CN1719395A - Optical assembly structure and its manufacturing method - Google Patents
Optical assembly structure and its manufacturing method Download PDFInfo
- Publication number
- CN1719395A CN1719395A CNA2004100637069A CN200410063706A CN1719395A CN 1719395 A CN1719395 A CN 1719395A CN A2004100637069 A CNA2004100637069 A CN A2004100637069A CN 200410063706 A CN200410063706 A CN 200410063706A CN 1719395 A CN1719395 A CN 1719395A
- Authority
- CN
- China
- Prior art keywords
- component
- optical module
- conducting bracket
- making
- luminescence component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Light Receiving Elements (AREA)
Abstract
The present invention relates to an optical component structure and its production method. Said method includes the following steps: (a) fixing an illuminant component and a sensing component on a conducting supporting frame; (b) combining an aperture component with open pore on said conducting supporting frame, and making said open pore be correspondent to said sensing component; and (c) utilizing transparent protective component to fix and package said illuminant component and said sensing component and making them be integrally formed on said conducting supporting frame, and making the projected arc portion and circular projected portion which are respectively correspondent to said open pore and said illuminant component be extended.
Description
Technical field
The present invention relates to a kind of optical assembly structure and its method for making, relate in particular to a kind ofly by the designed optical module that goes out of this structural design and method for making, it can be applicable to any imaging system with light source and sensing component.
Background technology
Generally speaking, optical system is made up of assemblies such as sensing component, light source and optical lenses; As optical mouse, the light that utilizes this light source to produce is squeezed into body surface (as: desktop or mouse pad etc.), because the concave-convex surface inequality of institute's sensing, the image of body surface utilizes lens imaging on sensing component, when mouse when body surface moves, utilize image to distinguish that the technology of looking grasps image fast, and will obtain video conversion and become the degree of excursion data; That is, certain time point picked image and next time point picked image are compared, to detect direction and the distance that image moves.
See also shown in Figure 1, it is the side view of the first known optical system, it is disclosed in United States Patent (USP) the 4th, 751, in No. 505 cases, its interior optical system of optical system framework 100a comprises the LED light emitting source 106a that is fixed on the holder 107a, makes this LED light emitting source 106a have fixing incident angle of light, then, pin is fixed on circuit board (PCB) 118a by the action of clubfoot.Another significant components is the sensor 128a that is arranged on the IC chip 124a, and the light process lens 120a via the body surface reflection makes the body surface image be presented on this sensor 128a.Leaded light component 122a is shielding status on every side, removes as the usefulness of covering veiling glare, and can fix these lens 120a simultaneously.
Fig. 2 is the second known optical system architecture diagram, it is the product of the designed product of Hewlett-Packard's science and technology (HP) HDNS-2000 by name, at the polishing system aspects, light emitting source 44b is a LED, and this light emitting source 44b is fixedly arranged on the holder 46b, and lens combination 30b sets up a suitable light conducting path between this light emitting source 44b and sensor 160b, for this light emitting source 44b, the light that this lens combination 30b can be launched light emitting source 44b by reflection way, is squeezed into body surface with a predetermined angle.This sensor 160b is fixed on the conducting bracket 170b, utilize and have an accommodation space in the black glue shell 150b of an ejection formation this sensor 160b can be set, this black glue shell 150b also is covered with lower cover 180b, make this lower cover 180b one hole 181b be arranged, make to cover veiling glare to promote the optical imagery quality with usefulness as aperture; Wherein, attach in order to protect this sensor 160b to avoid grit in assembling process, its surface can plate layer of transparent silica gel 190b.In addition, on lens combination 30b for the body surface video imaging is had a lens 32b to sensor 160b surface design; Circuit board 100b is light emitting source 44b fixedly, and simultaneously by this conducting bracket 170b fixation of sensor 160b.
Yet, in first and second known optical system, be an optical system with the combination of components of above-mentioned several difference in functionalitys, each assembly is made with different process, again and then assembling, causes numerous and diverse consuming time the taking a lot of work of making step; And owing to have different errors between each assembly, especially need higher assembling degree of accuracy finishing preferable image quality, yet the combined tolerances that finished product exists is difficult to reach accurate image quality with this light emitting source 106a, 44b; In addition,, do a series of reflection and refraction, instead cause light loss easily, cause optical efficiency to improve for the light pipe (Light Pipe) of asking suitable light type and direction to pass through optical lens combination layer by layer as the second known optical system; And as the second known optical system, the number of assembling steps of this lower cover 180b is brought grit easily into and attached to this transparent silica gel 190b, gently then influences image quality, and is heavy then produce waste product, the increase production cost.
So, propose a kind of reasonable in design and extensively and effectively improve the present invention of above-mentioned defective at above-mentioned defective.
Summary of the invention
The invention provides a kind of optical assembly structure and its method for making, can avoid combined tolerances, improve image quality.
The invention provides a kind of optical assembly structure and its method for making, can reduce combination of lenses, reduce optical loss, and then improve optical efficiency.
The invention provides a kind of optical assembly structure and its method for making, can simple and easy packaging technology, reach the function of optical module.
The invention provides a kind of optical assembly structure and its method for making, can avoid grit to attach, improve product percent of pass, reduce production costs by simple and easy packaging technology.
The invention provides that a kind of optical assembly structure comprises conducting bracket, is connected with sensing component in this conducting bracket, the aperture assembly of this sensing component of cover cap, the luminescence component of being located at this conducting bracket, the protection assembly that encapsulates this luminescence component and this aperture assembly, and light path guiding mechanism.Wherein, this aperture assembly is provided with perforate that should sensing component; This protection assembly is transparent, and the one-body molded respectively convex arc section and circle teat that has corresponding to this perforate and this luminescence component; This light path guiding mechanism makes the light of this luminescence component emission reflex to this sensing component along a predetermined light paths.
According to the optical module of above-mentioned conception, wherein this luminescence component is light emitting diode or laser diode crystal grain.
According to the optical module of above-mentioned conception, wherein this sensing component is complementary matal-oxide semiconductor, or is photodiode, or is photosensitive coupling component, or is chips such as photoelectricity frequency multiplier.
According to the optical module of above-mentioned conception, wherein this protection assembly is that epoxy resin or thermosetting plastics are made.
According to the optical module of above-mentioned conception, wherein this light path guiding mechanism comprises: on the conducting bracket with the one-body molded kink that downward bending is arranged of a predetermined angular; And be located at this luminescence component on this kink.
According to the optical module of above-mentioned conception, wherein the scope of this predetermined angular comprises by 60 to 70 degree, and causing this luminescence component transmitting illuminant to the light projector angle of object plane or reflecting surface is 20 to 30 degree.
According to the optical module of above-mentioned conception, wherein this light path guiding mechanism comprises: form a microstructure that can change light path on this conducting bracket.
According to the optical module of above-mentioned conception, wherein one-body molded this conducting bracket that is equivalent in of this aperture assembly is formed by this conducting bracket bending.
According to the optical module of above-mentioned conception, wherein this aperture component groups is filled to this conducting bracket.
The method for making that the invention provides a kind of optical module comprises: (a) luminescence component and sensing component are fixed on the conducting bracket line lead of going forward side by side action; (b) in conjunction with an aperture assembly with perforate to this conducting bracket, and make this perforate correspond to this sensing component; And (c) utilize transparent protection assembly to fix and encapsulate this luminescence component and this sensing component is shaped on this conducting bracket, and projection has corresponding to the convex arc section of this perforate and this luminescence component and justifies teat.
According to above-mentioned conception the method for making of optical module, wherein further bend this protection component package after, the conductive connecting pin that this conducting bracket exposes makes to be the plug-in unit pattern.
According to the method for making of the optical module of above-mentioned conception, after this protection component package, this conducting bracket is the conductive connecting pin of the surface mount pattern that exposes.
According to the method for making of the optical module of above-mentioned conception, wherein this sensing component can be CMOS, CCD, PD, PM chip.
According to the method for making of the optical module of above-mentioned conception, wherein the mode of this aperture assembly to embed or to bind is fixed on the conducting bracket.
According to the method for making of the optical module of above-mentioned conception, wherein one-body molded this conducting bracket that is equivalent in of this aperture assembly is formed by this conducting bracket bending.
Method for making according to the optical module of above-mentioned conception encapsulates all component comprising pouring into a mould with epoxy resin or thermosetting natural gum, and one-body molded this convex arc section and this circle teat that similar optical lens is arranged simultaneously.
According to the method for making of the optical module of above-mentioned conception,, make this luminescence component be a predetermined angular comprising this conducting bracket of bending.
According to the method for making of the optical module of above-mentioned conception, wherein the scope of this predetermined angular comprises by 60 to 70 degree, and causing luminescence component transmitting illuminant to the light projector angle of object plane or reflecting surface is 20 to 30 degree.
Description of drawings
Fig. 1 is the schematic side view of first optical system;
Fig. 2 is the schematic side view of second optical system;
Fig. 3 is the schematic side view of most preferred embodiment of the present invention;
Fig. 4 is the schematic perspective view of most preferred embodiment of the present invention;
Fig. 5 A is the decomposing schematic representation of imaging system of the present invention;
Fig. 5 B is the combination synoptic diagram of imaging system of the present invention;
Fig. 6 A is the decomposing schematic representation of the imaging system of another embodiment of the present invention;
Fig. 6 B is the combination synoptic diagram of the imaging system of another embodiment of the present invention;
Fig. 7 is the schematic side view of polishing of the present invention system; And
Fig. 8 is for using the schematic side view of a plurality of Application Examples of the present invention.
100a: optical system framework 106a:LED light emitting source
107a: holder 118a: circuit board
120a: lens 122a: leaded light component
124a:IC chip 128a: sensor
44b: light emitting source 46b: holder
30b: lens combination 32b: lens
100b: circuit board 150b: black glue shell
160b: sensor 170b: conducting bracket
180b: lower cover 181b: hole
125,125 ': conducting bracket 126: kink
133,133 ': sensing component 136,136 ': luminescence component
140,140 ': aperture assembly 142,142 ': perforate
155,155 ': protection assembly 156,156 ': convex arc section
157,157 ': circle teat θ: predetermined angular
Embodiment
Fig. 3 Fig. 4 is respectively optical assembly structure schematic side view of the present invention and schematic perspective view, this optical assembly structure comprises conducting bracket 125, be connected with sensing component 133 in this conducting bracket 125, the aperture assembly 140 of this sensing component 133 of cover cap, be located at this conducting bracket 125 luminescence component 136, be shaped on this conducting bracket 125 in order to the protection assembly 155 that encapsulates this luminescence component 136 and this aperture assembly 140, and light path guiding mechanism.Wherein, this aperture assembly 140 is provided with perforate (Aperture) 142 that should sensing component 133, is used for increasing the image quality of light; This luminescence component 136 provides the illuminated object surface source of light; This sensing component 133 is used for detecting the image on illuminated object surface; This protection assembly 155 is transparent, and the one-body molded convex arc section 156 and circle teat 157 that has corresponding to this perforate 142 and this luminescence component 136, is used for protecting this sensing component 133, fixes this luminescence component 136 and lens moulding; This light path guiding mechanism makes the light of these luminescence component 136 emissions reflex to this sensing component 133 along a predetermined light paths.
Its manufacturing step is as follows: by the lead-in wire action this sensing component 133 is connected with in this conducting bracket 125, this sensing component 133 can be complementary matal-oxide semiconductor (CMOS, ComplemenuryMetal-Oxide Semiconductor) chip, or be photodiode (PD, or be photosensitive coupling component (CCD, Charge Coupled Device) Photo Diode),, or be photoelectricity frequency multiplier chips such as (PM, Photo Multiplier).Similarly this luminescence component 136 is located on this conducting bracket 125, this luminescence component 136 is light emitting diode or laser diode crystal grain, its emission wavelength scope can be connected to telecommunications by routing the pin of these sensing component 133 both sides from 400nm to 1000nm.Utilize aperture assembly implanted prosthetics that this aperture assembly 140 is combined with conducting bracket 125; Wherein, this aperture assembly 140 is fixed on (as Fig. 5 A and Fig. 5 B) on this conducting bracket 125 in the mode that embeds or bind, or these aperture assembly 140 one-body molded this conducting brackets 125 that are equivalent in, form (shown in Fig. 6 A and Fig. 6 B) by these conducting bracket 125 bendings; This this sensing component 133 of aperture assembly 140 cover caps, and be provided with this perforate 142 that should sensing component 133, purpose is for covering unnecessary veiling glare for this sensing component 133.This protection assembly 155 is epoxy resin (Epoxy), or be thermosetting plastics, utilization pours into a mould with epoxy resin or this thermosetting plastics and encapsulates, protects and fix all assemblies, and simultaneously one-body molded this convex arc section 156 and this circle teat 157 that similar optical lens is arranged; Pay special attention to known different be; this protection assembly 155 of this embodiment is protected this sensing component 133 and this luminescence component 136 in one-body molded mode at this conducting bracket 125; this protection assembly 155 provides the function of protection lens simultaneously, exempts the step and the increase combined tolerances that lens brought of required extra increase lens in the known skill.This convex arc section 156 of these sensing component 133 below moulding mainly is exactly the demand for imaging; And below luminescence component 136 the round teat 157 of institute's moulding, mainly be to concentrate light to use.See also preferred embodiment of the present invention shown in Figure 7, this optical module can then pass through the bending leg technology, bend this conducting bracket 125 one-body molded kinks 126 that downward bending is arranged, this luminescence component 136 is located on this kink 126, make this luminescence component 136 be predetermined angle theta bending, make the light of these luminescence component 136 emissions suitable angle squeeze into body surface, please consult Fig. 4 simultaneously.Wherein, the scope of this predetermined angle theta comprises that by 0 to 90 degree best suitable angular range comprises that by 60 to 70 degree causing these luminescence component 136 transmitting illuminants to the light projector angle of body surface or reflecting surface is 20 to 30 degree.
So optical module of the present invention can be avoided combined tolerances, improve image quality, be applied to more accurate image identification system, as fingerprint, red film identification etc.An Application Example as shown in Figure 8, an optical mouse 20 can be used two groups of optical modules of the present invention simultaneously, and one is used for reading positional information, and another then is used for the identification fingerprint.The optical module that reads positional information utilizes luminescence component 136 to provide illuminated object 30 surface source of lights; Sensing component 133 is used for detecting the image on illuminated object 30 surfaces; Protection assembly 155 is transparent, and respectively one-body molded convex arc section 156 and circle teat 157, is used for protecting this sensing component 133, fixes this luminescence component 136 and lens moulding; The optical module of identification fingerprint then utilizes luminescence component 136 ' to provide finger 40 surface source of lights; Sensing component 133 ' is used for detecting the image on finger 40 surfaces; Protection assembly 155 ' is protected this sensing component 133 ', is fixed this luminescence component 136 ' and lens moulding.The mobile message of the image that this two groups of optical modules obtained all can cooperate relevant design and reach simultaneously applied effect.The present invention can further apply to information household appliances (1A, Information Appliance), electronic product, safety management system etc.
Perhaps this light path guiding mechanism comprises and forms a microstructure that can change light path on this conducting bracket 125, then in this embodiment, then can omit the process that this conducting bracket 125 of bending is this predetermined angle theta.
See also Fig. 5 A and Fig. 5 B, decomposing schematic representation for imaging system of the present invention, this aperture assembly 140 is assembled to this conducting bracket 125, at first this sensing component 133 is fixed on this conducting bracket 125, then this sensing component 133 is being connected with this conducting bracket 125 and aperture assembly 140 is being inserted in this conducting bracket 125 visual as a whole assembly in the routing mode; This aperture assembly 140 can be made by metal or resistant to elevated temperatures plastic material.Perhaps as Fig. 6 A and Fig. 6 B, this aperture assembly 140 is made of one piece by these conducting bracket 125 bendings, and it is made for metal material then can be equal to this conducting bracket 125 in this aperture assembly 140.
Fig. 7 is the design diagram of polishing system in the preferred embodiment of the present invention, at first on this conducting bracket 125, go out the pothole of a bowl type, and has reflecting surface in this pothole, this luminescence component 136 is located in this pothole, by routing this luminescence component 136 is connected with this conducting bracket 125, via the round teat 157 that transparent resin forms these luminescence component 136 protections is lived, its function class is similar to lens, can change the lighting angle of this luminescence component 136, make light more concentrated; The light that the pothole of being gone out also can make this luminescence component 136 be sent is more concentrated.Follow technology by bending leg, this luminescence component 136 is this predetermined angle theta, these luminescence component 136 issued lights are beaten more efficiently at body surface, increase the efficient of optical system, in this preferred embodiment, the present invention is enhanced about more than once compared to the optical efficiency of this second known optical system.
Wherein, after these protection assembly 155 encapsulation, this conducting bracket 125 can be the conductive connecting pin that exposes plug-in unit pattern (DIP), as shown in Figure 4; After maybe should protecting assembly 155 encapsulation, this conducting bracket 125 can be the conductive connecting pin of the surface mount pattern (SMD) that exposes.
In sum, Organic Light Emitting Diode assembly of the present invention has following advantage:
1, this luminescence component 136 is shaped on this conducting bracket 125 with this sensing component 133, utilizing encapsulation technology to make again becomes an optical module, omits number of assembling steps, can avoid combined tolerances, improves image quality.
2, utilize these conducting bracket 125 bendings to make this luminescence component 136 be this predetermined angle theta, the optical loss that can avoid the synthetic photoconductive tube of lens combination to reduce, and then improve optical efficiency.
3, utilizing encapsulation technology to make becomes an optical module, causes grit to attach when avoiding assembling lower cover in addition, to improve product percent of pass, reduces production costs.
4, the use of the easy and encapsulation technology of reduction by production cost and the manufacturing technology size that can dwindle optical module of the present invention can significantly be expanded its application.
In sum, the present invention can reach its intended purposes and effect really, and the technological means of above-mentioned announcement only is a preferred embodiment of the present invention, and any modification and variation of doing according to spirit of the present invention, feature all should be contained in the scope of claims.
Claims (18)
1, a kind of optical module wherein comprises:
Conducting bracket;
Sensing component is connected with in this conducting bracket;
Aperture assembly, this sensing component of cover cap, this aperture assembly are provided with perforate that should sensing component;
Luminescence component is located at this conducting bracket;
The protection assembly encapsulates this luminescence component and this aperture assembly, and this protection assembly is transparent and is shaped on this conducting bracket, and this protection assembly projection has the convex arc section and circle teat that corresponds respectively to this perforate and this luminescence component; And
Light path guiding mechanism makes the light of this luminescence component emission reflex to this sensing component along a predetermined light paths.
2, optical module as claimed in claim 1 is characterized in that, this luminescence component is light emitting diode or laser diode crystal grain.
3, optical module as claimed in claim 1 is characterized in that, this sensing component is complementary matal-oxide semiconductor, or is photodiode, or is photosensitive coupling component, or is chips such as photoelectricity frequency multiplier.
4, optical module as claimed in claim 1 is characterized in that, this protection assembly is epoxy resin or is that thermosetting plastics is made.
5, optical module as claimed in claim 1 is characterized in that, this light path guiding mechanism comprises: with the one-body molded kink that downward bending is arranged of a predetermined angular, and be located at this luminescence component on this kink on the conducting bracket.
6, optical module as claimed in claim 5 is characterized in that, the scope of this predetermined angular comprises that by 60 to 70 degree causing this luminescence component transmitting illuminant to the light projector angle of object plane or reflecting surface is 20 to 30 degree.
7, optical module as claimed in claim 1 is characterized in that, this light path guiding mechanism comprises: form a microstructure that can change light path on this conducting bracket.
8, optical module as claimed in claim 1 is characterized in that, one-body molded this conducting bracket that is equivalent in of this aperture assembly is formed by this conducting bracket bending.
9, optical module as claimed in claim 1 is characterized in that, this aperture component groups is filled to this conducting bracket.
10, a kind of method for making of optical module, comprising:
Luminescence component and sensing component are fixed on the conducting bracket line lead of going forward side by side action;
To this conducting bracket, and make this perforate correspond to this sensing component in conjunction with an aperture assembly with perforate; And
Utilize transparent protection assembly to fix and encapsulate this luminescence component and this sensing component and be shaped on this conducting bracket, and be extruded with convex arc section and circle teat corresponding to this perforate and this luminescence component.
11, the method for making of optical module as claimed in claim 10 is characterized in that, further bend this protection component package after, the conductive connecting pin that this conducting bracket exposes makes to be the plug-in unit pattern.
12, the method for making of optical module as claimed in claim 10 is characterized in that, comprise this protection component package after, this conducting bracket is the conductive connecting pin of the surface mount pattern that exposes.
13, the method for making of optical module as claimed in claim 10 is characterized in that, this sensing component can be CMOS, CCD, PD, PM chip.
14, the method for making of optical module as claimed in claim 10 is characterized in that, the mode of this aperture assembly to embed or to bind is fixed on the conducting bracket.
15, the method for making of optical module as claimed in claim 10 is characterized in that, one-body molded this conducting bracket that is equivalent in of this aperture assembly is formed by this conducting bracket bending.
16, the method for making of optical module as claimed in claim 10 is characterized in that, comprises that pouring into a mould with epoxy resin or thermosetting natural gum encapsulates all component, and one-body molded this convex arc section and this circle teat that similar optical lens is arranged of while.
17, the method for making of optical module as claimed in claim 10 is characterized in that, comprises this conducting bracket of bending, makes this luminescence component be a predetermined angular.
18, the method for making of optical module as claimed in claim 17 is characterized in that, the scope of this predetermined angular comprises that by 60 to 70 degree causing luminescence component transmitting illuminant to the light projector angle of object plane or reflecting surface is 20 to 30 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100637069A CN100374993C (en) | 2004-07-07 | 2004-07-07 | Optical assembly structure and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100637069A CN100374993C (en) | 2004-07-07 | 2004-07-07 | Optical assembly structure and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1719395A true CN1719395A (en) | 2006-01-11 |
| CN100374993C CN100374993C (en) | 2008-03-12 |
Family
ID=35931241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100637069A Expired - Fee Related CN100374993C (en) | 2004-07-07 | 2004-07-07 | Optical assembly structure and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100374993C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8330094B2 (en) | 2009-01-16 | 2012-12-11 | Pixart Imaging Inc. | Optical sensing module and optical mouse with the same |
| CN101807589B (en) * | 2009-02-17 | 2013-03-06 | 原相科技股份有限公司 | Photosensitive module and optical mouse using same |
| CN103400787A (en) * | 2013-07-26 | 2013-11-20 | 无锡万银半导体科技有限公司 | Semiconductor-packaged MOUSE product carrier |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4751505A (en) * | 1986-06-23 | 1988-06-14 | Xerox Corporation | Optical mouse |
| KR100463430B1 (en) * | 2001-09-05 | 2004-12-23 | 삼성전기주식회사 | Structure of light-receiving part for optical mouse and optical mouse having the same |
| US20030142078A1 (en) * | 2002-01-29 | 2003-07-31 | Unity Opto Technology Co. Ltd. | Optical mouse for a personal computer |
| US6967321B2 (en) * | 2002-11-01 | 2005-11-22 | Agilent Technologies, Inc. | Optical navigation sensor with integrated lens |
-
2004
- 2004-07-07 CN CNB2004100637069A patent/CN100374993C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8330094B2 (en) | 2009-01-16 | 2012-12-11 | Pixart Imaging Inc. | Optical sensing module and optical mouse with the same |
| CN101807589B (en) * | 2009-02-17 | 2013-03-06 | 原相科技股份有限公司 | Photosensitive module and optical mouse using same |
| CN103400787A (en) * | 2013-07-26 | 2013-11-20 | 无锡万银半导体科技有限公司 | Semiconductor-packaged MOUSE product carrier |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100374993C (en) | 2008-03-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108401093B (en) | Image pickup module, molded photosensitive assembly thereof, manufacturing method of molded photosensitive assembly and electronic equipment | |
| US8130312B2 (en) | Reflowable camera module with integrated flash | |
| CN1314125C (en) | Module for optical apparatus and its mfg. method | |
| CN1182584C (en) | Optical device and its producing method and electronic device | |
| CN1275330C (en) | Optical module, circuit board and its electronic machine | |
| JP6876812B2 (en) | Lens group, camera module and its manufacturing method | |
| CN1577873A (en) | Solid-state imaging device and method for manufacturing the same | |
| CN1844966A (en) | Nonadjustable focusing type camera module | |
| KR102334464B1 (en) | Camera module, molded photosensitive assembly and manufacturing method thereof, and electronic device | |
| CN1880836A (en) | Backlight unit having light emitting diodes and method for manufacturing the same | |
| CN1822642A (en) | Camera module | |
| CN1742217A (en) | Illumination system using a plurality of light sources | |
| CN1574379A (en) | Solid-state imaging method and apparatus | |
| CN1169343C (en) | Line light source and image sensor using same | |
| JP2008258921A (en) | Solid-state imaging apparatus, and electronic equipment with same | |
| JP2008258949A (en) | Solid-state imaging apparatus | |
| CN110649047A (en) | Photosensitive chip packaging structure and forming method thereof | |
| JPH1184137A (en) | Linear illumination device and image reader using the same | |
| CN1812493A (en) | Lens unit used for camera module having optical filter therein | |
| CN209859155U (en) | Fingerprint identification device and electronic equipment | |
| CN1249991C (en) | Camera module | |
| CN1719395A (en) | Optical assembly structure and its manufacturing method | |
| JP4340697B2 (en) | Solid-state imaging device and electronic apparatus including the same | |
| JP2007194161A (en) | Linear light source device | |
| JP2011109495A (en) | Aligned module obtained including image sensor, focus driving apparatus, and driver circuit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: GUANGBAO SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20131212 Owner name: LITE-ON TECHNOLOGY (CHANGZHOU) CO., LTD. Free format text: FORMER OWNER: GUANGBAO SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20131212 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: TAIWAN, CHINA TO: 213166 CHANGZHOU, JIANGSU PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20131212 Address after: 213166 Wujin high tech Industrial Development Zone, Jiangsu Province, Yang Lake Road, No. 88 Patentee after: LITE-ON TECHNOLOGY (CHANGZHOU) CO., LTD. Patentee after: Lite-On Technology Corporation Address before: Taipei City, Taiwan, China Patentee before: Lite-On Technology Corporation |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080312 Termination date: 20170707 |