CN101807589B - Photosensitive module and optical mouse using same - Google Patents
Photosensitive module and optical mouse using same Download PDFInfo
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- CN101807589B CN101807589B CN2009100095265A CN200910009526A CN101807589B CN 101807589 B CN101807589 B CN 101807589B CN 2009100095265 A CN2009100095265 A CN 2009100095265A CN 200910009526 A CN200910009526 A CN 200910009526A CN 101807589 B CN101807589 B CN 101807589B
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Abstract
The invention relates to a photosensitive module and an optical mouse using the same. The sensitive module comprises a circuit board and a package, wherein the circuit board is provided with an upper surface and a lower surface which are opposite; the package is arranged on the lower surface of the circuit board and comprises a colloid, a photosensitive wafer and a pin; the colloid is provided with a transparent surface; the photosensitive wafer is arranged in the colloid, and the photosensitive surface of the photosensitive wafer is a transparent surface facing towards the colloid and used for receiving light rays; the pin is electrically connected with the photosensitive wafer and provided with a shoulder part which extends out of the colloid along the direction parallel to the photosensitive surface of the photosensitive wafer; and the shoulder part is fixed on the lower surface of the circuit board. The photosensitive module can be applied to the optical mouse. In the photosensitive module, the package is positioned on the lower surface of the circuit board and fixed with the lower surface of the circuit board via the shoulder part of the pin of the package, thus the assembly precision of the photosensitive module can be improved.
Description
Technical field
The present invention relates to a kind of sensitization module and use its optical mice, particularly relate to a kind of sensitization module of easy raising assembly precision and use its optical mice.
Background technology
See also shown in Figure 1, it is a kind of generalized section that has known optical mice now, optical mice 100, comprise housing 11 and the sensitization module 10 that is disposed in the housing 11, sensitization module 10 comprises circuit board (Printed Circuit Board, PCB) 12, packaging body 14, lens unit (Lens Unit) 15, circuit board bracing frame (PCB Rack) 16 and base plate 17, wherein base plate 17 links to each other with housing 11.The circuit board 12 of sensitization module 10 has upper surface 122, lower surface 124 and through hole 126, wherein upper surface 122 and lower surface 124 relative to each other, through hole 126 then runs through upper surface 122 and lower surface 124.Packaging body 14 is positioned at the top of through hole 126.
From the above, packaging body 14 comprises colloid 140, sensitization wafer 146 and pin (Lead Frame) 148, sensitization wafer 146 is packaged in the colloid 140, pin 148 and 146 electrical connections of sensitization wafer and via the side 144 of colloid 140 to colloid 140 extensions.Wherein, packaging body 14 is positioned the upper surface 122 of circuit board 12 by the transparent surface 142 of colloid 140.The part of pin 148 outside colloid 140 is to insert circuit boards 12 towards circuit board 12 bending from the upper surface 122 of circuit board 12, and passes lower surface 124 by scolder 13 it is welded on the lower surface 124 of circuit board 12.Lens unit 15 is positioned at the below of through hole 126, and is fixed on the base plate 17.16 of circuit board bracing frames are supported between circuit board 12 and the base plate 17.
As shown in Figure 1, when the object (for example mouse mat) that contacts when optical mice 100 bottoms is reflected back optics slide-mouse 100 inside with light 110, can focus on sensitization wafer 146.Therefore, when optical mice 100 moved, its motion track just can be registered as the coherent image of one group of high-speed capture.Variation to characteristic point position on these images is analyzed, and just can judge moving direction and the displacement of optical mice 100, and then the location of finishing vernier.
Yet, when assembling optical mice 100, error, position height error, the thickness error of circuit board 12 and the height error of circuit board bracing frame 16 of sensitization wafer 146 in colloid 140 that colloid 140 produces because of distortion, all can affect the precision of sensitization wafer 146 that the focal length according to lens unit 15 sets and the space D of lens unit 15, and be unfavorable for that light focusing is to sensitization wafer 146.Therefore, how to reduce rigging error, improve assembly precision, thereby promote light focusing to the accuracy of sensitization wafer 146, one of subject under discussion of paying attention to for the personnel of association area in fact.
This shows that above-mentioned existing sensitization module and optical mice obviously still have inconvenience and defective, and demand urgently further being improved in structure and use.For solving the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, finished by development but have no for a long time applicable design always, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious wish of relevant dealer solves.Therefore how to found a kind of sensitization module and optical mice of new structure, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing sensitization module and optical mice exist, the inventor is based on being engaged in for many years abundant practical experience and professional knowledge of this type of product design manufacturing, and cooperate scientific principle to use, positive research and innovation in addition, in the hope of founding a kind of novel sensitization module and using its optical mice, can improve general existing sensitization module and optical mice, make it have more practicality.Through constantly research, design, and through after repeatedly studying sample and improvement, finally create the present invention who has practical value.
Summary of the invention
The object of the invention is to, overcome the defective that existing sensitization module exists, and a kind of sensitization module of new structure is provided, technical problem to be solved is to make it have high assembly precision, is very suitable for practicality.
Another object of the present invention is to, overcome the defective that existing optical mice exists, and a kind of optical mice of new structure is provided, technical problem to be solved is to make its light that exterior object can be reflected focus to exactly the sensitization wafer, thereby more is suitable for practicality.
The object of the invention to solve the technical problems is to adopt following technical scheme to realize.According to a kind of sensitization module that the present invention proposes, it comprises: a circuit board has relative a upper surface and a lower surface; One packaging body is disposed at this lower surface of this circuit board; One base plate is positioned at the below of this packaging body; One lens unit is disposed on this base plate; And a circuit board bracing frame, be equipped between this base plate and this circuit board, to support this circuit board.This packaging body comprises: colloid has a transparent surface; One sensitization wafer, it is inner to be arranged at this colloid, and the photosurface of this sensitization wafer is used for receiving a light in the face of this transparent surface of this colloid; And a pin, with this sensitization wafer electrical connection, this pin has a shoulder, and this shoulder extends outside this colloid along the direction that is parallel to this photosurface of this sensitization wafer, and this shoulder is fixed in this lower surface of this circuit board.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid sensitization module, this lower surface of wherein said circuit board has an accommodation hole, and this packaging body is partly to be embedded in this accommodation hole.
Aforesaid sensitization module, wherein said accommodation hole run through this lower surface and this upper surface.
Aforesaid sensitization module, wherein said pin has more a junction, wears this circuit board from the outer end of this shoulder along extending perpendicular to the direction of this lower surface.
Aforesaid sensitization module, wherein said packaging body more comprises a light source, is suitable for sending this light.
It is inner that aforesaid sensitization module, wherein said light source are positioned at this colloid, and this light source equates with the height of this sensitization wafer with respect to this transparent surface with respect to the height of this transparent surface.
Aforesaid sensitization module, wherein said lens unit are disposed on the path that this light is passed to this sensitization wafer.
The object of the invention to solve the technical problems also realizes by the following technical solutions.According to a kind of optical mice that the present invention proposes, it comprises: a housing; And a sensitization module, be equipped in this housing.This sensitization module comprises: a circuit board has relative a upper surface and a lower surface; One packaging body is disposed at this lower surface of this circuit board; One base plate is positioned at the below of this packaging body; One lens unit is disposed on this base plate; And a circuit board bracing frame, be equipped between this base plate and this circuit board, to support this circuit board.This packaging body comprises: colloid has a transparent surface; One sensitization wafer, it is inner to be arranged at this colloid, and the photosurface of this sensitization wafer is used for receiving a light in the face of this transparent surface of this colloid; And a pin, with this sensitization wafer electrical connection, this pin has a shoulder, and this shoulder extends outside this colloid along the direction that is parallel to this photosurface of this sensitization wafer, and this shoulder is fixed in this lower surface of this circuit board.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid optical mice, this lower surface of wherein said circuit board has an accommodation hole, and this packaging body is partly to be embedded in this accommodation hole.
Aforesaid optical mice, wherein said accommodation hole run through this lower surface and this upper surface.
Aforesaid optical mice, wherein said this pin has more a junction, wears this circuit board from the outer end of this shoulder along extending perpendicular to the direction of this lower surface.
Aforesaid optical mice, wherein said packaging body more comprises a light source, is suitable for sending this light.
It is inner that aforesaid optical mice, wherein said light source are positioned at this colloid, and this light source equates with the height of this sensitization wafer with respect to this transparent surface with respect to the height of this transparent surface.
Aforesaid optical mice, wherein said lens unit are disposed on the path that this light is passed to this sensitization wafer.
The present invention compared with prior art has obvious advantage and beneficial effect.By above technical scheme as can be known, main technical content of the present invention is as follows:
For achieving the above object, the invention provides a kind of sensitization module, it comprises circuit board and packaging body.Circuit board has relative upper surface and lower surface.Packaging body is disposed at the lower surface of circuit board, and packaging body comprises colloid, sensitization wafer and pin.Colloid has transparent surface, and the sensitization wafer is arranged at colloid inside, and the photosurface of sensitization wafer is the transparent surface in the face of colloid, is used for receiving light.Pin and the electrical connection of sensitization wafer, it has a shoulder, and shoulder extends outside the colloid along the direction that is parallel to the photosurface of sensitization wafer, and shoulder is the lower surface that is fixed in circuit board.
In addition, for achieving the above object, the present invention also provides a kind of optical mice that uses the sensitization module in addition, and it comprises housing and is equipped on the interior above-mentioned sensitization module of housing.
By technique scheme, sensitization module of the present invention and use its optical mice to have at least following advantages and beneficial effect: at sensitization module of the present invention and use in its optical mice, packaging body is the lower surface that is positioned circuit board, and fix by the shoulder of pin and the lower surface of circuit board, therefore in the assembling process of sensitization module, error and the circuit board thickness error that can avoid the colloid distortion to produce cause bad impact to assembly precision, and then be conducive to improve assembly precision, can promote the accuracy of light focusing in the sensitization wafer.
In sum, the invention relates to a kind of sensitization module and use its optical mice that the sensitization module comprises circuit board and packaging body.Circuit board has relative upper surface and lower surface.Packaging body is disposed at the lower surface of circuit board, and packaging body comprises colloid, sensitization wafer and pin.Colloid has transparent surface, and the sensitization wafer is arranged at colloid inside, and the photosurface of sensitization wafer is the transparent surface in the face of colloid, is used for receiving light.Pin and the electrical connection of sensitization wafer, it has a shoulder, and shoulder extends outside the colloid along the direction that is parallel to the photosurface of sensitization wafer, and shoulder is the lower surface that is fixed in circuit board.This sensitization module can be applicable to an optical mice.Above-mentioned sensitization module is the lower surface that packaging body is positioned circuit board, and fixes by the shoulder of the pin of packaging body and the lower surface of circuit board, therefore can improve the assembly precision of sensitization module.Sensitization module of the present invention has high assembly precision, and the light that optical mice of the present invention can reflect exterior object focuses to the sensitization wafer exactly, is very suitable for practicality.The present invention has above-mentioned plurality of advantages and practical value, no matter it all has larger improvement on product structure or function, significant progress is arranged technically, and produced handy and practical effect, and more existing sensitization module and optical mice have the outstanding effect of enhancement, thereby more being suitable for practicality, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above and other purpose of the present invention, feature and advantage can be become apparent, below especially exemplified by preferred embodiment, and the cooperation accompanying drawing, be described in detail as follows.
Description of drawings
Fig. 1 is a kind of generalized section that has known optical mice now.
Fig. 2 is the generalized section of sensitization module in the first embodiment of the invention.
Fig. 3 is the generalized section of sensitization module in the second embodiment of the invention.
Fig. 4 is the generalized section of sensitization module in the third embodiment of the invention.
Fig. 5 is the generalized section of optical mice in one embodiment of the invention.
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, the sensitization module that foundation the present invention is proposed and its embodiment of optical mice, structure, feature and the effect thereof of using it are described in detail as follows.
Relevant aforementioned and other technology contents of the present invention, Characteristic can be known to present in the following detailed description that cooperates with reference to graphic preferred embodiment.By the explanation of embodiment, when can being to reach technological means and the effect that predetermined purpose takes to get one more deeply and concrete understanding to the present invention, yet appended graphic only provide with reference to the usefulness of explanation, the present invention is limited.
Seeing also shown in Figure 2ly, is the generalized section of sensitization module in the first embodiment of the invention.The sensitization module 20 of the present invention's the first preferred embodiment comprises circuit board 22 and packaging body 24, and wherein circuit board 22 has relative upper surface 222 and lower surface 224.Packaging body 24 comprises colloid 240, sensitization wafer 246 and pin 248.Wherein, colloid 240 side 244 that has transparent surface 242 and link to each other with transparent surface 242.Sensitization wafer 246 is positioned at the inside of colloid 240, and its photosurface 2462 is in the face of transparent surface 242, in order to receive the light 210 of incident sensitization module 20.For instance, light 210 for example is to be positioned at the light that the object (not shown) of sensitization module 20 outsides reflects.
From the above, pin 248 and 246 electrical connections of sensitization wafer, and have shoulder 2482, and shoulder 2482 along the direction of the photosurface 2462 that is parallel to sensitization wafer 246 via the side 244 of colloid 240 to colloid 240 extensions.It should be noted that packaging body 24 namely is the lower surface 224 that is fixed in circuit board 22 by shoulder 2482.
In the present embodiment, pin 248 is the lower surfaces 224 that are fixedly welded on circuit board 22 by scolder 23.In addition, circuit board 22 also has accommodation hole 226, and it for example is the through hole that runs through upper surface 222 and lower surface 224.24 of packaging bodies can partly be embedded in the accommodation hole 226.
It is worth mentioning that sensitization module 20 also can comprise lens unit 25, circuit board bracing frame 26 and base plate 27.Wherein, lens unit 25 is disposed on the path that light 210 is passed to sensitization wafer 246.Specifically, lens unit 25 is disposed on the base plate 27 that is located at packaging body 24 belows, so that the light 210 that exterior object reflects focuses on sensitization wafer 246.26 of circuit board bracing frames are equipped between base plate 27 and the circuit board 22, in order to support circuit plate 22.
From the above, packaging body 24 is the lower surfaces 224 that are positioned circuit board 22, and is fixed in the lower surface 224 of circuit board 22 by the shoulder 2482 of its pin 248, to reduce the influencing factor of sensitization wafer 246 and the precision of the space D of lens unit 25.In other words, in sensitization module 20 assembling process, except can removing the impact of circuit board thickness error on assembly precision, can also avoid the colloid 240 of packaging body 24 because of the error that distortion produces assembly precision to be caused bad impact, and then be conducive to improve assembly precision, promote the accuracy that light 210 focuses to sensitization wafer 246.
Seeing also shown in Figure 3ly, is the generalized section of sensitization module in the second embodiment of the invention.The present invention's the second better preferred embodiment sensitization module 30, similar to above-mentioned sensitization module 20, below will be illustrated for both different places.
The pin 348 of packaging body 34 has shoulder 3482 and connecting portion 3484, wherein shoulder 3482 along the direction of the photosurface 3462 that is parallel to sensitization wafer 346 via the side 344 of colloid 340 to colloid 340 extensions, and be fixed in the lower surface 324 of circuit board 32.Extend along the direction perpendicular to lower surface 324 3484 outer ends from shoulder 3482 of connecting portion, and wear the lower surface 324 and upper surface 322 of circuit board 32.
Seeing also shown in Figure 4ly, is the generalized section of sensitization module in the third embodiment of the invention.The present invention's the 3rd better preferred embodiment sensitization module 40, similar to above-mentioned sensitization module 30, below will be illustrated for both different places.
The packaging body 44 of sensitization module 40 more comprises light source 447, and it is disposed at colloid 440 inside, and light source 447 equates with the height of sensitization wafer 446 with respect to transparent surface 442 with respect to the height of the transparent surface 442 of colloid 440.Give an actual example, the light 410a that sends when light source 447 exposes to the object (mouse mat for example of sensitization module 40 outsides through lens unit 45, figure does not show) time, the light 410b that part is reflected by the object back sensitization module 40 can focus on via lens unit 45 sensitization wafer 446.It is worth mentioning that, lens unit 45 can be made of the eyeglass more than two, wherein an eyeglass is arranged on light 410a and is incident upon on the transmission path of exterior object from light source 447, another eyeglass then is arranged on light 410b and reflexes on the transmission path of sensitization wafer 446 from exterior object, but the present invention is not as limit.
Have the knack of this skill person and more understand the present invention for making, below the application of sensitization module of the present invention will be described for embodiment, but it is not to limit the present invention.Seeing also shown in Figure 5ly, is the generalized section of optical mice in one embodiment of the invention.Optical mice 200 comprises housing 21 and sensitization module 20, and wherein sensitization module 20 is equipped in the housing 21, and the base plate 27 of sensitization module 20 links to each other with housing 21.Preamble has described composed component and the operating mechanism of sensitization module 20 in detail, so locate to repeat no more.It is worth mentioning that in optical mice 200, sensitization module 20 also can be substituted by above-mentioned sensitization module 30 or sensitization module 40.
In sum, at sensitization module of the present invention and use in its optical mice, packaging body is the lower surface that is positioned circuit board, and fix by the shoulder of pin and the lower surface of circuit board, therefore in the assembling process of sensitization module, error and the circuit board thickness error that can avoid the colloid distortion of packaging body own to produce cause bad impact to assembly precision, and then are conducive to improve assembly precision, can promote light focusing in the accuracy of sensitization wafer.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, although the present invention discloses as above with preferred embodiment, yet be not to limit the present invention, any those skilled in the art, within not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be not break away from the technical solution of the present invention content, any simple modification that foundation technical spirit of the present invention is done above embodiment, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (15)
1. sensitization module is characterized in that it comprises:
One circuit board has relative a upper surface and a lower surface;
One packaging body be disposed at this lower surface of this circuit board, and this packaging body comprises:
Colloid has a transparent surface;
One sensitization wafer, it is inner to be arranged at this colloid, and the photosurface of this sensitization wafer is used for receiving a light in the face of this transparent surface of this colloid; And
One pin, with this sensitization wafer electrical connection, this pin has a shoulder, and this shoulder extends outside this colloid along the direction that is parallel to this photosurface of this sensitization wafer, and this shoulder is fixed in this lower surface of this circuit board;
One base plate is positioned at the below of this packaging body;
One lens unit is disposed on this base plate; And
One circuit board bracing frame is equipped between this base plate and this circuit board, to support this circuit board.
2. sensitization module according to claim 1 it is characterized in that this lower surface of wherein said circuit board has an accommodation hole, and this packaging body is partly to be embedded in this accommodation hole.
3. sensitization module according to claim 2 is characterized in that wherein said accommodation hole runs through this lower surface and this upper surface.
4. sensitization module according to claim 1 is characterized in that wherein said pin has more a junction, wears this circuit board from the outer end of this shoulder along extending perpendicular to the direction of this lower surface.
5. sensitization module according to claim 1 is characterized in that wherein said packaging body more comprises a light source, is suitable for sending this light.
6. sensitization module according to claim 5, it is inner to it is characterized in that wherein said light source is positioned at this colloid, and this light source equates with the height of this sensitization wafer with respect to this transparent surface with respect to the height of this transparent surface.
7. sensitization module according to claim 1 is characterized in that wherein said lens unit is disposed on the path that this light is passed to this sensitization wafer.
8. optical mice is characterized in that it comprises:
One housing; And
One sensitization module is equipped in this housing, and this sensitization module comprises:
One circuit board has relative a upper surface and a lower surface;
One packaging body be disposed at this lower surface of this circuit board, and this packaging body comprises:
Colloid has a transparent surface;
One sensitization wafer, it is inner to be arranged at this colloid, and the photosurface of this sensitization wafer is used for receiving a light in the face of this transparent surface of this colloid; And
One pin, with this sensitization wafer electrical connection, this pin has a shoulder, and this shoulder extends outside this colloid along the direction that is parallel to this photosurface of this sensitization wafer, and this shoulder is fixed in this lower surface of this circuit board;
One base plate is positioned at the below of this packaging body;
One lens unit is disposed on this base plate; And
One circuit board bracing frame is equipped between this base plate and this circuit board, to support this circuit board.
9. optical mice according to claim 8 it is characterized in that this lower surface of wherein said circuit board has an accommodation hole, and this packaging body is partly to be embedded in this accommodation hole.
10. optical mice according to claim 9 is characterized in that wherein said accommodation hole runs through this lower surface and this upper surface.
11. optical mice according to claim 8 is characterized in that wherein said this pin has more a junction, wears this circuit board from the outer end of this shoulder along extending perpendicular to the direction of this lower surface.
12. optical mice according to claim 8 is characterized in that wherein said packaging body more comprises a light source, is suitable for sending this light.
13. optical mice according to claim 12, it is inner to it is characterized in that wherein said light source is positioned at this colloid, and this light source equates with the height of this sensitization wafer with respect to this transparent surface with respect to the height of this transparent surface.
14. optical mice according to claim 8 is characterized in that wherein said lens unit is disposed on the path that this light is passed to this sensitization wafer.
15. optical mice according to claim 14 is characterized in that the below that wherein said base plate is positioned at this packaging body links to each other with this housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100095265A CN101807589B (en) | 2009-02-17 | 2009-02-17 | Photosensitive module and optical mouse using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100095265A CN101807589B (en) | 2009-02-17 | 2009-02-17 | Photosensitive module and optical mouse using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101807589A CN101807589A (en) | 2010-08-18 |
| CN101807589B true CN101807589B (en) | 2013-03-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2009100095265A Active CN101807589B (en) | 2009-02-17 | 2009-02-17 | Photosensitive module and optical mouse using same |
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| CN (1) | CN101807589B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104978052B (en) * | 2014-04-10 | 2018-03-27 | 原相科技股份有限公司 | The electronic installation of high electrostatic protection |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1402186A (en) * | 2001-08-14 | 2003-03-12 | 三星电机株式会社 | Upper chip for secondary board of optic mouse |
| CN1719395A (en) * | 2004-07-07 | 2006-01-11 | 光宝科技股份有限公司 | Optical assembly structure and its manufacturing method |
-
2009
- 2009-02-17 CN CN2009100095265A patent/CN101807589B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1402186A (en) * | 2001-08-14 | 2003-03-12 | 三星电机株式会社 | Upper chip for secondary board of optic mouse |
| CN1719395A (en) * | 2004-07-07 | 2006-01-11 | 光宝科技股份有限公司 | Optical assembly structure and its manufacturing method |
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| Publication number | Publication date |
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| CN101807589A (en) | 2010-08-18 |
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