CN1769027A - Equipment and method for controlling encapsulating semiconductors with plastics - Google Patents
Equipment and method for controlling encapsulating semiconductors with plastics Download PDFInfo
- Publication number
- CN1769027A CN1769027A CN 200510119377 CN200510119377A CN1769027A CN 1769027 A CN1769027 A CN 1769027A CN 200510119377 CN200510119377 CN 200510119377 CN 200510119377 A CN200510119377 A CN 200510119377A CN 1769027 A CN1769027 A CN 1769027A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The resin molding equipment comprises: a work piece feeding section; a work piece measuring section measuring thickness of a semiconductor chip mounted on a work piece; a resin supplying section supplying liquid resin to the work piece; a resin molding section having a molding die for molding the work piece with the liquid resin; a product measuring section measuring thickness of a resin molded part of the molded product; a product accommodating section; and a control section for controlling the sections. The control section includes means for adjusting an amount of the liquid resin, which is supplied to the work piece by the resin supplying section, on the basis of the thickness measured by the work piece measuring section.
Description
Technical field
The present invention relates to a resin molding apparatus and a resin molding method, specifically, relate to the amount of resin that accurately to control supply and with the resin molding apparatus and the resin molding method of accurate topotype system one workpiece of resin.
Background technology
One compression molded method is known.In the method, liquid resin, powdex or paste resin are fed on the workpiece that has been placed in the mould, and this workpiece clamps with resin and carries out molded in mould.Applicant of the present invention has invented the resin compression moulding apparatus, and the weight of its measuring workpieces and the thickness of semiconductor chip calculate the amount of resin of supply and the amount of resin (Japanese patent gazette No.2003-165133) of supplying according to the variation adjustment of workpiece.
In compression molded method, the variation that is fed to the resin of workpiece directly influences the quality of product, so, the thickness of necessary measurement semiconductor chip etc., and adjust the amount of resin that is fed to each semiconductor chip.
Yet, even calculate the amount of resin of supply, can not be fully by resin molded workpiece.We think that the thickness of workpiece that comprises semiconductor chip changes, so, must change suitable molded condition, and the supply amount of resin changes because of the precision of resin feeding unit.
At present, the thickness of the resin molded part of product be 1mm or less than, so the change in elevation of resin molded condition influences the quality of moulded product.
Summary of the invention
Design of the present invention is to improve the quality because of the affected moulded product of varied slightly of resin molded condition.
An object of the present invention is to provide a resin molding apparatus and a resin molding method, even molded condition is former thereby change because of the structure of workpiece, supply amount of resin etc., they also can produce the moulded product with homogeneous quality.
In order to realize this purpose, the present invention has following structure.
Resin molding apparatus of the present invention comprises:
One workpiece transport portion;
One measures the workpiece calibration part that is installed in the semiconductor chip thickness on the workpiece;
One is fed to the resin supply section of workpiece with liquid resin;
One has the resin molded part with the mould of liquid resin molded piece;
One measures the product measure portion of the resin molded segment thickness of moulded product;
One product holding portion; And
One is used for controlling the control section of each several part,
Wherein, control section comprises the device that is used for adjusting the liquid resin amount, and the resin supply section is fed to workpiece according to the thickness that workpiece calibration partly records with liquid resin.
Should be noted that in the present invention, liquid resin means the resin and the slurry type resin of the liquid-type that will be supplied by a distributor.
In resin molding apparatus, the value that is partly recorded by workpiece calibration can be used to adjust the liquid resin amount that is fed to workpiece, and like this, workpiece can carry out molded with resin fully.
In resin molding apparatus, control section can comprise the device that is used for adjusting the liquid resin amount, and the resin supply section is fed to workpiece according to the thickness that the product measure portion records with liquid resin.Adopt this structure, workpiece can further carry out molded with resin fully.
In resin molding apparatus, mould can comprise a pressure mechanism, and its position in regulation flatly is pressed in workpiece on the clamping area of mould.Adopt this structure, workpiece can firmly remain in the mould in molded, and can shorten resin molded circulation timei.
In resin molding apparatus, the resin supply section can comprise a distributor, and it is fed to workpiece with the liquid resin of ormal weight, and
This distributor comprises:
One cylinder body comprises the cylinder part of a storaging liquid resin, and a fluid path partly is connected to a liquid container with cylinder, and a fluid path partly is connected to a discharge nozzle with cylinder;
One plunger that in the cylinder part, slides;
One supply valve is arranged on cylinder body, and supply valve opens and closes the fluid path between cylinder body and the liquid container;
One dump valve is arranged on cylinder body, and dump valve opens and closes the fluid path between cylinder body and the discharge nozzle;
Driver element is actuation plunger, supply valve and dump valve respectively.Adopt this structure, the liquid resin of ormal weight can correctly be fed to workpiece.
Preferably, the bottom of plunger, supply valve and dump valve is connected to the link of driver element respectively, and
All coupling parts can not thrown off along the moving direction of plunger, supply valve and dump valve, but they can be thrown off along the direction perpendicular to their moving directions.Adopt this structure, distributor can be easily attached and be shirked the resin supply section, and can easily implement the maintaining of resin molding apparatus.
In resin molding apparatus, mould can comprise:
Carry out the cavity that the layout of a molded inner chamber forms with resin therein according to workpiece;
One binding clasp surrounds cavity and forms chamber depression, and its inner bottom surface is made up of an end face of cavity, and binding clasp can slide along the direction that opens and closes mould on the side of cavity; And
One suction hole is formed in the inner face of binding clasp, and binding clasp contacts the side of cavity slidably, and suction hole is communicated with the chamber depression so that with in the release film suction chamber depression, when cavity moved on to a position of clamping mold, suction hole was closed.Adopt this structure, workpiece can carry out molded suitably, and does not form outstanding in the outer surface of a resin molded part.
In resin molding apparatus, mould can have:
The inner chamber of the element installation region of the resin molded electronic device of one usefulness; And
One false inner chamber is communicated to an edge of inner chamber so that store air.Adopt this structure, do not have the space to be formed in the resin molded part of moulded product.
In resin molding apparatus, the resin molded zone of the mould of clamping and molded piece can be surrounded by a vacuum chamber, and
Air in the vacuum chamber can be discharged by vacuum unit.Adopt this structure, can prevent further that also the space is formed in the resin molded part.
Resin molding method of the present invention can be implemented in resin molding apparatus of the present invention.One comprises that a plurality of workpiece that are layered in a suprabasil semiconductor chip carry out compression molded with resin in mould.This method comprises following all steps:
Store the cube volume and the amount of resin that is fed to each semiconductor chip of semiconductor chip;
Measure the distance " Z " between substrate and the outermost semiconductor chip;
According to the distance that records " Z ", survey the quantity of stacked semiconductor chip;
Calculating adds to the amount of resin of semiconductor chip;
The amount of resin of replenishing is delivered to the resin supply section as control data; And
According to control data, resin is fed to workpiece from the resin supply section.Adopt this method, can detect bad workpiece, can prevent to produce defective product, and can improve the output of producing valuable device.
Brief description of drawings
Now by means of example and embodiment with reference to the accompanying drawings to describe the present invention, wherein:
Fig. 1 is the plane of an embodiment of resin molding apparatus of the present invention;
Fig. 2 is the front view of resin molding apparatus;
Fig. 3 is the block diagram of resin molding apparatus;
Fig. 4 is the front view of sensor unit;
Fig. 5 is the plane of sensor unit;
Fig. 6 one explanatoryly attempts, wherein, and the sensor unit measuring workpieces;
Fig. 7 is the plane of the workpiece set mechanism of a mould;
Fig. 8 is the sectional view of workpiece set mechanism;
Fig. 9 is the sectional view of a distributor;
Figure 10 is the sectional view along the intercepting of the line J-J shown in Fig. 9;
Figure 11 one explanatoryly attempts, and another mechanism that a framework is connected to a cylinder body is shown;
Figure 12 A and 12B are that the explanatory of workpiece attempted, and semiconductor chip is bonded on the workpiece;
Figure 13 A and 13B are that the explanatory of workpiece attempted, and liquid resin is fed on the workpiece;
Figure 14 is the block diagram of a control system of resin molding apparatus;
Figure 15 is the flow chart of resin supply action;
Figure 16 is a sectional view, and wherein, workpiece forms a plurality of outstanding when compression molded;
Figure 17 is the sectional view of the mould opened, and a workpiece is set in wherein;
Figure 18 is the sectional view of the mould of clamping work pieces;
Figure 19 is the sectional view of the mould of compression molded workpiece;
Figure 20 is the plane with molded workpiece of passage;
Figure 21 is the sectional view with mould of false chamber depression;
Figure 22 is the plane of a cavity and a binding clasp; And
Figure 23 is the sectional view with mould of false chamber depression, and a workpiece carries out compression molded therein.
The specific embodiment
Now with reference to the accompanying drawings, the preferred embodiment of the present invention will be described in detail.
(entire infrastructure of resin molding apparatus)
Fig. 1 and 2 is the plane and the front view of entire infrastructure that an embodiment of resin molding apparatus of the present invention is shown.
As shown in Figure 1, resin molding apparatus comprises: a workpiece transport portion (A); One measures the workpiece calibration part (B) that is installed in the semiconductor chip thickness on the workpiece; One is fed to the resin supply section (C) of workpiece with liquid resin; One has the resin molded part (D) with the mould of liquid resin molded piece; One measures the product measure portion (E) of the resin molded segment thickness of moulded product; An and product holding portion (F).
Fig. 3 is the block diagram of the resin molding apparatus of present embodiment.The part (A-F) that one control section (G) control is above-mentioned is so that conveying workpieces to workpiece supply resin, is used resin molded workpiece, and held molded product.
Should be noted that the workpiece 10 of present embodiment is made of a substrate and two row semiconductor chips mounted thereto.
Workpiece transport portion (A) has: one comprises the setup unit 11 in a plurality of boxes storehouse, and workpiece 10 is contained in each box storehouse; One unloading device comprises a lifter, the box storehouse of its vertically mobile transport portion (A), one from the box storehouse propeller of conveying workpieces 10; And a set mechanism that comprises the turntable 14 that is used for leading two workpiece 10, two workpiece have taken out from the box storehouse abreast with corresponding to the desired location in the resin molded part (D) etc.
One sets station is arranged on the rear side of turntable 14, and the workpiece of being arranged abreast by turntable 14 10 temporarily remains on this setting station.Being used for transmitting a pair of feeder track 16a of workpiece 10 and 16b is arranged on turntable 14 and sets between the station.
Workpiece calibration part (B) has: one is used for keeping the X-Y platform 20 of workpiece 10; An and sensor unit 22 that is used for measuring workpiece 10 thickness that kept by X-Y platform 20.X-Y platform 20 keeps two workpiece that are arranged in parallel 10.One camera 21 that is used for handling image is arranged on X-Y platform 20 tops.
One loader 36 is transferred to X-Y platform 20 with workpiece 10 from setting station on track 18, described track 18 is arranged between the side position of setting station and X-Y platform 20.
As shown in Figure 2, the sensor unit 22 of workpiece calibration part (B) is made up of with the sensor 24a and the 24b that are attached on the framework 23 a U-shaped framework 23.
Figure 4 and 5 are zoomed-in views of sensor unit 22.In the present embodiment, the sensor 24a of sensor unit 22 and 24b are towards workpiece 10 emission laser beams and accept folded light beam from workpiece 10 reflected backs, so that the thickness of measuring workpieces 10.In Fig. 4, each arranges dividually vertically that to sensor 24a and 24b they measure the distance from the substrate of workpiece 10 respectively, then, deduct the distance that records the distance between sensor 24a and 24b, thereby calculates the thickness of substrate.
Because two workpiece 10 remain on the X-Y platform 20 abreast with the spacing of regulation, so, the two couples of sensor 24a and 24b with a pitch arrangement corresponding to the layout of workpiece 10.Sensor 24a and 24b are slidably attached to guide 25a and 25b, so, can adjust the detection position of sensor 24a and 24b.According to the spacing between the workpiece 10 that remains on the X-Y platform 20, can determine the detection position of sensor 24a and 24b.
Resin supply section (C) comprising: allocation units 32, and it is made up of the distributor 30a and the 30b that liquid resin are fed to the semiconductor chip 10b on the substrate 10a; And the X-Y platform 34 that is used for keeping workpiece 10.
In the present embodiment, as shown in Figure 1, resin supply section (C) is arranged in the center front of a bottom.Use a pair of distributor 30a and 30b respectively liquid resin to be fed to two workpiece 10 that remain on the X-Y platform 34.Control X-Y platform 34 moves in a horizontal plane (along a directions X and a Y direction perpendicular to directions X), and vertically (along the Z direction perpendicular to directions X and Y direction) moves.
Loader 36 is arranged on the rear side of resin supply section (C), so that workpiece 10 is transferred to resin supply section (C) from workpiece calibration part (B), also workpiece 10 is transferred to resin molded part (D) from resin supply section (C).Loader 36 has a pair of chuck mechanism that is used for clamping two workpiece of arranging abreast 10, and it transmits workpiece 10 and does not change its head.
Resin molded part (D) comprising: a mould, and it is made up of the patrix 40 and the counterdie 41 that are used for clamping with molded piece 10; And the press unit 42 of a maintenance mould.Press unit 42 comprises: one keeps the fixed platen 43 of patrix 40; One keeps the movably platen 44 of counterdie 41; An and mold clamping mechanism that is used for oppressing with clamping mold.In the present embodiment, press unit 42 also comprises: one drives the motor of mold clamping mechanism; An and press mechanism that forms by a knee joint mechanism.
One comprises that the release film conveying mechanism of a conveying roller and a collecting drum is arranged on the patrix 40.Conveying roller is transported to a release film 80 molded of patrix 40 with Overmolded, and collecting drum is therefrom collected the part of using of release film.Conveying roller and collecting drum are synchronously driven with resin molded action.
Product measure portion (E) comprising: one is used for keeping two X-Y platforms 60 of molded moulded product 50 in resin molded part (D); And the sensor unit 62 of resin molded part that is used for measurement products 50.The horizontal layout that X-Y platform 60 is arranged products 50 and is positioned at the product 50 on the mould of resin molded part (D).
The structure of sensor unit 62 is identical with the structure of the sensor unit 22 of workpiece calibration part (B).That is, two pairs of sensors are corresponding to two products 50 that kept by X-Y platform 60.Each is vertically arranged with the spacing of regulation sensor.X-Y platform 60 flatly moves between all sensors of sensor unit 62.One camera 63 that is used for handling image is arranged on X-Y platform 60 tops, and a camera 21 is arranged on X-Y platform 20 tops.
One is arranged on product 50 on the rear side of resin molded part (D) from the emptier 64 that resin molded part (D) is transferred to product measure portion (E).Emptier 64 picks up product 50 and they is transferred to X-Y platform 60 from counterdie 41, keep the layout on their planes in the press unit 42 of resin molded part (D).
Product holding portion (F) is arranged in the right front part of bottom.
One mechanism for picking 70 that picks up product 50 is arranged on the top of a forward facing position of X-Y platform 60.Mechanism for picking 70 picks up product 50 and they is inserted in the box storehouse (not shown) from X-Y platform 60.In Fig. 2, a lifter 74 wherein is received in the box warehouse certificate unit in all boxes storehouse of stored prod 50.
(workpiece set mechanism)
One is used for the mechanism that workpiece 10 is set in the mould of resin molded part (D) is shown in Fig. 7 and 8.
Fig. 7 is the plane of counterdie 41.Resin molded regional 7 semiconductor chips corresponding to workpiece 10.Be used for compression molded inner chamber and be formed in the patrix 40, they are corresponding to resin molded regional 7.
In Fig. 7, press mechanism 120 is set, its edge with substrate 6 is pressed on the clamping area.Each minor face edge of two press mechanisms, 120 compressing substrates 6; Two press mechanism 120 its each long edges of compressing.
Press mechanism 120 has hook 122, and the edge join of hook 122 and substrate 6 and substrate 6 being urged on the clamping area of counterdie 41.A plurality of holes are formed in the patrix, disturb mutually with the clamping area of patrix 40 to prevent hook 122.
Fig. 8 is the sectional view along the intercepting of the line H-H shown in Fig. 7.Removable plate 114a and 114b are attached in the bottom biock 113 of counterdie 41 bottoms, and they are directed to by pin 141 and move along the opening of mould-closing direction.The front end of pin 141 is threaded with maintainance block 112, and its shaft portion penetrates removable plate 114, and its head 141a contacts the bottom surface of removable plate 114a.The spring 142 of removable plate 114a of biased downward and 114b is set on the pin 141 as bias unit respectively.
Each press mechanism 120 comprises: one from removable plate 114a and the vertically extending removable pin 121 of 114b; And the hook 122 that activates by the upper end of removable pin 121.One bottom of removable pin 121 is kept by removable plate 114a and 114b, and their upper end extends in the maintainance block 112.
It is one L shaped that each hook 122 forms, and be made up of the hook portion 122b that a contact arm 122a and who is activated by the upper end of removable pin 121 is used for hooking workpiece 10.One axle 123 that allows hook 122 to rotate in a vertical plane is set on the sweep of hook 122.
The pawl of hook portion 122b is outstanding from the top edge at the hole 111b of a die cavity piece 111 internal drillings.
The mobile terminal of the contact arm 122a that activates by removable pin 121 by a spring 124 all the time towards the biasing of the upper end of removable pin 121.
The bottom surface of the removable plate 114b of one drive rod, 119 contacts, removable plate 114b is attached in the bottom biock 113 together with removable plate 114a.Drive rod 119 is driven by suitable device, for example, motor, hydraulic mechanism, so as along mould open-closing direction activates removable plate 114a and 114b.
On the left side of the centre line C L of Fig. 8, workpiece 10 is set in the counterdie 41.In the time of in workpiece 10 is set in counterdie 41, removable plate 114a and 114b be by spring 142 biased downward and the position under being positioned at, and the position of removable pin 121 under being positioned at, so that the part 122b that hooks of the hook 122 of press mechanism 120 rotates outward.In this state, can set workpiece 10 and with hook part 122b and do not disturb.
After in workpiece 10 is set in counterdie 41, removable plate 114a and 114b are driven bar 119 and promote.On the right side of the centre line C L of Fig. 8, removable plate 114a and 114b move up by drive rod 119.By drive rod 119 removable plate 114a and 114b are moved up, removable thus pin 121 moves up, and the upper end of removable pin 121 pushes away the contact arm 122a with swivel hook 122, so, hook part 122b and inwardly rotate around axle 123.Since this action, the edge join of hooking pawl and the workpiece 10 of part 122a.Hook part 122a by further rotation, workpiece 10 is pressed against on the clamping area of counterdie 41 and remains there.
Because workpiece 10 is pressed against on the counterdie 41 by hook 122, so whole workpiece 10 can contact counterdie 41 equably, like this, can prevent the distortion of workpiece 10.In addition, workpiece 10 heating effectively by counterdie 41, like this, resin can solidify in a short time.
In a traditional resin molding apparatus, at first, workpiece 10 is set on the counterdie 41, and heated parts 10 also reaches thermally-stabilised, uses mold cramping workpiece 10 then.On the other hand, in the present embodiment, workpiece 10 is set on the counterdie 41 and by hook 122 and keeps, and then, uses mould 40 and 41 clamping work pieces 10 immediately.Therefore, can shorten resin molded circulation timei.
(dispensing arrangement)
Fig. 9 illustrates a distributor 30a among distributor 30a and the 30b.Another distributor 30b has identical structure.
Distributor 30a comprises: a cylinder body 210; One is slidably disposed on the plunger 212 in the cylinder 210a who is formed in the cylinder body 210; One is used for controlling the supply valve 214 of supply liquid resin; And one be used for controlling the dump valve 216 of discharging liquid resin.Through hole 210b that valve 214 and 216 liquid thickly insert and 210c are formed in the cylinder body 210, and through hole 210b and 210c are parallel to cylinder 210a.One is communicated to the flow path 220 of cylinder 210a with resin reservoir vessel 222, and one be communicated to the flow path 221 of cylinder 210a with discharge nozzle 218, and they are formed in the cylinder body 210.
Bottom 212b, the 214b of plunger 212 and valve 214 and 216 and 216b are connected respectively to driver element 230,232 and 234.In the present embodiment, the cross sectional shape of bottom 212b, 214b and 216b forms T shape, as the protuberance that connects; The T-shaped groove of link also can engage with T shape bottom 212b, 214b and 216b, and they are respectively formed in driver element 230,232 and 234.Bottom 212b, 214b and 216b can not throw off from link along its axial direction.
Figure 10 is the sectional view along the intercepting of the line J-J shown in Fig. 9.Because the bottom 214b of supply valve 214 is T-slot 232b of driver element 232, so valve 214 is not thrown off along the driving direction and the groove 232b of driver element 232.Therefore, valve 214 reciprocally moves together with driver element 232.Be to be noted that driver element 232 is suitable devices, it is connected to valve 214 and movement of valve 214 reciprocally.For example, can adopt a servomotor mechanism, a cylinder mechanism etc.Driver element 230 and 234 has identical structure.
In Figure 10, cylinder body 210 is fixed to a framework 225, and framework 225 is fixed on the bottom of resin molding apparatus.One flat shape of framework 225 forms a U-shaped, and vertical channel 225a is formed in the inner face of framework 225.Boss 210d is formed on the side of cylinder body 210, and boss engages with vertical channel 225a respectively.
One screw 226 is set to the front portion of framework 225.This screw 226 is to pusher cylinder body 210, and its boss 210d engages with groove 225a, so that the back of boss 210d is pressed against on the inner face of groove 225a.Therefore, cylinder body 210 is fixed to framework 225.
In the distributor 30a of present embodiment, when moving on to intercommunicating pore 214a, supply valve 214 is communicated with the position corresponding to one of flow path 220, and dump valve 216 is when moving on to intercommunicating pore 216a from a closed position of flow path 221 conversion, plunger 212 moves backward, then, liquid resin is drawn into cylinder 210a from container 222.Next, supply valve 214 moves on to a closed position, and dump valve 216 moves on to a connection position, and then, plunger 212 moves forward, so that the liquid resin that is stored in the cylinder 210a is discharged in nozzle 218.By repeating above-mentioned action, the liquid resin of each ormal weight is discharged from container 222 sucking-offs and in nozzle 218.
In the distributor 30a of present embodiment, cylinder body 210 can easily be attached to framework 225 and pull down from framework 225.In order from framework 225, to pull down cylinder body 210, at first, the screw 226 of lax contact cylinder body 210 front ends, then, cylinder body 210 moves up with respect to framework 225, so that cylinder body 210 can separate from framework 225.The links of plunger 212 etc. can be along vertical direction from driver element be pulled down 230.
After cylinder body 210 was pulled down from framework 225, plunger 212 and valve 214 and 216 were pulled out from cylinder body 210, so that can clean the inside of cylinder body 210, plunger 212 etc.
For cylinder body 210 is attached to framework 225, link 212b, the 214b of plunger 212 and valve 214 and 216 and 216b are corresponding to T-slot 230b, 232b and 234b, and then, cylinder body 210 is fitted in the framework 225 from upside.Adopt this action, plunger 212 and valve 214 and 216 can be connected to driver element 230,232 and 234.
Be to be noted that plunger 212 and valve 214 with 216 with driver element 230,232 and the 234 all bonding stations that engage vertically needn't be identical.For example, in Figure 11, the bonding station of plunger 212 moves forward with respect to valve 214 and 216 bonding stations.In this case, the height of plunger 212 and valve 214 and 216 and horizontal layout are corresponding to the height and the horizontal layout of driver element 230,232 and 234, like this, by moving in the vertical direction plunger 212 etc., plunger 212 grades are attachable to driver element 230 grades and from wherein pulling down.One hole 230c is formed in the driver element 230, so that prevent that with dismantling when moving dump valve 216 from disturbing mutually with driver element 230 attached.In Figure 10, the driver element 230 of Bu Zhiing is shown as dotted line as shown in figure 11.
In any case, plunger 212 and valve 214 and 216 engage with driver element 230,232 and 234, they in axial direction or reciprocating direction can not throw off, but can throw off along the direction of direction perpendicular to axial direction.The structure of coupling part is not limited to T shape link and T-slot.
In the above-described embodiments, the boss 210d of cylinder body 210 engages with the groove 225a of framework 225.On the other hand, boss can be formed in the framework 225 and engage with groove in being formed on cylinder body 210.In addition, cylinder body 210 can have flat side and can be formed in the inner face of framework 225 with the boss that contacts cylinder body 210 1 back.That is, can use any structure, as long as they allow cylinder body 210 vertically to be attached to framework 225 and from wherein dismounting, move backward with respect to framework 225 but limit cylinder body 210.
In the distributor 30a and 30b of present embodiment, plunger 212 grades can easily be connected to driver element 230 grades and need not use screw, and plunger 212 grades can be pulled out together with cylinder body 210 from framework 225.Therefore, when the slidably property variation of plunger 212 grades, distributor 30a and 30b can easily pull down from resin molding apparatus and safeguard.Adopt this structure, can obtain sufficient maintaining all the time with the state of the resin molding apparatus of resin molded workpiece
Be to be noted that in the resin molding apparatus of present embodiment workpiece 10 is kept by X-Y platform 34, and the distributor 30a of fixed-site and 30b are fed to workpiece 10 with liquid resin.In other embodiments, distributor 30a and 30b or its nozzle can move, and liquid resin are fed to an established part of the workpiece 10 that is fixed on a pre-position.
(resin molded action)
Next, explanation is shown in the resin molded action of the resin molding apparatus among Fig. 1 and 2.
Promote the box storehouse that is contained in the setup unit 11 length by length by lifter 12, one by one workpiece 10 is transported to turntable 14 by unloading device.At place, a holding position, turntable 14 accepts to be removed first workpiece 10 that mechanism carries, and then, turntable 14 turns over 180 degree and accepts second workpiece 10 at another place, holding position.Because this action, two workpiece 10 are arranged abreast.
The workpiece 10 that has been arranged in abreast on the turntable 14 moves into place in the desired location of turntable 14 rear sides by conveyor track 16a and 16b.
Two workpiece 10 are transferred to the X-Y platform 20 of workpiece calibration part (B) therefrom by loader 36.For workpiece 10 is transferred on the X-Y platform 20, the loader 36 of picking up work piece 10 moves towards side along conveyor track 16a and 16b, and then, workpiece 10 is transferred on the X-Y platform 20.
After workpiece 10 is transferred to X-Y platform 20, load the image of workpiece 10 and handle by camera 21, so that survey the default point of workpiece, for example, there are not semiconductor chip, vacancy.
In workpiece calibration part (B), at first, X-Y platform 20 moves along the longitudinal direction of workpiece 10, so that measure the thickness of the semiconductor chip 10b of first row, X-Y platform 20 along continuous straight runs move then, so that measure the thickness of the semiconductor chip 10b of second row.
In Fig. 6, use the thickness of the semiconductor chip 10b of X-Y platform 20 measuring workpieces 10 that move.
Because sensor 24a and 24b are positioned at the above and below of workpiece 10, so, even substrate 10a bends or is out of shape, also can correctly record by the thickness that deducts the semiconductor chip 10 that substrate 10a THICKNESS CALCULATION tries to achieve.In addition, may detect according to the data that record by sensor 24a and 24b semiconductor chip is not installed.
The data of the semiconductor chip 10b that is recorded by workpiece calibration part (B) are used for or feed back in the amount of resin of control by resin supply section (C) supply.That is, control section (G) is according to the THICKNESS CALCULATION of the semiconductor chip 10b that the records amount of resin to each semiconductor chip 10b supply.In addition, the amount of resin of control section (G) control resin supply section (C) so that each semiconductor chip 10b supply is calculated.If detecting at the assigned position place of substrate 10a does not have semiconductor chip, then calculate the needed amount of resin in this position, and resin supply section (C) resin that its supply is required.
After the thickness of measuring workpieces 10, loader 36 is transferred to X-Y platform 34 with workpiece 10 from the X-Y platform 20 of resin supply section (C).In resin supply section (C), be fed to two workpiece 10 that kept by X-Y platform 34 by distributor 30a and 30b liquid resin.
To explain the resin molded action in the resin molding part (D) below.At first, the mobile platen 44 of press unit 42 moves down and opens mould, and then, workpiece 10 is arranged on the counterdie 41 by loader 36.Next, counterdie 41 moves up and workpiece 10 between clamping mold 40 and 41.In this state, workpiece 10 can carry out molded.In the present embodiment, workpiece 10 is clamped between mould 40 and 41 together with the liquid resin that is fed to workpiece 10, so usable resins is come molded piece 10.This method is referred to as " compression molded ".
By being clamped between mould 40 and 41 together with liquid resin, workpiece 10 continues a preset time, resin solidification and form molded product.
When resin fully solidified, counterdie 41 moved down and opens mould, then, takes out molded product 50 by emptier 64 from mould.Emptier 64 is transferred to two products 50 the X-Y platform 60 of product measure portion (E) from mould.
In product measure portion (E), with the laser sensor of the above and below that is arranged on product 50, and to measure the mode of the thickness of semiconductor chip 10b, the thickness of the resin molded part of measurement products 50 by workpiece calibration part (B).With the X-Y platform 60 that moves, measure the thickness of the resin molded part of all products 50.In addition, load the image of products 50 and handle by camera 63, so that survey the default point of product, for example, inadequate molded, vacancy.
The data (for example, the thickness of resin molded part) that recorded by product measure portion (E), the data of image can be fed back the amount of resin of controlling by resin supply section (C) supply.That is, control section (G) calculates the amount of resin to each semiconductor chip 10b supply according to the thickness of the semiconductor chip 10b that records.In addition, control section (G) control resin supply section (C) is so that to workpiece 10 supply appropriate resin amounts.Therefore, can be in the scope of a permission with the thickness limits of the resin molded part of product 50.
Yet, in some cases, owing to the feature of workpiece 10, the structure of mould, the feature of press unit 42 etc., the scope of the thickness of the resin molded part of product 50 meeting deviation permit.Therefore, the data that recorded by product measure portion (E) by feedback can be with the thickness limits of the resin molded part of product 50 in the scope of permission.That is, resin supply section (C) can be adjusted the amount of resin of supply.
For example, in the situation of molded new product, can determine effectively and correctly by following steps by the amount of resin of resin supply section (C) supply: the thickness of the semiconductor chip 10b of measuring workpieces 10; Setting is by the resin supply of resin supply section (C) supply; And, adjust resin supply by resin supply section (C) supply according to the measurement data of moulded product.That is, can easily determine the molded condition of resin molding apparatus.
In the situation that changes workpiece 10 and liquid resin feature, the variation of the resin molded part of moulded product 50 can be replenished by adjusting according to the measurement data of product 50 by the resin supply of resin supply section (C) supply.That is,, can adjust the resin supply of supplying in advance according to their trend by resin supply section (C) by measuring the variation of molded product 50 and the resin molded part that monitors product 50 continuously.
Trend by the measurement data that will be recorded by product measure portion (E) feeds back in the resin supply by resin supply section (C) supply, and the amount of resin that can control supply is being limited in the scope of permission by the variation of the shape of the resin molded part that changes the product 50 that molded condition causes.Even the scope of the shape deviation permit of resin molded part also can prevent a large amount of time bad products of producing by measurement data being fed back to resin supply section (C).
Feed back in the resin supply by resin supply section (C) supply by measurement data, can accurately implement the molded of resin according to changing with the resin molded part of product 50.In the situation that forms thin resin molded part, for example, its thickness be 1mm or less than, then can monitor the thickness of the thin resin molded part of product effectively all the time, and control resin supply section (C) according to the result of monitor.Because this action can form enough thin resin molded part.
In the above-described embodiments, semiconductor chip 10b is arranged on the substrate 10a of workpiece 10 linearly, but is not limited to the workpiece 10 of this embodiment by the molded workpiece of resin molding apparatus of the present invention.For example, resin molding apparatus of the present invention can become one group, whole sides of semiconductor wafer etc. by molded a plurality of semiconductor chips.In the situation of whole sides of molded semiconductor wafer, the thickness of moulded product can feed back to resin supply section (C), and does not need the thickness of measuring workpieces.If boss and being recessed to form in the surface of workpiece so that the amount of resin that needs changes, then can be controlled the amount of resin of supply by the surface of measuring workpieces.
(method of resin molded stacked product)
Figure 12 A and 12B illustrate the wherein workpiece of stacked semiconductor chips 2.In Figure 12 B, a spacing block 3 is inserted between the semiconductor chip 2.Semiconductor chip 2 is stacked on the side of substrate 1, and they are arranged as matrix or map.
In the situation of the workpiece of molded wherein stacked semiconductor chips, the amount of resin by adjusting supply is molded piece suitably.
In Figure 13 A and 13B, a dispenser nozzle 6b is applied to workpiece with liquid resin 6c, and the workpiece that has applied liquid resin 6c is clamped between the upper die and lower die, so that compression molded workpiece.
Now the control system that one control comprises the resin supply section of distributor is described with reference to Figure 14.One control section 4 comprises: a CPU 4a, and it delivers to a resin supply section 6 according to the data of sending from a Z axle checker 5 with control instruction; One ROM 4b, the operation sequence of its storage dispenser nozzle 6b etc.; And a RAM 4c who stores the input data, work the working region of making CPU 4a etc.Z axis data (highly), capacity data and the additional amount of resin of each semiconductor chip all is stored in the RAM 4c.
The height of Z axis data or semiconductor chip 2 is delivered to control section 4 from Z axle checker 5.Control section 4 calculates needed amount of resin according to the Z axis data of sending from Z axle checker 5, and the data of calculating are delivered to resin supply section 6 as control instruction.
Explain a method of control resin supply below with reference to Figure 15.
At first, before compression molded, the Z axle height of each layer of measuring workpieces is as the data of Z axle.In this example, six layers of semiconductor chip 2 are stacked in the workpiece.Symbols Z 0 be a standard flat (measurement point: Xi, Yi), its expression is from the height of a substrate 1, or from a height of the bottom surface of chip, for example, Z0=0.064mm.What it should be noted that is, preferably, since the warpage of substrate 1, each measured value Z0.The altitude information of six layers of semiconductor chip 2 is, for example, and Z1=0.15mm-Z6=0.75mm.The amount of resin that molded semiconductor chip 2 needs, for example, Vz1=0.00524cc-Vz6=0.00274cc is stored in the control section 4 in advance.Calculate these data (step S1) according to each semiconductor chip 2 with respect to the volume of dies cavity.
Next, use the Z axle height of Z axle checker 5 measuring workpieces.At the center of outermost semiconductor chip 2 (measurement point: Xj, Yj) the height Zc of measurement above chip.Then, measure the calibrated altitude Zo of chip annex.By launching a laser beam to semiconductor chip and measure the focusing distance (step S2) of folded light beam, Z axle checker 5 reads height Zc.For example, if value Zc is 0.582mm, Zc-Zo=0.582-0.064=0.518mm, then it is near data Z4=0.50mm.Therefore, whether control section 4 judgment data Zc are the height (step S3) from a surface of the 4th layer semiconductor chip 2.Therefore, control section 4 also judge the 5th and the semiconductor chip of layer 6 whether not or lack, then, control section 4 adds Vz5+Vz6=0.00346+0.00274=0.00620cc in the resin supply of standard, to determine actual resin supply (step S4).
The data that control section 4 will be used for controlling the amount of resin that offers workpiece are transported to resin supply section 6 (step S5), and semiconductor chip is arranged imaging array or map in each workpiece.Resin supply section 6 stores the data (step S6) to a workpiece, and to each chip or each inner chamber supply liquid resin to substrate 1 (step S7).The data for each workpiece that stored are used as the control data that is used for supplying resin.Even have the identical workpiece that loses or lack layer in supply next time, also can feed back the actual resin amount that is fed to previous workpiece of storage, so that can analyze additional amount of resin.Therefore, molded piece fully.
Repeat above-mentioned steps and come molded piece.In above description, as shown in FIG. 13A, the liquid resin 6c that lacks part 7 that its volume replenishes semiconductor chip 2 is fed in the mould 81, and this mould has an inner chamber 78 and is used for molded piece as one group, in compression molded process, keeps the pressure of liquid.On the other hand, shown in Figure 13 B, if use a mould 82, wherein, workpiece carries out molded respectively in inner chamber 79, then control section 4 is controlled resin supply sections 6 and resin 6c is not fed in the inner chamber 79 that holds the semiconductor chip 2 with shortage part 7, so, can consume resin 6c with avoiding waste.
The shortage part 7 that is to be noted that semiconductor chip 2 can replace highly surveying with Z axle checker 5 measurement Z axles by image data processing.For example, the Z axle height of semiconductor chip 2 can be measured according to the focusing distance of semiconductor-on-insulator chip 2 or the shape of semiconductor chip 2.
In the situation of the molded workpiece that piles up a plurality of semiconductor chips 2, according to the amount of resin of the existence adjustment supply of the shortage part of semiconductor chip.Adopt this method, can prevent the variation of moulded product height, also can consume resin with avoiding waste.
(adopting decompression to carry out resin molded method)
As shown in figure 16, utilize a side of compression molded method molded piece 10.In some cases, resin 5 is invaded in the air-breathing path 402d that is formed between an inner chamber body 401 and the binding clasp 402, so suction also is fixed to release film 80 on the inner face of an inner chamber, like this, outstanding K is formed on the outside of moulded product.In addition, release film 80 is in the 402d implosion of air-breathing path, so in the slipper that resin 5 is invaded between cavity 401 and the binding clasp 402, thus, mould can not successfully be operated.
If air was discharged from a resin molded zone by a vacuum chamber 410 when workpiece 10 was molded, then resin 5 easily leaks into vacuum chamber 410 from inner chamber, so resin fin wing " L " is formed in the workpiece 10 along a clamping area of the binding clasp 402 of clamping work pieces 10.
In order to address the above problem, as shown in figure 17, suction hole 402c can be formed in the inner face of binding clasp 402, suction hole 402c suction air is so that aspirate the inner face of release film 80 towards inner chamber, and the inner face of described binding clasp 402 can slide on the outside of binding clasp 401.Air-breathing path 402c is communicated with air path 402b.Air-breathing path 402c is formed on that to be similar to groove on the inner face of binding clasp 402 such.A plurality of air-breathing path 402c are arranged to surround cavity 401.
Open and binding clasp 402 when being positioned at upper/lower positions when mould, the lower end of air-breathing path 402c and the distance " H " between the clamping area are less than the bottom surface of cavity 401 and the distance between the clamping area.That is, when mould was opened, air-breathing path 402c was communicated to chamber depression.
Clamped and the molded therein resin molded zone of workpiece 10 is surrounded by a vacuum chamber 410, and this vacuum chamber 410 is communicated to a vacuum unit 420 by an air discharge path 411.
Be used for aspirating and release film 80 is fixed to the air-breathing path 402a on the clamping area of binding clasp 402, in clamping area, open, and they be communicated to the air path 402b that is formed in the binding clasp 402.Air path 402b is communicated to an extraction sector 415, and this extraction sector 415 is provided with vacuum unit 420 dividually so that discharge air from vacuum chamber 410.In the present embodiment, suction hole 402a and suction hole 402c are communicated to public air path 402b.In other situation, suction hole 402a can be communicated to different extraction sectors with suction hole 402c, and can control independently by suction hole 402a suction release film 80 with by suction hole 402c suction release film 80.
In Figure 17, mould is opened, and workpiece 10 is set on the counterdie 41, and release film 80 is sucked and is fixed on the inner face of the clamping area of binding clasp 402 and chamber depression.After workpiece 10 was set on the counterdie 41, resin molded zone was surrounded by vacuum chamber 410, and then, vacuum unit 420 is discharged air by air discharge path 411 from vacuum chamber 410.
Extraction sector 415 usefulness condition of high vacuum degree aspirate and release film 80 are fixed on the depression inner face of chamber, and this vacuum is greater than the vacuum of vacuum chamber 410.Open near the bottom surface of the interior smallpox face of chamber depression or cavity 401 end of suction hole 402c.So that release film 80 aspirates the interior smallpox face towards the chamber depression reliably, and the inner face that can easily cave in along the chamber is sucked.
In Figure 18, workpiece 10 is clamped between patrix 40 and the counterdie 41, and an inner chamber 405 is formed on the upside of workpiece 10.When binding clasp 402 contact workpieces 10, the suction hole 402c of binding clasp 402 opens in inner chamber 405, and by using extraction sector 415 suction airs, release film 80 is sucked the interior smallpox face towards the chamber depression.
Next, move removable mould till reaching a clamped position, then, workpiece 10 carries out compression molded (seeing Figure 19).Inner chamber 405 usefulness resins 5 are filled, and pressurization and heat reactive resin 5.
Carry out in inner chamber in the compression molded state at workpiece 10 usefulness resins 5, the bottom surface of cavity 401 and the distance between the clamping area are less than lower end and the distance between the clamping area " H " of air-breathing path 402c.That is, when workpiece 10 usefulness resins 5 were fully molded, a degree of depth of inner chamber 405 was less than distance " H ", so that the connection between chamber depression and the air-breathing path 402c is closed.The flat side of binding clasp 402 and the bottom surface of cavity 401 constitute the inner face in chamber 405.Therefore, can prevent to be formed on resin fin wing outstanding among the air-breathing path 402c.
In above-mentioned method, resin molded zone is surrounded by vacuum chamber 410, and air is therefrom discharged in molding process, so air can purify from inner chamber 405, does not have the space can be formed in the molded product.
In the present embodiment, when mould was opened, distance " H " was less than the bottom surface of cavity 401 and the distance between the clamping area, but two distances can equate basically.If air-breathing path 402c is formed on the inner face of binding clasp 402, then can reduce the draw resistance of suction release film 80 in the air path; Even two distances equate that air also can be sucked by gap portion, so that release film 80 can be fixed on the inner face of inner chamber 405.
(carrying out resin molded method) with false inner chamber
When a workpiece by a mold cramping with carry out when compression molded, air-vent can be formed in the surface of work piece substrate.In Figure 20, workpiece 10 usefulness resins carry out compression molded, and thin resin fin wing 92 is formed in the air-vent, and they are connected on the angle of resin molded part 90 separately.
Air-vent stops resin to be discharged from an inner chamber.In the present embodiment, the degree of depth air-vent that is about 0.03mm forms by the clamping area of polishing mould.Adopt this structure, the flow resistance of air-vent is big as exhaust apparatus, so air can not be discharged reliably, and the space of air can be formed in the resin molded part 90.Because air-vent is formed in the surface of substrate of workpiece 10, air can easily store near the outside and its angle of resin molded part 90.That is, space 90a easily is formed near the bight of resin molded part 90.
In order to address this problem, effective method is the mould molded piece of using shown in Figure 21 and 22 10.This mould is characterised in that, forms false chamber depression 406a in the clamping area of the binding clasp 402 of patrix 40.
Figure 22 illustrates cavity 401 and the binding clasp of watching from downside 402.False chamber depression 406a is formed in the binding clasp 402.The inner of false chamber depression 406a is corresponding to the angle of cavity 401.Planish in the angle that is to be noted that cavity 401, the inner of false chamber depression 406a is corresponding to the part of planing.
The suction hole 402a that is used for aspirating release film 80 is formed in the clamping area of binding clasp 402.Suction hole 402a is communicated to the air path 402b that is formed in the binding clasp 402, and this air path 402b is communicated to extraction sector 415.All grooves are formed on the outside of cavity 401.Because cavity 401 is fitted in the binding clasp 402 slidably, so all holes 407 are formed on therebetween.All holes 407 are communicated to the air path 402b of binding clasp 402.
In Figure 21, mould is opened, and workpiece is set on the counterdie 41, and resin 5 is fed to workpiece 10.Release film 80 is sucked into the clamping area of binding clasp 402, and release film 80 is fixed on the inner face of inner chamber through suction air by air path 402b.Suction hole 402a and the air-breathing path of opening in inner chamber need not be communicated to public air path 402b.In other situation, they can be communicated to different extraction sectors.
Resin molded zone is surrounded and gastight closing by vacuum chamber 410, and vacuum unit 420 is discharged air by air discharge path 411 from vacuum chamber 410.
In Figure 23, workpiece 10 clamps between patrix 40 and counterdie 41 and is compression molded.Inner chamber 405 and false chamber depression 406a are filled with resin 5, resin 5 pressurized and heat cures.
In the present embodiment, resin 5 is incorporated in the depression 406a of inner chamber 405 and false chamber and little by little moves movably mould till reaching clamped position.Because inner chamber 405 and false chamber depression 406a under reduced pressure fill with resin 5, so, can prevent to be formed on the formation in the space in the resin 5 effectively because of residual air.
In order to purify residual air effectively from false chamber depression 406a, air-vent can be communicated to false chamber depression 406a.
The position of false inner chamber is not limited on the angle of inner chamber, and for example, false inner chamber can be formed on the center at each edge of inner chamber.The quantity that is communicated to the false inner chamber of inner chamber can be used as option and selects.They can be set to the selection angle of inner chamber.
In the above-described embodiment, resin molded enforcement under reduced pressure, but air is not limited under reduced pressure implement resin molded by the resin molding method that false inner chamber stores therein.
Under the spirit that does not break away from essential characteristic of the present invention, the present invention also can be embodied as other specific forms.Therefore, it is illustrative and not restrictive that all embodiment of the present invention can be considered in all fields, scope of the present invention is pointed out by appended claims, rather than point out by above-mentioned description, therefore, all implication and variations within the scope that fall into the equivalent of claims are all desired to covered in wherein.
Claims (18)
1. a resin molding apparatus comprises:
One workpiece transport portion;
One measures the workpiece calibration part that is installed in the semiconductor chip thickness on the workpiece;
One is fed to the resin supply section of workpiece with liquid resin;
One has the resin molded part with the mould of liquid resin molded piece;
One measures the product measure portion of the resin molded segment thickness of moulded product;
One product holding portion; And
One is used for controlling the control section of described each several part,
Wherein, described control section comprises the device that is used for adjusting the liquid resin amount, and described resin supply section is fed to workpiece according to the thickness that described workpiece calibration partly records with liquid resin.
2. resin molding apparatus as claimed in claim 1 is characterized in that described control section comprises the device that is used for adjusting the liquid resin amount, and described resin supply section is fed to workpiece according to the thickness that described product measure portion records with liquid resin.
3. resin molding apparatus as claimed in claim 2 is characterized in that, workpiece has a substrate and a plurality ofly is installed in suprabasil semiconductor chip,
Described product measure portion comprises that one is used for measuring the sensor unit of the resin molded segment thickness of semiconductor chip, and
Adjusting device is adjusted the liquid resin amount, and described resin supply section is fed to workpiece according to the thickness of the resin molded part that sensor unit records with liquid resin.
4. resin molding apparatus as claimed in claim 3, it is characterized in that, sensor unit comprises at least one pair of sensor, one of them launches laser beam, and wherein another accepts the laser light reflected bundle, so that measurement thickness, pair of sensors is arranged along the thickness direction of moulded product, and is separately positioned on the product both sides.
5. resin molding apparatus as claimed in claim 1 is characterized in that mould comprises a pressure mechanism, and this pressure mechanism flatly is pressed in workpiece on one clamping area of mould in the position of regulation.
6. resin molding apparatus as claimed in claim 5 is characterized in that,
Pressure mechanism has a pressure hook, and in the time of in workpiece is transported to mould, the pressure hook can be pressed onto the edge of workpiece on the clamping area, and flatly workpiece is kept thereon,
The pressure hook can rotate in the plane perpendicular to clamping area, and
Pressure mechanism also has a travel mechanism that is used between a pressure position and free position movement pressure hook, and at pressure position, the pressure hook is with the workpiece compressing and remain on the clamping area, and at free position, the pressure hook does not disturb mutually with the edge of workpiece.
7. resin molding apparatus as claimed in claim 1 is characterized in that, described resin supply section comprises a distributor, and this distributor is fed to workpiece with the liquid resin of ormal weight, and
This distributor comprises:
One cylinder body comprises the cylinder part of a storaging liquid resin, and one partly is connected to the fluid path of a liquid container with cylinder, and one partly is connected to the fluid path of a discharge nozzle with cylinder;
One plunger that in the cylinder part, slides;
One is arranged on the supply valve on the cylinder body, and supply valve opens and closes the fluid path between cylinder body and the liquid container;
One is arranged on the dump valve on the cylinder body, and dump valve opens and closes the fluid path between cylinder body and the discharge nozzle; And
All driver elements of actuation plunger, supply valve and dump valve respectively.
8. distributor as claimed in claim 7 is characterized in that,
The bottom of plunger, supply valve and dump valve is connected to the link of driver element respectively, and
All coupling parts can not thrown off along the moving direction of plunger, supply valve and dump valve, but they can be thrown off along the direction perpendicular to their moving directions.
9. distributor as claimed in claim 8 is characterized in that,
Also comprise:
One is used for keeping the framework of cylinder body, and this framework engages with cylinder body, thus, allows framework vertically to throw off from cylinder body, but stops framework to move backward; And
Cylinder body is fixed on the device of framework, and this fixture is arranged on the anterior of framework and cylinder pressure body backward.
10. resin molding apparatus as claimed in claim 1 is characterized in that,
Mould comprises:
Carry out the cavity that the layout of a molded inner chamber forms with resin therein according to workpiece;
One binding clasp surrounds cavity and forms chamber depression, and this chamber depression inner bottom surface is made up of an end face of cavity, and binding clasp can slide along the direction that opens and closes mould on the side of cavity; And
One suction hole is formed in the inner face of binding clasp, and binding clasp contacts the side of cavity slidably, and suction hole is communicated with the chamber depression so that with in the release film suction chamber depression, when cavity moved on to a position of clamping mold, suction hole was closed.
11. resin molding apparatus as claimed in claim 10 is characterized in that,
The resin molded zone of mould is positioned at a vacuum chamber, and
Vacuum chamber is communicated to a vacuum unit.
12. resin molding apparatus as claimed in claim 1 is characterized in that,
Mould has:
The inner chamber of the element installation region of the resin molded electronic device of one usefulness; And
One is communicated to an edge of inner chamber so that store the false inner chamber of air.
13. resin molding apparatus as claimed in claim 12 is characterized in that, mould also has the air-vent that is communicated to false inner chamber.
14. resin molding apparatus as claimed in claim 12 is characterized in that,
The resin molded zone of the mould of clamping and molded piece is surrounded by a vacuum chamber, and
Air in the vacuum chamber is discharged by a vacuum unit.
15. a resin molding method of implementing in resin molding apparatus as claimed in claim 1, wherein, one to comprise that a plurality of workpiece that are layered in a suprabasil semiconductor chip carry out in mould with resin compression molded, and described method comprises following all steps:
Store the cube volume and the amount of resin that is fed to each semiconductor chip of semiconductor chip;
Measure the distance " Z " between substrate and the outermost semiconductor chip;
According to the distance that records " Z ", survey the quantity of stacked semiconductor chip;
Calculating adds to the amount of resin of semiconductor chip;
The amount of resin of replenishing is delivered to the resin supply section as control data; And
According to control data, resin is fed to workpiece from the resin supply section.
16. method as claimed in claim 15 is characterized in that,
The amount of resin of replenishing is replenished the cube volume of the semiconductor chip of resin corresponding to needs.
17. method as claimed in claim 15 is characterized in that,
Distance " Z " is measured by a measuring instrument.
18. method as claimed in claim 15 is characterized in that,
The image that distance " Z " is taken from an imaging device is measured.
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| CN201310321030.8A CN103448188B (en) | 2004-11-02 | 2005-11-02 | Resin molding apparatus and resin molding method |
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| JP2004319020A JP2006134917A (en) | 2004-11-02 | 2004-11-02 | Method of sealing with resin |
| JP2005136933 | 2005-05-10 | ||
| JP2005171183 | 2005-06-10 | ||
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102543773A (en) * | 2010-11-25 | 2012-07-04 | 山田尖端科技株式会社 | Resin molding machine |
| CN102543773B (en) * | 2010-11-25 | 2016-08-03 | 山田尖端科技株式会社 | Resin molding machine |
| CN107538667A (en) * | 2016-06-24 | 2018-01-05 | 东和株式会社 | The manufacture method of resin molding apparatus, the manufacture method of synthetic resin and product |
| CN107538667B (en) * | 2016-06-24 | 2019-12-06 | 东和株式会社 | Resin molding apparatus, method for manufacturing resin molded product, and method for manufacturing product |
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| JP2006134917A (en) | 2006-05-25 |
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