CN1816246A - 印刷电路板及其形成方法 - Google Patents
印刷电路板及其形成方法 Download PDFInfo
- Publication number
- CN1816246A CN1816246A CN 200510006788 CN200510006788A CN1816246A CN 1816246 A CN1816246 A CN 1816246A CN 200510006788 CN200510006788 CN 200510006788 CN 200510006788 A CN200510006788 A CN 200510006788A CN 1816246 A CN1816246 A CN 1816246A
- Authority
- CN
- China
- Prior art keywords
- pcb
- printed circuit
- circuit board
- hole
- aperture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
10 | 印刷电路板 | 12 | 基板 |
22、24、26、28、32 | 通孔 | 42 | 导电层 |
44 | 阻隔物质 | 46 | 防焊物质 |
62、64 | 金属垫 | 66、68、72、74、76、78、82、84、 | 印刷导线 |
92、94、96、98、102、112、114、116、118、122 | 环状金属 | 86、88 | 印刷导线 |
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100067888A CN100386006C (zh) | 2005-02-04 | 2005-02-04 | 印刷电路板及其形成方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100067888A CN100386006C (zh) | 2005-02-04 | 2005-02-04 | 印刷电路板及其形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1816246A true CN1816246A (zh) | 2006-08-09 |
CN100386006C CN100386006C (zh) | 2008-04-30 |
Family
ID=36908126
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100067888A Expired - Fee Related CN100386006C (zh) | 2005-02-04 | 2005-02-04 | 印刷电路板及其形成方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100386006C (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102159033A (zh) * | 2011-03-28 | 2011-08-17 | 冠锋电子科技(梅州)有限公司 | 一种电路板上喇叭形孔的制作方法 |
US8048801B2 (en) | 2007-04-25 | 2011-11-01 | Infineon Technologies, Ag | Substrate with feedthrough and method for producing the same |
CN102458040A (zh) * | 2010-10-28 | 2012-05-16 | 鸿富锦精密工业(深圳)有限公司 | 印刷电路板 |
CN103258933A (zh) * | 2012-04-09 | 2013-08-21 | 东莞市久祥电子有限公司 | 晶片型led线路板运用镀铜防止封装过程中溢胶的方法 |
CN105101628A (zh) * | 2014-05-07 | 2015-11-25 | 易鼎股份有限公司 | 软性电路板的线路搭接结构 |
CN105122607A (zh) * | 2013-04-24 | 2015-12-02 | 罗伯特·博世有限公司 | 电路载体,具有电路载体的结构和用于建立电接触的方法 |
CN111432549A (zh) * | 2019-01-09 | 2020-07-17 | 鸿富锦精密工业(武汉)有限公司 | 电路板 |
CN112333929A (zh) * | 2020-11-02 | 2021-02-05 | 梅虞进 | 一种大规模集成电路芯片生产加工处理设备 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000332111A (ja) * | 1999-05-25 | 2000-11-30 | Shinko Electric Ind Co Ltd | 配線形成方法、多層配線基板及び半導体装置 |
US6772515B2 (en) * | 2000-09-27 | 2004-08-10 | Hitachi, Ltd. | Method of producing multilayer printed wiring board |
-
2005
- 2005-02-04 CN CNB2005100067888A patent/CN100386006C/zh not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8048801B2 (en) | 2007-04-25 | 2011-11-01 | Infineon Technologies, Ag | Substrate with feedthrough and method for producing the same |
CN102458040A (zh) * | 2010-10-28 | 2012-05-16 | 鸿富锦精密工业(深圳)有限公司 | 印刷电路板 |
CN102159033A (zh) * | 2011-03-28 | 2011-08-17 | 冠锋电子科技(梅州)有限公司 | 一种电路板上喇叭形孔的制作方法 |
CN103258933A (zh) * | 2012-04-09 | 2013-08-21 | 东莞市久祥电子有限公司 | 晶片型led线路板运用镀铜防止封装过程中溢胶的方法 |
CN103258933B (zh) * | 2012-04-09 | 2017-05-17 | 东莞市久祥电子有限公司 | 晶片型led线路板运用镀铜防止封装过程中溢胶的方法 |
CN105122607A (zh) * | 2013-04-24 | 2015-12-02 | 罗伯特·博世有限公司 | 电路载体,具有电路载体的结构和用于建立电接触的方法 |
CN105101628A (zh) * | 2014-05-07 | 2015-11-25 | 易鼎股份有限公司 | 软性电路板的线路搭接结构 |
CN111432549A (zh) * | 2019-01-09 | 2020-07-17 | 鸿富锦精密工业(武汉)有限公司 | 电路板 |
CN112333929A (zh) * | 2020-11-02 | 2021-02-05 | 梅虞进 | 一种大规模集成电路芯片生产加工处理设备 |
Also Published As
Publication number | Publication date |
---|---|
CN100386006C (zh) | 2008-04-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100386006C (zh) | 印刷电路板及其形成方法 | |
US7615707B2 (en) | Printed circuit board and forming method thereof | |
EP1350417B1 (de) | Verfahren zur herstellung einer elektronischen baugruppe | |
US7956292B2 (en) | Printed circuit board manufacturing method, printed circuit board, and electronic apparatus | |
CN103369868B (zh) | 一种pcb板的制作方法及pcb板 | |
WO1991014015A1 (en) | Method and materials for forming multi-layer circuits by an additive process | |
US9706667B2 (en) | Via in a printed circuit board | |
CN1258959C (zh) | 焊接凸点的形成方法 | |
KR100771293B1 (ko) | 인쇄회로기판 및 그 제조방법 | |
CN109246935B (zh) | 一种侧壁非金属化的阶梯槽的制作方法 | |
US6675472B1 (en) | Process and structure for manufacturing plastic chip carrier | |
US20030089522A1 (en) | Low impedance / high density connectivity of surface mount components on a printed wiring board | |
WO2006098863A1 (en) | A 2-metal flex circuit and a method of manufacturing the same | |
CN103906354A (zh) | 电路板及其制造方法 | |
CN101102640A (zh) | 印刷电路板及其制造方法 | |
JP2005322832A (ja) | 配線基板およびそれを使用したチップ形電子部品 | |
KR101507913B1 (ko) | Pcb 제조 방법 | |
US3396459A (en) | Method of fabricating electrical connectors | |
KR100632579B1 (ko) | 인쇄회로기판의 비아홀 형성방법 | |
CN101460015B (zh) | 用于安装至少两种类型的电子元件的方法和设备 | |
CN211240284U (zh) | 一种含有盲孔结构的pcb板 | |
KR20020069675A (ko) | 연성인쇄회로기판의 접합방법 | |
CN116940003A (zh) | 一种双面压接盲孔印制电路板及其制作方法 | |
KR100627072B1 (ko) | 스루우 홀 구조 형성 방법 및 스루우 홀 구조 | |
CN115087207A (zh) | Fpc基板的封孔工艺及fpc的制造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: LITE-ON TECHNOLOGY (CHANGZHOU) CO., LTD. Free format text: FORMER OWNER: GUANGBAO SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20131212 Owner name: GUANGBAO SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20131212 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: TAIWAN, CHINA TO: 213166 CHANGZHOU, JIANGSU PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20131212 Address after: 213166 Wujin high tech Industrial Development Zone, Jiangsu Province, Yang Lake Road, No. 88 Patentee after: LITE-ON TECHNOLOGY (CHANGZHOU) CO., LTD. Patentee after: Lite-On Technology Corporation Address before: Taipei City, Taiwan, China Patentee before: Lite-On Technology Corporation |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080430 Termination date: 20170204 |
|
CF01 | Termination of patent right due to non-payment of annual fee |