CN1747644A - Method for assembling and implanting reducing base plate - Google Patents
Method for assembling and implanting reducing base plate Download PDFInfo
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- CN1747644A CN1747644A CN 200410078423 CN200410078423A CN1747644A CN 1747644 A CN1747644 A CN 1747644A CN 200410078423 CN200410078423 CN 200410078423 CN 200410078423 A CN200410078423 A CN 200410078423A CN 1747644 A CN1747644 A CN 1747644A
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Abstract
A method for repairing the high-density assembled substrate includes such steps as testing each package on a multi-package substrate, marking the unqualified packages, cutting out the unqualified package along its substrate from the multi-package substrate, cutting out the qualified package along its substrate from a stand-by substrate, precisely cutting the relative recess, transplanting the qualified package along its substrate in the window on primary substrate, filling refractory resin to adhere them together, and testing again to ensure that all packages on a substrate are qualified.
Description
Technical field
But the present invention relates to a kind of method of assembling and implanting reducing base plate, especially the method that refers to a kind of like this assembling and implanting reducing base plate, its substrate with defective item cuts on multi-piece substrate, and the substrate that engages qualified product with heat-resistant adhesive is in the space that multi-piece substrate produces, utilizing accurate cutting and heat-resistant adhesive bonding that it can be combined closely is integral, again through the difference of height of precision measurement joint, heat resistance and stress test, can avoid scrapping of defective item, reach the quality and the utilance that promote multi-piece substrate, the effect that reduces production costs.
Background technology
The speed of present scientific and technological progress, to making us the stage that to imagine, especially the research and development of electronics industry, constantly in the small world of exploring nanometer, light, thin, short, little more electronic product in the hope of developing, and pick up from moving equalization production mostly in the process of producing, to reduce the loss that human negligence was caused.So, when making the production electronic product, more need strengthen the quality of electronic component, heighten to avoid defective item, make production cost heighten, and can reduce the competitiveness of industry; And it is important especially for the substrate of various electronic component grafting, this substrate is to take from the multi-piece substrate, and has the experimental process plate base on this multi-piece substrate, in the process of making sheet, in case one of them substrate is a defective item, and various electronic component is plugged into continuation production on the underproof substrate, and that will enlarge the loss of manufacturer.Yet, when manufacturer finds a underproof substrate to occur on the multi-piece substrate, underproof substrate can't be extractd alone, because under consistent automated job, this machinery can't be differentiated space on the multi-piece substrate electronic component of can not pegging graft, for making mechanical normal operation, the monoblock multi-piece substrate will be abandoned, will increase the loss of many costs so get off for a long time, moreover, the multi-piece substrate of scrapping increases, and also can cause the waste of efficient resource, and the burden in the environmental protection.
Summary of the invention
The technical problem to be solved in the present invention is, a kind of scrapping of defective item of avoiding is provided, and reaches the quality and the utilance that promote multi-piece substrate, but the method for the assembling and implanting reducing base plate that reduces production costs.
For this reason, the present invention proposes a kind of method of assembling and implanting reducing base plate, its step is as described below: step 1: each substrate is good on the test multi-piece substrate/and bad, and the substrate of defective item on the multi-piece substrate indicated; Step 2: the multi-piece substrate subscript is shown with the substrate of defective item mark, on two multi-piece substrates, cuts down respectively with the substrate of qualified product on the backup multi-piece substrate, and on multi-piece substrate, form the space; Step 3: at the jointing edge of the substrate of multi-piece substrate space and qualified product, utilize accurate cutter plane cutting that corresponding recess is arranged respectively, the substrate of qualified product is filled up back in the space of multi-piece substrate, and utilized glue filling device in the recess of its joint, to be coated with heat-resistant adhesive it is combined closely; Step 4: will change its joint effect of multi-piece substrate precision measurement of substrate, can will have the multi-piece substrate shipment of whole qualified substrates.
The method of aforesaid assembling and implanting reducing base plate, wherein, this precision measurement includes: the vertical parallax of measuring substrate and multi-piece substrate joint, with guarantee multi-piece substrate after transplanting precision at ± 3mil with interior uniform thickness, high temperature resistant 90～300 ℃ of tests, and stress 1～10kg test.
The method of aforesaid assembling and implanting reducing base plate, wherein, this glue filling device is a printing glue-injection machine.
Therefore, the method for the assembling and implanting reducing base plate that the present invention proposes, it can avoid scrapping of defective item, reaches the quality and the utilance that promote multi-piece substrate, the effect that reduces production costs.
Description of drawings
Fig. 1 is an operation chart one of the present invention.
Fig. 2 is an operation chart two of the present invention.
Fig. 3 is an operation chart three of the present invention.
Fig. 4 is an operation chart four of the present invention.
Fig. 5 is an operation chart five of the present invention.
Fig. 6 is a flow chart of steps of the present invention.
The drawing reference numeral explanation:
1..... multi-piece substrate 11....... space
1a..... substrate 1b..... substrate
2...... glue filling device 12....... breach
13....... breach
Embodiment
See also Fig. 1,2,3,4,5,6, be respectively operation chart one, two, three, four, five of the present invention, and flow chart of steps, as shown in the figure:
The method of this assembling and implanting reducing base plate, its step is as described below:
Step 1: each substrate 1a's is good on the test multi-piece substrate 1/and bad, and the substrate 1b of defective item on the multi-piece substrate 1 indicated (as shown in Figure 1);
Step 2: the substrate 1b that multi-piece substrate 1 subscript is shown with the defective item mark, on two multi-piece substrates 1, cut down respectively with the substrate 1a of qualified product on the backup multi-piece substrate 1, and on multi-piece substrate 1, form space 11 (as shown in Figure 2);
Step 3: at the jointing edge of the substrate 1a of multi-piece substrate 1 space 11 and qualified product, utilize accurate cutter plane cutting that corresponding recess 12,13 is arranged respectively, the substrate 1a of qualified product is filled up back in the space of multi-piece substrate 1, and the coating heat-resistant adhesive makes its combine closely (shown in Fig. 3,4) in the recess 12,13 of its joint to utilize glue filling device 2 (this glue filling device 2 can be a printing glue-injection machine);
Step 4: will change substrate 1a multi-piece substrate 11 precision measurements its engage effect (this precision measurement include: the vertical parallax of measuring substrate 1a and multi-piece substrate 1 joint, with guarantee multi-piece substrate 1 after transplanting precision at ± 3mil with interior uniform thickness, high temperature resistant 90～300 ℃ of tests, multi-piece substrate 1 shipment (as shown in Figure 5) that and stress 1～10kg test), can will have whole qualified substrate 1a.
By method of the present invention, cut the substrate of defective item in precision, substrate with qualified product is closely adhered in the space of multi-piece substrate through heat-resistant adhesive again, it is reached really combines closely, and after multi-piece substrate is more finished changing good substrate, just will be through the vertical parallax test of substrate and multi-piece substrate joint, bad and cause mechanical failure to avoid always changing automatic insertion machinery plug-in unit in the future, and heat-resisting test part assembling on substrate in the future especially, can avoid multi-piece substrate and substrate when being subjected to high temperature, whether can cause one of the necessary test that comes off, stress test then is will detect multi-piece substrate when pressurized, this multi-piece substrate and substrate joint can or can not plate burstings and are come off mutually, after this strict test, can guarantee good quality, can avoid scrapping of defective item, reach the quality that promotes multi-piece substrate, the effect that reduces production costs.
The above is preferred embodiment of the present invention only, is not in order to limit claim of the present invention; All other do not break away from the equivalence of being finished under the disclosed spirit and changes or modification, all should be included in the claim.
Claims (3)
1. the method for an assembling and implanting reducing base plate, its step is as described below:
Step 1: each substrate is good on the test multi-piece substrate/and bad, and the substrate of defective item on the multi-piece substrate indicated;
Step 2: the multi-piece substrate subscript is shown with the substrate of defective item mark, on two multi-piece substrates, cuts down respectively with the substrate of qualified product on the backup multi-piece substrate, and on multi-piece substrate, form the space;
Step 3: at the jointing edge of the substrate of multi-piece substrate space and qualified product, utilize accurate cutter plane cutting that corresponding recess is arranged respectively, the substrate of qualified product is filled up back in the space of multi-piece substrate, and utilized glue filling device in the recess of its joint, to be coated with heat-resistant adhesive it is combined closely;
Step 4: will change its joint effect of multi-piece substrate precision measurement of substrate, can will have the multi-piece substrate shipment of whole qualified substrates.
2. the method for assembling and implanting reducing base plate as claimed in claim 1, it is characterized in that, this precision measurement includes: the vertical parallax of measuring substrate and multi-piece substrate joint, with guarantee multi-piece substrate after transplanting precision at ± 3mil with interior uniform thickness, high temperature resistant 90～300 ℃ of tests, and stress 1～10kg test.
3. the method for assembling and implanting reducing base plate as claimed in claim 1 or 2 is characterized in that, this glue filling device is a printing glue-injection machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410078423 CN1747644A (en) | 2004-09-10 | 2004-09-10 | Method for assembling and implanting reducing base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410078423 CN1747644A (en) | 2004-09-10 | 2004-09-10 | Method for assembling and implanting reducing base plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1747644A true CN1747644A (en) | 2006-03-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410078423 Pending CN1747644A (en) | 2004-09-10 | 2004-09-10 | Method for assembling and implanting reducing base plate |
Country Status (1)
| Country | Link |
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| CN (1) | CN1747644A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101009971B (en) * | 2006-01-25 | 2010-05-19 | 日东电工株式会社 | Wired-circuit-board assembly sheet |
| CN108430151A (en) * | 2018-01-22 | 2018-08-21 | 奥士康精密电路（惠州）有限公司 | Reduce the method that finished product test opens short circuit leakage |
-
2004
- 2004-09-10 CN CN 200410078423 patent/CN1747644A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101009971B (en) * | 2006-01-25 | 2010-05-19 | 日东电工株式会社 | Wired-circuit-board assembly sheet |
| CN108430151A (en) * | 2018-01-22 | 2018-08-21 | 奥士康精密电路（惠州）有限公司 | Reduce the method that finished product test opens short circuit leakage |
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