CN1782122A - 管状喷射靶 - Google Patents
管状喷射靶 Download PDFInfo
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- CN1782122A CN1782122A CNA2005101288290A CN200510128829A CN1782122A CN 1782122 A CN1782122 A CN 1782122A CN A2005101288290 A CNA2005101288290 A CN A2005101288290A CN 200510128829 A CN200510128829 A CN 200510128829A CN 1782122 A CN1782122 A CN 1782122A
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- 239000000463 material Substances 0.000 claims abstract description 12
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- 239000011733 molybdenum Substances 0.000 claims description 11
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 9
- 239000011651 chromium Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 229910052750 molybdenum Inorganic materials 0.000 claims description 9
- 238000003466 welding Methods 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 239000004411 aluminium Substances 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052804 chromium Inorganic materials 0.000 claims description 7
- 150000002739 metals Chemical class 0.000 claims description 7
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 7
- 239000010937 tungsten Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910001182 Mo alloy Inorganic materials 0.000 claims description 6
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- 239000010949 copper Substances 0.000 claims description 6
- 239000010955 niobium Substances 0.000 claims description 6
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- 239000010936 titanium Substances 0.000 claims description 5
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- 229910001069 Ti alloy Inorganic materials 0.000 claims description 4
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- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 4
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- 229910000990 Ni alloy Inorganic materials 0.000 claims description 2
- 229910001362 Ta alloys Inorganic materials 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910001297 Zn alloy Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
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- 230000004888 barrier function Effects 0.000 description 2
- 239000013077 target material Substances 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
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- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
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- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
本发明涉及一种管状喷射靶，具有靶体和一个安装在管子的至少一个末端的附加装置，附加装置和/或管子末端的盖子通过正向锁定或材料接合和靶体连接起来。
Description
技术领域
本发明涉及一种管状喷射靶，其具有靶体和安装在管子的至少一个末端的附加装置。
背景技术
这种类型的许多喷射靶是公知的，例如，在国际专利申请WO97/15697、德国专利DE 100 43 748和DE 100 63 383中所公开的，这种类型的管状喷射靶可以由喷射材料作为一种自我支撑靶成形，或者被喷射材料涂布从而作为一个支撑管成形。
在实践中，钼或钼合金的薄涂层用于光学功能涂布变得日益重要，尤其是大型玻璃表面的涂布和平面荧光屏的涂布。通常这种涂布由喷射产生，同时管状靶也被越来越广泛的使用，因为它们提供了比较高的喷射产量以及产生更加均衡的效果。确切地，这里使用的是钼或钼合金(特别是以钼为主的合金)。它们作为喷射靶材料用于支持管子，焊接在管子上从而达到管状喷射靶的足够的稳定。这种通常使用高级钢作为管子支持材料的设计，在热吸收和分散的能力上是有限的，因为这种焊接头经常不能承受热应力。然而，如果焊料熔化并从***间隙中溢出，喷射靶将再也不能使用。
发明内容
根据本发明，这个问题将被独立权利要求的目标解决。从属权利要求中是本发明的优选。
作为结果，附加装置和/或管子末端的盖子通过正向锁定或材料接合和支持体连接起来，首先，喷射材料和支持管之间通过其他必要的焊接过程产生的问题被避免了，其次，管子末端的稳定性产生了必要的机械力，通过正向锁定或材料接合产生了必要的真空紧密性，尤其是当靶体几乎完全延伸超过管子的横截面。
特别地，靶体由金属制成是有利的，优选钛、钼、铌、铬、钨、铝、铜、锆、钽、镍、银，或至少一种这些金属的合金。此外，附加装置(优选设计成法兰盘)和/或管子末端盖子由钛、钼、钨、铬、铝、银、镍、锌、铜、锆、钒、铌、钽或至少一种这些金属的合金制成是有利的。原因有两方面，第一，这些金属可以很好的与靶材料融合，第二，它们保证了必要的稳定性和热分散。钛和一种或多种选自铝、锡、铜、锆、钒和钼的金属组成的合金尤为合适。优选合金为钛-铝-锡合金，钛-铜合金，钛-铝-锆合金，钛-铝-钒合金和钛-铝-钼合金。靶体的材料优选含量为0.5wt.％到5wt.％的铬或钨。此外，靶体和附加装置和/或管子的末端盖子由同一种材料制成是有利的。附加装置和/或管子的末端盖子焊接或焊缝到靶体上是有利的，尤其是通过电子束焊接。靶体可以通过压力成形来制造，尤其是通过对靶坯的挤压或旋压。
这种喷射靶可以积极承受的负荷量大大超过上述现有技术描述的支持管/喷射层的设计，因为它们具有较好的热传导性。比起现有技术的管子，它们可以积极承受大约1.5倍多的负荷量。本发明的喷射靶的涂层具有良好的传输、反射和涂层阻力数值。
附图说明
本发明通过下述附图说明来解释。
图1是一个一端有支持的管状靶。
图2是一个两端有支持的管状靶。
具体实施方式
喷射装置中的管状靶可以是一端支持或两端均有支持。管子的内部被抽成真空，与外界封闭。靶体1由钼制成，或者由钼与约0.5wt.％到5wt.％的铬或钨合金制成。在管状靶只有一端有支持的情况下(图1)，附件法兰盘2通过电子束焊接方法在真空密闭下仅被焊接到管子的一端，同时另一端通过电子束焊接方法在真空密闭下与管子末端盖子3连接。
在管状靶的两端均有支持的情况下(图2)，附件法兰盘2被焊接到靶体1的两端。这里，连接再一次是真空密闭的，优选电子束焊接方法。上述特指的钛合金对于管子末端盖子3或者附加法兰盘2是特别合适的材料。
可以使用钼，例如，作为光电池(大面积涂布)的后触点的喷射材料，或者作为显示涂布中铝和硅的分散屏障。可以使用钛，例如，形成高折射二氧化钛涂层或作为分散屏障。可以使用铬，例如，在玻璃涂布或者黑底显示中作为反射体或CrN吸收体。可以使用铌，例如，在玻璃涂布中形成高折射的Nb2O5涂层。钨可以作为喷射材料使用，例如，在电镀铬的应用中作为氧化钨。
Claims (9)
1.管状喷射靶，具有靶体和一个安装在管子的至少一个末端的附加装置，其特征在于，附加装置和/或管子末端的盖子通过正向锁定或材料接合和靶体连接起来。
2.根据权利要求1所述的管状喷射靶，其特征在于，靶体几乎完全延伸超过管子的横截面。
3.根据权利要求1或2所述的管状喷射靶，其特征在于，靶体由金属组成，优选钛、钼、铌、铬、钨、铝、铜、锆、钽、镍、银，或至少一种这些金属的合金。
4.根据权利要求1至3任一所述的管状喷射靶，其特征在于，附加装置和/或管子末端盖子由钛、钼、钨、铬、铝、银、镍、锌、铜、锆、钒、铌、钽或至少一种这些金属的合金制成。
5.根据权利要求4所述的管状喷射靶，其特征在于，钛合金由钛和一种或多种选自铝、锡、铜、锆、钒和钼的金属所组成。
6.根据权利要求1至5任一所述的管状喷射靶，其特征在于，靶体和附加装置和/或管子的末端盖子由同一种材料制成。
7.根据权利要求1至6任一所述的管状喷射靶，其特征在于，附加装置和/或管子的末端盖子是焊接或焊缝到靶体上的，尤其是通过电子束焊接。
8.根据权利要求1至7任一所述的管状喷射靶，其特征在于，附加装置被特别地设计成法兰盘。
9.根据权利要求1至8任一所述的管状喷射靶，其特征在于，靶体含约0.5wt.％到5wt.％的铬和/或钨。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102004058316A DE102004058316A1 (de) | 2004-12-02 | 2004-12-02 | Rohrförmiges Sputtertarget |
| DE102004058316.1 | 2004-12-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1782122A true CN1782122A (zh) | 2006-06-07 |
Family
ID=35613843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2005101288290A Pending CN1782122A (zh) | 2004-12-02 | 2005-12-01 | 管状喷射靶 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20060151320A1 (zh) |
| EP (1) | EP1666631A3 (zh) |
| JP (1) | JP2006161159A (zh) |
| KR (1) | KR20060061886A (zh) |
| CN (1) | CN1782122A (zh) |
| DE (1) | DE102004058316A1 (zh) |
| TW (1) | TW200626737A (zh) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105463392A (zh) * | 2015-12-03 | 2016-04-06 | 江阴恩特莱特镀膜科技有限公司 | 一种组合式旋转银靶材 |
| CN107969159A (zh) * | 2015-05-06 | 2018-04-27 | 攀时奥地利公司 | 管靶 |
| CN110282177A (zh) * | 2018-03-19 | 2019-09-27 | Ｊｘ金属株式会社 | 溅射靶及其包装方法 |
| CN112063981A (zh) * | 2020-07-31 | 2020-12-11 | 洛阳高新四丰电子材料有限公司 | 一种镍钼合金挤压管靶的制备方法 |
| CN112877656A (zh) * | 2021-01-08 | 2021-06-01 | 宝鸡市亨信稀有金属有限公司 | 一种锆管靶及生产方法 |
| TWI814892B (zh) * | 2018-09-18 | 2023-09-11 | 荷蘭商Ａｓｍｌ荷蘭公司 | 用於高壓連接之供應設備、極紫外線光源、及製造一管道之方法 |
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| US7922066B2 (en) * | 2005-09-21 | 2011-04-12 | Soleras, LTd. | Method of manufacturing a rotary sputtering target using a mold |
| TWI317763B (en) * | 2005-10-03 | 2009-12-01 | Thermal Conductive Bonding Inc | Very long cylindrical sputtering target and method for manufacturing |
| DE102007060306B4 (de) * | 2007-11-29 | 2011-12-15 | W.C. Heraeus Gmbh | Magnetische Shunts in Rohrtargets |
| KR101266200B1 (ko) * | 2010-07-13 | 2013-05-21 | 플란제 에스이 | 엔캡 방식의 스퍼터링용 로터리 타겟 |
| EP2788523A1 (en) * | 2011-12-09 | 2014-10-15 | Applied Materials, Inc. | Rotatable sputter target |
| DE102014102407A1 (de) * | 2014-02-25 | 2015-08-27 | Sindlhauser Materials Gmbh | Sputtertargetanordnung |
| DE102017103746A1 (de) * | 2017-02-23 | 2018-08-23 | VON ARDENNE Asset GmbH & Co. KG | Elektronenstrahlverdampfer, Beschichtungsvorrichtung und Beschichtungsverfahren |
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| US4179351A (en) * | 1976-09-09 | 1979-12-18 | Hewlett-Packard Company | Cylindrical magnetron sputtering source |
| US4179361A (en) * | 1978-11-13 | 1979-12-18 | Chevron Research Company | Sorbent regeneration in a process for removing sulfur-containing impurities from mineral oils |
| US4361472A (en) * | 1980-09-15 | 1982-11-30 | Vac-Tec Systems, Inc. | Sputtering method and apparatus utilizing improved ion source |
| US5200049A (en) * | 1990-08-10 | 1993-04-06 | Viratec Thin Films, Inc. | Cantilever mount for rotating cylindrical magnetrons |
| US5143590A (en) * | 1991-07-10 | 1992-09-01 | Johnson Matthey Inc. | Method of manufacturing sputtering target assembly |
| US5836506A (en) * | 1995-04-21 | 1998-11-17 | Sony Corporation | Sputter target/backing plate assembly and method of making same |
| US5591314A (en) | 1995-10-27 | 1997-01-07 | Morgan; Steven V. | Apparatus for affixing a rotating cylindrical magnetron target to a spindle |
| DE10043748B4 (de) | 2000-09-05 | 2004-01-15 | W. C. Heraeus Gmbh & Co. Kg | Zylinderförmiges Sputtertarget, Verfahren zu seiner Herstellung und Verwendung |
| DE10063383C1 (de) | 2000-12-19 | 2002-03-14 | Heraeus Gmbh W C | Verfahren zur Herstellung eines Rohrtargets und Verwendung |
| DE10102493B4 (de) * | 2001-01-19 | 2007-07-12 | W.C. Heraeus Gmbh | Rohrförmiges Target und Verfahren zur Herstellung eines solchen Targets |
| US6375815B1 (en) * | 2001-02-17 | 2002-04-23 | David Mark Lynn | Cylindrical magnetron target and apparatus for affixing the target to a rotatable spindle assembly |
| DE10253319B3 (de) * | 2002-11-14 | 2004-05-27 | W. C. Heraeus Gmbh & Co. Kg | Verfahren zum Herstellen eines Sputtertargets aus einer Si-Basislegierung, sowie die Verwendung des Sputtertargets |
| US20070007129A1 (en) * | 2003-03-25 | 2007-01-11 | Wilmert De Bosscher | Universal vacuum coupling for cylindrical target |
| DE102004005663A1 (de) * | 2004-02-05 | 2005-09-01 | Zentrum für Material- und Umwelttechnik GmbH | Verfahren zum Herstellen einer Targetanordnung |
-
2004
- 2004-12-02 DE DE102004058316A patent/DE102004058316A1/de not_active Withdrawn
-
2005
- 2005-11-09 EP EP05024381A patent/EP1666631A3/de not_active Withdrawn
- 2005-11-14 KR KR1020050108435A patent/KR20060061886A/ko not_active Application Discontinuation
- 2005-12-01 CN CNA2005101288290A patent/CN1782122A/zh active Pending
- 2005-12-01 JP JP2005348261A patent/JP2006161159A/ja active Pending
- 2005-12-02 TW TW094142658A patent/TW200626737A/zh unknown
- 2005-12-02 US US11/293,544 patent/US20060151320A1/en not_active Abandoned
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107969159A (zh) * | 2015-05-06 | 2018-04-27 | 攀时奥地利公司 | 管靶 |
| TWI695414B (zh) * | 2015-05-06 | 2020-06-01 | 奧地利商攀時歐洲公司 | 管靶 |
| CN107969159B (zh) * | 2015-05-06 | 2020-06-19 | 攀时奥地利公司 | 管靶 |
| CN105463392A (zh) * | 2015-12-03 | 2016-04-06 | 江阴恩特莱特镀膜科技有限公司 | 一种组合式旋转银靶材 |
| CN110282177A (zh) * | 2018-03-19 | 2019-09-27 | Ｊｘ金属株式会社 | 溅射靶及其包装方法 |
| TWI814892B (zh) * | 2018-09-18 | 2023-09-11 | 荷蘭商Ａｓｍｌ荷蘭公司 | 用於高壓連接之供應設備、極紫外線光源、及製造一管道之方法 |
| US11774012B2 (en) | 2018-09-18 | 2023-10-03 | Asml Netherlands B.V. | Apparatus for high pressure connection |
| CN112063981A (zh) * | 2020-07-31 | 2020-12-11 | 洛阳高新四丰电子材料有限公司 | 一种镍钼合金挤压管靶的制备方法 |
| CN112877656A (zh) * | 2021-01-08 | 2021-06-01 | 宝鸡市亨信稀有金属有限公司 | 一种锆管靶及生产方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20060151320A1 (en) | 2006-07-13 |
| DE102004058316A1 (de) | 2006-06-08 |
| KR20060061886A (ko) | 2006-06-08 |
| EP1666631A2 (de) | 2006-06-07 |
| TW200626737A (en) | 2006-08-01 |
| JP2006161159A (ja) | 2006-06-22 |
| EP1666631A3 (de) | 2006-08-16 |
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