CN1725930A - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN1725930A CN1725930A CNA2005100644480A CN200510064448A CN1725930A CN 1725930 A CN1725930 A CN 1725930A CN A2005100644480 A CNA2005100644480 A CN A2005100644480A CN 200510064448 A CN200510064448 A CN 200510064448A CN 1725930 A CN1725930 A CN 1725930A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- printed circuit
- circuit board
- pcb
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/099—Coating over pads, e.g. solder resist partly over pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A printed circuit board consists of an insulation plate as base plate, a conduction layer with conductive pattern on base plate for erecting components, copper foil sheet on conduction layer and welding layer. It features that said copper foil sheet area is greater than component base area, component pins in the same electric attribute are connected on copper foil sheet directly by method of opening window without welding barrier for not covering welding barrier layer to expose copper foil sheet , for direct connecting the component pin and copper foil.
Description
Technical field
The present invention relates to a kind of printed circuit board.
Background technology
Printed circuit board is also referred to as printed circuit board or printed wiring board, realizes being electrically connected between the component pin by the printed conductor on the printed circuit board, pad and metallization via hole.Be provided with printed circuit board (PCB in the position of counter element on the existing printed circuit board, Printed Circuit Board) component library, described component library is the good one group of Copper Foil that is used for connection PCB and element of Fixed Design, and each pin of element links to each other with the Copper Foil in the component library and then is electrically connected with PCB formation.
Fig. 1 is under the existing PCB structure, transistor AND gate PCB connection diagram in certain Circuits System, and as shown in the figure, certain transistor unit 11 is connected with PCB by PCB component library 12.Component library 12 is more bigger than actual components, and component library 12 is corresponding one by one with each pin of element 11, and element 11 links to each other with conductive pattern on the PCB by described component library 12; With reference to Fig. 1, on PCB, realize interconnecting of component pin with the form of Copper Foil cabling.
Along with development of electronic technology, printed circuit board technology has obtained very fast development, and element that can be integrated on the printed circuit board is more and more; Yet in the existing printed circuit board, described Copper Foil, Copper Foil cabling and metallization via hole etc. only is used to realize the electrical connection on the PCB; Though Copper Foil is the good conductor of heat, yet existing P CB structure (as: uses the Copper Foil cabling to realize that element connects; Metallization via hole set-up mode etc.) do not bring into play this characteristic of Copper Foil, and then cause existing PCB radiating effect poor.
In the prior art, a kind of approach that reduces system temperature is to install radiator on element additional.Radiator is made of fin, and it can obtain the heat that element produces by heat conducting mode, and is dispersed in the air by fin; Compare with element itself, radiator has bigger surface area, and release heat, thereby radiating efficiency at faster speed is higher than element itself, and then can reduce system temperature fast.The defective of this method is: increase radiator, promptly increased cost, increased the manufacturing process of system simultaneously, reduced production efficiency.
In the prior art, another kind reaches the method that reduces system temperature and is to use high performance element.High-performance components can have less caloric value.As: high performance MOSFET pipe owing to have switching characteristic at a high speed, shortened by or time of turn on process, thereby reduced the heating duration, reduced caloric value.Yet the price of high-performance components is higher, has increased system cost.
As the above analysis, self can have preferable heat sinking function the ifs circuit system, can reduce the system radiating cost largely.
Disclose a kind of printed board structure in the Chinese patent application number the 89216575.8th, this technology is substrate with the aluminum or aluminum alloy, at its superficial growth one deck aluminium oxide rete, again with the electrolytic copper foil hot pressing all-in-one-piece Metal printed circuit board of definite shape.In this technology since with aluminium as substrate, thereby make printed circuit board have heat sinking function preferably, yet this technology also makes full use of the radiating treatment that printed board existing structure characteristics realize PCB.
Summary of the invention
The problem to be solved in the present invention provides a kind of printed circuit board, and this printed circuit board can effectively distribute the heat that produces when electronic component is worked on it, has better radiating effect.
For solving the problems of the technologies described above, the invention provides a kind of printed circuit board, this printed board is base material with the insulation board, has a conductive layer on it at least with conductive pattern, have a conductive layer with conductive pattern on it at least, in order at least one element to be installed, the printed circuit board conductive layer has copper foil, wherein, be used for the area of the copper foil area of installation elements greater than the pairing PCB component library of element on the printing board PCB.
On above-mentioned printed circuit board architecture basics, on described copper foil, connect electric attribute components identical pin, so that the copper foil area can further increase.If have the solder mask that is used to protect conductive pattern on the printed circuit board surface; then the method for windowing by welding resistance makes component pin directly be connected with described copper foil; promptly with the corresponding position of component pin; do not cover solder mask to appear copper foil; so that component pin can directly be connected with copper foil, all the other positions on printed circuit board surface cover solder mask.
On above-mentioned printed circuit board architecture basics, when printed circuit board is multi-layer sheet, have metal aperture and be used to realize the electrical connection of the identical electric attribute copper foil of different conductive layers, and the copper foil that different conductive layers has identical electric attribute links to each other by at least two metal aperture; Perhaps, has metal hole count between the copper foil of same alike result in the different conductive layers more than the component pin number that connects on the copper foil.Described metal aperture can be via hole or component hole or blind hole.
In the printed circuit plate structure of multilayer, the copper foil described in the such scheme comprises the copper foil of internal grounded layers in the printed circuit board or internal power plane.
Above technical scheme as can be seen, in the present invention, on the PCB surface, do not cover solder mask with the Copper Foil of component pin relevant position, promptly the mode of windowing with welding resistance makes the Copper Foil of printed circuit board directly be connected with component pin, owing to the be connected restriction that no longer be subjected to component library of PCB with component pin, thereby aspect heat conduction, on the Copper Foil that passes to PCB that the heat that produces on the element can be very fast; On the other hand, compared with prior art, no longer link to each other between component pin by the Copper Foil cabling, but utilize copper foil to connect component pin (described electric attribute components identical pin with identical electric attribute, be usually expressed as in the circuit and can pass through the component pin that lead directly links to each other), have big as far as possible surface area owing to copper foil simultaneously, thereby have heat sinking function preferably.In sum, because the Plastic Package of that energy owing to element washed in the heat conduction of component pin, thereby will install the better radiating effect that arrives of radiator additional by the heat radiation of PCB Copper Foil.
Further, when described printed circuit board is non-single-clad board, have the metallization via hole in the circuitous pattern on the PCB, be used for realizing that different conductive layers has the connection of identical electric attribute Copper Foil.On above-mentioned printed circuit board architecture basics, the quantity that increases via hole between Copper Foil will help heat conducting effect, and then the heat that element produces can be assigned on the Copper Foil that has identical electric attribute in the different conductive layers fast, enlarged area of dissipation, accelerate system radiating; Further, when the metallization via hole can be arranged in order between Copper Foil,, increased the effect of heat radiation with the uniform distribution and the release of the more effective realization heat of energy.
The present invention especially is fit to the printed circuit board of sandwich construction, among the PCB of multilayer, have internal grounded layers or internal power plane, Copper Foil can have bigger surface area (especially this two-layer Copper Foil usually close with the printed circuit board size) in this layer, thereby heat that can faster delivery system generation.
In sum, the present invention has low cost, the characteristics of good heat dissipation effect.
Description of drawings
Fig. 1 is element and a PCB connection diagram in the prior art;
Fig. 2 is four layers of printed circuit board structural representation of typical case;
Fig. 3 connects the schematic diagram of Copper Foil in ground plane and the signals layer for the metallization via hole;
Fig. 4 is general PWM switching power circuit schematic diagram;
Fig. 5 is printed circuit panel assembly of the present invention MOSFET place structure principle chart in the PWM Switching Power Supply.
Embodiment
Printed circuit board is also referred to as printed wiring board or printed circuit board, and by the printed conductor on the printed circuit board, pad and metallization via hole are realized being electrically connected between the component pin.Because conductive pattern on the printed circuit board (as component pin pad, printing line, via hole etc.) and illustrative words (as element profile, sequence number, model) etc. are all realized by printing method, therefore are called printed circuit board.
By certain technology, on the very high base material of insulation property, cover the good copper film of one deck electric conductivity, just constituted the necessary material of production printed circuit board---copper-clad plate, press circuit requirement, in copper-clad plate, etch conductive pattern, and get out the component pin installing hole, and realize the via hole of electric interconnection and the fixing required screw hole of entire circuit plate, just obtained the printed circuit board of required by electronic product.
The printed circuit board (pcb) kind is a lot, and according to the difference of conductive layer number, PCB is divided into single face circuit board (abbreviation single sided board), double-sided PCB (abbreviation double sided board) and multilayer circuit board; According to the difference of copper-clad plate base material, PCB is divided into papery copper clad laminate and glass cloth coated copper-clad laminate two classes.
The used copper-clad plate of the PCB of single face has only one side to cover Copper Foil, the another side blank, thereby can only on the coating foil face, make conductive pattern, the conductive pattern on the single sided board mainly comprises fixing, the printed conductor of the pad of Connection Element pin and the interconnection of realization component pin, this face is called " solder side ".
The upper and lower surface of two-sided PCB substrate all covers Copper Foil, and all contains conductive pattern, except pad, printed conductor, also is useful on the metallization via hole that the upper and lower surface printed conductor is linked to each other in the conductive pattern.In double sided board, element only is installed on one of them face, and this face is called component side, and another side is called solder side; In double sided board, need to make connect, below the metallization via hole of printed conductor.
Along with element annexation in first circuit diagram is complicated all the more, the element operating frequency increases, and multi-layer sheet occurred.The number of conductive layer is generally 4,6,8,10 etc. in multi-layer sheet, is example with four laminates, and levels is signals layer (a signal line wiring layer), also has bus plane and ground plane between two-layer up and down.
In multilayer circuit board, being electrically connected by component pin pad and metallization via hole between layer and the layer realizes, except component pin pad hole, be used to realize that the metallization via hole of different layers electric interconnection runs through the entire circuit plate usually, with convenient boring processing, after the special process processing, avoid causing short circuit.
On two-sided PCB basis, the metallization via hole in the multi-layer PCB further is categorized as: via (via): a kind ofly be used for the metal aperture that internal layer connects, but wherein and be not used in insertion element lead-in wire or other reinforcing material; Blind hole (Blind via): the via that only is extended to a top layer in the printed circuit board; Buried via hole (Buried via): a kind of via that does not extend to the printed circuit board surface; Via hole (Through via): the via that is extended to another top layer from a top layer of printed circuit board; Component hole (Componenthole): be used for the element terminal and be fixed in printed circuit board and the electrically connected hole of conductive pattern.
Printed circuit board (pcb) provided by the present invention based on existing PCB structure, on the PCB surface, appears Copper Foil with the corresponding position of component pin, makes element directly to link to each other with the Copper Foil of PCB signals layer; Promptly on the prior art basis, the present invention has saved the PCB component library; And directly produce the pin shape of element by the mode that welding resistance is windowed, appear this place's Copper Foil on the PCB surface.
Described PCB component library comes down to one group of good Copper Foil of Fixed Design, and each pin of element links to each other with a slice Copper Foil wherein, and the PCB component library is more bigger than actual components, after calling in the PCB component library, is communicated with by the PCB cabling component pin that will be mutually related.Described solder mask (Solder Mask) is pad on the existing printed circuit board and the protection zone around the via hole, and its main purpose is that soldering paste flows away along Copper Foil and causes rosin joint when avoiding welding; It is that the Copper Foil of reserving on the PCB Copper Foil with the component pin relevant position does not cover solder mask that described welding resistance is windowed.
The structure of above-mentioned PCB makes no longer to be confined to component pin and being connected of PCB and being connected of component library, and directly links to each other with the PCB Copper Foil around the component pin; On this basis, strengthen PCB and go up the Copper Foil area that links to each other with component pin, make between the component pin with identical electric attribute by continuous (the described electric attribute components identical pin of copper foil, be usually expressed as in the circuit and can pass through the component pin that lead directly links to each other), replace original Copper Foil cabling, promptly on a copper foil, the component pin that is connected has identical electric attribute.Use copper foil, help distributing of heat, and the increase of copper foil area can access more obvious radiating effect; Because the component pin heat conductivility is better, thereby copper foil directly links to each other with component pin, the heat that helps the element generation is passed to copper foil in the mode of conduction heat transfer rapidly, and then by the copper foil distribute heat, reduces component temperature.Above-mentioned printed circuit plate structure is mainly dispelled the heat in the mode of printed circuit board surface Copper Foil heat radiation, is applicable to single face PCB, two-sided PCB and multi-layer PCB, and is especially when single face PCB and two-sided PCB, more remarkable by the effect of surperficial copper foil heat radiation.
When printed circuit board (pcb) is double sided board or multi-layer sheet, be useful on the metallization via hole that the different conductive layers lead is linked to each other, and as is known to the person skilled in the art, in multilayer printed circuit board, when the Copper Foil that need will have an identical electric attribute through a plurality of conductive layers when the metallization via hole is connected, link to each other with the conductive layer of centre for fear of the metallization via hole, this via hole preset a hole bigger on the conductive layer Copper Foil of process than described via hole.Further, on above-mentioned printed circuit board architecture basics, different conductive layers has between the copper foil of identical electric attribute and links to each other by a plurality of metallization via holes, so that the heat that element produces can pass to a plurality of Copper Foils faster.Among the present invention, the Copper Foil on the printed circuit board is the heat radiation main body, and therefore, the heat that element is produced passes to a plurality of Copper Foils faster, promptly improves the efficient of conduction heat transfer and the surface area of increase radiator, can improve radiating effect of the present invention.Realize that the concrete mode that the metallization via hole connects comprises: different conductive layers has between the copper foil of identical electric attribute and links to each other by at least two metal aperture; Or be used to connect metallization between the Copper Foil of identical electric attribute hole count should be more than the component pin number of PCB surface signal layer; And, suitably increase the hole size that metallized and also can reach heat that element produces is delivered to a plurality of Copper Foils rapidly.In the present invention promptly, described metallization via hole has the function of conduction and heat conduction simultaneously.On the other hand, when the Copper Foil area is enough big, a plurality of metallization via holes should be set as far as possible between Copper Foil; And when being connected by a plurality of metallization via holes between Copper Foil, described metallization via hole should be evenly distributed on the Copper Foil, so that the heat that produces on the element can be delivered on the Copper Foil uniformly, to improve the radiating efficiency of Copper Foil.
When printed circuit board was multi-layer sheet, earth terminal and power end respectively accounted for a plane layer usually, and the Copper Foil area in this internal grounded layers and the internal power plane is bigger, and be close with place printed circuit board size usually.Hence one can see that, in multi-layer sheet (is example with four laminates), the Copper Foil of described internal grounded layers and internal power plane will become main radiator among the PCB, therefore, the signals layer Copper Foil identical with this two-layer electric attribute should be connected with ground plane Copper Foil or bus plane Copper Foil respectively by metallization via hole as much as possible, make the thermal conducting path of described metallization via hole, to give full play to the heat-sinking capability of this two-layer Copper Foil as signals layer and internal grounded layers or internal power plane.Fig. 2 is typical four layers of printed circuit board structural representation, and as shown in the figure, the printed circuit board the superiors and the bottom are signals layer, and the intermediate layer comprises internal grounded layers and internal power plane, passes through dielectric between each conductive layer at interval.Fig. 3 is the schematic diagram that the metallization via hole connects identical electric attribute Copper Foil in ground plane and the signals layer in the multi-layer sheet, and 41 are the via hole that metallizes among the figure.
Known to ability and technical staff, above-mentioned metallization via hole can further comprise: via, blind hole, via hole, component hole etc.
With reference to Fig. 4 and Fig. 5, illustrate that the concrete application of printed circuit board of the present invention in the PWM Switching Power Supply realizes.In Switching Power Supply, the MOSFET pipe can be regarded rheostat as in conducting or procedures of turn-off, and produces bigger heat; The performance of MOSFET is relevant with the temperature under the operating state simultaneously, and promptly the high more MOSFET performance of working temperature will reduce, thereby, in switching power circuit, need the MOSFET pipe is carried out radiating treatment.
Figure 4 shows that general PWM switching power circuit schematic diagram, 51,52 are respectively the MOSFET pipe among the figure, are example with MOSFET 51, and it comprises grid, drain electrode and source electrode; As shown in the figure, grid receives the signal of PWM chip, drain electrode with import power supply (Vin) and be connected, source electrode behind the LC filter filtering as the output of Switching Power Supply.
As the MOSFET component structure among Fig. 5, MOSFET have 4 pins be source electrode as output, 1 pin is the signal that grid is used to receive PWM, 3 pins connect input power supply (Vin) as drain electrode.In conjunction with Fig. 5 as can be known, the mode of windowing with welding resistance on the printed circuit board leaves Copper Foil in the position corresponding with the MOSFET component pin, the local solder mask that covers of other of printed circuit board surface; And, the welding resistance of the position of 4 pins of corresponding MOSFET source electrode is windowed and is on the copper foil, promptly different with existing structure, the pin of MOSFET will be links to each other by the Copper Foil cabling, but integral body is connected on the copper foil, to increase the area as the copper foil of the main body of dispelling the heat, equally, 3 pins of MOSFET drain electrode are connected on another piece copper foil, and 1 pin of MOSFET grid will be connected to alone on the 3rd copper foil, more than three blocks of Copper Foils do not link to each other mutually.
Further, if used four layers printed circuit board in the present embodiment, the input pin that then also should connect the LC oscillator on the copper foil at 4 of the MOSFET source electrode pin places, the output pin that also should connect the PWM chip on the copper foil at 1 pin place of MOSFET grid, and, on the copper foil at 3 pin places that MOSFET drains, link to each other with the internal power plane of printed circuit board by the metallization via hole, and the size according to this copper foil is provided with more than one metallization via hole connection, and described metallization via hole journey on the copper foil at pin place evenly distributes.The metallization structure of via hole in printed circuit board can be with reference to Fig. 3, and the metallization via hole in the printed circuit board is a technology conventionally known to one of skill in the art.
More than printed circuit board provided by the present invention is described in detail, used specific case herein principle of the present invention and execution mode set forth, the explanation of above embodiment just is used for help understanding method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that all can change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (7)
1, a kind of printed circuit board is a base material with the insulation board, has a conductive layer with conductive pattern on it at least, in order at least one element to be installed, it is characterized in that:
The printed circuit board conductive layer has copper foil, wherein, is used for the area of the copper foil area of installation elements greater than the pairing PCB component library of element on the printing board PCB.
2, printed circuit board as claimed in claim 1 is characterized in that:
Connect electric attribute components identical pin on the described copper foil.
3, printed circuit board as claimed in claim 1 or 2 is characterized in that:
On the printed circuit board surface, with the corresponding position of component pin, appear copper foil, be used for directly being connected with component pin, all the other positions on printed circuit board surface cover solder mask.
4, printed circuit board as claimed in claim 3 comprises metal aperture in the described conductive pattern, it is characterized in that:
The copper foil that different conductive layers has identical electric attribute links to each other by at least two metal aperture.
5, printed circuit board as claimed in claim 3 comprises metal aperture in the described conductive pattern, it is characterized in that:
The copper foil that different conductive layers has identical electric attribute connects by metal aperture, and the metal hole count is more than the component pin number that connects on the copper foil.
6, as claim 4 or 5 described printed circuit boards, it is characterized in that:
Described metal aperture is via hole or component hole or blind hole.
7, printed circuit board as claimed in claim 1 or 2 is characterized in that:
Described copper foil comprises the copper foil of internal grounded layers in the printed circuit board or internal power plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005100644480A CN1725930A (en) | 2005-04-15 | 2005-04-15 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2005100644480A CN1725930A (en) | 2005-04-15 | 2005-04-15 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1725930A true CN1725930A (en) | 2006-01-25 |
Family
ID=35925109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2005100644480A Pending CN1725930A (en) | 2005-04-15 | 2005-04-15 | Printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1725930A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010148817A1 (en) * | 2009-12-11 | 2010-12-29 | 中兴通讯股份有限公司 | Mobile terminal and label thereof |
| CN102592421A (en) * | 2011-01-12 | 2012-07-18 | 索尼公司 | Remote control device |
| WO2012122731A1 (en) * | 2011-03-16 | 2012-09-20 | 深圳市华星光电技术有限公司 | Printed circuit board with radiating structure and machining method thereof |
| CN102928563A (en) * | 2012-11-08 | 2013-02-13 | 广东生益科技股份有限公司 | Method for assessing filling performance of different prepregs |
| CN105813377A (en) * | 2016-05-09 | 2016-07-27 | 深圳爱易瑞科技有限公司 | Printed circuit board |
| CN103378748B (en) * | 2012-04-24 | 2017-02-15 | 光宝电子(广州)有限公司 | Power supply unit and synchronous rectification module circuit board |
| EP2134147B1 (en) * | 2008-06-09 | 2018-08-08 | Valeo Equipements Electriques Moteur | Method of soldering and positioning an integrated circuit on a substrate and assembly manufactured by this method |
| CN108900071A (en) * | 2018-08-27 | 2018-11-27 | 北京嘉楠捷思信息技术有限公司 | Switching power supply and computing equipment comprising same |
| CN110312348A (en) * | 2019-08-07 | 2019-10-08 | 深圳市鑫宇昊科技有限公司 | Bikini upside-down mounting constant-current driven chip and LED light |
| CN111821567A (en) * | 2019-03-30 | 2020-10-27 | 深圳硅基仿生科技有限公司 | Electronic package and implantable device |
| CN112153829A (en) * | 2019-06-28 | 2020-12-29 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and method for manufacturing the same |
| US10897809B2 (en) | 2016-12-16 | 2021-01-19 | Mitsubishi Electric Corporation | Printed circuit board, air conditioner, and method for manufacturing printed circuit board |
-
2005
- 2005-04-15 CN CNA2005100644480A patent/CN1725930A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2134147B1 (en) * | 2008-06-09 | 2018-08-08 | Valeo Equipements Electriques Moteur | Method of soldering and positioning an integrated circuit on a substrate and assembly manufactured by this method |
| WO2010148817A1 (en) * | 2009-12-11 | 2010-12-29 | 中兴通讯股份有限公司 | Mobile terminal and label thereof |
| CN102592421A (en) * | 2011-01-12 | 2012-07-18 | 索尼公司 | Remote control device |
| WO2012122731A1 (en) * | 2011-03-16 | 2012-09-20 | 深圳市华星光电技术有限公司 | Printed circuit board with radiating structure and machining method thereof |
| CN103378748B (en) * | 2012-04-24 | 2017-02-15 | 光宝电子(广州)有限公司 | Power supply unit and synchronous rectification module circuit board |
| CN102928563A (en) * | 2012-11-08 | 2013-02-13 | 广东生益科技股份有限公司 | Method for assessing filling performance of different prepregs |
| CN102928563B (en) * | 2012-11-08 | 2016-04-06 | 广东生益科技股份有限公司 | Assess the method for different prepreg filling perforation |
| CN105813377A (en) * | 2016-05-09 | 2016-07-27 | 深圳爱易瑞科技有限公司 | Printed circuit board |
| US10897809B2 (en) | 2016-12-16 | 2021-01-19 | Mitsubishi Electric Corporation | Printed circuit board, air conditioner, and method for manufacturing printed circuit board |
| CN108900071A (en) * | 2018-08-27 | 2018-11-27 | 北京嘉楠捷思信息技术有限公司 | Switching power supply and computing equipment comprising same |
| CN111821567A (en) * | 2019-03-30 | 2020-10-27 | 深圳硅基仿生科技有限公司 | Electronic package and implantable device |
| CN112153829A (en) * | 2019-06-28 | 2020-12-29 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board and method for manufacturing the same |
| CN110312348A (en) * | 2019-08-07 | 2019-10-08 | 深圳市鑫宇昊科技有限公司 | Bikini upside-down mounting constant-current driven chip and LED light |
| CN110312348B (en) * | 2019-08-07 | 2024-05-24 | 深圳市炫鼎光电科技有限公司 | Three-point type flip constant current driving chip and LED lamp |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1725930A (en) | Printed circuit board | |
| US7903417B2 (en) | Electrical circuit assembly for high-power electronics | |
| CN101379894B (en) | Printed circuit board with additional functional elements, method of production and use | |
| EP2008305A2 (en) | Electronic component module | |
| CN1662122A (en) | Multi-layer circuit board with thermal diffusion and method of fabricating the same | |
| CN1326312A (en) | Printed circuit board and electronic device therewith | |
| CN1998273A (en) | Embedded power management control circuit | |
| CN105491822B (en) | Multilayer printed circuit board integrates liquid cold passage preparation method | |
| CN105448864A (en) | Electronic component | |
| CN101472449A (en) | Combined structure and method of radiator and circuit | |
| GB2124035A (en) | Printed circuit boards | |
| CN1856239A (en) | Printing circuit board | |
| CN204131832U (en) | A kind of printed circuit board (PCB), transformer and modular power source | |
| CN1792125A (en) | Circuit board assembly employing solder vent hole | |
| JP3104749B2 (en) | Circuit device and method of manufacturing the same | |
| CN210274694U (en) | Equipment and PCB board thereof | |
| CN210245421U (en) | Class 2 solid relay with staggered structure | |
| JP4486553B2 (en) | Electronic device having double-sided mounting circuit board with built-in capacitor | |
| CN113727515A (en) | Metal copper-clad plate | |
| WO2020249409A1 (en) | Flexible circuit board with thermally conductive connection to a heat sink | |
| CN219999671U (en) | Metal substrate structure | |
| CN1404353A (en) | Making process of printed circuit board with solid copper pins for interconnection | |
| DE102014203310A1 (en) | electronic module | |
| CN218851031U (en) | Asymmetric PCB | |
| CN210432028U (en) | Printed circuit board with double-layer structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |