CN1699282A - Preparation of monodisperse spherical cerium oxide and its application in high precision polishing - Google Patents

Preparation of monodisperse spherical cerium oxide and its application in high precision polishing Download PDF

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Publication number
CN1699282A
CN1699282A CN 200510040459 CN200510040459A CN1699282A CN 1699282 A CN1699282 A CN 1699282A CN 200510040459 CN200510040459 CN 200510040459 CN 200510040459 A CN200510040459 A CN 200510040459A CN 1699282 A CN1699282 A CN 1699282A
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preparation
cerium oxide
polishing
monodisperse spherical
urea
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CN100351179C (en
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陈志刚
陈建清
陈杨
李霞章
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Jiangsu Polytechnic University
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Jiangsu Polytechnic University
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Abstract

The invention relates to the preparation of monodisperse spherical cerium oxide and its application in high precision polishing, wherein the preparation comprises weighing a definite quantity of cerium salt and urea, dissolving in distilled water, mixing the two solutions and stirring homogeneously with an electric mixer, wherein the concentration of Ce3+ in the total solution is between 0.005-0.1mol/l, the mol ratio of urea and cerium salt is between 10 : 1 - 100 : 1, sealing the mixed solution and heating 1-3h at the temperature of 70-90 deg. C, taking out for cooling down and stewing, ageing 0.5-12 hours at room temperature, filtering, washing the precipitate, drying and calcining 0.5-3h at 200-800 deg. C, thus obtaining CeO2 powder. Preparing polishing liquid from the obtained powder, finally polishing the silicon wafers with polishing machines.

Description

The preparation method of monodisperse spherical cerium oxide and the purposes in high precision polishing thereof
Technical field
The present invention relates to superfine powder preparation and Application Areas thereof, refer in particular to the preparation method of monodisperse spherical cerium oxide and the purposes in high precision polishing thereof.
Background technology
CeO 2Use as polishing material has had very long history, is widely used in the chemically machinery polished of precision glass polishing and super large-scale integration silica dioxide medium layer, than Al 2O 3Abrasive material and SiO 2Abrasive material, CeO 2Abrasive material has that the glazed surface roughness is low, the polishing efficiency advantages of higher.In high precision polishing, the granularity of powder, pattern and distributing homogeneity thereof have played significant feature, and particle is thin more, and be subsphaeroidal more, and it is even more to distribute, and then polishing effect is good more.The superfine powder technology of preparing, reaches its maturity making significant progress aspect preparation high pure and ultra-fine, the high reactivity powder through years of development simultaneously.Along with development of science and technology, at present the ultra-fine powder technology direction that begun to surpass pattern and controllable particle size distribution develops, but the pattern of superfine powder and size distribution are controlled in theory and also have difficulties with technical, relevant submicron order spherical rare-earth oxide compound CeO 2The preparation method yet there are no report.
Summary of the invention
The present invention is a raw material with cerium salt and urea, adopts sluggish precipitation technology to synthesize, by optimization cerium salt concn, and the molar ratio of urea and cerium salt, processing parameters such as reaction, calcination condition are controlled CeO 2The pattern of powder and size-grade distribution, thus obtain that monodispersity is good, granularity is at the cerium oxide powder particle of submicron order, and it is configured to the chemically machinery polished that polishing fluid is used for silicon single crystal flake, obtained the extremely low super-smooth surface of roughness.
Specific embodiment of the present invention is: take by weighing a certain amount of cerium salt and urea and be dissolved in respectively in the distilled water, stir with two kinds of solution mixing and with electric mixer.Ce wherein 3+Concentration range with respect to total solution is 0.005~0.1mol/l, urea and cerium salt mol ratio are between 10: 1~100: 1, under 70 ℃~90 ℃ temperature, heat 1~3h behind the mixing solutions good seal, take out cooling and leave standstill, ageing at room temperature 0.5~12 hour is filtered, throw out is after washing, carry out drying, at 200 ℃~800 ℃ calcining 0.5~3h, obtain CeO again 2Powder.
Cerium salt be in cerous nitrate, cerous sulfate, the cerous carbonate any.
Described Ce 3+Between 0.01~0.08, urea and cerium salt mol ratio effect between 20: 1~80: 1 are better with respect to the concentration range of total solution.
Get the powder that makes and be mixed with polishing fluid, the controlling quality percentage concentration transfers to 9~11 with ammoniacal liquor with the polishing fluid pH value between 1wt%~3wt%, adopts polishing machine that silicon wafer is polished.
The present invention has adopted comparatively simple chemical technology to prepare the goodish cerium oxide powder of monodispersity, need not complex apparatus, required chemical feedstocks kind is few, favorable repeatability, bigger industrial promotional value is arranged, simultaneously because its granule-morphology is spherical, and granulometric facies are when little (at submicron order), the quite high silicon wafer polishing of surperficial specification of quality had bigger superiority, show as the damage of as far as possible little top layer and sublayer, surface residual stress is minimum, and plane of crystal has complete crystalline structure.
Description of drawings
Fig. 1 is the sem photograph in the 1um scale scope
Fig. 2 is the sem photograph in the 0.5um scale scope
Fig. 3 is polishing back two-dimensional surface figure
Fig. 4 is a 3 dimensional drawing
Embodiment
The present invention is described in further detail below in conjunction with embodiment:
Embodiment 1: each disposes Ce (NO 3) 3With urea soln 500ml, wherein [Ce 3+]=0.04mol/l, urea and cerous nitrate mol ratio are 40: 1, two kinds of solution are mixed and stir, put into 85 ℃ of waters bath with thermostatic control and heat 2h, take out cooling and leave standstill, ageing 2h under the room temperature, throw out distilled water wash 3 times, absolute ethanol washing 1 time is put into baking oven and is dried, put into 600 ℃ of calcining furnaces again and calcine 2h, grind fully to powder the cooling back.Get the solution that certain powder is configured to 100ml, the solute mass concentration is 1wt%, add ammoniacal liquor and regulate pH value to 9, at certain polish pressure (2N), rotating speed (200rmp) with under the time (25min), use U.S. Buehler PHOENIX BETA type polishing machine polishes silicon wafer.Polished the back silicon wafer surface has been cleaned, got small pieces and under atomic force microscope, observe.
The CeO that makes by the processing parameter of embodiment 1 2The sem photograph of powder sample as shown in Figure 1 and Figure 2, wherein Fig. 1 is the SEM figure in the 1um scale scope, Fig. 2 be that the SEM in the 0.5um scale scope schemes.Therefrom as can be seen, particle size distribution is very even, is the sphere of rule, and median size is about 300nm.
Silicon wafer polishing rear surface atomic power microgram such as Fig. 3, Fig. 4.Wherein Fig. 3 is polishing back two-dimensional surface figure, and Fig. 4 is a 3 dimensional drawing.Test result shows that surperficial 2 mu m range internal surface machine rugosity Ra values are 0.204nm, and roughness root mean square value RMS value is 0.308nm.
Embodiment 2: change solution parameter [Ce 3+] be 0.01mol/1, urea and cerous nitrate mol ratio are 15: 1, heat 3h in 70 ℃ of water-baths, ageing 0.5h calcines 3h down at 200 ℃.Get an amount of powder and be configured to solution, the solute mass concentration is 1.5wt%, adds ammoniacal liquor and regulates pH value to 10, follow-up glossing such as embodiment 1.
Embodiment 3: cerium salt is cerous sulfate, changes solution parameter [Ce 3+] be 0.1mol/l, urea and cerous sulfate mol ratio are 60: 1, heat 2.5h in 80 ℃ of water-baths, ageing 8h calcines 2.5h down at 400 ℃.Get an amount of powder and be configured to solution, the solute mass concentration is 2wt%, adds ammoniacal liquor and regulates pH value to 10.5, and follow-up glossing is the same.
Embodiment 4: cerium salt is cerous carbonate, changes solution parameter [Ce 3+] be 0.2mol/l, urea and cerous carbonate mol ratio are 100: l, in 90 ℃ of water-baths, heat 1h, ageing 12h calcines 0.5h down at 800 ℃.Get an amount of powder and be configured to solution, the solute mass concentration is 3wt%, adds ammoniacal liquor and regulates pH value to 11, and follow-up glossing is the same.

Claims (5)

1. the preparation method of monodisperse spherical cerium oxide is characterized in that taking by weighing a certain amount of cerium salt and urea and is dissolved in respectively in the distilled water, stirs with two kinds of solution mixing and with electric mixer, wherein Ce 3+Concentration range with respect to total solution is 0.005~0.1mol/l, urea and cerium salt mol ratio are between 10: 1~100: 1, under 70 ℃~90 ℃ temperature, heat 1~3h behind the mixing solutions good seal, take out cooling and leave standstill, ageing at room temperature 0.5~12 hour is filtered, throw out is after washing, carry out drying, at 200 ℃~800 ℃ calcining 0.5~3h, obtain CeO again 2Powder.
2. the preparation method of monodisperse spherical cerium oxide according to claim 1 is characterized in that: cerium salt be in cerous nitrate, cerous sulfate, the cerous carbonate any.
3. the preparation method of monodisperse spherical cerium oxide according to claim 1 is characterized in that: described Ce 3+Concentration range with respect to total solution is better between 0.01~0.08.
4, the preparation method of monodisperse spherical cerium oxide according to claim 1 is characterized in that: urea and cerium salt mol ratio are better between 20: 1~80: 1.
5. the purposes of monodisperse spherical cerium oxide in high precision polishing, it is characterized in that getting the powder that makes and be mixed with polishing fluid, the controlling quality percentage concentration transfers to 9~11 with ammoniacal liquor with the polishing fluid pH value between 1wt%~3wt%, adopt polishing machine that silicon wafer is polished.
CNB2005100404595A 2005-06-09 2005-06-09 Preparation of monodisperse spherical cerium oxide and its application in high precision polishing Expired - Fee Related CN100351179C (en)

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101284983B (en) * 2007-04-12 2011-10-19 北京有色金属研究总院 Superfine and spheroidizing rare-earth polish and preparing process thereof
CN105251421A (en) * 2015-11-19 2016-01-20 天津城建大学 Low-temperature preparation method for micron cerium oxide micro-ball
CN106362657A (en) * 2016-08-30 2017-02-01 虔东稀土集团股份有限公司 Reaction device and method for preparing superfine rare earth compound through same
CN106590442A (en) * 2017-01-22 2017-04-26 海城海美抛光材料制造有限公司 Preparation method of cerium dioxide polishing powder liquid
CN111117566A (en) * 2018-10-31 2020-05-08 信越化学工业株式会社 Polishing particle for polishing synthetic quartz glass substrate, method for producing same, and method for polishing synthetic quartz glass substrate
CN113120940A (en) * 2019-12-30 2021-07-16 安集微电子科技(上海)股份有限公司 Spherical cerium carbonate and synthesis method of cerium oxide
CN115849430A (en) * 2022-12-29 2023-03-28 清华大学 Preparation method of monodisperse nano cerium oxide, nano cerium oxide grinding fluid and application thereof
WO2023125890A1 (en) * 2021-12-30 2023-07-06 安集微电子科技(上海)股份有限公司 Method for synthesizing cerium oxide, cerium oxide, and chemical mechanical polishing solution

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JP3411255B2 (en) * 2000-05-29 2003-05-26 株式会社ユニレック Premium management system for game consoles

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101284983B (en) * 2007-04-12 2011-10-19 北京有色金属研究总院 Superfine and spheroidizing rare-earth polish and preparing process thereof
CN105251421A (en) * 2015-11-19 2016-01-20 天津城建大学 Low-temperature preparation method for micron cerium oxide micro-ball
CN106362657A (en) * 2016-08-30 2017-02-01 虔东稀土集团股份有限公司 Reaction device and method for preparing superfine rare earth compound through same
CN106590442A (en) * 2017-01-22 2017-04-26 海城海美抛光材料制造有限公司 Preparation method of cerium dioxide polishing powder liquid
CN111117566A (en) * 2018-10-31 2020-05-08 信越化学工业株式会社 Polishing particle for polishing synthetic quartz glass substrate, method for producing same, and method for polishing synthetic quartz glass substrate
TWI819131B (en) * 2018-10-31 2023-10-21 日商信越化學工業股份有限公司 Polishing particles for polishing synthetic quartz glass substrate, method for manufacturing the polishing particles, and method for polishing synthetic quartz glass substrate
CN113120940A (en) * 2019-12-30 2021-07-16 安集微电子科技(上海)股份有限公司 Spherical cerium carbonate and synthesis method of cerium oxide
WO2023125890A1 (en) * 2021-12-30 2023-07-06 安集微电子科技(上海)股份有限公司 Method for synthesizing cerium oxide, cerium oxide, and chemical mechanical polishing solution
CN115849430A (en) * 2022-12-29 2023-03-28 清华大学 Preparation method of monodisperse nano cerium oxide, nano cerium oxide grinding fluid and application thereof

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