CN1749008A

CN1749008A - Pattern forming method, method of manufacturing electronic apparatus, and method of manufacturing substrate

Info

Publication number: CN1749008A
Application number: CNA2005100992544A
Authority: CN
Inventors: 平井利充; 酒井真理
Original assignee: Seiko Epson Corp
Current assignee: Seiko Epson Corp
Priority date: 2004-09-15
Filing date: 2005-09-07
Publication date: 2006-03-22
Anticipated expiration: 2025-09-07
Also published as: TW200619033A; US7300132B2; KR20060053108A; JP2006081985A; US20060055722A1; KR100643648B1; CN100455438C; TWI282761B

Abstract

The present invention discloses a method for forming a cellular cofferdam pattern or a lyophobic pattern corresponding to a thin-film pattern so as to form a good thin-film pattern in a section extending obliquely to the scanning direction of a droplet-spraying device. The pattern forming method of the present invention comprises the step of forming the cellular cofferdam pattern enclosing a pattern formation area so that the area of the first projection image where the impacting position (m, n) lies nearly at the center of the first projection image of the first droplet and the area of the second projection image where the impacting position (m+i, n+j) lies nearly at the center of the second projection image of the second droplet are positioned within the pattern formation area of an article surface. The first droplets and the second droplets are determined by the distance between the positions (m, n) and (m+i, n+j) so that the first and second droplets join mutually after spreading in the pattern formation area.

Description

The manufacture method of pattern formation method, electronic instrument and the manufacture method of matrix

Technical field

The present invention relates to utilize the pattern formation method of droplet ejection apparatus, more specifically say, the manufacture method that the present invention relates to be suitable for forming the pattern formation method of Wiring pattern in the electronic instrument and the matrix of Wiring pattern is set.

Background technology

Utilize droplet ejection apparatus to form becoming the pattern of the metal wiring of miter angle degree with respect to the grid reference line is known (patent documentation 1).

Patent documentation 1: the spy opens the 2001-318514 communique

As shown in figure 13, form under the situation of pattern with ejection drop D on the part 324 of surrounding (fringing) by storage lattice cofferdam (bank) pattern 308 or lyophoby pattern, the drop D that a part is ejected is on pattern 308 (or the lyophoby patterns) of storage lattice cofferdam, and its result often produces the residue of drop D on pattern 308 (or the lyophoby patterns) of storage lattice cofferdam.And the storage lattice cofferdam pattern 308 of Figure 13 is made of two storage lattice cofferdam 308B.

Summary of the invention

The present invention proposes just in view of the above problems, one of its purpose is to be provided with a kind of storage lattice cofferdam pattern or the lyophoby pattern corresponding with Thinfilm pattern, makes it form the good film pattern on the part that tilts to extend with respect to the scanning direction of droplet ejection apparatus.

Pattern formation method of the present invention is to use the droplet ejection apparatus that sprays first drop and second drop from nozzle, forms the pattern formation method of pattern on body surface.This pattern formation method comprises: step (A) and step (B), described steps A forms surrounds the storage lattice cofferdam pattern that described pattern forms the zone, so that when the coordinate of representing with integer m and n on the described body surface, represent under the situation of two integers beyond 0 with i and j simultaneously, (m, n) but the bullet scope of described first projected image under the center situation unanimous on the whole of first projected image of position and described first drop that falls, with (m+i, n+j) but the bullet scope of described second projected image under the center situation unanimous on the whole of second projected image of position and described second drop that falls, the pattern that is positioned on the described body surface forms the zone; Described step (B), to described (m, n) but bullet fall the position when spraying described first drop, to described (m+i, n+j) but the bullet position that falls spray second drop, form described pattern formed the pattern that the zone covers.In addition, described first drop and described second drop, by described (m, n) but bullet fall position and described (m+i, n+j) but the distance that falls between the position of bullet determine, make it form at described pattern that the expansion back is mutual on the zone collaborates.

Adopt one of available effect of above-mentioned formation to be, can not be on the pattern of storage lattice cofferdam, the pattern of arbitrary shape can be set from the drop of droplet ejection apparatus.

According to certain embodiment of the present invention, described step (A) comprises the step that forms described storage lattice cofferdam pattern, so that obtain linearity or curvilinear two described patterns form the zone.And described two patterns form regional parallel to each other.

Adopt one of available effect of above-mentioned formation to be, can form two patterns parallel to each other.

According to other embodiments of the present invention, described step (A) comprises the step that forms described storage lattice cofferdam pattern, so that obtain linearity or curvilinear two described patterns form the zone.And it is not parallel mutually that described two patterns form the zone.

Adopt one of available effect of above-mentioned formation to be, can form uneven two patterns mutually.

According to another embodiment of the present invention, described two patterns of linearity form the zone and are connected to each other.Wherein, it is parallel with first direction that described two patterns form a regional zone.And described two patterns form another zone in the zone, form greater than 0 degree but less than the angles of 90 degree with respect to described first direction.In addition, described step (B) comprising: spray the described drop of first volume but form the position that falls of bullet described in the zone to a described pattern, but form the fall described drop step of the position ejection volume littler than described first volume of bullet described in the zone to described another pattern simultaneously.

Adopt one of available effect of above-mentioned formation to be, form the drop that can spray first volume on the zone at the pattern that becomes above-mentioned angle with first direction, can form the drop of zone ejection second little volume simultaneously to the pattern parallel with first direction than first volume.

Described droplet ejection apparatus preferably is configured described nozzle is relatively moved along mutual different first direction and second directions, but sprays a plurality of described drops to a plurality of described bullets position that falls respectively from described nozzle selection ground.Wherein, the position constitutes the grid parallel with described second direction with described first direction but described a plurality of bullet falls.And the position determines towards the relative moving speed of described first direction and the minimum ejection cycle corresponding with described liquid material based on described nozzle along first spacing of described first direction but described a plurality of bullet falls.In addition, the position is along second spacing of described second direction, based on the relatively move spacing decision of described nozzle towards described second direction but described a plurality of bullet falls.

Adopt one of available effect of above-mentioned formation to be, can spray the drop of liquid material, form pattern with the minimum ejection cycle corresponding with liquid material.

According to certain embodiment of the present invention, described liquid material is a conductive material.

Adopt one of available effect of above-mentioned formation to be, drop can not dropped on the pattern of storage lattice cofferdam, form the Wiring pattern that extends with respect to the direction inclination that relatively moves of nozzle.

In a certain embodiment of the present invention, the manufacture method of electronic instrument comprises above-mentioned pattern formation method.

Adopt one of available effect of above-mentioned formation to be, the enough droplet ejection apparatus of energy form the Wiring pattern of electronic instrument.

The present invention can also adopt the various embodiments beyond the above-mentioned embodiment to realize.For example can replace step (A) to form storage lattice cofferdam pattern to form the mode of lyophoby pattern.

The manufacture method of matrix of the present invention, be that the substrate utilization makes nozzle relatively move along mutual different first direction and second directions, spray the droplet ejection apparatus of first drop and second drop from described nozzle, the pattern of giving described first drop and second drop forms the manufacture method of the matrix in zone.The manufacture method of this matrix comprises: form and surround the step that described pattern forms the storage lattice cofferdam pattern in zone, when the lip-deep coordinate of representing described matrix with integer m and n, represent under the situation of two integers beyond 0 with i and j simultaneously, (m, the scope of described first projected image under the center situation unanimous on the whole of first projected image of position n) and described first drop, with (m+i, n+j) scope of described second projected image under the center situation unanimous on the whole of second projected image of position and described second drop is positioned at described pattern and forms the zone.And described first drop and described second drop by the distance decision between the position of the position of described (m, n) and described (m+i, n+j), make at described pattern and form on the zone interflow mutually, expansion back.And form the step of storing lattice cofferdam pattern, also can be the step that forms the lyophoby pattern.

Can not be at drop under the situation on the pattern of storage lattice cofferdam, the pattern of arbitrary shape is set on the matrix of above-mentioned manufacture method manufacturing from droplet ejection apparatus.

Description of drawings

Fig. 1 is the ideograph of the device manufacture apparatus of expression present embodiment.

Fig. 2 is the ideograph of droplet ejection apparatus in the expression present embodiment.

Fig. 3 (a) is the schematic diagram of shower nozzle bottom in the showerhead of expression present embodiment, and Fig. 3 (b) is the ideograph of an ejection portion in the expression shower nozzle.

Fig. 4 is the functional-block diagram of control device in the droplet ejection apparatus of expression present embodiment.

Fig. 5 is the schematic diagram of ejection data in the expression present embodiment.

Fig. 6 (a)～(d) is that explanation forms the regional figure that forms method by the pattern that storage lattice cofferdam pattern surrounds.

Fig. 7 (a)～(d) is that explanation forms the regional figure that forms method by the pattern that storage lattice cofferdam pattern surrounds.

Fig. 8 is that expression forms regional ideograph by the pattern that storage lattice cofferdam pattern surrounds.

Fig. 9 is that the pattern that is illustrated in present embodiment forms the ideograph that the zone forms the conductive layer method.

Figure 10 is the ideograph of electronic instrument in the expression present embodiment.

Figure 11 is the ideograph that pattern forms the variation in zone in the expression present embodiment.

Figure 12 (a)～(c) is an ideograph of representing to be formed by the pattern that the lyophoby pattern is surrounded the formation method in zone.

Figure 13 is the linear parts that will be surrounded by storage lattice cofferdam pattern of expression and two bullets adjacent each other straight line that the position is connected that falls, mutual ideograph when not parallel.Among the figure:

CA ... the position but bullet falls, CP ... the bullet position that falls, 10 ... matrix; 10A ... substrate, 12 ... the HMDS layer, 16Q ... protective layer; 18 ... storage lattice cofferdam pattern, 24A, 24B, 24C, 24D ... pattern forms the zone, and 30 ... grid; 58 ... lyophobic areas; 100 ... droplet ejection apparatus, 106 ... stand, 112 ... control device; 114 ... shower nozzle, 118 ... nozzle.

The specific embodiment

(general structure of A. device manufacture apparatus)

The device manufacture apparatus of present embodiment below is described.Device manufacture apparatus 1 shown in Figure 1 is the part of the manufacturing installation of liquid crystal indicator.And device manufacture apparatus 1, comprise droplet ejection apparatus 100, purify stove (clean oven) 150 and conveying device 170.Droplet ejection apparatus 100 is drops from the ejection conductive material to matrix 10 (Fig. 2) that go up, and the device of conductive material layer is set on matrix 10.On the other hand, purifying stove 150 is conductive material layer activation that droplet ejection apparatus 100 is provided with, and forms the device of conductive layer.

Conveying device 170 has fork, make drive division that fork moves up and down and from running part.And conveying device 170 makes matrix 10 be subjected to handling respectively according to the sequentially-fed matrix 10 of droplet ejection apparatus 100, purification stove 150.Below describe the 26S Proteasome Structure and Function of droplet ejection apparatus 100 in detail.

(formation of B. droplet ejection apparatus)

As shown in Figure 2, droplet ejection apparatus 100 is so-called ink discharge devices.Specifically, droplet ejection apparatus 100 has: the storage tank 101 of preserving conductive material 8A; Pipeline 110; Pedestal GS; Showerhead 103; Stand 106; Primary importance control device 104; Second place control device 108; Control device 112; The 104a of support sector; With heater 140.

Showerhead 103 keeps shower nozzle 114 (Fig. 3).Shower nozzle 114 sprays conductive material 8A according to the driving signal from control device 112.And the shower nozzle in the showerhead 103 114, be connected with storage tank 101 by pipeline 110 in advance, therefore can supply with conductive material 8A to shower nozzle 114 from storage tank 101.

Stand 106 provides the plane of fixing base 10 usefulness.This plane of stand 106, parallel with X-direction with Y direction.Stand 106 has the function of the position that utilizes attraction fixing base 10 in addition.

Primary importance control device 104, the portion 104a of being supported are fixed on the position apart from pedestal GS predetermined altitude.This primary importance control device 104 has according to from the signal of control device 112, makes showerhead 103 along X-direction and the function that moves with the Z-direction of X-direction quadrature.The primary importance control device 104 in addition, make the function of showerhead 103 along the axle rotation parallel with the Z axle in addition.Wherein in the present embodiment, Z-direction is and the parallel direction of vertical direction (being the direction of acceleration of gravity).

Second place control device 108 according to the signal from control device 112, moves stand 106 to Y direction on pedestal GS.Wherein Y direction is the direction with X-direction and the two quadrature of Z-direction.

Have the formation of primary importance control device 104 of above-mentioned functions and the formation of second place control device 108, can adopt and utilize the known robot of linear motor and servo motor to be realized.Therefore, omit explanation here to its detailed structure.And in this manual, primary importance control device 104 and second place control device 108 are also remembered work " robot " or " scanner section ".

And the X-direction in the present embodiment, Y direction and Z-direction, with either party is consistent to direction that other party relatively moves in showerhead 103 and the stand 106.Wherein, X-direction may also be referred to as " non-scanning direction ".And Y direction may also be referred to as " scanning direction ".And the imaginary initial point of XYZ coordinate system of regulation X-direction, Y direction and Z-direction, be fixed on the reference part of droplet ejection apparatus 100.In addition in this manual, described Building X mark, Building Y mark and Building Z mark are the coordinates in this XYZ coordinate system.In addition, above-mentioned imaginary initial point, reference part not only, and can be fixed on the stand 106, perhaps be fixed on the showerhead 103.

As mentioned above, by means of primary importance control device 104 showerhead 103 is moved to X-direction.And, matrix 10 is moved to Y direction with stand 106 by means of second place control device 108.Its result, shower nozzle 114 will change with the relative position of matrix 10.More specifically say, showerhead 103, shower nozzle 114 or nozzle 118 (Fig. 3), by means of these actions, keep with respect to matrix 10 on Z-direction having institute set a distance on one side, on X-direction and Y direction, relatively move on one side, i.e. relative scanning.Described " relatively moving " or " relative scanning " are meant the drop side of ejection conductive material 8A and the bullet of drop the relatively moving with respect to the opposing party at least in the side (matrix 10) that fall wherein.And in this manual, even matrix 10 or stand 106 are moved, make under the static situation of nozzle 118, also can show as " nozzle 118 relatively moves ".

Control device 112 is configured so that to accept the ejection data from external information processing.The ejection data that control device 112 will be accepted are stored in the internal storage device 202 (Fig. 4), simultaneously according to the ejection data of being stored, and control primary importance control device 104, second place control device 108 and shower nozzle 114." ejection data " described here are meant, comprise that expression should spray the data of the drop relative position information of conductive material 8A.In the present embodiment, the data mode that the ejection data have spray bit map (bit map) data.

Have under the situation of above-mentioned formation, droplet ejection apparatus 100 can make the nozzle 118 (Fig. 3) of shower nozzle 114 relatively move with respect to matrix 10 according to the ejection data, the drop of the position ejection conductive material 8A that falls from nozzle 118 towards the bullet that sets simultaneously.And, also the shower nozzle 114 that often will produce by droplet ejection apparatus 100 relatively move and the drop of conductive material 8A is referred to as " coating scanning " or " ejection scanning " is put down in writing from the ejection of nozzle 118.

In this specification, also fall part note of the bullet of conductive material 8A drop is done " being ejected portion ".And the droplets wet extension minute mark that bullet is fallen is done " applied portion "." being ejected portion " and " applied portion ", also all is the object of substrate to be implemented surfaction handle, and makes conductive material 8A present required contact angle and the part that forms.But, even handle the body surface of substrate and also present for conductive material 8A under required lyophobicity or the lyophily situation of (promptly presenting required contact angle on the body surface of conductive material 8A in substrate that bullet falls) when not carrying out surfaction, the body surface of substrate itself also can be " being ejected portion " or " applied portion ".And in this manual, also will be ejected portion " note work " target " or " accommodating part "." pattern forms the zone " described later is made of this " being ejected portion " and " applied portion ".

Wherein the conductive material 8A of present embodiment is a kind of " liquid material "." liquid material " is meant, has with the material of drop form from the nozzle 118 ejection viscosity of shower nozzle 114.No matter wherein liquid material is all can of water-based or oiliness.If possess can be that fluid gets final product even then sneak into solid matter from the abundant flowability (viscosity) of nozzle 118 ejections on the whole.Wherein the viscosity of liquid material is preferably below the 1mPas and below the 50mPas.Viscosity is under the above situation of 1mPas, and is when spraying the drop of liquid material, very difficult by liquid material contamination at the peripheral part of nozzle 118.On the other hand, under viscosity was situation below the 50mPas, the frequency of the hole plug in the nozzle 118 was little, thereby can realize the smooth ejection of drop.

The electroconductive particle that conductive material 8A contains dispersant and can be disperseed by dispersant.The particle diameter of electroconductive particle is preferably more than 1 nanometer, below 1.0 microns.If be in below 1.0 microns, then the possibility of the nozzle 118 (Fig. 3) of shower nozzle 114 generation hole plug is little.And if be in more than 1 nanometer, then because coating is suitable with respect to the volume ratio of electroconductive particle, so the organic matter ratio in the resulting film is suitable.

In the present embodiment, electroconductive particle is the silver particles of average grain diameter 10 nanometers.And average grain diameter be about 1 nanometer to the particle of hundreds of nanometers, also can remember work " nano particle ".According to this record method, the conductive material 8A of present embodiment contains Nano silver grain.

(C. shower nozzle)

Below describe shower nozzle 114 in detail.Shown in Fig. 3 (a), shower nozzle 114 is the ink guns with a plurality of nozzles 118.And shower nozzle 114 is fixed in the showerhead 103 by carrier 103A.Shown in Fig. 3 (b), shower nozzle 114 has the nozzle plate 128 of oscillating plate 126 and regulation nozzle 118 openings.And reservoir 129 between oscillating plate 126 and nozzle plate 128, the conductive material 8A that supplies with by means of the never illustrated external reservoir in hole 131 is filled among this reservoir 129 usually.

In addition, a plurality of next doors between oscillating plate 126 and nozzle plate 128.And the part of being surrounded by oscillating plate 126, nozzle plate 128 and a counter septum is an inner chamber (cavity) 120.Inner chamber 120 since with nozzle 118 corresponding settings, so the number of inner chamber 120 is identical with the number of nozzle 118.Supply with conductive material 8A from reservoir 129 to inner chamber 120 by means of the supply port between a counter septum 130.And in the present embodiment, the diameter of nozzle 118 is approximately 27 microns.

Each vibrating elements 124 is positioned on the oscillating plate 126 corresponding with inner chamber 120 respectively.Each vibrating elements 124 comprises the pair of electrodes of piezoelectric element and clamping piezoelectric element.Control device 112 can spray the drop D of conductive material 8A from the nozzle 118 of correspondence to supplying with between this pair of electrodes under the situation of driving voltage.Wherein from the volume of nozzle 118 ejection materials, more than 0pl (skin liter) and variable in the scope between below the 42pl.Wherein can realize changing the volume of drop D by the waveform (so-called variable some morphology) that changes driving voltage.Here can adjust the shape of nozzle 118, conductive material 8A is sprayed from nozzle 118 towards Z-direction.

In this specification, also can will comprise a nozzle 118, the inner chamber 120 corresponding and do " ejection portion 127 " with the part note of the corresponding vibrating elements 124 of inner chamber 120 with nozzle 118.According to this record method, shower nozzle 114 has the ejection portion 127 with nozzle 118 number similar numbers.Ejection portion 127 also can replace piezoelectric element with electrothermal transformating element.That is to say that ejection portion 127 also can have the material coefficient of thermal expansion effect that utilizes electrothermal transformating element to cause, and the formation of ejection material.But, utilize the ejection of piezoelectric element, because the liquid material that is ejected is not heated, so have the advantage that the composition to liquid material is difficult to exert an influence.

(D. control device)

The formation of control device 112 below is described.As shown in Figure 4, control device 112 has input buffer storage 200, storage device 202, handling part 204, scanning driving part 206 and shower nozzle drive division 208.Input buffer storage 200 is connected to each other to such an extent that can communicate by letter with handling part 204.Handling part 204, storage device 202, scanning driving part 206 and shower nozzle drive division 208 utilize not shown bus to connect to such an extent that can communicate by letter mutually.

Scanning driving part 206 is connected to such an extent that can communicate by letter mutually with primary importance control device 104 with second place control device 108.Equally, shower nozzle drive division 208 is connected to such an extent that also can communicate by letter mutually with shower nozzle 114.

Input buffer storage 200 is accepted the ejection data of using from the drop D external information processing that is positioned at droplet ejection apparatus 100 outsides (not shown), ejection conductive material 8A.Input buffer storage 200 is supplied with the ejection data to handling part 204, and handling part 204 will spray data and be stored among the storage device 202.Among Fig. 4, storage device 202 is RAM.

Handling part 204 is carried expression nozzle 118 and the data that are ejected portion's relative position based on the ejection data in the storage device 204 to scanning driving part 206.Scanning driving part 206, the stand that data and minimum ejection period T m (aftermentioned) are corresponding drives signal and flows to second place control device 108 therewith.Its result, showerhead 103 will change with the relative position that is ejected portion.On the other hand, handling part 204 will flow to shower nozzle 114 based on the ejection data and the minimum ejection signal that sprays period T m that are stored in the storage device 202.Its result, the drop D of can be from shower nozzle 114 corresponding nozzle 118 ejection conductive material 8A.

Control device 112 is the computers that comprise CPU, ROM, RAM and bus.Therefore, the above-mentioned functions of control device 112 can be realized by the software program that computer is carried out.Certainly, control device 112 also can use special circuit (hardware) to realize.

(E. grid)

Below explanation " minimum ejection period T m ".Minimum ejection period T m is meant the minimum interval that can spray drop D from a nozzle 118 continuously.Minimum ejection period T m can decide according to the viscosity of liquid material and the diameter of nozzle 118 etc., often be difficult to spray drop D continuously in the short time interval than minimum ejection period T m from a nozzle 118.This is because the unsettled sometimes cause of meniscus that liquid material forms in nozzle 118.The inverse note that wherein minimum is sprayed period T m is made maximum ejection frequency Fm.

The liquid material of present embodiment is conductive material 8A.And the minimum of this conductive material 8A ejection period T m is about 5 * 10 ^-5Second, therefore maximum ejection frequency Fm is about 20KHz.

Relative position between showerhead 103 and the stand 106 will change along Y direction with the constant speed Vy of 700 mm/second in scan period.On the other hand, when the relative position of showerhead 103 change with constant speed Vy during in, shower nozzle 114 is with minimum ejection period T m ejection drop D.So each drop will be in that (interval of=Vy * Tm) bullet be respectively dropped on a plurality of position CA that may bullet falls arranged side by side with about 35 microns on the Y direction.Therefore, but be approximately 35 microns in the fall spacing of position CA of Y direction a plurality of bullets arranged side by side.

After a scan period stopped, before extremely next scan period began, nozzle 118 was at the only mobile moving interval dx of X-direction.In the present embodiment, moving interval dx is owing to being set identically with spacing Ly, so also be about 35 microns.Because nozzle 118 is at the only mobile moving interval dx of X-direction, so but each drop D respectively bullet drop on X-direction and fall on each position of position CA with a plurality of bullets of about 35 microns spacing parallel arrangings.Therefore, but at the fall spacing Lx of position CA of X-direction a plurality of bullets arranged side by side, be about 35 microns.

Like this, X-direction with spacing Lx (being about 35 microns) but and show a plurality of bullets position CA that falls.Equally, Y direction with spacing Ly (being about 35 microns) but and show a plurality of bullets position CA that falls.Therefore as shown in Figure 5, position CA constitutes parallel grid 30 on this both direction of X-direction and Y direction but a plurality of bullet falls.And this grid 30 is comprised within the sweep limits.In addition, grid 30 also has defined in the ejection data.Wherein, but the fall number of position CA of bullet in the grid 30 of present embodiment, for M * N (M, N are the integers more than 0) individual.Droplet ejection apparatus 100, but but the bullet position CA ejection drop D that falls arbitrarily in this M * N of device bullet falls position CA optionally.

In addition, the position CA but the bullet in

grid

30 and 30 falls, the coordinate that also can be used as on the body surface of surperficial representative of substrate 10A described later uses.

Fig. 5 illustrates a part of grid 30.But a plurality of bullets among the figure in 5 fall among the CA of position, the bullet of the drop D position CA that falls is 17 places but the decision bullet falls.For ease of explanation, but also will determine bullet the fall bullet of drop D fall position CA note work " bullet fall position CP " or " CP (m, n) "." (m, n) " expression grid 30 of symbol " CP " back be hit by a bullet coordinate of position CP.

Position CA and the bullet position CP that falls is all corresponding with the cardinal principle center of drop D projected image but bullet falls.The projected image of so-called drop D is meant, when spraying under the situation of drop D towards plane, the plane parallel with the Y direction both direction with X-direction (XY) from nozzle 118, can make the drop D image that projection obtains on the XY plane.But in case towards bullet position CA (or bullet fall position CP) the ejection drop D that falls, but drop D will be the center with the bullet position CA that falls, bullet drops in the scope of projected image of drop D.After bullet falls, drop D will outwards expand from the scope of projected image.

In the present embodiment, the projected image of drop D is circular substantially, and its diameter is Φ.Therefore, in case but towards bullet position CA (or bullet fall position CP) the ejection drop D that falls, but drop D will be the center with the bullet position CA that falls, bullet drops in drop D projected image radius Φ/2 scopes that determined.

Among Fig. 5, CP (m, n), CP (m+1, n-2), CP (m+2, n-4), CP (m+3, n-6), CP (m+4, n-8) are positioned on the oblique line L1 of gradient (2).CP (m+4, n-8), CP (m+6, n-8), CP (m+8, n-8), CP (m+10, n-8), CP (m+12, n-8), CP (m+14, n-8) are positioned on the parallel lines L2 parallel with X-axis.CP (m+5, n), CP (m+6, n-2), CP (m+7, n-4), CP (m+8, n-6) are positioned on the oblique line L3 of gradient (2).CP (m+8, n-6), CP (m+10, n-6), CP (m+12, n-6), CP (m+14, n-6) are positioned on the parallel lines L4 parallel with X-axis.

(F. pattern formation method)

(the F1. pattern forms the formation in zone)

Below explanation linearity pattern forms the formation method in zone.Pattern forms the zone, comprises that (m n) is the scope of the drop D projected image at center with CP.In addition, above-mentioned pattern forms the zone and comprises that also (m+i n+j) is the scope of the drop D projected image at center with CP.Wherein " m " is greater than 0 integer less than M." n " is greater than 0 integer less than N." i " is the integer beyond 0, is greater than (m) but (M-m) following integer." j " is the integer beyond 0, is greater than (n) but (N-n) following integer.

At first shown in Fig. 6 (a), surfaction is implemented in full on the surface of substrate 10A with light transmission handled.In the present embodiment, substrate 10A is a glass substrate.And the processing of the upgrading on above-mentioned surface is that HMDS handles.HMDS described here handles and is meant HMDS ((CH ₃) ₃SiNHSi (CH ₃) ₃) make vaporous, a kind of method that on body surface, is coated with.Can on substrate 10A, form HMDS layer 12 by the HMDS processing.On HMDS layer 12, form storage lattice cofferdam pattern 18 (Fig. 7 (d)) then.HMDS layer 12 can not only connect airtight on this storage lattice cofferdam pattern 18, and can also connect airtight on substrate 10A.Therefore, HMDS layer 12 has as the effect of connecting airtight layer that storage lattice cofferdam pattern 18 and substrate 10A are connected airtight.Wherein, plane shown in Figure 6, corresponding with B '-B cross section of Fig. 8 described later.

Then utilize spin-coating method on HMDS layer 12, to be coated with organic photosensitive material.The organic photo material should be coated with this moment to such an extent that can obtain the thickness (highly) in storage lattice described later cofferdam 18.Then, penetrate the organic photo material cured that makes coating, shown in Fig. 6 (b), form organic photosensitive material layer 14 by illumination.In the present embodiment, the thickness of organic photo material layer 14 is about 1 micron.

Wherein the organic photo material of present embodiment is an allyl resin.But replacement allyl resin, organic photo material also can be any macromolecular materials in polyimide resin, olefin resin, phenolic resin and the melmac.And can adopt spraying process, rolling method, mould to be coated with the above-mentioned spin-coating method of any method replacement such as method, dipping method.

And then shown in Fig. 6 (c), the resist of coating negative-type forms resist layer 1 on organic photo material layer 14.And shown in Fig. 6 (d),, make resist layer 16 exposures by means of forming the photomask M1 that the corresponding part of regional 24A, 24B, 24C and 24D (Fig. 8) covers with pattern described later through shadow mask MK.

Above-mentioned photomask M1 makes as follows.At first, on glass substrate, form the chromium film.Then, based on the fall diameter of phi of projected image of position CP and drop D of a plurality of bullets,, obtain shadow mask MK with the chromium film patterning.Specifically, the data according to the diameter of phi of the projected image of ejection data and expression drop D optionally expose the resist that is provided with on the chromium film with electronics ray scanning device or laser scanning device.And after will developing through the resist film of optionally exposure, the etching chromium film can obtain shadow mask MK.

Shown in Fig. 7 (a), will develop then through the resist layer 16 of overexposure.And shown in Fig. 7 (b) and 7 (c), etching organic photo material layer 14 is peeled off resist layer 16 remaining after the etching.Storage lattice cofferdam pattern 18 (Fig. 8) that will obtain coming from organic photo material layer 14 like this, constitute by a plurality of storage lattice cofferdam 18B.Plane wherein shown in Figure 7, corresponding with the B '-B cross section among aftermentioned Fig. 8.

Storage lattice cofferdam pattern 18 surrounds the two-dimensional shapes of Wiring pattern or Thinfilm pattern.And storage lattice cofferdam pattern 18 plays a part isolated part in the aftermentioned operation.And, constitute the organic photo material of storage lattice cofferdam pattern 18 owing to be allyl resin, so storage lattice cofferdam pattern 18 has light transmission.Wherein replace photoetching process to form method of patterning, also can adopt print process (what is called is activity methods completely) to form storage lattice cofferdam pattern 18.As long as storage lattice cofferdam pattern 18 can surround the two-dimensional shapes of Wiring pattern, also can form with any method.

" two-dimensional shapes of Wiring pattern " described here is with identical substantially by the shape of the bottom surface of Wiring pattern (promptly with by the plane contact of substrate 10A regulation part).

In addition, also can adopt material with inorganic skeleton (siloxane bond) and organic group material as storage lattice cofferdam pattern 18.But also can form the storage lattice cofferdam pattern (protuberance) more than two layers that constitutes by lower floor's inorganic matter and upper strata organic matter.And then, resist layer 16 is not peeled off, also can remain on the storage lattice cofferdam pattern 18.

Storage lattice cofferdam pattern 18 has a plurality of peristome AP that the HMDS layer 12 that is provided with is exposed on substrate 10A.And the shape separately of these a plurality of peristome AP, unanimous on the whole with a plurality of conductive layers 8 (Fig. 9 (d)) two-dimensional shapes separately.That is to say that in the present embodiment, storage lattice cofferdam pattern 18 has the shape of surrounding fully separately of a plurality of conductive layers 8 that will form afterwards on every side.And in the present embodiment, the pattern of conductive layer 8 is corresponding with above-mentioned " Wiring pattern ".

Certainly, storage lattice cofferdam pattern 18 also can be made of a plurality of storage lattice cofferdam 18B disconnected from each other respectively.For example,, and between the mutually substantially parallel a pair of storage lattice cofferdam 18B, also the two-dimensional shapes of a conductive layer 8 can be surrounded only apart from institute's set a distance in the position.In this case, also can not store lattice cofferdam 18B on the part corresponding with the two end portions of conductive layer 8.That is to say that storage lattice cofferdam pattern 18 will not surround around the two-dimensional shapes of conductive layer 8 fully.

In addition, the upper width of peristome AP, the width of the preferred AP of ratio open portion bottom one side (substrate 10A one side) is wide.Like this, the easier moistening expansion of the drop D of conductive material 8A.

On HMDS layer 12, form after the storage lattice cofferdam pattern 18, substrate 10A is implemented hydrofluoric acid treatment.Hydrofluoric acid treatment for example is with 2.5% hydrofluoric acid solution HMDS layer 12 to be carried out etch processes.Wherein store lattice cofferdam pattern 18 and have the function of mask, shown in Fig. 7 (d), the HMDS layer 12 of peristome AP bottom is removed, and substrate 10A is exposed.

The then lyophily processing of giving lyophily to the bottom separately of a plurality of peristome AP.The lyophily treatment process can be selected ultraviolet ray (UV) treatment with irradiation of irradiation ultraviolet radiation, perhaps under air atmosphere with oxygen as the O that handles gas ₂Plasma treatment etc.Here implemented O ₂Plasma treatment.

O ₂Plasma treatment makes it to utilize a kind of processing of not shown plasma discharge electrode pair substrate 10A (matrix 10) irradiation plasmoid oxygen.O ₂An example of plasma process conditions is, plasma power is 50～1000 watts, oxygen flow is 50～100 ml/min, and matrix 10 is 0.5～10 mm/min with respect to the relative moving speed of plasma discharge electrode, and substrate temperature is 70～90 ℃.

Wherein preferably the lyophily treatment process being carried out in the bottom of peristome AP (is O here ₂Plasma treatment), so that the contact angle of the liquid conductive material 8A on the bottom of peristome AP is in below 20 degree.Certainly, as present embodiment, substrate 10A is under the situation of glass substrate, because its surface has had to a certain degree lyophily to liquid conductive material 8A, so also often do not carry out the lyophily treatment process.Even like this, if implement O ₂Plasma treatment or ultraviolet treatment with irradiation are then owing to can remove might be on the peristome AP bottom remaining resist and the residue of HMDS layer fully, so preferably carry out these lyophily treatment process.And the lyophily treatment process, also can be with O ₂The operation of plasma treatment and the combination of ultraviolet treatment with irradiation.

And owing to pass through O ₂Plasma treatment or ultraviolet treatment with irradiation can fully be removed the HMDS layer 12 on the peristome AP bottom, so also can not carry out the operation that above-mentioned hydrofluoric acid treatment is removed HMDS layer 12 sometimes.Even like this, if carry out above-mentioned hydrofluoric acid treatment operation and lyophily chemical industry preface, owing to remove the HMDS layer 12 on the peristome AP bottom really, so preferably carry out above-mentioned hydrofluoric acid treatment and lyophily treatment process.

Then storage lattice cofferdam pattern 18 is carried out the lyophoby processing, give lyophobicity in its surface.As the lyophoby processing, adopt with carbon tetrafluoride (tetrafluoromethane) as the plasma processing method (CF that handles gas ₄Plasma processing method).CF ₄The condition of plasma treatment, for example plasma power is 50～1000 watts, CF ₄Gas flow is 50～100 ml/min, and matrix 10 is 0.5～1020 mm/second with respect to the relative moving speed of plasma discharge electrode, and substrate temperature is 70～90 ℃.And, also can adopt other hydrochlorofluorocar,ons gas, perhaps SF as plasma gas ₄And SF ₅CF ₃Replace tetrafluoromethane Deng gas.

By carrying out this lyophoby treatment process, owing in the resin that constitutes storage lattice cofferdam pattern 18, import fluoro-containing group, so the surface that can give storage lattice cofferdam 18 is with high lyophobicity.And, as the O that is above-mentioned lyophily treatment process ₂Plasma treatment also can be carried out before storage lattice cofferdam pattern 18 forms.But, for allyl resin or polyimide resin etc., in case adopt O ₂The pre-treatment of plasma treatment owing to have easier character of being fluoridized (lyophobyization), is preferably carried out O again after storage lattice cofferdam pattern 18 forms ₂Plasma treatment.

Even be subjected to the lyophoby treatment process at storage lattice cofferdam pattern 18, the lower surface of peristome AP also can be kept the lyophily of giving in advance in fact.Particularly for the substrate 10A of present embodiment, owing to being glass substrate, so even stand the lyophoby treatment process, its surface can not import fluoro-containing group on (bottom of peristome AP) yet.Therefore, can not damage the lyophily of peristome AP bottom, i.e. wettability.

But in the present embodiment, storage lattice cofferdam pattern 18 is carried out once more peristome AP bottom (pattern forms zone 24) being carried out hydrofluoric acid treatment after the lyophoby treatment process.If can like this surface (glass) of substrate 10A be exposed really in peristome AP bottom, its result can guarantee the lyophily of peristome AP bottom really.

By above-mentioned lyophily treatment process and lyophoby treatment process, the lyophobicity on storage pattern 18 surfaces, lattice cofferdam, the lyophobicity bottom peristome AP is compared and is increased.In the present embodiment, the bottom of peristome AP should present lyophily.And as mentioned above, the substrate 10A of present embodiment is owing to being to be made by glass, so even carry out CF ₄Plasma treatment can not import fluoro-containing group yet on the bottom of peristome AP.Therefore, even do not carry out O ₂Plasma treatment (lyophily treatment process) and only carry out CF ₄Plasma treatment (lyophoby treatment process) also can make the lyophobicity of the lyophobicity ratio open AP of the portion bottom of storing pattern 18 surfaces, lattice cofferdam higher.But as mentioned above, owing to have the advantage that the residue on the bottom of peristome AP can be removed fully and store the advantage that lattice cofferdam pattern 18 is fluoridized easily, so do not omit O in the present embodiment ₂Plasma treatment.

In the present embodiment, the bottom of a plurality of peristome AP of experience lyophily treatment process, to form regional 24A, 24B, 24C and 24D corresponding with pattern respectively.But,, but can omit the lyophily treatment process as described above when the bottom of peristome AP has presented conductive material 8A under the situation of required lyophily.In this case, the bottom of a plurality of peristome AP will be directly to form regional 24A, 24B, 24C and 24D corresponding with pattern.

So, as shown in Figure 8, the pattern that each two-dimensional shapes is surrounded respectively by storage lattice cofferdam pattern 18 forms regional 24A, 24B, 24C and 24D, is set on the substrate 10A.Form at these patterns on each zone of regional 24A, 24B, 24C and 24D, the Wiring pattern that is formed by conductive layer 8 is set respectively by means of ejection operation described later.And in the present embodiment, be provided with the substrate 10A after pattern forms regional 24A, 24B, 24C and 24D, (Fig. 2) is corresponding with matrix 10.

Wherein the linearity pattern forms regional 24A, 24B, 24C and 24D, respectively parallel with straight line L1, L2, L3 and L4 (Fig. 5).And the pattern of linearity is formed regional 24C, 24D be connected to each other.In addition, the linearity pattern forms the width of regional 24A, 24B, 24C and 24D, be meant along with the direction of vertical quadrature on length.

Form on regional 24A, 24B, 24C and the 24D at pattern, have respectively and the fall projected image of 17 corresponding drop D of position CP of 17 bullets shown in Figure 5.In the following description, adopt above-mentioned grid 30 to go up the coordinate of position as expression substrate 10A.

Pattern forms regional 24A, has the linearity shape between CP (m, n) and CP (m+1, n-2).Therefore, pattern forms regional 24A, has the inclination of (2) between CP (m, n) and CP (m+1, n-2).Equally, pattern forms the shape of regional 24A, also is the linearity with (2) gradient between CP (m+1, n-2) and CP (m+4, n-8).

Pattern forms regional 24B, has the linearity shape between CP (m+4, n-8) and CP (m+6, n-8).Therefore, pattern forms regional 24B, and is parallel with X-axis between CP (m+4, n-8) and CP (m+6, n-8).Equally, pattern forms the shape of regional 24B, and is also parallel with the directions X axle between CP (m+4, n-8) and CP (m+14, n-8).

Pattern forms regional 24C, has the linearity shape between CP (m+5, n) and CP (m+6, n-2).Therefore, pattern forms regional 24C, has the inclination of (2) between CP (m+5, n) and CP (m+6, n-2).Equally, pattern forms regional 24C to fall between the position (m+8, n-6) at CP (m+6, n-2) and bullet also is the gradient with (2).

Pattern forms regional 24D, has the linearity shape between CP (m+8, n-6) and CP (m+10, n-6).Therefore, to form regional 24D parallel with X-axis between CP (m+8, n-6) and CP (m+10, n-6) for pattern.Equally, pattern form regional 24D CP (m+10, n-6) with CP (m+14, n-6) between also parallel with X-direction.

(F2. sprays operation)

Then to position CA sprays the first drop D but the bullet of expression falls with CP (m, n), to position CA sprays the second drop D but the bullet of expression falls with CP (m+i, n+j), form pattern is formed the conductive material layer 8B that regional 24A, 24B, 24C and 24D cover simultaneously.And in the present embodiment, from a nozzle 118 to whole 17 bullets position ejection drop D separately that falls.But can certainly spray drop D from the number nozzle 118 that drips shown in Fig. 3 (a).

At first will be provided with the matrix 10 that pattern forms regional 24A, 24B, 24C and 24D is positioned on the stand 106 of droplet ejection apparatus 100.Its result, pattern forms the surface separately of regional 24A, 24B, 24C and 24D will be parallel with Y direction with X-direction.

And droplet ejection apparatus 100, form bullet on regional 24A, 24B, 24C and the 24D position CP ejection drop D that falls according to the ejection data towards pattern.So obtain pattern is formed the conductive material layer 8B that regional 24A, 24B, 24C and 24D cover.

Specifically, droplet ejection apparatus 100 changes till the other end makes nozzle 118 and matrix 10 relative from an end of sweep limits with constant speed Vy along the forward of Y direction.And shown in Fig. 9 (a), whenever nozzle 118 arrives when falling the corresponding position of position CP with bullet, droplet ejection apparatus 100 will spray the drop D of conductive material 8A from nozzle 118.Arrive when the relative position of nozzle 118 under the situation of the other end of sweep limits, by making nozzle 118 to X-direction moving interval dx only, droplet ejection apparatus 100 just can make nozzle 118 change with constant speed Vy with respect to the relative position of matrix 10 negative sense towards Y direction.And, will spray the drop D of conductive material 8A from nozzle 118 whenever nozzle 118 and bullet fall position CP at once.So, position CP ejection drop D will the whole bullets in sweep limits falls.

Wherein pattern being formed the fall volume of drop D of position CP ejection of bullet among regional 24A, the 24C is first volume.On the other hand, forming the fall volume of drop D of position ejection of bullet among regional 24B, the 24D to pattern, is second volume littler than first volume.It is the reasons are as follows.

Pattern forms the shape of regional 24A, 24C, and is neither parallel with X-direction, also not parallel with Y direction.On the other hand, pattern forms the shape of regional 24B, 24D, is the straight line parallel with X-direction.Therefore, form fall distance between the CP of position of two bullets adjacent each other among regional 24B, the 24D at pattern, it is short to form the distance that two bullets adjacent each other among regional 24A, the 24C fall between the CP of position than pattern.On the other hand, the distance of the moistening expansion of drop D that falls of bullet is limited.Owing to these reasons, by making the volume that forms the drop D of regional 24B, 24D ejection to pattern, littler than the droplet size that forms regional 24A, 24C ejection towards pattern, form regional 24A, 24B, 24C and 24D scope across pattern in, can make the volume of the conductive material 8A suitable identical with unit are.

Shown in Fig. 9 (b), in case dropping on bullet, the drop D bullet of conductive material 8A falls on the CP of position, will form the vertical moistening expansion of regional 24A (perhaps 24B, 24C, 24D) along pattern.The longitudinally that wherein said pattern forms regional 24A is meant the direction vertical with paper.And shown in Fig. 9 (c), form the moistening expansion of longitudinally of regional 24A at pattern by making drop D, can form conductive material layer 8B.

Bullet falls (conflict) at the fall drop D of position CP of two bullets adjacent each other, the position CP that will fall from bullet separately expansion and interflow, back respectively.This is the approaching cause of distance D D (Fig. 8) between the CP of position because two bullets adjacent each other fall.Specifically, forming on the regional 24A (perhaps 24B, 24C, 24D) at pattern, is that fall two times of distance D L between the CP of position of border and its bullet of the moistening spreading range of drop D in center are compared the cause that distance D D is shorter with the position CP that falls with bullet.And as mentioned above, bullet fall position CP and the center that is ejected drop D suitable position equate substantially.

Above-mentioned ejection data can be stipulated volume and the number of drop D, make the thickness of the conductive layer 8 (Fig. 9 (d)) that obtains behind the activation procedure that the following describes reach about 1 micron.And, the cross section shown in Fig. 9 (a)～(d), corresponding with the B '-B cross section among Fig. 8.

In addition,, also can adopt heater 140 (Fig. 2) to promote the drying of conductive material layer 8B in the ejection operation midway.

(F3. activation procedure)

Whole patterns form be provided with conductive material 8B layer on regional 24A, 24B, 24C and the 24D after, make conductive material 8B activation, obtain conductive layer 8.Specifically, conductive material 8B is burnt till (heating), make conductive material 8B contained silver particles sintering or fusion.For this reason, conveying device 170 is taken off substrate 10A from droplet ejection apparatus 100, sends into to purify among the stove 150.Will burn till (heating) to substrate 10A so purify stove 150.

The activation procedure of present embodiment is the heating process of carrying out in atmosphere.Heating process also can perhaps be carried out in the reducing atmosphere such as hydrogen in inert gas atmospheres such as nitrogen, argon gas, helium in case of necessity.The heating-up temperature of heating process, can according to thermal behaviors such as the dispersiveness of silver particles among the kind of the boiling point (vapour pressure) of dispersant, atmosphere gas, pressure, the conductive material 8B and oxidisability, cover silver particles coating material have or not suitably decisions such as heat resisting temperature with quantity and substrate 10A.

The activation procedure of present embodiment utilizes purification stove 150 under 280～300 ℃ of temperature conductive material 8B to be burnt till (heating) 300 minutes under air atmosphere.Wherein, preferably under about 200 ℃, burn till (heating) conductive material 8B in order to remove the organic principle among the conductive material 8B.But when substrates such as using plastics replaces preferably burning till (heating) more than the room temperature He under 250 ℃ of following temperature under the situation of glass substrate 10A.

Activation procedure also can utilize the operation to conductive material 8B irradiation ultraviolet radiation to replace above-mentioned heating process.In addition, activation procedure also can be the operation that the operation with above-mentioned the sort of heating process and irradiation ultraviolet radiation combines.

Can obtain respectively four patterns being formed the pattern (being Wiring pattern) of the conductive layer 8 that regional 24A, 24B, 24C and 24D cover by above operation.So, can on a matrix, form and nozzle 118 Wiring pattern that direction tilts that relatively moves, with the Wiring pattern parallel with the direction that relatively moves of nozzle 118.

(G. electronic instrument)

Below specify electronic instrument of the present invention.Pocket telephone 600 shown in Figure 10 (a) has the liquid crystal indicator 601 that the manufacture method of utilizing above-mentioned embodiment forms its Wiring pattern.Portable information processing device 700 shown in Figure 10 (b) has keyboard 701, information processing main body 703 and utilizes the manufacture method of above-mentioned embodiment to form the liquid crystal indicator 702 of its Wiring pattern.The more specifically example of this portable information processing device 700 is word processor and personal computer.Wristwatch-type electronic instrument 800 shown in Figure 10 (c) has and utilizes the manufacture method of above-mentioned embodiment to form the liquid crystal indicator 801 of its Wiring pattern.

According to above-mentioned embodiment, in liquid crystal indicator, adopted the present invention in the formation of Wiring pattern.But the present invention also can be used for the formation of the Wiring pattern of organic electroluminescence display device and method of manufacturing same, plasm display device and SED (surface-conduction-electron emission display) or FED (Field Emission Display).

In addition, in this manual, also notes such as liquid crystal indicator, el display device, plasm display device, SED, FED are made " electro-optical device " sometimes.Wherein described in this manual " electro-optical device ", be not limited to utilize the device of the change of optical property such as variation (so-called electrooptics effect) of the variation of variation, optical activity of birefringence or light scattering, and be meant according to the signal voltage that applies and make beam projecting, see through or the device of reflection all.

Though more than with reference to description of drawings the preferred implementation that the present invention relates to, much less the present invention is not limited on the related example.The shape of the various component parts shown in the above-mentioned example or its combination are full of an example, can make various changes according to designing requirement in the scope that does not exceed main points of the present invention.

(variation 1)

According to above-mentioned embodiment, make the pattern of linearity form each zone among regional 24A, 24B, 24C and the 24D, all contain four above bullets position CP that falls.Yet it can be two that pattern forms the contained bullet of regional 24A (perhaps 24B, 24C, 24D) the position number that falls.Specifically, can collaborate mutually as long as bullet drops on the drop D that two bullets adjacent each other fall on the CP of position, then to form the fall number of position CP of the contained bullet in zone also can be plural number to the pattern of linearity.

A plurality of patterns shown in Figure 11 form each zone among regional 24E, the 24F, all contain two bullets position CP that falls.And the pattern that will tilt for (0.5) forms regional 24E, is being connected to each other for the pattern of (0.2) forms regional 24F with gradient.Wherein being positioned at bullet that interconnected two patterns form the border of regional 24E, the 24F position CP that falls forms regional 24E, 24F with two patterns the two is corresponding.Pattern formation method of the present invention also can be applicable to the pattern formation method of this shape.But owing to be difficult to produce broken string in the Wiring pattern, the longer the better so a linearity pattern forms regional 24A (perhaps 24B, 24C, 24D) under the few situation in the position that gradient changes.

In addition, store pattern that lattice cofferdam pattern 18 or lyophoby pattern 58 surround, to form regional 24 shape can not be linearity also.As the one example, figure 11 illustrates four patterns that have curve shape respectively and form regional 24G.So, can collaborate mutually as long as bullet drops on the drop D that two bullets adjacent each other fall on the CP of position, then pattern form the shape in zone 24 (24G) can linearly or curve-like.In addition, in Figure 11, four patterns form each zone among the regional 24G and all contain two bullets position CP that falls.But, being positioned at bullet that interconnected two patterns form the border of the regional 24G position CP that falls, the two is corresponding to form regional 24G with two patterns.

(variation 2)

Adopt above-mentioned embodiment, make storage lattice cofferdam pattern 118 that pattern is formed regional 24A, 24B, 24C and 24D and surround.Surround yet also can pattern be formed regional 24A, 24B, 24C and 24D, replace storing lattice cofferdam pattern 18 with this with lyophoby pattern 58.The formation method of lyophoby pattern 58 is as follows.

And the surface of substrate 10A and the surface of protective layer 16Q carried out the lyophoby processing.A method of lyophoby processing is, forms the method for the self-organization film that is made of organic molecular film etc. on the surface of substrate 10A.

Constitute the molecule of organic molecular film, having can be with the functional group of substrate 10A combination, with functional group, the normal carbon chain that is connected these functional groups or the part branched chain of the characteristic upgrading (control surface energy) on substrate 10A surface.And this molecule combines back formation molecular film, for example monomolecular film with substrate 10A.

The self-organization film is the film that is made of the molecule that is orientated in same direction mutually.This molecule is made of the atom that constitutes substrates such as substrate 10A surface, reactive associativity functional group and the straight chain molecule beyond it.And this molecule, high orientation is only just arranged under the interaction of straight chain molecule.And because the self-organization film is to be made of the molecule that is orientated mutually at equidirectional, so the thickness of self-organization film as thin as a wafer.And this thickness is even on molecular level.In addition, owing to monomolecular same area is positioned at across on the surface of self-organization film, so the surface characteristic of self-organization film (for example lyophobicity) also is across uniform from the teeth outwards.

As being to constitute the compound of the organic molecular film that will form the self-organization film, and presenting an example of the compound of lyophobicity, is fluoroalkyl silanes (below be also referred to as FAS).FAS just can make molecularly oriented that fluoro-alkyl is positioned on the Free Surface in case combine with the substrate 10A of substrate, formation self-organization film (below be also referred to as the FAS film).The surface of the FAS film of fluoro-alkyl proper alignment, the surface can be little, therefore presents lyophobicity.Therefore, when forming under the situation of FAS film on the surface of substrate 10A, the surface that can give substrate 10A is with lyophobicity.Wherein, the FAS film is not only given lyophobicity to the surface of substrate 10A, and since strong with the connecting airtight property of substrate 10A, so durability is also good.

FAS has 17 fluoro-1,1,2,2-tetrahydrochysene decyl triethoxysilane, 17 fluoro-1,1,2,2-tetrahydrochysene decyl trimethoxy silane, 17 fluoro-1,1,2,2-tetrahydrochysene decyl three chloro silane, 13 fluoro-1,1,2,2-tetrahydrochysene decyl triethoxysilane, 13 fluoro-1,1,2,2-tetrahydrochysene octyl group trimethoxy silane, 13 fluoro-1,1,2, fluoroalkyl silanes such as 2-tetrahydrochysene octyl group three chloro silane, trifluoro propyl trimethoxy silane etc.During use,,, also two or more compounds can be used in combination under intended purposes prerequisite of the present invention though preferably be used alone compound.

Say that more specifically FAS generally can use formula R _nSiX _(4-n)Expression.In the formula, n represents the integer below 3 more than 1, and X represents hydrolization groups such as methoxyl group, ethyoxyl, halogen atom.And when R be fluoro-alkyl, have (CF ₃) (CF ₃) x (CH ₃) structure of y (in the formula, x represents the integer below 10 more than 0, and y represents the integer below 4 more than 0), under a plurality of R or x and the situation that Si combines, R or X both can distinguish identical mutually, also can be different.The hydrolysising group of representing with X forms siloxane bond through hydrolysis, and the hydroxyl reaction with substrate 10A substrates such as (glass, silicon) combines with substrate 10A by siloxane bond.On the other hand, R is owing to have (CF from the teeth outwards ₃) wait the fluoro group, so the surface of upgrading Cheng Buhui moistening (surface energy is low) base object (being substrate 10A here).

The method that forms the FAS film with gas phase on substrate 10A is as follows.Above-mentioned raw materials compound (being FAS) is put into same closed container with substrate 10A, place about 2～3 days under the situation of room temperature.So, on substrate 10A, will form the self-organization film (being the FAS film) that constitutes by organic molecular film.And, can on substrate 10A, form the FAS film through about 3 hours if closed container is remained under 100 ℃ the situation.

And it is as follows to form the method for FAS film by liquid phase on substrate 10A.At first, perhaps clean, carry out pre-treatment in this way with solvent to the surface irradiation ultraviolet ray of substrate 10A.And substrate 10A is immersed in the solution that contains starting compound (being FAS), washing after the drying, can obtain self-organization film (FAS film) on substrate 10A.In addition, also can suitably omit the pre-treatment on the surface of substrate 10A.

According to aforesaid way, shown in Figure 12 (a), lyophoby film (FAS film) 56 can be set on substrate 10A.And shown in Figure 12 (b), the part with the two-dimensional shapes of Wiring pattern is surrounded makes 56 exposures of FAS film by the photomask M1 that shadow mask MK is covered.So, because lyophoby film 56 decomposition of the part of illuminated light, so can form the lyophoby pattern 58 shown in Figure 12 (c).By lyophoby pattern 58, a plurality of parts (surface of substrate 10A) of having surrounded two-dimensional shapes are exposed simultaneously.

Lyophoby pattern 58 has the shape of surrounding respectively of a plurality of conductive layers 8 that will afterwards form fully on every side.Certainly, lyophoby pattern 58 also can be made of a plurality of lyophoby part 58B disconnected from each other separately.For example, only with institute's set a distance while disconnected from each other between the mutually substantially parallel a pair of lyophoby part 58B, the two-dimensional shapes that also can surround a conductive layer 8.In this case, on the part corresponding, can there be lyophoby part 58 with the two end portions of conductive layer 8 yet.That is to say that lyophoby pattern 58 need not and will surround fully around the two-dimensional shapes of conductive layer 8.

In this variation.A plurality of parts of each two-dimensional shapes being surrounded by lyophoby pattern 58, to form regional 24A, 24B, 24C and 24D corresponding with pattern respectively.

In addition, one of index of expression body surface lyophobicity is the contact angle that liquid material shows on body surface.The contact angle that liquid material shows on body surface is big more, and body surface will demonstrate bigger lyophobicity to liquid material.In the present embodiment, the contact angle that conductive material 8A shows on lyophoby pattern 58 forms the contact angle that conductive material 8A shows on the zone 24 with pattern and compares, should be more than big 30 degree.

(variation 3)

In the above-described embodiment, nozzle 118 is with respect to the direction that relatively moves of stand 106, and the two is parallel with the both direction (X-direction and Y direction) of mutually orthogonal.Therefore, grid 30 is rectangles.Yet, as long as nozzle 118 relatively moves with two dimension with respect to stand 106, also can be non-orthogonal mutually.That is to say that nozzle 118 also can relatively move on different mutually both directions (first direction of the present invention and second direction).In this case, the shape of the grid 30 of above-mentioned embodiment will become parallelogram.

(variation 4)

According to above-mentioned embodiment, can form Wiring pattern with the pattern formation method of present embodiment.But pattern formation method of the present invention is not limited to the concrete mode of Wiring pattern formation method.Pattern formation method of the present invention, the pattern that also can be used for being made of insulation material layer replaces the method that forms of Wiring pattern.

(variation 5)

According to above-mentioned embodiment, by conductive material layer 8B finally being activated with purifying stove 150 heating.But by electromagnetic wave irradiations such as ultraviolet ray, visible wavelength light or microwaves, replace heating, also can make these conductive material layer 8B activation.But also can replace this activation only with conductive material layer 8B drying.Even this is because only the conductive material layer 8B that gives is placed the cause that also can form conductive layer 8.But, and only conductive material layer 8B dry situation to be compared, the rise time of conductive layer 8 is short when carrying out any activation.Therefore, more preferably conductive material layer 8B is activated.

(variation 6)

In the above-mentioned embodiment, the linearity pattern form regional 2A, 24C and X-direction not parallel.And pattern forms regional 24A and X-direction angulation, and to form regional 24C identical with the X-direction angulation with pattern.Yet, form regional 2A, 24C with the uneven pattern of X-direction, also can present with X-direction and form different angles.That is to say that pattern forms regional 24A and X-direction angulation, form regional 24C with pattern and the X-direction angulation also can be different.

Claims

1. the formation method of a pattern is to use the droplet ejection apparatus that sprays first drop and second drop from nozzle, forms the pattern formation method of pattern on body surface, comprising:

Step (A) and step (B),

Described step (A), form and surround the storage lattice cofferdam pattern that described pattern forms the zone, so that when the coordinate of representing with integer m and n on the described body surface, represent under the situation of two integers beyond 0 with i and j simultaneously, (m, n) but the bullet scope of described first projected image under the center situation unanimous on the whole of first projected image of position and described first drop that falls, with (m+i, n+j) but the bullet scope of described second projected image under the center situation unanimous on the whole of second projected image of position and described second drop that falls, the pattern that is positioned on the described body surface forms the zone;

Described step (B), to described (m, n) but the bullet position that falls spray described first drop, simultaneously to described (m+i, n+j) but the bullet position that falls spray described second drop, form described pattern formed the pattern that the zone covers;

Described first drop and described second drop, by described (m, n) but bullet fall position and described (m+i, n+j) but the distance that falls between the position of bullet determine, make it form at described pattern that the expansion back is mutual on the zone collaborates.

2. pattern formation method according to claim 1, wherein

Described step (A) comprises the step that forms described storage lattice cofferdam pattern, can obtain linearity or curvilinear two described patterns form the zone,

It is parallel to each other that described two patterns form the zone.

3. pattern formation method according to claim 1, wherein

Described step (A) comprises the step that forms described storage lattice cofferdam pattern, so that obtain linearity or curvilinear two described patterns form the zone,

It is not parallel mutually that described two patterns form the zone.

4. pattern formation method according to claim 3, wherein

Two patterns of described linearity form the zone and are connected to each other,

It is parallel with first direction that described two patterns form a regional zone,

Described two patterns form another zone in zone, form greater than 0 degree but less than 90 angles of spending with respect to described first direction,

Described step (B) comprising: spray the described drop of first volume but form described bullet in the zone position that falls to a described pattern, but form the fall step of described drop of the position ejection volume littler than described first volume of described bullet in the zone to described another pattern simultaneously.

5. the formation method of a pattern is to use the droplet ejection apparatus that sprays first drop and second drop from nozzle, forms the pattern formation method of pattern on body surface, comprising:

Step (A) and step (B),

Described step (A) forms surrounds the lyophoby pattern that described pattern forms the zone, so that when the coordinate of representing with integer m and n on the described surface, represent under the situation of two integers beyond 0 with i and j simultaneously, (m, n) but the bullet scope of described first projected image under the situation unanimous on the whole of the center of first projected image of position and described first drop that falls, with (m+i, n+j) but the bullet scope of described second projected image under the situation unanimous on the whole of the center of second projected image of position and described second drop that falls, the pattern that is positioned on the described body surface forms the zone;

Described step (B) to described (m, n) but the bullet position that falls spray described first drop, simultaneously to described (m+i, n+j) but the bullet position that falls spray described second drop, form described pattern formed the pattern that the zone covers;

Described first drop and described second drop, by described (m, n) but bullet fall position and described (m+i, n+j) but the distance that falls between the position of bullet determine, make to form at described pattern that the expansion back is mutual on the zone collaborates.

6. want 5 described pattern formation methods according to right, wherein

Described step (A) comprises the step that forms described lyophoby pattern, obtaining linearity or curvilinear two described patterns form the zone,

It is parallel to each other that described two patterns form the zone.

7. pattern formation method according to claim 5, wherein

It is not parallel mutually that described two patterns form the zone.

8. pattern formation method according to claim 7, wherein

Described step (B) but comprise that forming described bullet in the zone position that falls to a described pattern sprays the described drop of first volume, but form the fall step of described drop of the position ejection volume littler of described bullet in the zone to described another pattern simultaneously than described first volume.

9. according to the formation method of any one described pattern in the claim 1～5, wherein

Described droplet ejection apparatus constitutes: described nozzle relatively moved along mutual different first direction and second directions, but spray a plurality of described drops to a plurality of described bullets position that falls respectively from described nozzle selection ground,

The position but described a plurality of bullet falls constitutes the grid parallel with described second direction with described first direction,

The position determines towards the relative moving speed of described first direction and the minimum ejection cycle corresponding with described liquid material based on described nozzle along first spacing of described first direction but described a plurality of bullet falls,

The position is along second spacing of described second direction, based on the relatively move spacing decision of described nozzle towards described second direction but described a plurality of bullet falls.

10. according to the formation method of any one described pattern in the claim 1～9, wherein said liquid material is a conductive material.

11. the manufacture method of an electronic instrument is comprising the described pattern of claim 9 formation method.

12. the manufacture method of a matrix, be to possess to utilize nozzle is relatively moved along mutual different first direction and second directions, spray the droplet ejection apparatus of first drop and second drop from described nozzle, the pattern of giving described first drop and second drop forms the manufacture method of the matrix in zone, comprising:

Form and surround the step that described pattern forms the storage lattice cofferdam pattern in zone, so that when the lip-deep coordinate of representing described matrix with integer m and n, represent under the situation of two integers beyond 0 with i and j simultaneously, (m, the scope of described first projected image under the center situation unanimous on the whole of first projected image of position n) and described first drop, with (m+i, n+j) scope of described second projected image under the center situation unanimous on the whole of second projected image of position and described second drop, be positioned at described pattern and form the zone

Described first drop and described second drop determines by the distance between the position of the position of described (m, n) and described (m+i, n+j), make to form at described pattern that the expansion back is mutual on the zone collaborates.

13. the manufacture method of a matrix, be to possess to utilize nozzle is relatively moved along mutual different first direction and second directions, spray the droplet ejection apparatus of first drop and second drop from described nozzle, the pattern of giving described first drop and second drop forms the manufacture method of the matrix in zone, comprising:

Form and surround the step that described pattern forms the lyophoby pattern in zone, so that when the lip-deep coordinate of representing described matrix with integer m and n, represent under the situation of two integers beyond 0 with i and j simultaneously, (m, the scope of described first projected image under the center situation unanimous on the whole of first projected image of position n) and described first drop, with (m+i, n+j) scope of described second projected image under the center situation unanimous on the whole of second projected image of position and described second drop, be positioned at described pattern and form the zone

Described first drop and described second drop by the distance decision between the position of the position of described (m, n) and described (m+i, n+j), make at described pattern and form on the zone interflow mutually, expansion back.