CN1791299A - Flexible rigid printed circuit board for display - Google Patents
Flexible rigid printed circuit board for display Download PDFInfo
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- CN1791299A CN1791299A CN 200410101365 CN200410101365A CN1791299A CN 1791299 A CN1791299 A CN 1791299A CN 200410101365 CN200410101365 CN 200410101365 CN 200410101365 A CN200410101365 A CN 200410101365A CN 1791299 A CN1791299 A CN 1791299A
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- display
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- circuit board
- printed circuit
- copper foil
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Abstract
The flexible solid PCB for display unit is formed by pre-process and lamination process. Wherein, in pre-process, attaching a first and second copper coil circuits on top and down surfaces of dielectric insulation layer respectively; then, attaching a second medium layer and a third agglutinant on said first circuit by turns; putting anisotropic conductive film (ACF) between said second circuit and glass substrate with electrode; then, applying hot lamination action to form electric connection between said second circuit and said electrode by conductive ion of ACF; reducing number of lamination layer for application of dielectric insulation layer, thereby, avoiding the offset the said second copper coil circuit.
Description
Technical field
The present invention relates to a kind of rigid printed circuit board, particularly a kind of flexible rigid printed circuit board that is used for display.
Background technology
(Printed Circuit Board PCB) always have the title of " mother of electronic system product " to printed circuit board (PCB), and its function is that electronic component is installed and the main support body of pegging graft, and provides the interconnection transmission platform, so that the function of every parts is brought into play.Wherein, printed circuit board (PCB) can have different sorting techniques according to structure, pliability, material, application etc. in classification.
Above-mentioned printed circuit board (PCB), for example with the insulating barrier of tool flexible character and Copper Foil be basic material combine can be described as flexible printed wiring board, its application is prevalent in the electronic product, especially the application development at mobile phone and display is the highest.Wherein, the former material characteristic of flexible printed wiring board can influence the electrical properties performance of flexible printed wiring board, and employed raw material can be divided into resin (resin), Copper Foil, stalemate agent (adhesive), surperficial cuticula (Coverlay), flexible copper foil substrate (FCCL) etc.
As shown in Figure 1, from this figure as can be known, this flexible printed wiring board 10 has flexible, when destroying or force to yield circuit as a kind of static state, but electrode 13 and integrated circuit (IC) chip 12 (IC) on the bridge joint glass substrate 11, this integrated circuit (IC) chip 12 can be used cobasis plate integrated circuit (IC) chip (COG), to reach the circuit control to glass substrate 11.
In addition, existing flexible printed wiring board is if can be divided into two layers and three-decker according to the number of plies, this two-layer structure flexible printed wiring board is made of copper foil circuit and basement membrane (Base film), this three-decker flexible printed wiring board is made of copper foil circuit, stalemate agent and basement membrane material, is equipped with laminar Copper Foil on each layer stalemate agent respectively.And this flexible printed wiring board often uses the material of polyimides (Polyimide) as basement membrane.
The Fig. 2 (A) that is drawn according to 1A part-structure enlarged detail in Fig. 1 flexible printed wiring board 10, this figure is a step schematic diagram of making flexible printed wiring board, this flexible printed wiring board 10 is made by pre-operation and pressing working procedure (Lamination Process), and this pre-operation comprises
(A) earlier on first dielectric layer 14 is two-sided, attach first stalemate agent 15 and second stalemate agent 16 respectively;
(B) attaching first copper foil circuit 17 on above-mentioned first stalemate agent 15 and on above-mentioned second stalemate agent 16, attaching second copper foil circuit 18;
(C) on above-mentioned first copper foil circuit 17, attach the 3rd stalemate agent 19, on above-mentioned the 3rd stalemate agent 19, attach second dielectric layer 20 again;
Please refer to shown in Fig. 2 (B), after this flexible printed wiring board 10 is made and is finished, then, carry out pressing working procedure, earlier between the glass substrate 11 with electrode 13 and second copper foil circuit 18 that in this pre-operation, attached, insert anisotropic conducting rubber 40 (Anisotropic Conductive Film, ACF), after pressing, for example use the hot pressing technology, second copper foil circuit 18 can be formed by anisotropic conducting rubber 40 with electrode 13 be electrically connected.
The material of the anisotropic conducting rubber 40 among the figure mainly is made of resin, thermosetting or thermoplasticity material such as polyethylene for example, and anisotropic conducting rubber 40 by hot pressing to cooling curing, make and the electrode 13 of the glass substrate 11 of the flexible printed wiring board 10 of top, below binds and constitutes display apparatus module, and anisotropic conducting rubber 40 can make second copper foil circuit 18 form with the electrode 13 of glass substrate 11 by conducting particles 401 and be electrically connected because of containing conducting particles 401.
But above-mentioned flexible printed wiring board has many defectives in the hot pressing process, as described below:
1. the hot-press method of this kind circuit board, owing to utilize hot-die to come a plurality of board structure of circuit layers that stack are carried out heating and pressurizing, thermal source is transmitted to the center by hot-die, thereby the quantity that stacks when circuit layer more for a long time, board structure of circuit layer pressurized heating degree by the centre also reduces relatively more, thereby the circuit board in the middle of causing is in conjunction with not exclusively causing attaching bad.
2. the stalemate agent of Shi Yonging is relatively poor because of heat-resisting quantity, if repeatedly contact hot environment, may cause resin, copper foil circuit to come off, and make the electrical properties variation, becomes the big obstacle of one in the application.
3. as shown in Figure 3, under the situation that monitor resolution improves constantly, the panel electrode spacing is more and more littler, thereby the static state of the display made from flexible printed wiring board is destroyed or force to yield under the circuit conditions, because of used second stalemate agent, 16 heat-resisting quantities relatively poor, when hot pressing, work as pressure, temperature raises, the material of this second stalemate agent 16 itself produces deformation, the displacements that cause second copper foil circuit 18 that second stalemate agent 16 sticked together to produce to the left or to the right, or make on second copper foil circuit 18 has, the phenomenon that has a down dip, promptly, make second copper foil circuit 18 touch electrode 13 on this glass substrate 11 easily, cause short circuit or cause other electrical problem.
By as can be known above-mentioned, because existing circuit board is also very high through the circuit board fraction defective of hot-press method manufacturing, therefore head it off how is that general manufacturer expects, also is main purpose of the present invention place.
Summary of the invention
Main purpose of the present invention, be to provide a kind of flexible rigid printed circuit board that is used for display, this flexible rigid printed circuit board uses a kind of glass epoxy resin material as dielectric insulation layer, glass epoxy resin is because of having favorable mechanical character, insulating property (properties) and good characteristics such as tackness, the feasible copper foil circuit that sticks on it, in hot pressing, can not cause copper foil circuit to produce shift phenomenon, thereby avoid and the circuit that the engages problem that is short-circuited.
Another object of the present invention, be to provide a kind of flexible rigid printed circuit board that is used for display, it can avoid the employed stalemate agent of previous printed circuit board (PCB) when hot pressing, the obscission of the copper foil circuit of the attaching that is caused because of the hot environment deterioration on it.The present invention can make and know this operator after reading specification, other benefit of applying for a patent invention or other purpose more understanding in the claim to be defined.
In order to reach above-mentioned purpose, the invention provides a kind of flexible rigid printed circuit board that is used for display, this flexible rigid printed circuit board forms by pre-operation and pressing working procedure (Lamination Process), in pre-operation, upper and lower surface at dielectric insulation layer attaches first copper foil circuit and second copper foil circuit respectively earlier, above first copper foil circuit, attach the 3rd stalemate agent again, the 3rd stalemate agent top attaches second dielectric layer again, then at second copper foil circuit and have insert between the glass substrate of electrode anisotropic conducting rubber (Anisotropic Conductive Film, ACF).After pre-operation is finished, then implement pressing working procedure, second copper foil circuit can be formed by the conducting particles of anisotropic conducting rubber with above-mentioned electrode to be electrically connected, because the application of dielectric insulation layer, make the number of plies of pressing reduce, thereby can avoid the second copper foil circuit generation shift phenomenon on the dielectric insulation layer.
Description of drawings
Fig. 1 is on display floater, and flexible printed wiring board is as the destroy or force to yield schematic diagram of circuit of static state;
Before Fig. 2 (A) is hot pressing, the making step schematic diagram of flexible printed wiring board;
Fig. 2 (B) is after hot pressing, the electrical block diagram of flexible printed wiring board, anisotropic conducting rubber and glass substrate;
Fig. 3 is in the anisotropic conducting rubber, the view of the copper foil circuit that stalemate agent sticked together after hot pressing;
Fig. 4 is the making step schematic diagram of flexible rigid printed circuit board;
Fig. 5 is the electrical block diagram before flexible rigid printed circuit board, anisotropic conducting rubber and the glass substrate hot pressing;
Fig. 6 is the electrical block diagram after flexible rigid printed circuit board, anisotropic conducting rubber and the glass substrate hot pressing;
Fig. 7 is on display floater, and flexible rigid printed circuit board is as the destroy or force to yield schematic diagram of circuit of static state.
Among the figure
10 flexible printed wiring boards
11 glass substrates
12 integrated circuit (IC) chip
13 electrodes
14 first dielectric layers
15 first stalemate agents
16 second stalemate agents
17,51 first copper foil circuits
18,52 second copper foil circuits
19,53 the 3rd stalemate agents
20,54 second dielectric layers
40,70 anisotropic conducting rubbers
401,701 conducting particless
50 dielectric insulation layers
60 flexible rigid printed circuit boards
↓ hot pressing
Embodiment
For further specifying feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, yet appended graphic only provide with reference to and the explanation usefulness, be not to be used for the present invention is limited.
Flexible printed wiring board used a kind of macromolecule basement membrane stalemate agent and copper foil circuit to stick together in the past, and form the 3rd layer, not only increase circuit board thickness, and when using such as stalemate agents such as polyester, acryl, thereby easily produce delamination because of the hot environment deterioration.
Thereby, the present invention is directed to above-mentioned defective, a kind of flexible rigid printed circuit board is provided, at first please cooperate shown in Figure 4, flexible rigid printed circuit board 60 is made by two kinds of different operations of pre-operation and pressing working procedure (LaminationProcess), at first make by pre-operation, its step comprises:
(A) on the above and below of dielectric insulation layer 50, attach earlier first copper foil circuit 51 and second copper foil circuit 52 respectively;
(B) on above-mentioned first copper foil circuit 51, attach the 3rd stalemate agent 53;
(C) on above-mentioned the 3rd stalemate agent 53, attach second dielectric layer 54 again;
At this moment, this flexible rigid printed circuit board 60 is made and is finished, wherein, above-mentioned second dielectric layer 54 is normal polyimides or the green lacquer that uses of flexible printed wiring board, and dielectric insulation layer 50 is a kind of substrate material, this substrate material is by resin, the reinforcement material is formed, refer to for tree, generally be meant macromolecule resin, commonly used has: epoxy resin, phenolic resins, polyamine formaldehyde, silicone and Teflon etc., the reinforcement material then has glass fabric (glass cloth), glass fibre mats, insulating paper etc., resin used in the present invention is an epoxy resin, and the reinforcement material then is a glass fabric, and the dielectric insulation layer of being made by above-mentioned these two kinds of materials can be described as glass epoxy resin, glass fabric is immersed epoxy resin, and the baking box by gluing machine is baked into and binds film and make dielectric insulation layer 50.
Please also refer to Fig. 5 and shown in Figure 6, then, in pressing working procedure, earlier at glass substrate 11 with between second copper foil circuit 52 of pre-formation that operation attaches with electrode 13, insert anisotropic conducting rubber 70, and in the present embodiment, in hot pressing ↓ mode with flexible rigid printed circuit board 60, anisotropic conducting rubber 70 and glass substrate 11 clampings, and by behind anisotropic conducting rubber 70 cooling curings, make and catch up with, under circuit bind and constitute display apparatus module, because anisotropic conducting rubber 70 contains conducting particles 701, can be electrically connected with second copper foil circuit 52 and electrode 13 formation through conducting particles 701 after the pressing.
In addition, dielectric insulation layer 50 used in the present invention can be added into a kind of curing agent, in the present embodiment, uses dicyandiamide (NH
2NH
2(CN)
2) be curing agent, dicyandiamide is because of having two primary amines, can with epoxy resin generation cross-linking reaction, thereby generate three-dimensional cross-linked structure (crosslinkage), like this, can make Fr4 that tackness is preferably arranged, make second copper foil circuit 52 that sticks together on it be difficult for dropping.
In sum, the technology of the present invention is characterised in that, with the first commonly used dielectric layer 14 for example polyimides and on first dielectric layer 14, stick together first stalemate agent 15 of first copper foil circuit 17, second stalemate agent, 16 usefulness the dielectric insulation layers 50 that stick together second copper foil circuit 18 in its lower section carry out material and replace, and employed dielectric insulation layer 50 has following advantage:
1. easily sclerosis: under 5 ℃～150 ℃ environment, dielectric insulation layer 50 is owing to contain epoxy resin thereby can be simply and carry out sclerous reaction fast, and hardening temperature changes with selected curing agent.
2. low cubical contraction: compare with general resin in hardening process, the cubical contraction of epoxy resin is approximately 3%, far below general resin 10% shrinkage.Therefore be used for dimensional requirement comparatively accurate machinery, motor aspect more.
3. good tackness: the epoxy resin after the sclerosis has polarity hydroxyl and ether, thereby good adhesive properties is arranged.
4. favorable mechanical character: epoxy resin is compared with the resin of other form, and engineering properties is preferably arranged, and this is because epoxy resin cubical contraction in hardening process is low, thereby mechanical property is preferably arranged.
5. good insulation performance character: the epoxy resin after the sclerosis because the resonance of two keys can effectively absorb external electronics, further stops electronics to transmit, thereby forms the good insulation performance characteristic because of there being the polar functional groups of double bond structure on the long-chain.
Please continue with reference to shown in Figure 6, when using dielectric insulation layer 50, can make flexible rigid printed circuit board 60 after finishing hot pressing, with respect to the electrode on the glass substrate 11 13, second copper foil circuit 52 that it sticked together can reduce the phenomenon of skew to the left or to the right, or avoids second copper foil circuit 52 that the situation of upper and lower inclination takes place.
Please refer to shown in Figure 7, the flexible rigid printed circuit board 60 that uses dielectric insulation layer 50 to make, because of having good flexible, in the bending process, can not cause short circuit, thereby the size and the shape in the utilized space of raising product, be easy to carry out the three dimensions three-dimensional wiring, be fit to light, thin, the short and small requirement of electronic product, for example be used on the display with double faces (OLED), monocrystalline silicon display high resolution display panels such as (LCOS) of LCD, plasma display panel, transparent Organic Light Emitting Diode.
But below only be preferable embodiment of the present invention, do not limit claim scope of the present invention thus, therefore so long as the equivalent structure that the content that utilization specification of the present invention and figure indicate is carried out changes, all in like manner all be included within the scope of the present invention, state in the lump at this.
Claims (8)
1. flexible rigid printed circuit board that is used for display, this flexible rigid printed circuit board forms by pre-operation and pressing working procedure (Lamination Process), wherein, in pre-operation, on first dielectric layer is two-sided, attach earlier first stalemate agent and second stalemate agent respectively, on above-mentioned first stalemate agent, attach first copper foil circuit, on above-mentioned second stalemate agent, attach second copper foil circuit, on above-mentioned first copper foil circuit, attach the 3rd stalemate agent, on the 3rd stalemate agent, attach second dielectric layer again; In pressing working procedure, earlier at glass substrate with between above-mentioned second copper foil circuit that above-mentioned pre-operation attached with electrode, insert anisotropic conducting rubber (Anisotropic Conductive Film, ACF), and after finishing pressing, above-mentioned second copper foil circuit can be formed by this anisotropic conducting rubber with above-mentioned electrode to be electrically connected, it is characterized in that, with above-mentioned first stalemate agent, above-mentioned first dielectric layer and above-mentioned second stalemate agent are replaced with dielectric insulation layer, after finishing pressing, can avoid the above-mentioned second copper foil circuit generation shift phenomenon on the above-mentioned dielectric insulation layer.
2. the flexible rigid printed circuit board that is used for display as claimed in claim 1, wherein said first dielectric layer and described second dielectric layer are polyimides (polyimide).
3. the flexible rigid printed circuit board that is used for display as claimed in claim 1, wherein said dielectric insulation layer is for containing the glass fabric (glass cloth) of epoxy resin dipping (Epoxy).
4. the flexible rigid printed circuit board that is used for display as claimed in claim 1, wherein said pressing mode is the hot pressing mode.
5. the flexible rigid printed circuit board that is used for display as claimed in claim 1, wherein said dielectric insulation layer can be added into curing agent again.
6. the flexible rigid printed circuit board that is used for display as claimed in claim 5, wherein said curing agent are dicyandiamide (NH
2NH
2(CN)
2).
7. the flexible rigid printed circuit board that is used for display as claimed in claim 5, the material of wherein said dielectric insulation layer are glass epoxy resin.
8. the flexible rigid printed circuit board that is used for display as claimed in claim 1, wherein said display be selected from LCD, plasma display panel, transparent Organic Light Emitting Diode display with double faces (OLED), monocrystalline silicon display (LCOS) one of them.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410101365 CN1791299A (en) | 2004-12-17 | 2004-12-17 | Flexible rigid printed circuit board for display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410101365 CN1791299A (en) | 2004-12-17 | 2004-12-17 | Flexible rigid printed circuit board for display |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1791299A true CN1791299A (en) | 2006-06-21 |
Family
ID=36788706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410101365 Pending CN1791299A (en) | 2004-12-17 | 2004-12-17 | Flexible rigid printed circuit board for display |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1791299A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102045949A (en) * | 2011-01-14 | 2011-05-04 | 深圳市兴森快捷电路科技股份有限公司 | Method for making rigid/flexible combined printed circuit board |
| CN101652033B (en) * | 2008-08-12 | 2012-09-26 | 北京中庆微数字设备开发有限公司 | PCB composite board for LED light-emitting diode |
| CN101657073B (en) * | 2008-08-19 | 2013-02-27 | 北京中庆微数字设备开发有限公司 | Multi-power-supply PCB composite panel |
| CN103281864A (en) * | 2013-05-02 | 2013-09-04 | 深圳崇达多层线路板有限公司 | Method for producing static flexible and foldable step circuit board |
| CN103596355A (en) * | 2013-10-26 | 2014-02-19 | 溧阳市东大技术转移中心有限公司 | Double-layer flexible printed circuit board |
| CN103596363A (en) * | 2013-10-26 | 2014-02-19 | 溧阳市东大技术转移中心有限公司 | Composite flexible substrate |
| CN101652032B (en) * | 2008-08-15 | 2014-07-30 | 北京中庆微数字设备开发有限公司 | PCB composite board with fixing device |
| CN105934093A (en) * | 2016-07-20 | 2016-09-07 | 苏州福莱盈电子有限公司 | Flexible-rigid combined printed circuit board |
-
2004
- 2004-12-17 CN CN 200410101365 patent/CN1791299A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101652033B (en) * | 2008-08-12 | 2012-09-26 | 北京中庆微数字设备开发有限公司 | PCB composite board for LED light-emitting diode |
| CN101652032B (en) * | 2008-08-15 | 2014-07-30 | 北京中庆微数字设备开发有限公司 | PCB composite board with fixing device |
| CN101657073B (en) * | 2008-08-19 | 2013-02-27 | 北京中庆微数字设备开发有限公司 | Multi-power-supply PCB composite panel |
| CN102045949A (en) * | 2011-01-14 | 2011-05-04 | 深圳市兴森快捷电路科技股份有限公司 | Method for making rigid/flexible combined printed circuit board |
| CN103281864A (en) * | 2013-05-02 | 2013-09-04 | 深圳崇达多层线路板有限公司 | Method for producing static flexible and foldable step circuit board |
| CN103596355A (en) * | 2013-10-26 | 2014-02-19 | 溧阳市东大技术转移中心有限公司 | Double-layer flexible printed circuit board |
| CN103596363A (en) * | 2013-10-26 | 2014-02-19 | 溧阳市东大技术转移中心有限公司 | Composite flexible substrate |
| CN105934093A (en) * | 2016-07-20 | 2016-09-07 | 苏州福莱盈电子有限公司 | Flexible-rigid combined printed circuit board |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| AD01 | Patent right deemed abandoned | ||
| C20 | Patent right or utility model deemed to be abandoned or is abandoned |