CN1690437A - Pump, cooler, and electronic device - Google Patents

Pump, cooler, and electronic device Download PDF

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Publication number
CN1690437A
CN1690437A CNA2005100634864A CN200510063486A CN1690437A CN 1690437 A CN1690437 A CN 1690437A CN A2005100634864 A CNA2005100634864 A CN A2005100634864A CN 200510063486 A CN200510063486 A CN 200510063486A CN 1690437 A CN1690437 A CN 1690437A
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CN
China
Prior art keywords
pump
resin
main body
pipeline
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2005100634864A
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Chinese (zh)
Inventor
富冈健太郎
畑由喜彦
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Toshiba Corp
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Toshiba Corp
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Filing date
Publication date
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Publication of CN1690437A publication Critical patent/CN1690437A/en
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/40—Casings; Connections of working fluid
    • F04D29/42—Casings; Connections of working fluid for radial or helico-centrifugal pumps
    • F04D29/426—Casings; Connections of working fluid for radial or helico-centrifugal pumps especially adapted for liquid pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/02—Selection of particular materials
    • F04D29/026—Selection of particular materials especially adapted for liquid pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
    • F05D—INDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS
    • F05D2300/00—Materials; Properties thereof
    • F05D2300/40—Organic materials
    • F05D2300/43—Synthetic polymers, e.g. plastics; Rubber
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F05—INDEXING SCHEMES RELATING TO ENGINES OR PUMPS IN VARIOUS SUBCLASSES OF CLASSES F01-F04
    • F05D—INDEXING SCHEME FOR ASPECTS RELATING TO NON-POSITIVE-DISPLACEMENT MACHINES OR ENGINES, GAS-TURBINES OR JET-PROPULSION PLANTS
    • F05D2300/00—Materials; Properties thereof
    • F05D2300/60—Properties or characteristics given to material by treatment or manufacturing
    • F05D2300/615—Filler

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)

Abstract

According to one embodiment, a pump housing comprises a heat receiving plate which is thermally coupled to a CPU, and a pump chamber. An impeller to be rotated by a motor is provided in the pump chamber. At least a part of the pump housing is made of resin containing at least one of metal filler, filler of material having lower linear expansion coefficient than the resin, and filler of material having lower water-vapor transmissivity than the resin.

Description

Pump, cooler and electronic equipment
Technical field
Embodiments of the invention relate to the pump that is applied in the liquid cooling type cooler, and this cooler cools off heater element such as central processing unit (CPU) (CPU) by using liquid coolant.The invention still further relates to cooler with this pump, and the electronic equipment with this cooler.
Background technique
Along with processing rate and polyfunctional reinforcement, be used in CPU in the electronic equipment and be in operation and produced ever-increasing heat.In recent years, take some countermeasures by the generation to this heat, electronic equipment has been put into by the liquid coolant that uses the particular thermal coefficient to be significantly higher than air and has been cooled off in the middle of the application of CPU.The cooling of this electronic equipment is undertaken by so-called liquid cooling type cooler.
Here, as the cooler that is equipped in the type in the electronic equipment, proposed to have the cooler of contact-type heat-exchange pump.The contact-type heat-exchange pump closely contacts with heat-generating electronic part such as CPU, thereby carries out heat exchange between heat-generating electronic part and liquid refrigerant, cooling off this heat-generating electronic part, and makes the liquid coolant circulation.
The contact-type heat-exchange pump has: cap; Pump case has the heat absorption surface with heating electronic equipment thermal coupling (hot connecting); And pump chamber.Cap deadend pump chamber.Pump case and cap are made by highly heat-conductive material, as copper or aluminium, to accelerate transmission of heat.In No. 3452059 Japan Patent, disclosed a kind of such contact-type heat-exchange pump.
In that for example copper or aluminium are made under the situation of parts such as pump case, cap by die casting.The die casting manufacture cost will be higher than the manufacturing of using the resin injection moulding.In addition, such pump is configured to rotor usually and is arranged in the pump chamber, and stator passes cap and is arranged on outside the pump chamber.Motor with rotor and stator makes the wheel rotation that is arranged in the pump chamber.For this structure, for wheel rotor optimally, that is, for drive motor optimally, the cap between rotor and the stator is preferably insulating material.Therefore, produced with resin material and formed above-mentioned pump case and cap demand.
Yet, in the structure that parts such as pump case, cap are formed from a resin, along with the ease of freezing mixture is lost than more taking place in the structure of parts such as pump case, cap by copper or aluminium manufacturing.More particularly, the liquid coolant in the pump chamber more may, for example, evaporate or spill from parts itself or by the sealed department between pump case and cap.
Summary of the invention
One object of the present invention is to provide a kind of pump, can prevent refrigerant evaporates or freezing mixture to spill, thereby can optimally cool off electro-heat equipment for a long time.
Another object of the present invention is to provide a kind of cooler with pump.
A further object of the present invention is to provide a kind of electronic equipment with cooler.
In order to realize these purposes, according to a first aspect of the invention, provide a kind of pump, comprising: impeller; And pump case, this pump case is connected to impeller, pump case comprises a plurality of parts, these parts comprise the housing that is connected to first cap, at least one parts in a plurality of parts are formed from a resin, this resin comprise following one of at least: (i) metal charge; The packing that (ii) has the material of the coefficient of linear expansion lower than resin; And the packing that (iii) has the material of the vapor transmission rate lower than resin.
In order to realize these purposes, according to a second aspect of the invention, provide a kind of cooler, comprising: thermal radiation portion; Pump is used for the freezing mixture pump circulation to thermal radiation portion, the impeller that it comprises pump case and is rotationally attached to pump case, and pump case comprises a plurality of parts, these parts comprise: (a) first cap; (b) the basic portion of main body, it is connected to first cap, comprises inlet duct and outer pipe; And (c) heat absorption plate, its thermal coupling (hot connecting) is to the basic portion of main body, wherein, at least two in first cap, the basic portion of main body and the heat absorption plate are formed from a resin, this resin comprise following one of at least: (i) metal charge; The packing that (ii) has the material of the coefficient of linear expansion lower than resin; And the packing that (iii) has the material of the vapor transmission rate lower than resin; First pipeline is connected to delivery side of pump pipe and thermal radiation portion, and the freezing mixture that this first pipeline will be heated at the pump place is sent to thermal radiation portion; And second pipeline, being connected to pump intake piping and thermal radiation portion, this second pipeline will be sent to pump by the freezing mixture of thermal radiation portion cooling.
In order to realize these purposes, according to a third aspect of the invention we, provide a kind of electronic equipment, comprising: heat-generating units, use in first housing; And cooler, comprise pump, pump comprises pump case and be rotationally attached to impeller pump case, that be used for circulating coolant, pump case comprises: cap, be formed from a resin, this resin comprise following one of at least: (i) metal charge; The packing that (ii) has the material of the coefficient of linear expansion lower than resin; And the packing that (iii) has the material of the vapor transmission rate lower than resin; And the basic portion of main body, it is connected to cap, by this resin manufacture, and comprises inlet duct and outer pipe.
According to the present invention, at pump, cooler and have in the electronic equipment of this pump, at least a portion of pump case (parts) is to be formed from a resin, and it is one of following that this resin comprises: metal charge, the packing of material with coefficient of linear expansion lower than resin and the packing with material of the vapor transmission rate lower than resin.Thereby it can cool off electro-heat equipment for a long time.
Other features and advantages of the present invention provide in the following description, and its partial content can obviously be found out from specification for a person skilled in the art, maybe can recognize from enforcement of the present invention.Objects and advantages of the present invention can be understood, obtain from the method and structure that hereinafter particularly points out.
Description of drawings
Accompanying drawing and specification combine, and constitute the part of specification, show embodiments of the invention, and with above-mentioned describe, in general terms and the detailed description to embodiment given below, in order to explain principle of the present invention.
Fig. 1 illustrates the stereogram of portable computer according to an embodiment of the invention;
Fig. 2 is the stereogram from the observed portable computer shown in Figure 1 of the exhaust side of first housing;
Fig. 3 is the planimetric map that the one exemplary embodiment that is installed in the cooler in first housing is shown;
Fig. 4 is the exploded perspective view of the one exemplary embodiment of pump;
Fig. 5 is the stereogram of the pump of Fig. 4, and wherein second cap is removed; And
Fig. 6 is the sectional view that position relation between the CPU that is installed on the printed circuit board (PCB) and the pump is shown.
Embodiment
Below embodiments of the invention are described to Fig. 6 referring to Fig. 1.
Fig. 1 and Fig. 2 show the portable computer 1 as electronic equipment.Portable computer 1 has computer main 2 and display unit 3.Computer main 2 has first housing 10.First housing 10 has diapire 11a, upper wall 11b, antetheca 11c, left and right sides sidewall 11d and 11e, rear wall 11f.
Referring to Fig. 1, upper wall 11b has hand rest platform 12 and keyboard holder portion 13.Keyboard holder portion 13 is arranged on the rear portion of hand rest platform 12.Keyboard 14 is installed in the keyboard holder portion 13.Antetheca 11c, left and right sides sidewall 11d and 11e and rear wall 11f form the peripheral wall along first housing, 10 peripheries.Referring to Fig. 2, a plurality of relief openings 15 are formed in the peripheral wall of first housing 10, as in rear wall 11f.Relief opening 15 is in line along the width direction of first housing 10.
Again referring to Fig. 1, display unit 3 has second housing 20 and as the Panel 21 of display floater.LCD panel 21 is contained in second housing 20.LCD panel 21 has the screen 21a that is used for show image.The screen 21a of Panel 21 exposes second housing 20 by the opening portion 22 that forms on the frontal plane of second housing 20.
Second housing 20 is bearing on the rearward end of first housing 10 by the hinge (not shown).Thereby display unit 3 can rotate between operating position and open position.Operating position is for to turn up display unit 3 to cover the position (see figure 2) of hand rest platform 12 and keyboard 14.Open position is that display unit 3 is upwards rotated, and makes the position (see figure 1) that hand rest platform 12, keyboard 14 and screen 21a expose.
Next referring to Fig. 3, printed circuit board (PCB) 30 is arranged in first housing 10.More particularly, as shown in Figure 6, printed circuit board (PCB) 30 is arranged to parallel with the diapire 11a of first housing 10.CPU 31, as heat-generating units, are installed on the upper surface of printed circuit board (PCB) 30.According to one embodiment of present invention, CPU 31 constitutes microprocessor, plays the effect of the Core Feature of portable computer 1.According to another embodiment of the invention, CPU 31 can constitute DSP digital signal processor, specific integrated circuit, controller or the like.
CPU 31 has substrate 32 and is arranged on intergrated circuit (IC) chip 33 of substrate 32 upper surface cores usually.Along with processing rate and polyfunctional reinforcement, IC chip 33 is in operation and has produced a large amount of heat, therefore in order to keep stable operation, it need be cooled off.
Refer back to Fig. 3, portable computer 1 has liquid cooling type cooler 40, is used for by using the liquid coolant such as antifreeze liquid that CPU 31 is cooled off.Cooler 40 is arranged in first housing 10.Cooler 40 has with lower member: pump 100, simultaneously as endothermic section and heat exchanger; Thermal radiation portion 50; Peripheral passage 60; And electric fan 70.
To shown in Figure 6, pump 100 causes liquid coolant stressed circulation and mobile in peripheral passage 60 as Fig. 3.Pump 100 has pump case 101, simultaneously as the endothermic section; Impeller 102; Motor 103 has rotor 103a and stator 103b; And control panel 104.
Pump case 101 has housing 110, first cap 111 and second cap 112.Housing 110 has the shape of similar flat book, and is bigger than CPU 31, and has the recess 113 of upward opening.
Housing 110 has the basic portion 121 of main body of shaped as frame, has constituted the sidewall (side) of housing 110; And heat absorption plate 122, as the endothermic section, by the endothermic section, the end of the opening that opens wide downwards of the basic portion 121 of main body is that anti-liquid oozes parts.That is, the basic portion 121 of main body defines the side of recess 113, and heat absorption plate 122 defines the bottom surface of recess 113.In other words, recess 113 is limited by the internal surface of the basic portion 121 of main body and the upper surface of heat absorption plate 122.Heat absorption plate 122 is simultaneously as the diapire of the recess 113 relative with CPU 31.The lower surface of heat absorption plate 122 forms the heat absorption surface 122a of flat shape basically.O shape ring 124 is between basic portion 121 of main body and heat absorption plate 122.The basic portion 110 of main body can be overall structure.
First cap 111 has been blocked the opening end of recess 113.O shape ring 123 is arranged between the housing 110 and first cap 111.The upper surface of first cap 111 has: stator holds recess 115, is used to hold stator 103b; And control panel holds recess 116, is used to hold control panel 104.
The inside of pump case 101 promptly, is separated into pump chamber 118 and hopper 119 by recess 113 and 111 area surrounded of first cap by ring wall 117.Next door 117 is combined into integral body with housing 110 (in the present embodiment, with the basic portion 121 of main body).One the side that pump chamber 118 is set among four bights with pump case 101 is adjoining.More particularly, the central position of pump chamber 118 is for departing from respect to the central position of pump case 101.Hopper 119 is used to store liquid coolant, to be used to surround the pump chamber 118 of three of residues among four bights that are derived from pump case 101.
In addition, inlet duct 131 and outer pipe 132 are arranged in the housing 110 (in the present embodiment, being the basic portion 121 of main body).Inlet duct 131 is horizontally disposed with and is separated from each other with outer pipe 132.The upstream extremity of inlet duct 131 is outwards outstanding by housing 110 sidewalls (in the present embodiment, being the basic portion 121 of main body).The downstream of inlet duct 131 is opened wide to the inside of hopper 119, and relative with the open communication 130 of formation in the next door 117.Although not shown, gas-liquor separation is disposed between the downstream and open communication 130 of inlet duct 131.Even pump case 101 changed its towards, this interval always is arranged under the liquid level of the liquid coolant that is stored in hopper 119.
The downstream of outer pipe 132 is outwards outstanding by housing 110 sidewalls (in the present embodiment, being the basic portion 121 of main body), and is positioned at the position contiguous with the upstream extremity of inlet duct 131.The upstream extremity of outer pipe 132 extends through sidewall 117, and opens wide to the inside of pump chamber 118.
Plate-like impeller 102 is sent to its outside (peripheral passage 60) with liquid coolant from the inside of pump case 101, be arranged in the pump chamber 118.Impeller 102 by resin material (hereinafter to be referred as for " resin ") make, and have running shaft 102a in its rotating center section.Running shaft 102a is arranged between first cap 111 and the heat absorption plate 122, extending through at this place, thereby makes running shaft 102a be supported by first cap 111 and heat absorption plate 122 and rotatable.
Motor 103 is drives impeller 102 rotatably.Rotor 103a, the parts of formation motor 103, this rotor 103a has by many positive poles and the magnetized magnet of multi-cathode, and has annular shape.Rotor 103a is arranged in the pump chamber 118, and along being fixed in the upper surface of impeller 102 with 102 one-tenth axially aligned directions of impeller.
Stator 103b, the parts that it constitutes motor 103 are arranged on the stator that forms on the upper surface of first cap 111 and hold in the recess 115.Stator 103b should be set to be associated with the rotor 103a that passes first cap 111.Like this, stator holds recess 115 and is arranged on the position that is associated with rotor 103a.More particularly, the stator central part that holds recess 115 departs from respect to the central part of first cap 111.Control panel holds recess 116 and is arranged on the position that stator holds recess 115 is not set.
The opening end of recess 113 is blocked by first cap 111, so that stator holds the inside that recess 115 enters rotor 103a.More particularly, stator 103b is arranged on the inside of the rotor 103a that passes first cap 111 coaxially.Stator 103b is electrically connected with control panel 104.
In operation that portable computer 1 is started shooting, make stator 103b conducting.By this conducting, in the circumferencial direction generation rotating magnetic field of stator 103b, and magnetic field and rotor 103 magnetic couplings.Next, between stator 103b and rotor 103a, produce, thereby impeller 102 is rotated along the torque of the circumferencial direction of impeller 102.
Second cap 112 is fixed in the upper surface of first cap 111.Stator 103b and control panel 104 are covered by second cap 112.Second cap 112 is used to suppress spilling, evaporating or the like of freezing mixture, and can be removed.
Below use description to form the material of pump case 101.As mentioned above, first cap 111 is arranged between rotor 103a and the stator 103b.If first cap 111 is made the danger of the operation of the rotor 103a that then may make a difference by conductive material.If first cap 111 is by the metallic material manufacturing, pump 100 may become heavy so.Like this, according to one embodiment of present invention, at least the first cap 111 of pump case 101 preferably is formed from a resin.
The basic portion 121 of main body has relatively complicated structure.Thereby, if the basic portion of main body 121 make by metallic material, so transfer mold be pressed into this with and manufacture cost may be very high.If the basic portion of main body 121 is made by metallic material, pump 100 may become heavy so.Therefore, according to one embodiment of present invention, the basic portion 121 of main body is made by resin material equally.
In the present embodiment, at least a portion of pump case 101 (just, parts) comprising: for instance, the basic portion 121 of main body and first cap 111, be formed from a resin, this resin comprise following one of at least: metal charge, the packing of material and packing with material of the vapor transmission rate lower than resin with coefficient of linear expansion lower than resin.Make like this can obtain to be easy to make, cost is low, in light weight and can suppress by evaporation, spill or the like the pump 100 that the liquid coolant that causes reduces.Therefore, can obtain the pump 100 that can optimally cool off for a long time.
More particularly, a lot of metals not only have higher conductivity, and have lower coefficient of linear expansion and vapor transmission rate.Therefore, the basic portion 121 of main body and first cap 111 are by the resin manufacture that comprises this types of metals packing.This feasible basic portion 121 of main body and first cap 111 that can obtain comparing lower coefficient of linear expansion with situation about only being formed from a resin.Thereby, can realize reducing the difference of first cap 111 and the coefficient of linear expansion of the basic portion 121 of main body, and the difference of the basic portion 121 of main body and the coefficient of linear expansion of heat absorption plate 122.Thereby, can suppress spilling of the gap of liquid coolant by formation between the gap that forms between first cap 111 and the basic portion 121 of main body and the basic portion 121 of main body and the heat absorption plate 122, these two kinds of gaps all are that the difference owing to coefficient of linear expansion forms.
In addition, because the basic portion 121 of main body and first cap 111 made by the resin that comprises this types of metals packing, so, compare with first cap 111 with the main body substantial section 121 that only is formed from a resin and to have lower vapor transmission rate.Thereby, can suppress the evaporation of liquid coolant from pump case 101.
In addition, because the basic portion 121 of main body and first cap 111 be by the resin manufacture that comprises this types of metals packing, show higher heat-conducting effect so compare with the structure of first cap 111 with the basic portion 121 of the main body that only is formed from a resin.Thereby the heat that produces in CPU 31 can be conducted fast to the liquid freezing mixture.
In addition because the basic portion 121 of main body and first cap 111 made by the resin that comprises this types of metals packing, so with only compare by the situation of metallic material manufacturing, the weight of pump case 101 is lighter.
Go for this types of metals packing such as copper filler material, aluminium packing or aluminum alloy packing.
When the basic portion 121 of main body and first cap 111 are made by the resin that comprises the metal charge with coefficient of linear expansion lower than resin, the basic portion 121 of main body and first cap 111 will have the coefficient of linear expansion lower than resin.This can reduce the difference of coefficient of linear expansion between first cap 111 and the basic portion 121 of main body, and the difference of coefficient of linear expansion between basic portion 121 of main body and the heat absorption plate 122.Thereby, can suppress the gap of liquid coolant by formation between the gap that forms between first cap 111 and the basic portion 121 of main body and the basic portion 121 of main body and the heat absorption plate 122 and spill.
In addition, when the basic portion 121 of main body and first cap 111 are made by the resin that comprises the metal charge with vapor transmission rate lower than resin, the basic portion 121 of main body and first cap 111 will have vapor transmission rate lower when only being formed from a resin than these elements 121 and 111.Thereby, can suppress liquid coolant from pump case 101 evaporations.Thereby the heat that produces in CPU 31 can conduct to liquid coolant by for example heat absorption plate 122 apace.
In addition, when the basic portion 121 of main body and first cap 111 by comprising metal charge with coefficient of linear expansion lower than resin, or the resin with metal charge of the vapor transmission rate lower than resin is when making, only compared by the situation that metallic material is made with first cap 111 with the basic portion 121 of main body, the weight of pump case 101 can be lighter.
Be not only metal, and most of carbon and stupalith, its coefficient of linear expansion and vapor transmission rate are all lower.Thereby, any by material with coefficient of linear expansion lower than resin, or the made packing with vapor transmission rate lower than resin, such as metal charge, carbon packing, semiconductor packing or ceramic packing, all can be fit to use.The example of pottery packing includes, but are not limited to or is subject to alumina (aluminium oxide) packing or aluminium nitride.
For the resin that comprises packing, for example, can use polycarbonate (PC) or ABS resin.State in the use under the situation of resin, can keep pump chamber 101 desired intensity.
Below be various materials coefficient of linear expansion separately:
Semiconductor silicon: 3ppm/ ℃
(aluminium oxide): 7ppm/ ℃ on pottery
Carbon: 2 to 7ppm/ ℃
Copper: 17ppm/ ℃
Aluminium: 22ppm/ ℃
Polycarbonate (PC): 70ppm/ ℃
ABS resin: 74ppm/ ℃
On the other hand, in order optimally to cool off CPU 31, heat absorption plate 122 is preferably made by the metallic material with high thermal conductivity coefficient.As an embodiment, heat absorption plate 122 is become by the copper that for example has high thermal conductivity coefficient.Because in the present embodiment, when housing 110 formed by being divided into basic portion 121 of main body and heat absorption plate 122, heat absorption plate 122 can be selectively by the high thermal conductivity coefficient made.
In addition, second cap 112 is preferably made by metallic material, with spilling and influence of evaporation that relevant second cap 112 of reinforcement inhibition liquid coolant is taken place.According to an embodiment, second cap 112 is made by for example aluminum or aluminum alloy material.
Pump 100 is arranged on the printed circuit board (PCB) 30 in the following manner: cover CPU 31 from the top of CPU 31.Referring to Fig. 6, the pump case 101 of pump 100 is fixed in the diapire 11a of first housing 10 with printed circuit board (PCB) 30.Diapire 11a has the protuberance 17 that is positioned at corresponding to the position in four bights of pump case 101.Protuberance 17 projects upwards from diapire 11a.Printed circuit board (PCB) 30 overlaps on the top surface of these protuberances 17.Among Fig. 6, label 34 expressions are used for reinforcing from the lower surface of printed circuit board (PCB) 30 gusset plate of printed circuit board (PCB) 30.
By adopting following assemble mechanism, pump 100 is mounted to the diapire 11a of first shell 10, cover CPU 31 with top from CPU 31.Recess 141 is arranged in pump case 101 four bights separately.The diapire (bight of heat absorption plate 122) that limits recess 141 has through hole 142, is used to allow cylindrical insert 143 to pass.Each cylindrical insert 143 all has the protuberance 143a that edge substantially horizontal along the circumferential direction on top is projected into the outside.In addition, cylindrical insert 143 has the slot part 143b that forms along circumferencial direction.
Pump 100 nestles up CPU 31 by assemble mechanism in the following manner.At first, cylindrical insert 143 is passed helical spring 144.The opening end of cylindrical insert 143 from the upward opening of the recess 141 of first cap 111 inserted, and slot part 143b is positioned at the position of the heat-absorbent surface 122a that is lower than pump 100.Drop-proof c shape ring 145 is mounted to slot part 143b.Thereby cylindrical insert 143 is mounted to pump 100 according to following state: protuberance 143a is promoted to separate with the diapire that limits recess 141 by helical spring 144.
Conduction grease (not shown) is imposed on the upper surface of IC chip 33, and the heat absorption surface 122a of pump case 101 is arranged on the position relative with IC chip 33.The screw 146 that passes cylindrical insert 143 is screwed in the protuberance 17 that forms on printed circuit board (PCB) 30.Thereby cylindrical insert 143 is fixed to protuberance 17, pump 100 by the elastic compression of helical spring 144 on IC chip 33.Thereby IC chip 33 is thermally coupled to the heat absorption surface 122a of pump case 101 by the conduction grease.
In portable computer 1, pump 100 is fixed on the printed circuit board (PCB) 30, thereby makes the center of center (center of the surperficial 122a that absorbs heat) the aligning IC chip 33 of pump case 101.Yet, the misalignment of the center of impeller 102 (running shaft 102a) and pump case 101.Therefore, the misalignment of the center of IC chip 33 and the impeller 102 relative with it, and pump case 101 is between between them.This arrangement makes liquid coolant can absorb the heat as much as possible of IC chip 33.That is, according to one embodiment of present invention, IC chip 33 is relative with the position that liquid coolant flows through fast, simultaneously pump case 101 is inserted between them, so that liquid coolant absorbs heat as much as possible.What known is, being flowing in from impeller 102 centers of the liquid coolant that rotation produced by rotor 103a will become fast more when far away more.Therefore, use said structure, the more heat of IC chip 33 has been absorbed into liquid coolant.
As shown in Figure 3, thermal radiation portion 50 have thermal radiation portion main body 51 and with a plurality of thermal radiation plates 57 of thermal radiation portion main body 51 thermal couplings.Thermal radiation portion main body 51 is made of pipeline (piping), and liquid coolant flows by this pipeline.Thermal radiation portion main body 51 has coolant entrance 54 and coolant outlet (when the paper that passes Fig. 3 is seen, being set at the depth side of coolant entrance, although it is not illustrated), and surface current is moving inwards thereby make freezing mixture.
According to one embodiment of present invention, thermal radiation portion main body 51 is made by the pipeline of U-shaped basically.An opening end of pipeline is as coolant entrance 54, and another opening end of pipeline is as coolant outlet.Therefore, the pipeline of thermal radiation portion 50 (thermal radiation portion main body 51) has constituted the part of peripheral passage 60 (following will being explained in more detail it).
Thermal radiation plate 57 is by making such as the metallic material of aluminum alloy or copper product, and this metallic material has excellent thermal conductivity.Thermal radiation plate 57 forms rectangular plate.Thermal radiation plate 57 is arranged parallel to each other and is spaced from each other.Thermal radiation plate 57 is soldered to thermal radiation portion main body 51.
Thermal radiation portion 50 is arranged in first housing 10, and wherein thermal radiation plate 57 is positioned at the position relative with the relief opening 15 of first housing 10.According to one embodiment of present invention, a pair of carriage 58 is soldered to thermal radiation portion 50.The protuberance (not shown) that each carriage 58 protrudes to the base plate 11a from first housing 10 by screw.In this way, thermal radiation portion 50 is fixed to the diapire 11a of first housing 10.
The pipeline (thermal radiation portion main body 51) that peripheral passage 60 has first pipeline 61, second pipeline 62 and belongs to thermal radiation portion 50.That is, thermal radiation portion main body 51 is simultaneously as thermal radiation portion 50 and peripheral passage 60.First pipeline 61 is connected to the outer pipe 132 of pump 100 coolant entrance 54 of thermal radiation portion 50.Second pipeline 62 is connected the inlet duct 131 of pump 100 and the coolant outlet of thermal radiation portion 50.Thereby liquid coolant is through first and second pipeline 61 and 62, and circulation between pump 100 and thermal radiation portion 50.
Electric fan 70 to thermal radiation portion 50, and is set directly at the position of thermal radiation portion 50 fronts with blow cold air.Electric fan 70 has fan hub 71 and the receded disk impeller 72 that is arranged in the fan hub 71.Fan hub 71 has outlet 71a, is used to extract out cooling air.Outlet 71a is connected to thermal radiation portion 50 by pipeline 73.
Impeller 72 is driven by the motor (not shown), for example, and in portable computer 1 start and when the temperature of CPU 31 arrives predeterminated level.Thereby cool air is transported to thermal radiation portion 50 by the outlet 71a from fan hub 71.
The work of cooler 40 below will be described.
In the process of using portable computer 1, the IC chip 33 of CPU 31 produces heat.The heat that IC chip 33 produces is sent to pump case 101 by the heat absorption surface 122a of pump 100.The recess 113 of pump case 101 (pump chamber 118 and hopper 119) is filled with liquid coolant, so that liquid coolant absorbs the heat that much is sent to pump case 101.
When portable computer 1 start, electric current is delivered to the stator 103b of motor 103.Thereby, between stator 103b and rotor 103a, produce torque, thereby rotor 103a impeller 102 is rotated.Follow the rotation of impeller 102, the liquid coolant in pump chamber 118 is applied in pressure, and is extracted out from outer pipe 132, simultaneously, imports thermal radiation portion 50 by first pipeline 61 from coolant entrance 54.Flow to the coolant outlet side by heat exchange heated liquid freezing mixture from coolant entrance 54 in pump case 101, in this process, the heat of IC chip 33 is absorbed by liquid coolant and is sent to thermal radiation plate 57.
In the process of using portable computer 1, rely on the rotation of the impeller 72 of electric fan 70, cool air flows to thermal radiation portion 50 from the outlet 71a of fan hub 71.Cool air 57 passes between contiguous mutually thermal radiation plate 57.Thereby, be cooled such as the parts of thermal radiation plate 57 and thermal radiation portion main body 51.Then, when cool air flowed like this, the most of heat that is sent to thermal radiation plate 57 and thermal radiation portion main body 51 was discharged into the outside of first housing 10 from relief opening 15.
The liquid coolant of cooling imports the inlet duct 131 of pump case 101 by second pipeline 62 in thermal radiation portion 50.Liquid coolant is got back to hopper 119 from inlet duct 131.When being inhaled into pump chamber 118, the liquid coolant that returns hopper 119 like this absorbs the heat of IC chip 33 once more.
In the repetition of operation period, the heat of IC chip 33 constantly is sent to thermal radiation portion 50, is loaded on the cool air of the thermal radiation portion 50 that flows through, thereby and is discharged into the outside of first shell 10.
As mentioned above, at pump 100, cooler 40 and have in the portable computer 1 according to the pump 100 of present embodiment, at least one part (parts) of pump case 101 is formed from a resin, this resin comprise following one of at least: (1) metal charge; (2) has the packing of the material of the coefficient of linear expansion lower than resin; And (3) have the packing of the material of the vapor transmission rate lower than resin.Therefore, the evaporation of freezing mixture or spill is inhibited, thereby CPU 31 is cooled off in a long time ideally.
In the pump 100 of present embodiment, when the basic portion 121 of main body and first cap 111 when comprising at least a resin in metal charge, carbon packing and the ceramic packing and make, the basic portion 121 of main body and first cap 111 are not limited to above-mentioned packing material, and other parts of pump case 101 can be formed by side (other) packing material.For example, the heat absorption plate 122 and second cap 112 can be made by the resin that comprises above-mentioned packing.The basic portion 121 of main body can be by making such as the material of the metallic material with high thermal conductivity coefficient, to strengthen the heat exchange effect in pump case 101.
Housing 110 can be formed from a resin except the part the heat-absorbent surface 122a part (parts).In this case, housing 110 other parts except the endothermic section that comprises heat-absorbent surface 122a also can be formed from a resin, and this resin comprises the packing material of the coefficient of linear expansion lower than resin and/or has the packing material of the vapor transmission rate lower than resin.
The above is the preferred embodiments of the present invention only, is not limited to the present invention, and for a person skilled in the art, the present invention can have various changes and variation.Within the spirit and principles in the present invention all, any modification of being done, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.

Claims (20)

1. pump is characterized in that comprising:
Impeller (102); And
Pump case (101), be connected to described impeller, described pump case (101) comprises a plurality of parts, described a plurality of parts comprise the housing (110) that is connected to first cap (111), at least one parts in described a plurality of parts are formed from a resin, described resin comprise following one of at least: (i) metal charge; The packing that (ii) has the material of the coefficient of linear expansion lower than described resin; And the packing that (iii) has the material of the vapor transmission rate lower than described resin.
2. pump according to claim 1 is characterized in that, described first cap (111) of described pump case (101) is made by described resin.
3. pump according to claim 2, it is characterized in that, the heat absorption plate (122) that described a plurality of parts of described pump case (101) further comprise the basic portion of main body (121) and are thermally coupled to the basic portion of described main body (121), the basic portion of described main body (121) is also made by described resin.
4. pump according to claim 1, it is characterized in that, the heat absorption plate (122) that described a plurality of parts of described pump case (101) further comprise the basic portion of main body (121) and are thermally coupled to the basic portion of described main body (121), the basic portion of described main body (121) is made by described resin.
5. pump according to claim 1, it is characterized in that, the heat absorption plate (122) that described a plurality of parts of described pump case (101) comprise the basic portion of main body (121) and are thermally coupled to the basic portion of described main body (121), described heat absorption plate (122) is made by described resin.
6. pump according to claim 1 is characterized in that, described impeller (102) is arranged in the recess (113) of the inside that is formed on described pump case (101), and described first cap (111) of described pump case (101) covers the opening of described recess (113).
7. pump according to claim 1 is characterized in that also comprising motor (103), is used to rotate described impeller (102).
8. pump according to claim 7 is characterized in that, described motor (103) comprising: rotor (103a) is positioned at described housing (110); And stator (103b), be positioned at described rotor (103a) coaxially, make the magnetic field of described impeller (102) rotation with generation.
9. pump according to claim 1 is characterized in that, at least one parts in described a plurality of parts are made by the described resin that comprises nonmetal packing, and described nonmetal packing has the coefficient of linear expansion lower than described resin.
10. pump according to claim 1 is characterized in that, at least one parts in described a plurality of parts are made by the described resin that comprises nonmetal packing, and described nonmetal packing has the water vapor penetration rate lower than described resin.
11. pump according to claim 1 is characterized in that, at least one parts in described a plurality of parts are made by the described resin that comprises metal charge, and described metal charge has the water vapor penetration rate lower than described resin.
12. a cooler is characterized in that comprising:
Thermal radiation portion (50);
Pump (100), be used to make the freezing mixture pump circulation to described thermal radiation portion (50), described pump (100) comprises pump case (101) and is rotationally attached to the impeller (102) of described pump case (101), described pump case (101) comprises a plurality of parts, and described a plurality of parts comprise: (a) first cap (111); (b) the basic portion of main body (121), it is connected to described first cap (111), comprises inlet duct (131) and outer pipe (132); And (c) heat absorption plate (122), it is thermally coupled to the basic portion of described main body (121); Wherein, at least two in described first cap (111), the basic portion of described main body (121) and the described heat absorption plate (122) are formed from a resin, described resin comprise following one of at least: (i) metal charge; The packing that (ii) has the material of the coefficient of linear expansion lower than described resin; And the packing that (iii) has the material of the vapor transmission rate lower than described resin;
First pipeline (61) is connected to the described outer pipe (132) and the described thermal radiation portion (50) of described pump (100), and described first pipeline (61) will be sent to described thermal radiation portion (50) at the freezing mixture that described pump (100) are located to be heated; And second pipeline (62), being connected to the described inlet duct (131) and the described thermal radiation portion (50) of described pump (100), described second pipeline (62) will be sent to described pump (100) by the freezing mixture of described thermal radiation portion (50) cooling.
13. cooler according to claim 12 is characterized in that, described thermal radiation portion (50) comprising:
The 3rd pipeline (51) comprises first opening (54) that is connected to described first pipeline (61) and second opening that is connected to described second pipeline (62); And a plurality of thermal radiation plates (57), be thermally coupled to described the 3rd pipeline (51).
14. cooler according to claim 12 is characterized in that, described first cap (111) and the basic portion of described main body (121) of described pump case (101) are made by described resin.
15. cooler according to claim 12 is characterized in that, described pump (100) also comprises motor (103), is used to rotate described impeller (102).
16. cooler according to claim 12, it is characterized in that, in described first cap (111), the basic portion of described main body (121) and the described heat absorption plate (122) at least two are made by the described resin that comprises metal charge, and described metal charge has the coefficient of linear expansion lower than described resin.
17. cooler according to claim 12, it is characterized in that, in described first cap (111), the basic portion of described main body (121) and the described heat absorption plate (122) at least two are made by the described resin that comprises metal charge, and described metal charge has the water vapor penetration rate lower than described resin.
18. an electronic equipment is characterized in that comprising:
Heat-generating units (31) uses in first housing (10); And cooler (40), comprising pump (100), described pump comprises pump case (101) and is rotationally attached to impeller described pump case (101), that be used to make circulate coolant that described pump case (101) comprising:
Cap (111), be formed from a resin, described resin comprise following one of at least: (i) metal charge, (ii) have the packing of material of the coefficient of linear expansion lower and a packing that (iii) has the material of the vapor transmission rate lower than described resin than described resin; And
The basic portion of main body (121), it is connected to described cap (111), is made by described resin, and comprises inlet duct (131) and outer pipe (132).
19. electronic equipment according to claim 18 is characterized in that, described cooler (40) comprising:
Thermal radiation portion (50), a plurality of thermal radiation plates (57) that comprise pipeline (51) and be thermally coupled to described pipeline (51), described pipeline (51) comprises first opening (54) and second opening;
First pipeline (61), be connected (i) and be arranged between described first opening (54) of described pipeline (51) of the described outer pipe (132) of the basic portion of described main body (121) of described pump (100) and (ii) described thermal radiation portion (50), the freezing mixture that described first pipeline (61) is used for locating to be heated at described pump (100) is sent to described pipeline (51); And
Second pipeline (62), be connected to described second opening that (i) is arranged in the described pipeline (51) of the described inlet duct (131) of the basic portion of described main body (121) of described pump (100) and (ii) described thermal radiation portion (50), described second pipeline (62) will be sent to described pump (100) by the freezing mixture of described a plurality of thermal radiation plates (57) cooling.
20. electronic equipment according to claim 18 is characterized in that, the described pump (100) of described cooler (40) also comprises motor (103), is used to rotate described impeller (102).
CNA2005100634864A 2004-04-28 2005-04-11 Pump, cooler, and electronic device Pending CN1690437A (en)

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JP2004133536 2004-04-28
JP2004133536A JP2005315158A (en) 2004-04-28 2004-04-28 Pump, cooling system and electronic equipment

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109416225A (en) * 2016-11-30 2019-03-01 惠而浦有限公司 System for cooling down the component in electronic module

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007242822A (en) * 2006-03-08 2007-09-20 Hitachi Ltd Cooling device for electronic apparatus
US7729118B2 (en) * 2006-11-03 2010-06-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Miniature liquid cooling device having an integral pump
JP5310339B2 (en) * 2009-07-15 2013-10-09 日本電産株式会社 Centrifugal fan
US9170056B2 (en) * 2010-12-03 2015-10-27 International Business Machines Corporation Duplex flexible heat exchanger
JP5330446B2 (en) * 2011-03-31 2013-10-30 株式会社東芝 Electronics and fans
CN107551369B (en) 2011-04-18 2020-11-24 瑞思迈发动机及马达技术股份有限公司 PAP system blower
KR101629344B1 (en) * 2014-10-01 2016-06-13 박동식 Cooling apparatus and heat exchanger using the same
CN212696428U (en) * 2020-09-04 2021-03-12 范纲龙 Heat-conducting plate full-injection plastic-sealed cooling structure water-cooling radiator
CN214092348U (en) * 2020-11-27 2021-08-31 瑞声光电科技(常州)有限公司 Miniature water pump
CN112502994A (en) * 2020-11-27 2021-03-16 瑞声新能源发展(常州)有限公司科教城分公司 Miniature water pump and electronic equipment
CN113266576A (en) * 2021-05-28 2021-08-17 惠州汉旭五金塑胶科技有限公司 Liquid cooling pump cavity runner structure and liquid cooling pump

Family Cites Families (94)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3989658A (en) * 1975-04-14 1976-11-02 Velsicol Chemical Corporation Hot melt resinous composition comprising a primary resin, a wax and a terpolymer of styrene, isobutylene and beta-pinene
US4052133A (en) * 1975-11-12 1977-10-04 The Gorman-Rupp Company Corrosion and abrasion resistant centrifugal pump
US5089936A (en) * 1988-09-09 1992-02-18 Hitachi, Ltd. Semiconductor module
US5619143A (en) * 1989-02-14 1997-04-08 Commonwealth Scientific And Industrial Research Organisation Microwave scanning apparatus
US5102960A (en) * 1989-09-11 1992-04-07 Bayer Aktiengesellschaft Silicon-epoxy resin composition
US5268817A (en) * 1990-04-27 1993-12-07 Kabushiki Kaisha Toshiba Portable computer with keyboard and having display with coordinate input tablet rotatably mounted to face either toward or away from keyboard when closed over keyboard
US5122704A (en) * 1990-10-25 1992-06-16 Sundstrand Corporation Composite rotor sleeve
WO1994029901A1 (en) * 1993-06-07 1994-12-22 Melcher Ag Securing device for semiconductor circuit components
US5594617A (en) * 1994-12-06 1997-01-14 Digital Equipment Corporation Rotating battery hinge for a notebook computer
JP3258198B2 (en) * 1995-04-28 2002-02-18 株式会社東芝 Cooling device for circuit module and portable electronic device having this cooling device
US6094180A (en) * 1996-04-05 2000-07-25 Fakespace, Inc. Gimbal-mounted virtual reality display system
US5825087A (en) * 1996-12-03 1998-10-20 International Business Machines Corporation Integral mesh flat plate cooling module
US6026888A (en) * 1997-06-02 2000-02-22 Compaq Computer Corporation Molded heat exchanger structure for portable computer
WO1998059278A1 (en) * 1997-06-20 1998-12-30 Hitachi, Ltd. Display and display optical system
US20020053421A1 (en) * 1997-09-10 2002-05-09 Kabushiki Kaisha Toshiba Heat dissipating structure for electronic apparatus
KR100286375B1 (en) * 1997-10-02 2001-04-16 윤종용 Radiator of electronic system and computer system having the same
US6049459A (en) * 1997-11-17 2000-04-11 Lucent Technologies, Inc. Nesting clamps for electrical components
US6464195B1 (en) * 1997-12-04 2002-10-15 Raymond Hildebrandt Ergonomic mounting for computer screen displays
US6148906A (en) * 1998-04-15 2000-11-21 Scientech Corporation Flat plate heat pipe cooling system for electronic equipment enclosure
US6288896B1 (en) * 1998-07-02 2001-09-11 Acer Incorporated Heat dissipation system for a laptop computer using a heat pipe
US6282082B1 (en) * 1998-07-31 2001-08-28 Qubit, Llc Case for a modular tablet computer system
US6050785A (en) * 1998-11-04 2000-04-18 Sunonwealth Electric Machine Industry Co., Ltd. Axle balance plates for miniature heat dissipating fan assemblies
US6532152B1 (en) * 1998-11-16 2003-03-11 Intermec Ip Corp. Ruggedized hand held computer
US6377452B1 (en) * 1998-12-18 2002-04-23 Furukawa Electric Co., Ltd. Heat pipe hinge structure for electronic device
GB2348459B (en) * 1999-03-27 2003-03-19 Ibm Lid restraint for portable computer
JP4203782B2 (en) * 1999-05-19 2009-01-07 ソニー株式会社 Information processing apparatus and battery
KR100553677B1 (en) * 1999-06-11 2006-02-24 삼성전자주식회사 Portable computer with mechanism supporting cover
US6231371B1 (en) * 1999-06-25 2001-05-15 Hewlett-Packard Company Docking station for multiple devices
US6270310B1 (en) * 1999-09-29 2001-08-07 Ford Global Tech., Inc. Fuel pump assembly
US6570764B2 (en) * 1999-12-29 2003-05-27 Intel Corporation Low thermal resistance interface for attachment of thermal materials to a processor die
US6196850B1 (en) * 2000-02-10 2001-03-06 International Business Machines Corporation Rotatable docking station for an electronic device
US6418017B1 (en) * 2000-03-30 2002-07-09 Hewlett-Packard Company Heat dissipating chassis member
US6437973B1 (en) * 2000-04-18 2002-08-20 Hewlett-Packard Company Modular mechanism for movable display
US6430038B1 (en) * 2000-04-18 2002-08-06 Hewlett-Packard Company Computer with articulated mechanism
JP2001318732A (en) * 2000-05-09 2001-11-16 Sony Corp Information processor
US6313990B1 (en) * 2000-05-25 2001-11-06 Kioan Cheon Cooling apparatus for electronic devices
JP3302350B2 (en) * 2000-06-29 2002-07-15 株式会社東芝 Electronics
US7086452B1 (en) * 2000-06-30 2006-08-08 Intel Corporation Method and an apparatus for cooling a computer
JP4018978B2 (en) * 2000-08-03 2007-12-05 富士通株式会社 SEMICONDUCTOR DEVICE AND A FIXING DEVICE FOR INSTALLING AND HEATING A HEAT Sink DISTRIBUTED ON THE SEMICONDUCTOR DEVICE AND Attaching To A Substrate
US6296048B1 (en) * 2000-09-08 2001-10-02 Powerwave Technologies, Inc. Heat sink assembly
JP2002099356A (en) * 2000-09-21 2002-04-05 Toshiba Corp Cooling device for electronic equipment and electronic equipment
US6469893B1 (en) * 2000-09-29 2002-10-22 Intel Corporation Direct heatpipe attachment to die using center point loading
US6396687B1 (en) * 2000-10-13 2002-05-28 Dell Products, L.P. Rotating portable computer docking station
US6435810B1 (en) * 2000-10-20 2002-08-20 Delphi Technologies, Inc. Wear resistant fuel pump
US6408937B1 (en) * 2000-11-15 2002-06-25 Sanjay K. Roy Active cold plate/heat sink
JP3607608B2 (en) * 2000-12-19 2005-01-05 株式会社日立製作所 Liquid cooling system for notebook computers
JP2002232174A (en) * 2001-02-06 2002-08-16 Hitachi Ltd Electronic device
US6717798B2 (en) * 2001-03-22 2004-04-06 Intel Corporation Docking digital picture displays
US6798429B2 (en) * 2001-03-29 2004-09-28 Intel Corporation Intuitive mobile device interface to virtual spaces
US20020141159A1 (en) * 2001-03-29 2002-10-03 Bloemen James Andrew Sealed and passively cooled telecommunications customer service terminal
JP3640347B2 (en) * 2001-04-27 2005-04-20 インターナショナル・ビジネス・マシーンズ・コーポレーション Computer devices, electrical equipment, housings and covers
US6741470B2 (en) * 2001-06-01 2004-05-25 Intel Corporation Reusable thermal solution attachment mechanism and methods of using same
FR2827115B1 (en) * 2001-07-06 2003-09-05 Alstom BOX FOR POWER CONVERTER
TW558611B (en) * 2001-07-18 2003-10-21 Matsushita Electric Ind Co Ltd Small pump, cooling system and portable equipment
US6873521B2 (en) * 2001-07-24 2005-03-29 Hewlett-Packard Development Company, L.P. Multiple environment foldable computer
JP4512296B2 (en) * 2001-08-22 2010-07-28 株式会社日立製作所 Liquid cooling system for portable information processing equipment
JP2003078270A (en) * 2001-09-07 2003-03-14 Hitachi Ltd Electronic apparatus
US6752204B2 (en) * 2001-09-18 2004-06-22 Intel Corporation Iodine-containing thermal interface material
JP3946018B2 (en) * 2001-09-18 2007-07-18 株式会社日立製作所 Liquid-cooled circuit device
US6808371B2 (en) * 2001-09-25 2004-10-26 Matsushita Electric Industrial Co., Ltd. Ultra-thin pump and cooling system including the pump
US20030124000A1 (en) * 2001-12-28 2003-07-03 Po-Jen Shih Heat dissipation fan
JP2003223238A (en) * 2002-01-28 2003-08-08 Internatl Business Mach Corp <Ibm> Computer device, monitor unit and support structure of unit facing user
US6926070B2 (en) * 2002-03-22 2005-08-09 Intel Corporation System and method for providing cooling systems with heat exchangers
US6741465B2 (en) * 2002-03-29 2004-05-25 Intel Corporation Cooling method and apparatus for handheld devices
US6839234B2 (en) * 2002-05-15 2005-01-04 Matsushita Electric Industrial Co., Ltd. Cooling device and an electronic apparatus including the same
US7209355B2 (en) * 2002-05-15 2007-04-24 Matsushita Electric Industrial Co., Ltd. Cooling device and an electronic apparatus including the same
DE10225993A1 (en) * 2002-06-12 2003-12-24 Bosch Gmbh Robert heatsink
US6856506B2 (en) * 2002-06-19 2005-02-15 Motion Computing Tablet computing device with three-dimensional docking support
US6674642B1 (en) * 2002-06-27 2004-01-06 International Business Machines Corporation Liquid-to-air cooling system for portable electronic and computer devices
JP3885679B2 (en) * 2002-06-28 2007-02-21 株式会社日立製作所 Electronics
US6757170B2 (en) * 2002-07-26 2004-06-29 Intel Corporation Heat sink and package surface design
JP2004071882A (en) * 2002-08-07 2004-03-04 Toshiba Corp Electronic apparatus
JP3629257B2 (en) * 2002-08-30 2005-03-16 株式会社東芝 Electronics
US6894899B2 (en) * 2002-09-13 2005-05-17 Hong Kong Cheung Tat Electrical Co. Ltd. Integrated fluid cooling system for electronic components
US6788530B2 (en) * 2002-09-24 2004-09-07 International Business Machines Corporation User friendly computer equipment, monitor unit, and monitor unit setting base
US7258160B2 (en) * 2002-09-25 2007-08-21 Sony Corporation Heat transfer element, cooling device and electronic device having the element
JP2004139187A (en) * 2002-10-15 2004-05-13 Toshiba Corp Electronic device
EP1333492B1 (en) * 2002-11-08 2006-03-01 Agilent Technologies Inc. a Delaware Corporation Cooling a microchip on a circuit board
JP3981628B2 (en) * 2002-11-28 2007-09-26 株式会社東芝 Cooling pump, electrical equipment and personal computer
TW545104B (en) * 2002-11-28 2003-08-01 Quanta Comp Inc Cooling apparatus
US6924978B2 (en) * 2002-12-27 2005-08-02 Intel Corporation Method and system for computer system ventilation
US7079394B2 (en) * 2003-01-08 2006-07-18 Lenovo (Singapore) Pte. Ltd. Compact cooling device
JP2004246403A (en) * 2003-02-10 2004-09-02 Toshiba Corp Information processor, electronic equipment, and cooling method of electronic equipment
US6702007B1 (en) * 2003-04-30 2004-03-09 Kuan-Da Pan Heat sink structure
JP2004348650A (en) * 2003-05-26 2004-12-09 Toshiba Corp Electronic device
US7055581B1 (en) * 2003-06-24 2006-06-06 Roy Sanjay K Impeller driven active heat sink
US7035090B2 (en) * 2003-09-04 2006-04-25 Kabushiki Kaisha Toshiba Interlocking mechanism for a display
JP2005107122A (en) * 2003-09-30 2005-04-21 Toshiba Corp Electronic equipment
US6958910B2 (en) * 2003-11-18 2005-10-25 Kabushiki Kaisha Toshiba Cooling apparatus for electronic apparatus
US7019979B2 (en) * 2003-11-21 2006-03-28 Waffer Technology Corp. Heat dissipating device having improved fastening structure
JP2005190316A (en) * 2003-12-26 2005-07-14 Toshiba Corp Electronic device
JP2005228237A (en) * 2004-02-16 2005-08-25 Hitachi Ltd Liquid cooled system and electronic equipment provided therewith
US7095614B2 (en) * 2004-04-20 2006-08-22 International Business Machines Corporation Electronic module assembly
JP2005315156A (en) * 2004-04-28 2005-11-10 Toshiba Corp Pump and electronic equipment having pump

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109416225A (en) * 2016-11-30 2019-03-01 惠而浦有限公司 System for cooling down the component in electronic module
US11417585B2 (en) 2016-11-30 2022-08-16 Whirlpool Corporation System for cooling components in an electronic module

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