CN1831185A - 蒸发源组件及使用该组件的蒸镀装置 - Google Patents
蒸发源组件及使用该组件的蒸镀装置 Download PDFInfo
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- CN1831185A CN1831185A CNA2005100980369A CN200510098036A CN1831185A CN 1831185 A CN1831185 A CN 1831185A CN A2005100980369 A CNA2005100980369 A CN A2005100980369A CN 200510098036 A CN200510098036 A CN 200510098036A CN 1831185 A CN1831185 A CN 1831185A
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- evaporation
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- evaporation source
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02269—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by thermal evaporation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR18834/05 | 2005-03-07 | ||
KR1020050018834A KR100623730B1 (ko) | 2005-03-07 | 2005-03-07 | 증발원 어셈블리 및 이를 구비한 증착 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1831185A true CN1831185A (zh) | 2006-09-13 |
CN1831185B CN1831185B (zh) | 2010-05-05 |
Family
ID=36993680
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2005100980369A Active CN1831185B (zh) | 2005-03-07 | 2005-07-01 | 蒸发源组件及使用该组件的蒸镀装置 |
Country Status (3)
Country | Link |
---|---|
JP (2) | JP4732036B2 (zh) |
KR (1) | KR100623730B1 (zh) |
CN (1) | CN1831185B (zh) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101182627B (zh) * | 2006-11-16 | 2011-06-22 | 三菱重工业株式会社 | 蒸发源以及使用该蒸发源的真空蒸镀装置 |
CN103255370A (zh) * | 2012-02-21 | 2013-08-21 | 三星显示有限公司 | 沉积装置及用其制造有机发光二极管显示器的方法 |
CN104404451A (zh) * | 2014-12-16 | 2015-03-11 | 合肥鑫晟光电科技有限公司 | 蒸镀源和蒸镀装置 |
CN106521423A (zh) * | 2016-11-28 | 2017-03-22 | 上海天马有机发光显示技术有限公司 | 一种真空蒸镀装置、方法及有机发光显示面板 |
CN107858652A (zh) * | 2017-12-09 | 2018-03-30 | 四川金英科技有限责任公司 | 一种线性蒸镀源装置 |
CN109666898A (zh) * | 2019-01-03 | 2019-04-23 | 福建华佳彩有限公司 | 一种用于点蒸发源的坩埚 |
CN112458404A (zh) * | 2016-05-10 | 2021-03-09 | 应用材料公司 | 操作沉积设备的方法和沉积设备 |
CN112831753A (zh) * | 2019-11-25 | 2021-05-25 | 合肥欣奕华智能机器有限公司 | 一种多重蒸发源遮挡机构及薄膜蒸镀设备 |
CN113463032A (zh) * | 2016-07-05 | 2021-10-01 | 佳能特机株式会社 | 蒸镀装置及蒸发源 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5046882B2 (ja) * | 2007-11-21 | 2012-10-10 | 三菱重工業株式会社 | インライン式成膜装置 |
JP4880647B2 (ja) * | 2008-07-01 | 2012-02-22 | 東京エレクトロン株式会社 | 有機elの成膜装置および蒸着装置 |
US8628617B2 (en) * | 2008-12-03 | 2014-01-14 | First Solar, Inc. | System and method for top-down material deposition |
JP4831841B2 (ja) * | 2009-07-10 | 2011-12-07 | 三菱重工業株式会社 | 真空蒸着装置及び方法 |
US8669192B2 (en) | 2011-01-18 | 2014-03-11 | Sharp Kabushiki Kaisha | Vapor deposition device, vapor deposition method, organic EL element and organic EL display device |
JP2012214834A (ja) * | 2011-03-31 | 2012-11-08 | Hitachi High-Technologies Corp | 真空蒸着装置および有機el表示装置の製造方法 |
KR101216530B1 (ko) * | 2011-04-18 | 2012-12-31 | (주)와이에스썸텍 | 선형 증발원을 이용한 증착 장치 |
JP5557817B2 (ja) * | 2011-09-30 | 2014-07-23 | 株式会社日立ハイテクノロジーズ | 蒸発源および成膜装置 |
JP6291696B2 (ja) * | 2014-07-28 | 2018-03-14 | 株式会社Joled | 蒸着装置および蒸発源 |
JP6529257B2 (ja) * | 2014-12-26 | 2019-06-12 | キヤノントッキ株式会社 | 真空蒸着装置 |
KR102567009B1 (ko) * | 2016-03-29 | 2023-08-14 | (주)선익시스템 | 열적 간섭을 억제시킨 복합증발장치 |
KR102629005B1 (ko) * | 2016-03-29 | 2024-01-25 | 주식회사 선익시스템 | 다수 종류의 증착물질의 혼합비율을 보완하여 줄 수 있는 복합증발장치 |
WO2021052592A1 (en) * | 2019-09-19 | 2021-03-25 | Applied Materials, Inc. | Method of operating an evaporation source, evaporation system, and shield handling apparatus |
CN112742631B (zh) * | 2020-12-24 | 2021-12-28 | 厦门天马微电子有限公司 | 喷头组件、喷印装置及喷印方法 |
CN115094383B (zh) * | 2022-07-01 | 2023-06-30 | 江阴纳力新材料科技有限公司 | 一种基于蒸镀的复合正极集流体制备装置及方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57158374A (en) | 1981-03-24 | 1982-09-30 | Mitsubishi Heavy Ind Ltd | Plated steel strip by vapor deposition of pb-zn binary alloy and producing device thereof |
JP4336869B2 (ja) * | 2001-11-27 | 2009-09-30 | 日本電気株式会社 | 真空成膜装置、真空成膜方法および電池用電極の製造方法 |
KR100532657B1 (ko) * | 2002-11-18 | 2005-12-02 | 주식회사 야스 | 다증발원을 이용한 동시증착에서 균일하게 혼합된 박막의증착을 위한 증발 영역조절장치 |
JP4493926B2 (ja) * | 2003-04-25 | 2010-06-30 | 株式会社半導体エネルギー研究所 | 製造装置 |
CN1210435C (zh) * | 2003-06-04 | 2005-07-13 | 深圳市创欧科技有限公司 | 用于制作有机电致发光显示器的蒸镀装置 |
CN2644433Y (zh) * | 2003-07-15 | 2004-09-29 | 精碟科技股份有限公司 | 镀膜设备及镀膜设备用的遮板单元 |
-
2005
- 2005-03-07 KR KR1020050018834A patent/KR100623730B1/ko active IP Right Grant
- 2005-07-01 CN CN2005100980369A patent/CN1831185B/zh active Active
- 2005-07-01 JP JP2005194444A patent/JP4732036B2/ja active Active
-
2009
- 2009-06-08 JP JP2009137662A patent/JP5155941B2/ja active Active
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101182627B (zh) * | 2006-11-16 | 2011-06-22 | 三菱重工业株式会社 | 蒸发源以及使用该蒸发源的真空蒸镀装置 |
CN103255370A (zh) * | 2012-02-21 | 2013-08-21 | 三星显示有限公司 | 沉积装置及用其制造有机发光二极管显示器的方法 |
CN103255370B (zh) * | 2012-02-21 | 2017-03-01 | 三星显示有限公司 | 沉积装置及用其制造有机发光二极管显示器的方法 |
CN104404451A (zh) * | 2014-12-16 | 2015-03-11 | 合肥鑫晟光电科技有限公司 | 蒸镀源和蒸镀装置 |
CN112458404A (zh) * | 2016-05-10 | 2021-03-09 | 应用材料公司 | 操作沉积设备的方法和沉积设备 |
CN113463032A (zh) * | 2016-07-05 | 2021-10-01 | 佳能特机株式会社 | 蒸镀装置及蒸发源 |
CN106521423A (zh) * | 2016-11-28 | 2017-03-22 | 上海天马有机发光显示技术有限公司 | 一种真空蒸镀装置、方法及有机发光显示面板 |
DE102017122120B4 (de) | 2016-11-28 | 2022-06-15 | Tianma Microelectronics Co., Ltd. | Vakuumverdampfungsvorrichtung und zugehöriges Verfahren, und organisches Licht emittierendes Anzeigefeld |
CN107858652A (zh) * | 2017-12-09 | 2018-03-30 | 四川金英科技有限责任公司 | 一种线性蒸镀源装置 |
CN109666898A (zh) * | 2019-01-03 | 2019-04-23 | 福建华佳彩有限公司 | 一种用于点蒸发源的坩埚 |
CN112831753A (zh) * | 2019-11-25 | 2021-05-25 | 合肥欣奕华智能机器有限公司 | 一种多重蒸发源遮挡机构及薄膜蒸镀设备 |
Also Published As
Publication number | Publication date |
---|---|
JP2006249572A (ja) | 2006-09-21 |
KR100623730B1 (ko) | 2006-09-14 |
CN1831185B (zh) | 2010-05-05 |
JP5155941B2 (ja) | 2013-03-06 |
JP2009197336A (ja) | 2009-09-03 |
JP4732036B2 (ja) | 2011-07-27 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20090109 Address after: Gyeonggi Do, South Korea Applicant after: Samsung Mobile Display Co., Ltd. Address before: Gyeonggi Do, South Korea Applicant before: Samsung SDI Co., Ltd. |
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ASS | Succession or assignment of patent right |
Owner name: SAMSUNG MOBILE DISPLAY CO., LTD. Free format text: FORMER OWNER: SAMSUNG SDI CO., LTD. Effective date: 20090109 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SAMSUNG MONITOR CO., LTD. Free format text: FORMER OWNER: SAMSUNG MOBILE DISPLAY CO., LTD. Effective date: 20121024 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20121024 Address after: Gyeonggi Do, South Korea Patentee after: Samsung Display Co., Ltd. Address before: Gyeonggi Do, South Korea Patentee before: Samsung Mobile Display Co., Ltd. |