CN210274694U - Equipment and PCB board thereof - Google Patents
Equipment and PCB board thereof Download PDFInfo
- Publication number
- CN210274694U CN210274694U CN201921224474.9U CN201921224474U CN210274694U CN 210274694 U CN210274694 U CN 210274694U CN 201921224474 U CN201921224474 U CN 201921224474U CN 210274694 U CN210274694 U CN 210274694U
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- circuit board
- heat dissipation
- dissipation plate
- power device
- metal base
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Abstract
The utility model discloses a device and a PCB thereof, wherein the PCB comprises a metal substrate heat dissipation plate and a circuit board for arranging a conductive circuit, the B surface of the circuit board is arranged on the A surface of the metal substrate heat dissipation plate, and the metal substrate heat dissipation plate is electrically connected with the circuit board; the circuit board is provided with a mounting groove, and the power device can penetrate through the mounting groove and then is mounted on the metal substrate heat dissipation plate. The utility model provides a PCB board, through the metal base heating panel with the setting of circuit board to install power device on the metal base heating panel for the heat transfer that power device produced gives the metal base heating panel, the heat dissipation of being convenient for is in power device's conducting wire setting is in on the circuit board, realizes the function separation on heat dissipation layer and line connection layer, not only can satisfy the wiring demand of high density heterogeneous power device, can also improve the radiating efficiency, and product performance is better.
Description
Technical Field
The utility model relates to a circuit board field especially relates to a PCB board. Furthermore, the utility model discloses still relate to an equipment including above-mentioned PCB board.
Background
In the existing industrial design, the power device has smaller and smaller volume, more and more functions and larger power, which gradually becomes a trend. However, for power devices, the higher the temperature, the lower the efficiency of the device, and the variation in the characteristics of the device may occur. Heat dissipation is a fatal problem to be urgently solved.
The heat of the device is transferred to the circuit board and then is dissipated through the heat dissipation device, wherein the heat dissipation of the power device is ensured to have no obvious bottleneck so as not to be accumulated together and cannot be dissipated; the heat dissipation device generally has various methods such as natural cooling and forced cooling.
In the prior art, a heat dissipation method for a high-density power device is generally implemented by increasing an area on a heat dissipation path or increasing a heat conductivity coefficient of a metal substrate, however, a scheme in the prior art can only solve a heat dissipation problem of a homogeneous power device, and cannot solve the heat dissipation problem when a heterogeneous power device needs to be connected with more lines.
Therefore, how to improve the heat dissipation efficiency of the PCB board of the heterogeneous power device is a technical problem that needs to be solved by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a PCB board, this PCB board can effectual improvement self radiating efficiency, improve power device's electrical property. Another object of the utility model is to provide an equipment including above-mentioned PCB board.
In order to achieve the above object, the utility model provides a following technical scheme:
a PCB board comprises a metal substrate heat dissipation plate and a circuit board used for arranging a conducting circuit, wherein the surface B of the circuit board is arranged on the surface A of the metal substrate heat dissipation plate, and the metal substrate heat dissipation plate is electrically connected with the circuit board; the circuit board is provided with a mounting groove, and the power device can penetrate through the mounting groove and then is mounted on the metal substrate heat dissipation plate.
Preferably, the circuit board has at least two layers, and the circuit boards of the layers are electrically connected with each other.
Preferably, the surface a of the circuit board is at least provided with a first power device conducting circuit, the surface B of the circuit board is at least provided with a second power device conducting circuit, and a conducting part for connecting the first power device conducting circuit with the second power device conducting circuit is arranged between the surface a and the surface B of the circuit board.
Preferably, the periphery of the side B of the circuit board is further provided with a circuit board connection pad for connecting with the metal base heat dissipation plate, a heat dissipation plate connection pad is arranged at a position on the metal base heat dissipation plate corresponding to the circuit board pad, and after the circuit board connection pad is connected with the heat dissipation plate connection pad, a preset position of a conductive circuit on the circuit board can be in contact with a preset position of a conductive circuit on the metal base heat dissipation plate so as to realize electrical connection between the circuit board and the heat dissipation plate.
Preferably, the metal base heat dissipation plate and the circuit board are connected by soldering, riveting or contact pins.
Preferably, a device mounting pad for mounting a power device is arranged on the metal substrate heat dissipation plate at a position corresponding to the mounting groove of the circuit board, and the device mounting pad is electrically connected with the conductive circuit on the metal substrate heat dissipation plate.
Preferably, the metal base heat dissipation plate and the circuit board are provided with threaded holes at corresponding positions, and the threaded holes can be used for screws to penetrate through and then are installed on the equipment main body.
Preferably, the circuit board is a glass fiber board.
The utility model also provides an equipment, including above-mentioned arbitrary one PCB board.
The utility model provides a PCB board, including metal base heating panel and the circuit board that is used for setting up the conducting wire, the B face of the said circuit board is installed on A face of the said metal base heating panel, the said metal base heating panel is connected with the said circuit board electricity; the circuit board is provided with a mounting groove, and the power device can penetrate through the mounting groove and then is mounted on the metal substrate heat dissipation plate. The utility model provides a PCB board, through the metal base heating panel with the setting of circuit board to install power device on the metal base heating panel for the heat transfer that power device produced gives the metal base heating panel, the heat dissipation of being convenient for is in power device's conducting wire setting is in on the circuit board, realizes the function separation on heat dissipation layer and line connection layer, not only can satisfy the wiring demand of high density heterogeneous power device, can also improve the radiating efficiency, and product performance is better.
In a preferred embodiment, the wiring board is a glass fiber board. Above-mentioned setting utilizes the glass fiber board that the cost is lower as the circuit board, is responsible for arranging of conducting wire to utilize the good thermal diffusivity of metal base heating panel, can be guaranteeing to dispel the heat under the good prerequisite, effectively reduce the cost of this PCB board, accord with the production demand of many batches of a small amount of middle-size and small-size enterprises.
The utility model provides an equipment is equipped with above-mentioned PCB board, because PCB board has above-mentioned technological effect, consequently, the equipment that is equipped with this PCB board should also have corresponding technological effect.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic diagram of a stacked structure of a specific embodiment of a PCB board provided in the present invention;
fig. 2-a is a schematic structural diagram of a surface a of a circuit board in a PCB according to an embodiment of the present invention;
FIG. 2-B is a schematic view of a partially enlarged structure of the A-side of the PCB shown in FIG. 2-A;
fig. 3 is a schematic diagram of a structure of a side B of a specific embodiment of a circuit board in a PCB provided by the present invention;
fig. 4 is a schematic cross-sectional view of one embodiment of a circuit board in a PCB provided by the present invention;
fig. 5-a is a schematic structural diagram of a surface a of a metal-based heat dissipation plate according to an embodiment of the present invention;
FIG. 5-B is an enlarged schematic view of the side A of the PCB shown in FIG. 5-A;
wherein: the circuit board comprises a metal substrate heat dissipation plate (1), a heat dissipation plate connecting pad (1-1), a negative electrode pad, a copper foil circuit (1-2), a positive electrode pad (1-3), a device mounting pad (1-4), a circuit board (2), a mounting groove (2-1), a first power device conducting circuit (2-2), a second power device conducting circuit (2-3), a third power device conducting circuit (2-4), a circuit board connecting pad (2-5), a resistor bit (2-6), a power device (3) and a threaded hole (4).
Detailed Description
The core of the utility model is to provide a PCB board, this PCB board can improve the radiating efficiency under the unchangeable prerequisite of volume, saves the cost. The utility model discloses another core provides an equipment including above-mentioned PCB board.
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 5, fig. 1 is a schematic diagram illustrating a stacked structure of a PCB according to an embodiment of the present invention; fig. 2-a is a schematic structural diagram of a surface a of a circuit board in a PCB according to an embodiment of the present invention; FIG. 2-B is a schematic view of a partially enlarged structure of the A-side of the PCB shown in FIG. 2-A; fig. 3 is a schematic diagram of a structure of a side B of a specific embodiment of a circuit board in a PCB provided by the present invention; fig. 4 is a schematic cross-sectional view of one embodiment of a circuit board in a PCB provided by the present invention; fig. 5-a is a schematic structural diagram of a surface a of a metal-based heat dissipation plate according to an embodiment of the present invention; fig. 5-B is an enlarged structural diagram of a surface a of the PCB shown in fig. 5-a.
In this embodiment, the PCB board includes the metal base heat dissipation plate 1 and the wiring board 2, and particularly, the PCB board is preferably a mounting board for the high-density heterogeneous power device 3 because the arrangement of the conductive traces of the high-density heterogeneous power device 3 is complicated.
The circuit board 2 is used for setting a conductive circuit, specifically, a conductive circuit of the power device 3, so as to realize normal operation of the power device 3, specifically, the surface B of the circuit board 2 is installed on the surface a of the metal base heat dissipation plate 1, the metal base heat dissipation plate 1 is electrically connected with the circuit board 2, the metal base heat dissipation plate 1 can also be provided with a conductive circuit, and the conductive circuit on the metal base heat dissipation plate 1 and the conductive circuit on the circuit board 2 can be connected through a copper column or in contact.
Further, the circuit board 2 is provided with an installation groove 2-1, and the power device 3 can penetrate through the installation groove 2-1 and then be installed on the metal base heat dissipation plate 1, namely, the circuit board 2 is only used for wiring, and the metal base heat dissipation plate 1 is used for heat dissipation.
The utility model provides a PCB board, through metal base heating panel 1 and circuit board 2's setting, and install power device 3 on metal base heating panel 1, make the heat transfer that power device 3 produced give metal base heating panel 1, be convenient for dispel the heat, set up power device 3's conducting wire on circuit board 2, realize the function separation on heat dissipation layer and line connection layer, not only can satisfy high density heterogeneous power device 3's wiring demand, can also improve the radiating efficiency, product performance is better.
In addition to the above embodiments, the wiring board 2 has at least two layers, and the wiring boards 2 of the respective layers are electrically connected to each other. Here, the number of layers of the circuit board 2 refers to the number of layers provided with conductive traces, and the conductive traces may be provided on both the a-side and the B-side of the same circuit board 2 to form the double-layer circuit board 2.
On the basis of the above embodiments, the a surface of the circuit board 2 is at least provided with a first power device conductive trace 2-2, the B surface of the circuit board 2 is at least provided with a second power device conductive trace 2-3, and a conducting part for connecting the first power device conductive trace 2-2 and the second power device conductive trace 2-3 is arranged between the a surface and the B surface of the circuit board 2, wherein the conducting part may be a conductive via hole. Specifically, the A surface of the circuit board 2 can be provided with a first power device conducting circuit 2-2, and the B surface of the circuit board 2 can be provided with a second power device conducting circuit 2-3 and a third power device conducting circuit 2-4, wherein the first power device conducting circuit 2-2 can be a conducting circuit of a green light lamp bead, the second power device conducting circuit 2-3 can be a conducting circuit of a blue light lamp bead, and the third power device conducting circuit 2-4 can be a conducting circuit of a red light lamp bead.
Specifically, the first power device conductive traces 2-2 may be sequentially arranged along the length direction of the circuit board 2 and occupy half of the width of the circuit board 2, the second power device conductive traces 2-3 and the third power device conductive traces 2-4 occupy the other half of the width, and the second power device conductive traces 2-3 and the third power device conductive traces 2-4 are alternately arranged.
More specifically, the circuit board 2 may be a two-layer or multi-layer circuit board 2, each layer of circuit board 2 may be a single-sided or double-sided wiring, and for the double-sided wiring circuit board 2, a via hole needs to be provided to electrically connect the conductive traces on the two sides of the circuit board 2.
Further, the PCB board that this embodiment provided can be the lamp plate, installs blue light lamp pearl, green glow lamp pearl, ruddiness lamp pearl etc..
Specifically, the surface a of the double-layer or multilayer circuit board 2 is mainly responsible for connection of green light bulbs, the ID resistors and the circuit connection pads, and needs to be provided with connection through holes, ID resistor bits 2-6 and circuit connection pads with the surface B of the double-layer or multilayer circuit board 2.
On the basis of the above embodiments, the peripheral part of the B surface of the circuit board 2 is further provided with circuit board connection pads 2-5 for connecting with the metal base heat dissipation plate 1, the heat dissipation plate connection pads 1-1 are arranged on the metal base heat dissipation plate 1 at positions corresponding to the circuit board 2 pads, and after the circuit board connection pads 2-5 are connected with the heat dissipation plate connection pads 1-1, the preset positions of the conductive circuits on the circuit board 2 can be in contact with the preset positions of the conductive circuits on the metal base heat dissipation plate 1, so as to realize the electrical connection between the two.
Specifically, the preset position of the conducting circuit on the circuit board 2 can be provided with a boss metal part, and similarly, the preset position of the conducting circuit on the metal substrate heat dissipation plate 1 is provided with a plane metal part or a boss metal part, so that after the circuit board 2 is attached to the metal substrate heat dissipation plate 1, the preset position of the conducting circuit on the circuit board 2 can be in contact connection with the preset position of the conducting circuit on the metal substrate heat dissipation plate 1, and electric signal conduction is realized. Of course, the contact connection may be made by other structures, or the electrical connection may be made by a contact pin or the like.
Specifically, the surface B of the double-layer or multilayer circuit board 2 is mainly responsible for the connection of the blue light beads and the red light beads, and circuit board connection pads 2-5 connected with the surface a of the metal substrate heat dissipation plate 1, conductive circuits of the blue light beads and the red light beads, connection through holes connected with the surface a of the double-layer or multilayer circuit board 2, and connection through holes connected with the green light welding spots need to be arranged.
In addition to the above embodiments, the metal base heat sink 1 and the circuit board 2 may be connected by soldering, caulking, or pin contact, and the connection method is not limited to the connection method given in the present embodiment, and may be any connection method that can achieve both stable connection and electrical connection.
On the basis of the above embodiments, the metal base heat dissipation plate 1 is provided with device mounting pads 1-4 at positions corresponding to the mounting grooves 2-1 of the circuit board 2, the device mounting pads 1-4 are used for mounting the power devices 3, and the device mounting pads 1-4 are electrically connected with the conductive circuits on the metal base heat dissipation plate 1.
Furthermore, a negative electrode bonding pad, a copper foil circuit 1-2 and a positive electrode bonding pad 1-3 are arranged on the metal substrate heat dissipation plate 1, and the device installation bonding pad 1-4 is electrically connected with the negative electrode bonding pad, the copper foil circuit 1-2 or the positive electrode bonding pad 1-3.
In a specific embodiment, the surface circuit of a metal base heating panel 1 is arranged as shown in fig. 4, the copper foil is 3oz thick, the metal base heating panel 1 is mainly responsible for the heat dissipation of the LED lamp beads, the positive and negative electrodes are connected with the surface B of the glass fiber board double-sided board in a welding spot mode, the distance between each circuit is 0.5mm, 72 blue light lamp beads are 6 and 12 lamps in a string, 36 red light lamp beads are 2 and 18 lamps in a string, 36 green light lamp beads are 3 and 12 lamps in a string, and each lamp bead is distributed along the middle of the metal base heating panel 1 along the transverse direction.
On the basis of the above embodiments, the corresponding positions of the metal base heat dissipation plate 1 and the circuit board 2 are further provided with threaded holes, the threaded holes can be used for screws to penetrate through and then installed on the device main body, the threaded holes on the metal base heat dissipation plate 1 and the circuit board 2 should correspond in position and have the same size, and the PCB is conveniently installed on the device main body.
In addition to the above embodiments, the wiring board 2 is a glass fiber board. Above-mentioned setting utilizes the glass fiber board that the cost is lower as circuit board 2, is responsible for arranging of conducting wire to utilize the good thermal diffusivity of metal base heating panel 1, can be guaranteeing to dispel the heat under the good prerequisite, effectively reduce the cost of this PCB board, accord with the production demand of a lot of small-size enterprises in a small amount.
Specifically, in the PCB provided in this embodiment, when processing, the conductive circuit is printed on the circuit board 2 with the through hole according to the design scheme, then the circuit board 2 is mounted on the metal-based heat dissipation plate 1, then the power device 3 is mounted on the metal-based heat dissipation plate 1, and finally the combined circuit board 2 and the metal-based heat dissipation plate 1 are mounted on the device main body by screws.
Besides the above PCB, the present invention also provides a device including the above PCB, and other structures of the device refer to the prior art, which is not repeated herein.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The PCB board provided by the utility model is introduced in detail above. The principles and embodiments of the present invention have been explained herein using specific examples, and the above descriptions of the embodiments are only used to help understand the method and its core ideas of the present invention. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, the present invention can be further modified and modified, and such modifications and modifications also fall within the protection scope of the appended claims.
Claims (9)
1. A PCB board is characterized by comprising a metal substrate heat dissipation plate (1) and a circuit board (2) for arranging conducting circuits, wherein the surface B of the circuit board (2) is arranged on the surface A of the metal substrate heat dissipation plate (1), and the metal substrate heat dissipation plate (1) is electrically connected with the circuit board (2); the circuit board (2) is provided with a mounting groove (2-1), and the power device (3) can penetrate through the mounting groove (2-1) and then is mounted on the metal base heat dissipation plate (1).
2. The PCB board according to claim 1, wherein the circuit board (2) has at least two layers, and each layer of the circuit board (2) is electrically connected with each other.
3. The PCB board according to claim 1, wherein the A side of the circuit board (2) is provided with at least a first power device conductive circuit (2-2), the B side is provided with at least a second power device conductive circuit (2-3), and a conducting part for connecting the first power device conductive circuit (2-2) and the second power device conductive circuit (2-3) is arranged between the A side and the B side of the circuit board (2).
4. The PCB board according to claim 3, wherein the periphery of the B surface of the circuit board (2) is further provided with circuit board connecting pads (2-5) for connecting with the metal base heat dissipation plate (1), the positions of the metal base heat dissipation plate (1) corresponding to the circuit board (2) pads are provided with heat dissipation plate connecting pads (1-1), and after the circuit board connecting pads (2-5) are connected with the heat dissipation plate connecting pads (1-1), the preset positions of the conductive circuits on the circuit board (2) can be contacted with the preset positions of the conductive circuits on the metal base heat dissipation plate (1) to realize the electrical connection of the circuit board connecting pads and the heat dissipation plate connecting pads.
5. A PCB board according to claim 3, wherein the metal base heat sink (1) and the circuit board (2) are connected by soldering, riveting or pin contact.
6. The PCB board according to claim 4, wherein the metal base heat dissipation plate (1) is provided with device mounting pads (1-4) for mounting power devices (3) at positions corresponding to the mounting grooves (2-1) of the circuit board (2), and the device mounting pads (1-4) are electrically connected with the conductive circuits on the metal base heat dissipation plate (1).
7. The PCB board according to claim 1, wherein the metal base heat dissipation plate (1) and the circuit board (2) are provided with threaded holes at corresponding positions, and the threaded holes are used for screws to penetrate through and then are installed on the equipment main body.
8. A PCB board according to any of claims 1 to 7, characterized in that the wiring board (2) is a fibreglass board.
9. An apparatus comprising a PCB board, characterized in that the PCB board is a PCB board according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921224474.9U CN210274694U (en) | 2019-07-31 | 2019-07-31 | Equipment and PCB board thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921224474.9U CN210274694U (en) | 2019-07-31 | 2019-07-31 | Equipment and PCB board thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210274694U true CN210274694U (en) | 2020-04-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921224474.9U Active CN210274694U (en) | 2019-07-31 | 2019-07-31 | Equipment and PCB board thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210274694U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110290639A (en) * | 2019-07-31 | 2019-09-27 | 东莞市沃德普自动化科技有限公司 | A kind of equipment and its pcb board |
-
2019
- 2019-07-31 CN CN201921224474.9U patent/CN210274694U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110290639A (en) * | 2019-07-31 | 2019-09-27 | 东莞市沃德普自动化科技有限公司 | A kind of equipment and its pcb board |
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