CN1870251A - 散热装置 - Google Patents

散热装置 Download PDF

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CN1870251A
CN1870251A CNA2005100349831A CN200510034983A CN1870251A CN 1870251 A CN1870251 A CN 1870251A CN A2005100349831 A CNA2005100349831 A CN A2005100349831A CN 200510034983 A CN200510034983 A CN 200510034983A CN 1870251 A CN1870251 A CN 1870251A
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radiating fin
heat
pedestal
heat abstractor
fluting
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CN100389493C (zh
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林桐华
陈进龙
林雨利
周大昶
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Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Fuzhun Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to US11/164,893 priority patent/US7426956B2/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
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  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本发明提供一种散热装置,其包括一基座,若干相互堆叠之散热鳍片及连接基座与散热鳍片之热管,相邻两散热鳍片之间形成一通道,该通道内设有至少一分流结构将通道分隔成若干区域,从而可有效防止气流流经通道时产生回流,靠近基座之散热鳍片之分流结构与基座直接接触,基座吸收之热量一部分可通过热管传至散热鳍片,而另一部分可通过相邻两散热鳍片间之分流结构相互抵接而传至散热鳍片,从而提高散热装置之散热效率。

Description

散热装置
【技术领域】
本发明涉及一种具有防回流效果之散热装置。
【背景技术】
随着电子产业技术之迅猛发展,电子组件之运行速度不断提升,其产生之热量亦随之增多,如果不及时将其产生之热量排出,将导致其温度不断升高,进而严重影响其运行性能,为确保电子组件能正常运行,通常在其表面安装一散热器以将热量快速地散发出去。
传统铝挤型散热器由于开模费用底、技术要求不高等优点受到广泛应用,然,随着电子组件集成度之提高,电子组件所产生之热量亦与日俱增,而铝挤型散热器之散热鳍片系一体挤压成型,因受限于模具技术散热鳍片之高宽比受到限制,因而其有效散热面积有限,日渐不能满足电子组件对散热之需求。故业界对上述传统铝挤型散热器进行改良,利用若干金属散热鳍片组合形成堆叠式散热器,该种散热器之散热鳍片由金属薄片预先成型,其有效散热面积可得到明显提高。然而,该种散热器在配合风扇使用时,风扇产生之气流在通过散热鳍片间之通道时容易产生回流,从而影响散热效果,尤其在散热器利用***风扇进行辅助散热时,风扇并未正对散热器通道,此时回流现象更为严重。
【发明内容】
为解决上述气流在散热鳍片间产生回流之问题,有必要提供一种可防止于散热鳍片间产生回流之散热装置。
该散热装置包括一基座,若干相互堆叠之散热鳍片及连接基座与鳍片之热管,相邻两散热鳍片之间形成一通道,该通道内设有至少一分流结构将通道分隔成若干区域,靠近基座之散热鳍片之分流结构与基座直接接触。
相较于现有技术,该散热装置之通道内设有分流结构从而将通道分隔成若干区域,从而可有效防止气流流经通道时产生回流。而且,基座吸收之热量一部分可通过热管传至散热鳍片,而另一部分可通过相邻两散热鳍片间之分流结构传至散热鳍片,从而提高散热装置之散热效率。
【附图说明】
图1为本发明第一实施例散热装置之组装图;
图2为图1之立体分解图;
图3为图2中基座及热管之另一角度视图;
图4为本发明第一实施例散热装置之散热鳍片之组装示意图;
图5为图4中圈V部分之放大图;及
图6为本发明第二实施例散热装置之散热鳍片之组装示意图。
【具体实施方式】
下面参照附图,结合实施例对本发明作进一步说明。
图1所示为本发明第一实施例散热装置10之示意图,该散热装置10包括一基座60,若干散热鳍片20及连接基座60与散热鳍片20之若干热管40。
请一并参阅图2及图3,该基座60包括一底面62,一与底面相对之顶面64,底面62上开设有若干开槽66。基座60通常由热传导率较高且质量较轻之材质如铝等制成。
该热管40为U形,可以理解地,该热管之形状并不局限于U形,还可以为其它形状,如L形等,为方便描述,在本实施例中将以U形为例进行说明。该热管40包括一吸热部42及从吸热部42两端延伸出之放热部44,吸热部42通过焊接或其它方式固定收容于基座60之开槽66内。
一吸热板68贴附于基座60之底面62从而将热管40之吸热部42夹设于基座60与吸热板68之间。该吸热板68用于与一发热元件(图未示)接触,其通常由热传导率较基座60高之材质如铜等制成。可以理解地,本发明也可以不使用吸热板68,而使得基座60之底面62及热管40之吸热部42直接与发热元件接触。
请参阅图4及图5,每一散热鳍片20包括一本体22,本体22之一侧向另一侧一体冲压从而在本体22之一侧形成一U形凹槽26,而在本体22之另一侧形成一突肋28,该突肋28包括从本体22延伸之两侧壁28a,连接两侧壁28a之一底壁28b,可以理解地,突肋28之横截面还可为其它形状,如三角形,半圆形等。散热鳍片20之四角处各设有一折边30,折边30之一端斜向延伸设有一卡扣结构,在本实施例中该卡扣结构包括从折边30斜向延伸之一连接片32及形成于连接片32末端之一卡梢34,散热鳍片20本体22对应卡扣结构处开设有开槽36。散热鳍片20之本体22上更进一步设有若干通孔38以供热管40之放热部44穿设。后位散热鳍片20之突肋28对应卡设于前位散热鳍片20之凹槽26中,后位散热鳍片20之折边30抵靠于前位散热鳍片20之本体22之后侧,后位散热鳍片20之卡扣结构分别跨过前位散热鳍片20之本体22之开槽36。当所有散热鳍片20叠好之后,再利用治具将卡梢34进行折弯,使之抵靠于对应散热鳍片20之本体22之前侧从而将散热鳍片20在前后方向上进行定位。相邻散热鳍片20之间形成一沿整个散热鳍片20长度方向之通道,靠近基座60的顶面64之散热鳍片20之突肋28的底壁28b与基座60之顶面64直接接触(请参图1)。
在本实施例中,后位散热鳍片20之突肋28对应卡设于前位散热鳍片20之凹槽26中,相邻两散热鳍片20之突肋28之侧壁28a相互抵接,形成一分流结构将两相邻散热鳍片20间之通道分隔成若干互不相通之区域。这样,当***风扇(图未示)产生之气流通过散热装置10时,气流在互不相通之区域中流动,从而可避免气流在通道内产生回流。热管40连接基座60与散热鳍片20,从而形成第一传热路径;靠近基座60顶面64之散热鳍片20之突肋28的底壁28b与基座60的顶面64直接接触,且相邻两散热鳍片20之突肋28之侧壁28a相互抵接,从而在基座60与散热鳍片20之间形成第二传热路径。这样,基座60吸收之热量一部分可通过热管40传至散热鳍片20,而另一部分可通过相邻两散热鳍片20之突肋28之侧壁28a相互抵接传至散热鳍片20,从而提高散热装置10之散热效率。
图6所示为本发明散热装置10之散热鳍片20’之第二实施例的示意图,其与第一实施例之散热鳍片20之结构基本相同,不同之处在于分流结构。在第二实施例中,从散热鳍片20’之本体22’一侧向另一侧一体冲压设有若干挡片26’,后位散热鳍片20’之挡片26’抵接于前位散热鳍片20’之本体22’之后侧从而形成分流结构,该分流结构将散热鳍片20’间之通道分隔成若干区域,从而可避免气流在通道内产生回流。该散热鳍片20’之使用情形与第一实施例之散热鳍片20相同,靠近基座60顶面64之散热鳍片20’的挡片26’与基座60之顶面直接接触,这样,基座60吸收之热量一部分可通过热管40传至散热鳍片20’,另一部分可通过散热鳍片20’之挡片26’与本体22’相互抵接而顺次从基座60传至散热鳍片20’。

Claims (15)

1.一种散热装置,包括一用于从发热元件吸热之基座、若干平行堆叠之散热鳍片及至少一连接基座与散热鳍片从而形成第一传热路径之热管,相邻散热鳍片之间形成相互平行之通道,其改良在于:每一通道内设有若干分流结构将该通道分成若干区域且其中一散热鳍片的分流结构与基座接触从而在基座与鳍片之间形成第二传热路径。
2.如权利要求1所述的散热装置,其特征在于:其中相邻散热鳍片间相对应之分流结构相互抵接。
3.如权利要求2所述的散热装置,其特征在于:其中每一散热鳍片包括一本体,该分流结构为从本体一体延伸而成之挡片。
4.如权利要求2所述的散热装置,其特征在于:其中每一散热鳍片包括一本体,本体之一侧形成一凹槽,本体之另一侧与凹槽对应处形成一突肋,且每一散热鳍片之突肋对应卡设于相邻散热鳍片之凹槽中从而形成分流结构。
5.如权利要求4所述的散热装置,其特征在于:其中该突肋之横截面为U形、半圆形或三角形。
6.如权利要求1至5任一项所述的散热装置,其特征在于:其中每一散热鳍片设有至少一与相邻散热鳍片相卡扣之卡扣结构及与卡扣结构相对应之开槽。
7.如权利要求6所述的散热装置,其特征在于:其中该卡扣结构包括一卡梢,且前位散热鳍片之卡梢跨过相邻后位散热鳍片之开槽抵靠于后位散热鳍片之本体之后侧。
8.如权利要求1所述的散热装置,其特征在于:其中该基座之用于与发热元件相接触之表面设有至少一开槽,该热管包括一收容于该至少一开槽内之吸热部及串接于散热鳍片之放热部。
9.如权利要求1所述的散热装置,其特征在于:其中该散热装置更进一步包括一装设于基座并用于与发热元件相接触之吸热板,该基座之与吸热板相接触之表面设有至少一开槽,该热管包括一收容于该至少一开槽内并与吸热板直接接触之吸热部及串接于散热鳍片之放热部。
10.如权利要求9所述的散热装置,其特征在于:其中该热管之形状为U形或L形。
11.一种散热装置,包括一用于从发热元件吸热之基座、若干相互堆叠之散热鳍片及至少一沿垂直基座厚度方向穿越基座并与散热鳍片相连接之热管,两相邻散热鳍片之间形成一通道,其改良在于:该通道内设有若干分流结构将该通道分成若干区域且至少一散热鳍片之分流结构与基座接触。
12.如权利要求11所述的散热装置,其特征在于:其中该基座之垂直其厚度方向之一表面设有至少一开槽,该热管包括一收容于该至少一开槽内之吸热部及串接于散热鳍片之放热部。
13.如申请专利范围第12项所述之散热装置,其中一吸热板贴设于基座之设有开槽之表面并将热管之吸热部夹设于吸热板与基座之间。
14.如申请专利范围第13项所述之散热装置,其中该吸热板之热传导率高于基座之热传导率。
15.如申请专利范围第11至14任一项所述之散热装置,其中该热管之形状为U形或L形。
CNB2005100349831A 2005-05-29 2005-05-29 散热装置 Expired - Fee Related CN100389493C (zh)

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US11/164,893 US7426956B2 (en) 2005-05-29 2005-12-09 Heat dissipating apparatus

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US7866375B2 (en) 2006-12-01 2011-01-11 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
CN101193535B (zh) * 2006-12-01 2011-07-27 富准精密工业(深圳)有限公司 热管散热装置
CN101610656B (zh) * 2008-06-18 2011-11-30 富准精密工业(深圳)有限公司 散热装置及其组装方法
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CN110600852A (zh) * 2019-10-18 2019-12-20 大连大学 一种新型通讯天线散热器

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