CN1829418A - 印制电路板的冲孔方法及印制电路板的冲孔装置 - Google Patents
印制电路板的冲孔方法及印制电路板的冲孔装置 Download PDFInfo
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- CN1829418A CN1829418A CN 200610058634 CN200610058634A CN1829418A CN 1829418 A CN1829418 A CN 1829418A CN 200610058634 CN200610058634 CN 200610058634 CN 200610058634 A CN200610058634 A CN 200610058634A CN 1829418 A CN1829418 A CN 1829418A
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Abstract
Description
Claims (22)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005061322 | 2005-03-04 | ||
JP2005-061322 | 2005-03-04 | ||
JP2005061322A JP4559260B2 (ja) | 2005-03-04 | 2005-03-04 | プリント基板の穴明け方法 |
JP2005-213608 | 2005-07-25 | ||
JP2005213608 | 2005-07-25 | ||
JP2005213608A JP4977341B2 (ja) | 2005-07-25 | 2005-07-25 | レーザ加工装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009101738483A Division CN101676059B (zh) | 2005-03-04 | 2006-03-02 | 印制电路板的冲孔方法及印制电路板的冲孔装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1829418A true CN1829418A (zh) | 2006-09-06 |
CN1829418B CN1829418B (zh) | 2010-09-08 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2006100586348A Expired - Fee Related CN1829418B (zh) | 2005-03-04 | 2006-03-02 | 印制电路板的冲孔方法及印制电路板的冲孔装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4559260B2 (zh) |
CN (1) | CN1829418B (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101712098A (zh) * | 2008-09-29 | 2010-05-26 | 日立比亚机械股份有限公司 | 激光加工装置 |
CN101930907A (zh) * | 2009-06-17 | 2010-12-29 | 索尼公司 | 照射装置及半导体器件制造方法 |
CN102844142A (zh) * | 2010-04-12 | 2012-12-26 | 三菱电机株式会社 | 激光加工机、激光加工方法以及激光加工控制装置 |
CN101795808B (zh) * | 2007-07-24 | 2013-09-18 | Eo技术有限公司 | 使用光束分割的激光处理设备和方法 |
CN101674913B (zh) * | 2007-05-03 | 2014-08-20 | Esi电子科技工业公司 | 具有后扫瞄透镜偏转的激光微加工*** |
CN114571103A (zh) * | 2020-11-30 | 2022-06-03 | 大族激光科技产业集团股份有限公司 | 印制线路板的激光加工方法和***、计算机存储介质 |
CN114791605A (zh) * | 2021-01-26 | 2022-07-26 | 南京大量数控科技有限公司 | 印刷电路板内层深度测量光学*** |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017130960A1 (ja) * | 2016-01-27 | 2017-08-03 | 株式会社デンソー | 部材の製造方法、及び、部材の製造装置 |
JP6468295B2 (ja) * | 2016-01-27 | 2019-02-13 | 株式会社デンソー | 部材の製造方法、及び、部材の製造装置 |
EP3466597A1 (en) * | 2017-10-05 | 2019-04-10 | Synova S.A. | Apparatus for machining a workpiece with a laser beam |
DE112021001140T5 (de) * | 2020-04-27 | 2022-12-29 | Panasonic Intellectual Property Management Co., Ltd. | Laserverarbeitungskopf und laserverarbeitungsvorrichtung |
JP2022105463A (ja) * | 2021-01-02 | 2022-07-14 | 大船企業日本株式会社 | プリント基板のレーザ加工方法およびプリント基板のレーザ加工機 |
CN114698250B (zh) * | 2022-04-08 | 2024-03-22 | 安捷利电子科技(苏州)有限公司 | 一种电路板盲孔的开设方法及电路板 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0441091A (ja) * | 1990-06-04 | 1992-02-12 | Canon Inc | レーザーによるプリント板の加工方法 |
TW436357B (en) * | 1997-12-12 | 2001-05-28 | Matsushita Electric Ind Co Ltd | Laser drilling equipment and control method |
JP3488614B2 (ja) * | 1998-01-09 | 2004-01-19 | 三菱電機株式会社 | 積層材料の凹設部検査装置及びレーザ加工装置 |
JP3583279B2 (ja) * | 1998-01-13 | 2004-11-04 | 三菱電機株式会社 | 穴あけ加工方法 |
JP2000263263A (ja) * | 1999-03-12 | 2000-09-26 | Sumitomo Heavy Ind Ltd | レーザ穴あけ加工方法及び加工装置 |
TW482705B (en) * | 1999-05-28 | 2002-04-11 | Electro Scient Ind Inc | Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias |
JP3756723B2 (ja) * | 1999-07-27 | 2006-03-15 | 松下電工株式会社 | プリント配線板の加工方法 |
JP2001313471A (ja) * | 2000-02-24 | 2001-11-09 | Matsushita Electric Works Ltd | 配線板のビアホール形成方法 |
JP2002335063A (ja) * | 2001-05-09 | 2002-11-22 | Hitachi Via Mechanics Ltd | プリント基板の穴あけ加工方法および装置 |
JP2002137074A (ja) * | 2000-10-31 | 2002-05-14 | Hitachi Via Mechanics Ltd | レーザ加工方法およびレーザ加工機 |
JP4316827B2 (ja) * | 2001-08-13 | 2009-08-19 | 日立ビアメカニクス株式会社 | レーザ加工方法およびレーザ加工装置 |
JP3921992B2 (ja) * | 2001-10-26 | 2007-05-30 | 松下電器産業株式会社 | レーザ加工方法 |
JP2003136267A (ja) * | 2001-11-01 | 2003-05-14 | Hitachi Via Mechanics Ltd | レーザ加工方法およびレーザ加工装置 |
JP4174267B2 (ja) * | 2002-08-21 | 2008-10-29 | 日立ビアメカニクス株式会社 | レーザ加工方法 |
-
2005
- 2005-03-04 JP JP2005061322A patent/JP4559260B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-02 CN CN2006100586348A patent/CN1829418B/zh not_active Expired - Fee Related
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101674913B (zh) * | 2007-05-03 | 2014-08-20 | Esi电子科技工业公司 | 具有后扫瞄透镜偏转的激光微加工*** |
CN101795808B (zh) * | 2007-07-24 | 2013-09-18 | Eo技术有限公司 | 使用光束分割的激光处理设备和方法 |
CN101712098A (zh) * | 2008-09-29 | 2010-05-26 | 日立比亚机械股份有限公司 | 激光加工装置 |
CN101712098B (zh) * | 2008-09-29 | 2014-09-10 | 维亚机械株式会社 | 激光加工装置 |
CN101930907A (zh) * | 2009-06-17 | 2010-12-29 | 索尼公司 | 照射装置及半导体器件制造方法 |
CN102844142A (zh) * | 2010-04-12 | 2012-12-26 | 三菱电机株式会社 | 激光加工机、激光加工方法以及激光加工控制装置 |
CN102844142B (zh) * | 2010-04-12 | 2015-03-04 | 三菱电机株式会社 | 激光加工机、激光加工方法以及激光加工控制装置 |
CN114571103A (zh) * | 2020-11-30 | 2022-06-03 | 大族激光科技产业集团股份有限公司 | 印制线路板的激光加工方法和***、计算机存储介质 |
CN114791605A (zh) * | 2021-01-26 | 2022-07-26 | 南京大量数控科技有限公司 | 印刷电路板内层深度测量光学*** |
CN114791605B (zh) * | 2021-01-26 | 2023-08-22 | 南京大量数控科技有限公司 | 印刷电路板内层深度测量光学*** |
Also Published As
Publication number | Publication date |
---|---|
JP4559260B2 (ja) | 2010-10-06 |
CN1829418B (zh) | 2010-09-08 |
JP2006245438A (ja) | 2006-09-14 |
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