CN1762082A - 传送器头和用于无接触能量传输的*** - Google Patents
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- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
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Abstract
本发明涉及一种用于无接触能量传输***的传送器头。本发明的传送器头包括与至少一个铁氧体芯相连的支承件。根据本发明,所述铁氧体芯至少局部地设计成E形,并且绕所述E形的一个分支设置扁平绕组。
Description
技术领域
本发明涉及一种传送器头和一种用于无接触能量传输的***。
背景技术
由DE10053373A1已知一种用于无接触地传输能量的装置。其中说明了一种传送器头,所述传送器头可进行感应能量传输并具有一定的匝数。
由DE 4446779 C2和DE 19735624 C1已知一种用于无接触能量传输的***,其中传输路径由一静止设置的中部导体和作为回输导线的铝型材组成。这里所述中部导体由传送器头可沿中部导体运动的U形芯部包围。在U形芯部上设有一个绕组。总体上所述传送器头需要较大的结构体积。
由WO 92/17929同样已知一种用于无接触能量传输的***。其中传输段包括线性导体形式的入流导线和回流导线。其中设计成具有一E形芯部和一设置在E形芯部的中间分支上的绕组的传送器头同样需要较大的结构空间。
由DE 19746919 A1已知一种扁平的布置,但这种布置会导致能量传输时效率较低。
发明内容
因此本发明的目的是,这样改进用于无接触能量传输的***,从而经济地需要较小的结构空间。
根据本发明通过根据权利要求1或2的传送器头和通过根据权利要求12给出的特征的***来实现所述目的。
对于所述传送器头,本发明的重要特征是,所述用于无接触传输能量的***的传送器头包括一个支承件,所述支承件与至少一个铁氧体芯相连,其中所述铁氧体芯至少局部地设计成E形,并且绕所述E形的一个分支设置扁平绕组。用于电能传输装置的传送器头特别设计成具有一包括至少两个相互平行延伸的初级导体的初级导线布置和至少一个与所述初级导线布置电磁耦合的次级绕组布置,所述次级绕组布置与初级导体布置机械上相分离,并可沿其纵向移动,其中所述次级绕组布置具有至少一个次级线圈,所述次级线圈设计成扁平绕组并且位于这样一个平面内,所述平面设置成平行于接纳所述初级导体布置的平面,其中传送器头包括一个支承件,所述支承件与至少一个铁氧体芯相连,其中所述铁氧体芯至少局部地设计成E形,并且绕所述E形的一个分支设置扁平绕组。
这里有利的是,所述传送器头特别扁平、非常经济,并且需要较少的结构空间。此外能量传输时的效率要高很多,因为E形的结构使得场线这样分布,即形成较少的散射场/杂散场(Streufeld),并且由初级导线产生的场线的大部分穿过具有E形分支的铁氧体芯。
在一个有利的实施形式中,所述初级导体设计成线形导体,或者所述初级导体设计成扁平导体,其面法线垂直于接纳次级绕组布置的平面。这里有利的是,可实现高的电流密度,可采用绞合线(Litze)材,并且由此可降低集肤效应。
在一个有利的实施形式中,所述次级绕组布置设置在车辆底板的下侧。这里有利的是,和无轨***一样同样可以采用轨道***。
在一个有利的实施形式中,所述次级绕组布置嵌入一个浇铸体中。这里有利的是,可实现高度(安全性)的防护形式。
在一个有利的实施形式中,所述初级导体布置静止地布置在行驶路径表面附近的区域内。这里有利的是,可在能量传输中实现高效率。
在一个有利的实施形式中,所述初级导体布置和/或所述次级导体布置至少局部地由绞合材料形成。这里有利的是,可降低集肤效应。
在一个有利的实施形式中,所述扁平绕组设计成单层或多层(印刷)线路板(Platine)上的导体带。这里有利的是,可实现特别经济地制造所述传送器头。
在一个有利的实施形式中设想,所述线路板装备有电子构件。这里有利的是,可降低部件的数量,特别是可降低用于电和/或机械连接的装置的数量。
在一个有利的实施形式中,所述线路板与一个包括冷却装置的壳体件连接。特别是所述冷却装置具有冷却肋和/或冷却条。这里有利的是,来自壳体件的热量可以传递给所述冷却装置。
在具有按前述权利要求中至少一个所述的传送器头的用于无接触能量传输的***中,本发明的重要特征是,在底部以一定的相互间距A铺设两个线形导体,其中所述传送器头与底部的距离在0.05*A和0.2*A之间。这里有利的是,可以在结构空间特别小的情况下传输大的功率。
其它优点由从属权利要求中得出。
附图标号表
1 支承件
2 铁氧体芯
3 多层线路板的层
4 多层线路板的层
5 多层线路板的层
21 壳体件
22 冷却肋
23 电子构件
24 铁氧体芯
25 绕组
26 线路板
31 铁氧体芯
32 塑料成形件
33 绞合线
41 底部
42 线形导体
43 壳体件
A、B 距离
下面借助于附图详细说明本发明。
具体实施方式
图1a中示出的根据本发明的传送器头,其中在图1b中示出左侧端部区域放大的局部。所述传送器头设计成扁平的,并需要小的结构空间。
这里在支承件1上安装并连接有铁氧体芯2,特别是作为粘接连接或作为可拆连接,如螺纹连接等进行连接。
在铁氧体芯2上设置具有层(3、4、5)的多层线路板,所述层带有设计成扁平绕组的铜制导体带并由此在线路板上形成。
这里,在另一个根据本发明的实施例中,唯一一个平坦的螺旋形绕组设置成单层的线路板的导体带,但此时只可传输较小的电功率。
在根据本发明的另一个实施例中,特别是按图1a和1b的实施例,这里采用多层的线路板(3、4、5),所述线路板在多个平面内具有螺旋形绕组。特别是这里电流导线不止在一个唯一的螺旋形的相应平面内延伸,而是所述导线在各平面之间多次转换/交替(Wechsel),以防止集肤效应。也就是说,在一短的导体带区段后就有利地转换到线路板的下一个平面中,在这里又经过一个短的导体带区段,然后又再次转换。这样就形成一种类似于扭转/绞合的电流分布,所述电流分布在基本原理上相当于一个绞合线,即相当于设计成相互绝缘的电流导线的多重线束。即这样形成的绕组设计成类似扭转的。
图2中示出带有支承绕组的线路板3的传送器头的整体结构。所述线路板3还附加地带有电子构件23,并具有必要的导体带。
所述线路板3和铁氧体芯2与一个壳体件21相连,所述壳体件具有用于散热的冷却肋22。
在图3中示出根据本发明的另一个实施例。其中在所述铁氧体芯31上设有塑料成形件32,在所述塑料成形件的凹陷部内嵌入绞合线33。图3a中没有示出绞合线。在图3和3a的左侧上半部示出塑料成形件32象征性的剖视图,其中具有示意性地示出的两个嵌入的绞合线33。所述塑料成形件32使得绞合线33易于嵌入。所述铁氧体芯31设计成E形的,并且所述绕组设置成绕E形的中间分支分布。其中E形的三个分支设计得非常短,特别是短到和绕组的高度一样。
图4中示出所述***用于感应传输能量的部分。其中在底部41中嵌入两个由绞合线形成的线形导体42,所述线形导体相互间的距离A为140mm。在其它根据本发明的实施例中(所述距离为)100mm至200mm的值也是有利的。
所述扁平的设置在一壳体件43中的传送器头到底部41的最大距离B为15mm,即约为线形导体间距离A的十分之一。除了十分之一,7%至12%的值都是有利的。
在本发明中,通过将绕组设计成扁平的来实现这些所述的几何特征。这里所述绕组的导线位于一个平面内并且不发生交叉。
在根据本发明的其它实施例中,所述塑料成形件32设计成可相互贴合地顺序排列的模块,所述模块的凹陷部设计成使所述绞合线可按直线嵌入或按圆弧段嵌入。为此,在原始的塑料成形件中这样作为凹陷部压出直的或圆弧形的分布路径,从而保留相互部分地断开一即不是直接相互邻接的凸起部。
传送器头安装在一个可相对于所述底部相对移动的图中未示出的车辆或机械部件中。
根据本发明的用于无接触地传输能量的***按DE 4446779 C2、DE1005373 A1和/或DE19735624 C1中说明的电子和电气特征工作,并相应地设计。但与所述文献不同的是,可以以特别小的结构空间实现功率传输,特别是实现传送器头。
Claims (12)
1.一种用于无接触能量传输***的传送器头,包括与至少一个铁氧体芯相连的支承件,其中,所述铁氧体芯至少局部地设计成E形,并且绕所述E形的一个分支设置扁平绕组。
2.用于电能传输装置的传送器头,具有一包括至少两个相互平行延伸的初级导体的初级导体布置和至少一个与所述初级导体布置电磁耦合的次级绕组布置,所述次级绕组布置与初级导体布置机械上相分离,并可沿所述初级导体布置纵向移动,其中所述次级绕组布置具有至少一个次级线圈,所述次级线圈设计成扁平绕组并且位于这样一个平面内,所述平面平行于接纳所述初级导体布置的平面,其中传送器头包括一个支承件,所述支承件与至少一个铁氧体芯相连,其中所述铁氧体芯至少局部地设计成E形,并且绕所述E形的一个分支设置扁平绕组。
3.按前述权利要求中至少一项所述的传送器头,其特征为:所述初级导体设计成线形导体,或者所述初级导体设计成扁平导体,所述扁平导体的面法线垂直于接纳次级绕组布置的平面。
4.按前述权利要求中至少一项所述的传送器头,其特征为:所述次级绕组布置设置在车辆底板的下侧。
5.按前述权利要求中至少一项所述的传送器头,其特征为:所述次级绕组布置嵌入一个浇铸体中。
6.按前述权利要求中至少一项所述的传送器头,其特征为:所述初级导体布置静止地布置在行驶路径靠近表面的区域内。
7.按前述权利要求中至少一项所述的传送器头,其特征为:所述初级导体布置和/或所述次级绕组布置至少局部地由绞合线材形成。
8.按前述权利要求中至少一项所述的传送器头,其特征为:所述扁平绕组设计成单层或多层线路板上的导体带。
9.按前述权利要求中至少一项所述的传送器头,其特征为:所述线路板设计成还装备有电子构件。
10.按前述权利要求中至少一项所述的传送器头,其特征为:所述线路板与一个包括冷却装置的壳体件相连接。
11.按前述权利要求中至少一项所述的传送器头,其特征为:所述冷却装置具有冷却肋和/或冷却条。
12.用于无接触传输能量的***,具有按上述权利要求中至少一项的传送器头,其中在底部中以一定的相互间的距离A铺设两个线形导体(42),其特征在于,所述传送器头到底部的距离在0.05*A和0.2*A之间。
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CN109952624B (zh) * | 2016-11-15 | 2022-05-27 | 株式会社富士 | 非接触供电装置及作业机 |
CN111095446A (zh) * | 2017-10-06 | 2020-05-01 | 索尤若驱动有限及两合公司 | 用于无接触地向移动部件传输电能的*** |
CN111095446B (zh) * | 2017-10-06 | 2023-08-22 | 索尤若驱动有限及两合公司 | 用于无接触地向移动部件传输电能的*** |
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US7492247B2 (en) | 2009-02-17 |
DE10312284A1 (de) | 2004-10-28 |
CN100431237C (zh) | 2008-11-05 |
ATE401688T1 (de) | 2008-08-15 |
DE502004007613D1 (de) | 2008-08-28 |
DE10312284B4 (de) | 2005-12-22 |
WO2004084372A1 (de) | 2004-09-30 |
EP1606869B1 (de) | 2008-07-16 |
EP1606869A1 (de) | 2005-12-21 |
US20060209487A1 (en) | 2006-09-21 |
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