-03 |
CN100490130C (zh) | 2009-05-20 |
DE602004023734D1 (de) | 2009-12-03 |
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