CN1783378A - 电容/电阻器件和带该器件的印刷电路板及其制造方法 - Google Patents
电容/电阻器件和带该器件的印刷电路板及其制造方法 Download PDFInfo
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Abstract
一种能提供电容和电阻两种功能的电容/电阻器件。该电容/电阻器件可嵌入到印刷电路板的层中。嵌入电容/电阻器件保存了电路板表面上的区域,并减少焊接数量,从而提高了可靠性。
Description
技术领域
本发明涉及一种同时具有电容和电阻功能的器件,和在有机电介质叠层和印刷电路板中结合这些器件的方法。
背景技术
电容器和电阻器可串联用做集成电路(IC)器件延伸出的信号***的传输线终端。容器和电阻器用来使IC器件的阻抗匹配于传输线、或用来降低或消除信号反射。某些电路是连续负载的,使用与电路并联的电阻器。非连续负载电路带有串联的电阻器和电容器,能用于低功率IC。图1示范性地阐述了现有技术中已知的IC器件10和20的不连续负载终端。
在图1中,a与b的距离通常较短。选择电阻R的数值使其与线路的阻抗匹配,通常是约45-80欧姆。选择电容器C的值使串联的电阻R和电容C的电阻电容时间常数大于信号的发生时间,而小于信号脉冲的总时间。通常的电容值在30皮法拉第的数量级上。
常规的电容电阻终端通常由表面安装技术(SMT)的电阻和电容器构成。图2是印刷电路板25的一部分的剖面图,该印刷电路板带有SMT电阻器40和SMT电容器50,二者与IC器件30连接,以形成用于IC 30的常规的SMT电容电阻终端。向IC 30传输信号的信号线路与将IC器件30连接到电阻器40上的电路轨迹60相连接。电容器50通过一对焊接盘52和焊接头58与电路轨迹70相偶联。电阻器40通过焊接盘42和焊接头48与电路轨迹70相偶联。电容器50通过其它的焊接盘58和电路轨迹59与通孔80相偶联。这样的排列使电阻器40和电容器50与信号线串联,并且通过电镀过的通孔80接地。此常规表面安装法需要使用较贵的表面区域(real estate)。而且,对焊接头的需求降低了可靠性,而增加制造成本。
发明内容
依据第一个实施方式,电容/电阻器件包括第一电极、设置在第一电极上的电介质、在电介质上形成且与电介质相邻的电阻元件,导电轨迹,和设置在电介质上且与电阻元件电接触的第二电极。电容/电阻器件可嵌入在有机电介质叠层中,而结合到印刷电路板中。
依据以上的实施方式,电阻和电容器的功能都可结合到单一嵌入式叠层中,从而降低成本以及产生电阻和电容器功能的难度。当电容/电阻器件被结合到印刷电路板中时,电容/电阻器件的嵌入也不再需要较贵的固定部件。而且,可以取消SMT器件所需的焊接头,从而提高了可靠性。电容/电阻器件可使用常规蚀刻工艺来加工,进一步降低了生产成本。
本领域技术人员通过阅读以下对实施方式的详细说明,会明白上述优点和本发明各种其它实施方式的优点和好处。
附图说明
参照下列附图进行详细说明,其中相同的数字代表相同的元件,其中:
图1是常规(现有技术)串联有电阻器和电容器的不连续负载终端的示意图;
图2是具有用于集成电路器件的常规(现有技术)的SMT RC传输线路终端的印刷电路板的剖面图;
图3是依据第一个实施方式,具有嵌入式电容/电阻器件的印刷电路板的一部分的剖面图;
图4A-4F所示说明制造图3所示的电容/电阻器件的一种方法。
具体实施方式
本发明的实施方式涉及可嵌入在印刷电路板(PWB)基板中的电容/电阻器件。向PWB基板提供电容/电阻功能,保存了在印刷电路板上有价值较贵的实体表面。本发明的实施方式也比常规SMT终端排列需要更少的焊接头。
图3是第一个实施方式中的印刷电路板1000的一部分的剖面图。印刷电路板1000包括电容电阻传输线路终端,其中将电阻的功能和电容器的功能整合到单一的电容/电阻器件100中。器件100嵌入在印刷电路板部分1000中。器件100包括下电极110、电介质120、上电极或上片130、电阻元件140和导电轨迹145。器件100向单一层状结构中提供电阻和电容的功能,通常用括号101标示。
器件100通过由电介质层180、182延伸出的电镀的通孔150和传导电路轨迹160与IC器件170相偶联。IC器件170可通过焊接盘172和焊接头174与传导电路轨迹160相连接。但是,也可采用其它连接技术。下电极110也可在印刷电路板中用作为接地面,且可与连接其它电路的传导电路轨迹111相偶联。
图4A-4F所示说明制造包括器件100的电容器叠层的方法。
图4A是第一制造阶段的前视剖面图,该阶段提供第一和第二金属箔112、132。金属箔112、132可由如铜、铜基材料和其它金属制得。可将淤浆材料或溶液浇铸或施涂在第一箔112上,然后干燥和固化,形成第一电介质层124。例如,如果淤浆具有热塑性质,可通过在150℃干燥来进行固化。如果淤浆是热固性材料,则可使用更高的固化温度。可通过采用类似的方法,在第二箔132上形成类似的第二电介质层126。
用于形成电介质层124、126的溶液可包含例如溶解在溶剂的聚合物。淤浆材料可包含,例如具有高介电常数(“高K”)填充料或功能相的聚合物-溶剂溶液。合适的用作淤浆或溶液聚合物可包括,例如,环氧树脂或聚酰亚胺树脂。高K功能相可定义为介电常数超过500的材料,可包括通式为ABO3的钙钛矿。合适的填充料包括,例如,钛酸钡结晶(BT)、钛酸锶钡(BST)、钛酸锆酸铅(PZT)、钛酸镧铅、钛酸锆酸镧铅(PLZT)、铌酸镁铅(PMN),和钛酸铜钙以及它们的混合物。填充料可为粉末形式。
在电介质层124、126中任一表面或两个表面上(图4A中所示的层126上)可施涂薄的粘合层127。粘合层227可由热塑性聚合物形成,并且可填充高电介质相以避免介电常数的下降。然后,两种结构按图4A中所示的箭头方向,在加热和加压下层压在一起。
参考图4B,由层124、126和127通过层叠形成单一电介质120。粘合层227使电介质层124和电介质层126在层叠过程中易于结合。但是,如果电介质层124和126在层叠之前只是部分固化,或电介质层124和126本质上为热塑性,层叠时合适的温度和压力足以软化树脂,以致于层124和126可以在无粘合剂的情况下结合在一起时,则粘合层127也可以不存在。例如,所得电介质120可为一薄层,层压后为4-25微米数量级上。
另外一种形成电介质120的方法是将经填充或未填充的热塑性聚合物浇铸到箔112、132中的一个上,而将另一个箔直接层叠到填充的热塑性聚合物上。此方法显然需要粘合层。而另一种制造方法包括分别形成为单一膜的电介质层120,在加热和加压下将该层层压到第一箔112和第二箔132上。
未填充的聚合物诸如酰亚胺电介质INTERRATM HK 04(可从德国Wilmington的DuPont Electrionic Technologies购得)可用来形成电介质120。
层压后,将光致刻蚀剂(未示于图4B中)施涂于箔112上,并且对箔112进行成像和蚀刻,而所剩余的光致刻蚀剂可使用标准印刷电路板加工条件来剥离。图4C是蚀刻后所得制品沿图4D中的4C-4C线的顶视剖面图。参见图4C,蚀刻制造出器件100的下电极110。导电电路轨迹111也可以由箔112形成,将下电极110连接到地面或其它电路上。
图4D是沿图4C中的4D-4D线得到的前视剖面图。参见图4D,将所得制品的下电极110面层压到电介质层压材料182上。例如,使用FR4预浸材料或其它的预浸材料,在标准印刷电路板上进行层叠。
将光致蚀刻剂(未示于图4D中)施涂在箔132上,并且对箔132进行成像和蚀刻,并剥离残余的光致刻蚀剂。图4E是蚀刻后所得制品沿图4F中的4E-4E线所得的顶视剖面图。图4F是沿图4E中的4F-4F线得到的前视剖面图。参见图4E,蚀刻制造出器件100的上电极130、间隙134和导电电路轨迹145。
参见图4F,电阻元件140通过在电介质120上和间隙134内沉积电阻材料来形成。例如,电阻元件140可通过沉积聚合物厚膜电阻糊料,并固化该电阻糊料来形成。上电极130和导电电路轨迹145用作电阻元件140的终端。聚合物厚膜电阻糊料可由如分散在丝网印刷介质中的碳粉类材料形成。丝网印刷介质可包含,例如溶解在合适溶剂中的环氧树脂。也可加入其它的添加剂,诸如表面活性剂,来改善所得电阻元件140的介电性质。
电阻元件140固化后,在电介质层182的部件一面上层叠电介质层180,形成层状结构101。然后,由上述方法所得的层状结构101可通过使用常规的层压方法,由形成工艺结合到如图3所示的印刷电路板上。
实施例1:
参照图4,讨论此实施例的器件100。在此实施例中,电极110、130由铜箔形成,电介质120是未填充的聚酰亚胺电介质,厚为25微米、介电常数(Dk)为3.5,因而产生800皮法拉(picoFarads)/平方英寸的电容密度(INTERRATM HK04,可从德国Wilmington的DuPont ElectrionicTechnologies购得)。
30皮法拉的传输线路终端所需的电容器的尺寸(当从俯视图中观察时)大小是24.2平方毫米,即略小于5毫米×5毫米。所沉积的电阻材料是可丝网印刷的100欧姆/平方的聚合物厚膜电阻糊料(可从DuPontElectrionics购得)。
此实施例中用于标称60欧姆电阻的电阻器的尺寸可以改变,长度和宽度的比例保持在0.6至1.0为佳。如果IC所需的终端电阻器相当少,则上述电容器尺寸是可以接受的。在需要很多终端的情况下,更期望高电容密度的层压制品,因为这样电容器可以做的小一些。
实施例2:
参照图3,讨论此实施例的器件100。在此实施例中,层压制品这样形成,在一铜箔上浇铸填充了钛酸钡的热塑性聚酰亚胺,将第二铜箔层叠在填充了钛酸钡的热塑性聚酰亚胺涂层表面上。钛酸钡作为填充料的优点是它易得到且不含有铅。
在合适的温度和压力下进行层叠,以使制品在不使用单独的粘合材料而结合在一起。电极110、130由铜箔形成,电介质120是填充的聚酰亚胺电介质,厚14微米、介电常数(Dk)为1.1,因而产生4.5纳法拉/平方英寸的电容密度(INTERRATM/ HK11,可从德国Wilmington的DuPont ElectrionicTechnologies购得)。
如上所述,传输线路终端所需的电容器的尺寸是4.3平方毫米,或约2毫米×2毫米。所沉积的电阻是可丝网印刷的,100欧姆/平方英寸的聚合物厚膜电阻糊料(可从DuPont Electrionics购得)。
此实施例中用于标称60欧姆电阻的电阻器的优选尺寸是1.2毫米长、2毫米宽,且长度和宽度的长宽比为0.6至1.0。
实施例3:
参照图3,讨论此实施例的器件100。在此实施例中,层压制品这样形成,在两铜箔上浇铸填充了钛酸钡的热塑性聚酰亚胺(可从DuPontElectrionic Technologies购得),且在适当的温度和压力下层压,使它们结合在一起。不需要使用单独的粘合材料。电极110、130由铜箔形成。所得的电介质120是厚14微米的填充了钛酸钡的聚酰亚胺电介质,电容密度为6.2纳法拉/平方英寸。
如上所述,传输线路终端所需的电容器的尺寸是3.1平方毫米,或约1.77毫米×1.77毫米。所沉积的电阻器可由丝网印刷的100欧姆/平方的聚合物厚膜电阻器糊料(可从DuPont Electrionics购得)来形成。
此实施例中用于标称60欧姆电阻的电阻器的优选尺寸是1.06毫米长、1.77毫米宽,且长度和宽度的长宽比为0.6至1.0。
依据上述实施方式,使用结合了电阻器的薄电容器的层状结构可减小嵌入式电容功能的尺寸,并且更有效地嵌入电阻电容传输线路终端。嵌入电阻器和电容器功能不需要较贵的电路板表面的区域,并且取消了与SMT器件有关的焊接头,因此提高了可靠性。而且,在其中结合了电阻和电容器的层压制品可使用常规蚀刻方法来加工,进一步降低了生产成本。
上述实施例也提供用于电路设计和PWB制造的其他选择。例如,一件层压制品可用于嵌入离散的电阻器和离散的电容器,这降低了连接电阻和电容所产生的电感效应。
依据上述实施方式,结合了电阻器的薄电容器层状结构可用于减少嵌入式电容功能的尺寸,并且更有效的嵌入电阻电容传输线路终端。嵌入电阻器和电容器功能不需要较贵的电路板表面的区域,并且取消与SMT器件有关的焊接头,因此提高了可靠性。而且,在其中结合了电阻和电容器的层压制品可使用常规蚀刻方法来加工,进一步降低了生产成本。
上述实施例也提供用于电路设计和PWB制造的其他选择。例如,一件层压制品可用于嵌入很多离散的电阻器和很多离散的电容器,这降低了连接电阻和电容所产生的电感效应。
顶面视图中电容器实施方式的形状通常是矩形。但是,电容器电极、电介质以及其它部件和层也可具有其它规则或不规则的表面形状,诸如,圆形、椭圆形、卵形或多边形。
在上述层状结构中形成单独的电容/电阻器件100。但是,板形结构和印刷电路板可包括大量独立的不同类型和排列方式的电容/电阻器件。
在上述实施方式中,电阻、电容和电感结合形成特定电路阻抗,通常用大写字母Z表示。电容和电阻可构造成得到特定的阻抗。改变电阻、电容或两者都会改变电感。可控制所有三者的改变以限定最终的阻抗。换言之,层压制品的阻抗是“可调的”。
上面本发明的说明书举例说明和描述了本发明。另外,虽然公开内容只显示和描述了本发明的优选的实施方式,但应理解为本发明可在各种其它的组合、修改和环境中使用,并且可以在这里所述的本发明概念范围内、符合上述教导的,和/或在本领域技术或知识范围内进行改变和修改。
以上描述的实施方式旨在进一步解释已知实施本发明的最好模式,以及使本领域技术人员能够使用本发明的或其它的实施方式和进行特定应用所需的各种修改或使用本发明。因此,说明书不旨在将本发明限制在这里所揭示的形式中。附加的权利要求书旨在包括另外的,没有在说明书清楚限定的实施方式。
Claims (15)
1.一种电容/电阻器件,其包括:
第一电极;
设置在第一电极上的电介质;
在电介质上形成且与电介质相邻的电阻器元件;
导电轨迹;和
设置在电介质上且与电阻元件电接触的第二电极,其中电介质设置在第一电极和第二电极之间。
2.如权利要求1所述的电容/电阻器件,其特征在于,所述电阻元件在第二电极和导电轨迹之间延伸,且部分地覆盖第二电极和导电轨迹。
3.如权利要求2所述的电容/电阻器件,其特征在于,所述电阻元件在第二电极和传导轨迹之间间隙上延伸,并且与电介质相邻。
4.如权利要求1所述的电容/电阻器件,其特征在于,所述电介质包括未填充的聚合物。
5.如权利要求1所述的电容/电阻器件,其特征在于,所述电介质包括填充了电介质功能相的聚合物。
6.如权利要求1所述的电容/电阻器件,嵌入在至少两个有机电介质层压层之间,其特征在于,所述层压层和电容/电阻器件形成层状结构。
7.一种印刷电路板,其包括:
至少一种如权利要求6所述的层状结构;和
至少一种设置在印刷电路板上表面的IC器件,其中IC器件与电容/电阻器件电偶联。
8.一种制造电容/电阻器件的方法,其包括:
提供第一金属箔和第二金属箔;
在第一金属箔和第二金属箔之间形成电介质;
由第一金属箔形成第一电极;和
由第二金属箔形成第二电极和导电轨迹;
形成电阻元件,其中电阻元件与电介质相邻,且与第二电极和导电轨迹电接触。
9.如权利要求8所述的方法,还包括:
提供第一金属箔和低二金属箔;和
刻蚀第一金属箔和第二金属箔,形成第一和第二电极。
10.如权利要求9所述的方法,其特征在于,形成电阻元件包括在电解质上沉积与第二电极相邻的电阻材料。
11.如权利要求10所述的方法,其特征在于,形成电介质的步骤包括在第一和第二金属箔中的至少一个上浇铸填充或未填充的聚合物溶液中的至少一种。
12.如权利要求11所述的方法,其特征在于,形成电介质的步骤包括形成单独的填充或未填充的聚合物膜,并将所述膜层压到第一和第二金属箔上。
13。一种制造层状结构的方法,其包括:
在至少两个有机电介质层之间嵌入至少一个采用如权利要求8所述的方法形成的电容/电阻器件。
14.一种制造印刷电路板的方法,其包括:
提供至少一种如权利要求13所述的层状结构;和
提供至少一种设置在印刷电路板上表面的IC器件,其中IC器件与电容/电阻器件电偶联。
15.一种制造层状结构的方法,其包括:
提供第一金属箔和第二金属箔;
在第一金属箔上形成聚酰亚胺电介质;
由第一金属箔形成第一电极;
将第一电介质层层压到第一电极的一面;
由第二金属箔形成第二电极和导电轨迹,其中第二电极和导电轨迹置于电介质上;
将电阻元件印在聚酰亚胺电介质上,且与第二电极电接触,其中电介质设置在第一电极和第二电极之间;和将第二电介质层层压到第二电极和电阻元件上。
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- 2005-10-04 TW TW094134607A patent/TWI412306B/zh active
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- 2005-10-17 KR KR1020050097354A patent/KR100812515B1/ko active IP Right Grant
- 2005-10-18 CN CNA2005101161073A patent/CN1783378A/zh active Pending
- 2005-10-18 JP JP2005303552A patent/JP2006121088A/ja active Pending
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CN101661920B (zh) * | 2008-08-26 | 2011-06-29 | 欣兴电子股份有限公司 | 芯片封装载板及其制造方法 |
CN103247860A (zh) * | 2012-02-09 | 2013-08-14 | 深圳光启创新技术有限公司 | 一种超材料的制备方法及超材料 |
CN105047642A (zh) * | 2015-08-12 | 2015-11-11 | 深圳市槟城电子有限公司 | 一种端口防护电路集成封装件 |
WO2017025002A1 (zh) * | 2015-08-12 | 2017-02-16 | 深圳市槟城电子有限公司 | 一种电阻和电容串联的组件及其制作方法 |
CN105047642B (zh) * | 2015-08-12 | 2024-01-19 | 深圳市槟城电子股份有限公司 | 一种端口防护电路集成封装件 |
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US20070139901A1 (en) | 2007-06-21 |
EP1648208A1 (en) | 2006-04-19 |
DE602005015657D1 (de) | 2009-09-10 |
KR20060054033A (ko) | 2006-05-22 |
TW201343017A (zh) | 2013-10-16 |
TW200628024A (en) | 2006-08-01 |
EP1648208B1 (en) | 2009-07-29 |
EP2104407A1 (en) | 2009-09-23 |
US7436678B2 (en) | 2008-10-14 |
TWI412306B (zh) | 2013-10-11 |
US7571536B2 (en) | 2009-08-11 |
US20060082981A1 (en) | 2006-04-20 |
KR100812515B1 (ko) | 2008-03-11 |
JP2006121088A (ja) | 2006-05-11 |
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