CN1683933A - Probe element and its test card - Google Patents
Probe element and its test card Download PDFInfo
- Publication number
- CN1683933A CN1683933A CN 200410031698 CN200410031698A CN1683933A CN 1683933 A CN1683933 A CN 1683933A CN 200410031698 CN200410031698 CN 200410031698 CN 200410031698 A CN200410031698 A CN 200410031698A CN 1683933 A CN1683933 A CN 1683933A
- Authority
- CN
- China
- Prior art keywords
- probe
- bearing carrier
- insulating body
- test card
- card according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The present invention provides a probe element and test card as semiconductor element testing parts capable of regulating the pressure on the IC element and aligning automatically. The probe element includes insulated body, at least one bearing member set inside the insulated body, probe set in the center of the bearing member and electric signal wire set in the insulated body and connected electrically to the bearing member. The test card includes circuit board with several test contacts and probe seat with several probe elements, and the circuit board has also conducting passage in the lower surface.
Description
Technical field
The invention belongs to the semiconductor element test parts, particularly a kind of probe member and test card thereof.
Background technology
Whether generally speaking, the integrated circuit elements on the wafer must be tested its electrical specification in advance, good to judge integrated circuit elements.Good integrated circuit will be selected to carry out follow-up encapsulation procedure; Defective products will be rejected to avoid increasing extra packaging cost.
The integrated circuit elements of finishing encapsulation also must be carried out another time testing electrical property again filtering out the encapsulation defective products, and then promotes the final finished yield.
Two kinds of traditional test card employing cantalever type probe and vertical probes.
Cantalever type probe is pressed excessive for the suitable length travel when the contact measured integrated circuit elements of probe pin portion is provided by horizontal cantilever with the pin of avoiding probe pin portion to put on integrated circuit elements to be measured.Yet, because cantalever type probe needs the space to hold horizontal cantilever, and the thin space arrangement of cantalever type probe with the integrated circuit elements to be measured of corresponding high density signal contact will be limited in this space, therefore can't be applied to have the integrated circuit elements to be measured of high density signal contact.
Though the thin space of the integrated circuit elements to be measured that vertical probe can corresponding high density signal contact is arranged, and provide needle point in the required length travel of contact measured integrated circuit elements by the elastic deformation of needle body itself.Yet when the deflection of needle body itself was excessive, adjacent probe can contact and be short-circuited or collision mutually.
U.S. Patent number US 5,914,613 discloses a kind of in order to test the elastic film test suite of integrated circuit elements electrical specification to be measured.The elastic film test suite is arranged on viscoelasticity (elastomeric) layer for several are surveyed terminal, and provide by the viscoelasticity layer and respectively to survey the suitable displacement of terminal, when the signal pad of contact measured integrated circuit elements, can scratch oxide layer on the signal pad so that respectively survey terminal.Only, the displacement that the viscoelasticity layer provides and inhomogeneous, bigger at viscoelasticity layer central part, then less relatively around.So, several detection terminals can't strike off the oxide layer on the signal pad equably, cause impedance difference each other.In addition, the viscoelasticity layer is sandwich construction and is made of multiple material, the application that the thermal expansion coefficient difference restriction elastic film test suite of different materials electrically measures at high temperature.
Summary of the invention
The purpose of this invention is to provide and a kind ofly can adjust probe member and the test card thereof that the pin that puts on integrated circuit elements to be measured is pressed, automatic center is aimed at automatically.
Probe member of the present invention comprises insulating body, at least one is arranged at bearing carrier in the insulating body, be arranged at the probe at bearing carrier center and be arranged in the insulating body and be electrically connected in the electric signal lead of bearing carrier; Test card comprises the probe base that the circuit board that is provided with several test contacts and group are established several probe members; Circuit board is provided with several conductive paths that is electrically connected several test contacts and circuit board lower surface; Probe member comprises insulating body, at least one is arranged at bearing carrier in the insulating body, be arranged at bearing carrier the center probe and be arranged in the insulating body and be electrically connected in bearing carrier and the electric signal lead of circuit board conductive path.
Wherein:
Bearing carrier is a volute spring.
It is the cantilever that the center is radial setting with the probe that bearing carrier comprises several, and the angle between two adjacent cantilevers is identical.
Bearing carrier also comprises the abutment ring of at least one each cantilever of connection.
Insulating body has the opening that is provided with for bearing carrier.
Opening on the insulating body is triangular in shape; Bearing carrier is made of the abutment ring that three cantilevers and at least one connect each cantilever, and the angle between two adjacent cantilevers is 120 °.
Opening on the insulating body is quadrangle; Bearing carrier is a volute spring.
Opening on the insulating body is quadrangle; Bearing carrier is made of four cantilevers, and the angle between two adjacent cantilevers is 90 °.
Opening on the insulating body is sexangle; Bearing carrier is a volute spring.
Opening on the insulating body is sexangle; Bearing carrier is made of six cantilevers, and the angle between two adjacent cantilevers is 60 °.
The material of probe and bearing carrier is selected from the group that copper, nickel, cobalt, tin, boron, phosphorus, chromium, tungsten, molybdenum, bismuth, indium, caesium, antimony, gold, silver, rhodium, palladium, platinum, ruthenium and alloy thereof are formed.
A kind of test card, it comprise the circuit board that is provided with at least one test contacts, group establish the probe base of at least one probe member and be arranged at circuit board and probe base between interface panel; Probe member also comprises insulating body, at least one is arranged at bearing carrier in the insulating body, be arranged at the probe at bearing carrier center and be arranged in the insulating body and be electrically connected in the electric signal lead of bearing carrier; The upper and lower surface of interface panel is respectively equipped with at least one and can be electrically connected in test contacts on the circuit board and be electrically connected in power on first and second signal contact of Communication signal wire of probe base.
Probe member comprises the weld pad that is electrically connected electric signal lead and the interface panel second signal contact.
Probe base comprises several weld pads that is electrically connected the electricity number of reading lead and the interface panel second signal contact.
Probe member comprises the weld pad that is electrically connected electric signal lead and circuit board conductive path.
Probe base comprises several weld pads that is electrically connected the electricity number of reading lead and circuit board conductive path.
Because probe member of the present invention comprises insulating body, at least one is arranged at bearing carrier in the insulating body, be arranged at the probe at bearing carrier center and be arranged in the insulating body and be electrically connected in the electric signal lead of bearing carrier; Test card comprises the probe base that the circuit board that is provided with several test contacts and group are established several probe members; Circuit board is provided with several conductive paths that is electrically connected several test contacts and circuit board lower surface; Probe member comprises insulating body, at least one is arranged at bearing carrier in the insulating body, be arranged at bearing carrier the center probe and be arranged in the insulating body and be electrically connected in bearing carrier and the electric signal lead of circuit board conductive path.During the probe off-center of probe member of the present invention, can automatically probe be pushed back the center by bearing carrier, can guarantee the lateral stability degree of probe so that the probe automatic center is aimed at, and the probe of probe base can not contact each other and is short-circuited and can not produce start interference such as collision each other; Make probe and contacting of integrated circuit elements to be measured not be that meeting destroys the hard contact of integrated circuit elements to be measured, but Elastic Contact; The probe of avoiding probe base is pressed the unequal damage that causes weld pad in the moment of contact pad because of pin, and prolongs probe serviceable life; When test card of the present invention uses, the probe of several probe members is with the weld pad of the electric contact measured integrated circuit elements in tip on the probe base, to capture the electrical specification of integrated circuit elements to be measured, end can be when contact pad, and the oxide that punctures the weld pad surface produces error in measurement with the impedance of avoiding oxide; And the probe of probe base can the differing needles pressure be put on the integrated circuit elements to be measured; Not only can adjust the pin that puts on integrated circuit elements to be measured automatically and press, but and automatic center aim at, thereby reach purpose of the present invention.
Description of drawings
Fig. 1, for probe member embodiment one structural representation stereographic map of the present invention.
Fig. 2, for probe member embodiment two structural representation stereographic maps of the present invention.
Fig. 3, for probe member embodiment three structural representation stereographic maps of the present invention.
Fig. 4, for probe member embodiment four structural representation stereographic maps of the present invention.
Fig. 5, for probe member embodiment five structural representation stereographic maps of the present invention.
Fig. 6, for probe member embodiment six structural representation stereographic maps of the present invention.
Fig. 7, for probe member embodiment seven structural representation stereographic maps of the present invention.
Fig. 8, for test card embodiment one structural representation cut-open view of the present invention.
Fig. 9, for test card embodiment one probe base structural representation vertical view of the present invention.
Figure 10, for test card embodiment one probe base structural representation stereographic map of the present invention.
Figure 11, be test card embodiment of the present invention one effect synoptic diagram.
Figure 12, for test card embodiment two structural representation cut-open views of the present invention.
Figure 13, for test card embodiment two probe base structural representation stereographic maps of the present invention.
Figure 14, (group is established probe member for test card embodiment two probe base structural representation stereographic maps of the present invention
Embodiment two).
Figure 15, (group is established probe member for test card embodiment two probe base structural representation stereographic maps of the present invention
Embodiment five).
Figure 16, (group is established probe member for test card embodiment two probe base structural representation stereographic maps of the present invention
Embodiment seven).
Embodiment
Probe member embodiment one of the present invention
As shown in Figure 1, probe member 10 of the present invention comprise insulating body 12 with circular open 14, two upper and lowerly be arranged at bearing carrier 20 in the opening 14, be arranged at two in the bearing carrier 20 probe 26 and be arranged in the insulating body 12 and be electrically connected the electric signal lead 28 of bearing carrier 20.
Moreover, when the long-pending circuit component of the needle point contact measured of probe 26, can adjust the pin that probe 26 puts on the integrated circuit elements to be measured automatically for the longitudinal elasticity of volute spring bearing carrier 20 and press.That is the present invention is by making probe 26 and contacting of integrated circuit elements to be measured not be to destroy the hard contact (hard contact) of integrated circuit elements to be measured for the elasticity of volute spring bearing carrier 20, but Elastic Contact (softcontact).Probe 26 and bearing carrier 20 are made of elastic conducting material.Preferably, the material of probe 26 and bearing carrier 20 is selected from the group that copper, nickel, cobalt, tin, boron, phosphorus, chromium, tungsten, molybdenum, bismuth, indium, caesium, antimony, gold, silver, rhodium, palladium, platinum, ruthenium and alloy thereof are formed.That is, by the electrical signal of probe 26 acquisitions integrated circuit elements to be measured, outwards export via two bearing carriers 20 and electric signal lead 28 again.
Probe member embodiment two of the present invention
As shown in Figure 2, probe member 40A of the present invention comprise insulating body 42 with tetragonal opening 44, two upper and lowerly be arranged at bearing carrier 50A in the opening 44, be arranged at two among the bearing carrier 50A probe 56 and be arranged in the insulating body 42 and be electrically connected the electric signal lead 58 of bearing carrier 50A.
It is the cantilever 52 that the center is radial setting with probe 56 that bearing carrier 50A comprises four, and the angle of 52 on two adjacent cantilevers is identical, is essentially 90 °.That is four cantilevers 52 form ' cross ' structure, and probe 56 then is positioned at the center of ' cross ' structure.One end of cantilever 52 is connected in probe 56, and its other end one of then is connected in 42, four cantilevers 52 of insulating body and is electrically connected electric signal lead 58 and probe 56.
Probe member embodiment three of the present invention
As shown in Figure 3, probe member 40B of the present invention comprise insulating body 42 with tetragonal opening 44, two upper and lowerly be arranged at bearing carrier 50B in the opening 44, be arranged at two among the bearing carrier 50B probe 56 and be arranged in the insulating body 42 and be electrically connected the electric signal lead 58 of bearing carrier 50B.
It is that to be the cantilever 52 of radial setting and four be that the center is radial setting and constitutes with tilting cantilever 54 that cantilever is about 45 ° of angles with probe 56 at the center with probe 56 that bearing carrier 50B comprises four.One end of electric signal lead 58 one of is electrically connected in four cantilevers 52, outwards exports from the electrical signal of integrated circuit elements to be measured to probe 56 or with probe 56 acquisitions to transmit the test signal.
Probe member embodiment four of the present invention
As shown in Figure 4, probe member 40C of the present invention comprise insulating body 42 with tetragonal opening 44, two upper and lowerly be arranged at bearing carrier 50C in the opening 44, be arranged at two among the bearing carrier 50C probe 56 and be arranged in the insulating body 42 and be electrically connected the electric signal lead 58 of bearing carrier 50C.
Bearing carrier 50C is the square spiral spring, and its inner is connected in probe 56, and its outer end then is connected in insulating body 52.Preferably, probe 56 is positioned at the center of square spiral spring.Electric signal lead 58 is electrically connected in the outer end of bearing carrier 50C, outwards exports from the electrical signal of integrated circuit elements to be measured to probe 56 or with probe 56 acquisitions to transmit the test signal.
Probe member embodiment five of the present invention
As shown in Figure 5, probe member 60A of the present invention comprise insulating body 62 with hex-shaped openings 64, two upper and lowerly be arranged at bearing carrier 70A in the opening 64, be arranged at two among the bearing carrier 70A probe 76 and be arranged in the insulating body 62 and be electrically connected the electric signal lead 78 of bearing carrier 70A.
Probe member embodiment six of the present invention
As shown in Figure 6, probe member 60B of the present invention comprise insulating body 62 with hex-shaped openings 64, two upper and lowerly be arranged at bearing carrier 70B in the opening 64, be arranged at two among the bearing carrier 70B probe 76 and be arranged in the insulating body 62 and be electrically connected the electric signal lead 78 of bearing carrier 70B.
Probe member embodiment seven of the present invention
As shown in Figure 7, probe member 80 of the present invention comprise insulating body 82 with triangle open mouth 84, two upper and lowerly be arranged at bearing carrier 90 in the opening 84, be arranged at two in the bearing carrier 90 probe 96 and be arranged in the insulating body 82 and be electrically connected the electric signal lead 98 of bearing carrier 90.
Bearing carrier 80 is made of three cantilevers 92 and two abutment rings 94 that connect each cantilever 92.One end of three cantilevers 92 is connected to probe 96, and its other end one of is connected in 82, three cantilevers 92 of insulating body and is electrically connected this electric signal lead 98 and probe 96.Several cantilevers 92 are that the center is radial setting with probe 96, and the angle of 92 on two adjacent cantilevers is identical, is essentially 120 °.
Test card embodiment one of the present invention
As Fig. 8, shown in Figure 11, test card test card 100 of the present invention comprises circuit board 110 and probe base 140.
As shown in Figure 9, probe base 140 comprises the lead 146 that several as shown in Figure 1 probe members 10, several weld pads 144 and several are electrically connected electric signal lead 28 and weld pad 144.The arrangement mode of several probe members 10 can design with the weld pad 172 corresponding to integrated circuit elements 170 to be measured.For example, as shown in figure 10, several probe members 10 are arranged with 3 * 6 array way.
When test card of the present invention 100 used, as shown in figure 11, circuit board 110 was made of four lamination laminates 120, and the spacing of conductive path 118 by upper surface 112 to lower surface 114 convergents.Therefore the position of the weld pad 144 of probe base 140 can be electrically connected the electric signal lead 28 of probe member 10 and the conductive path 118 of circuit board 110 corresponding to the conductive path 118 of circuit board 110.The probe 26 of probe base 140 is provided with spacing 142, wherein the spacing 142 corresponding spacings of separating the weld pad 172 of integrated circuit elements 170 to be measured.Probe 26 is with the weld pad 172 of the electric contact measured integrated circuit elements 170 in tip, to capture the electrical specification of integrated circuit elements 170 to be measured, and the tip can be when contact pad 172, and the oxide that punctures weld pad 172 surfaces produces error in measurement with the impedance of avoiding oxide.
Test card embodiment two of the present invention
As shown in figure 12, test card 200 of the present invention comprises printed circuit board (PCB) 220, interface panel 230 and probe base 150.
Printed circuit board (PCB) 220 comprises several test contacts 222 and several are electrically connected the lead 224 of test contacts 222 to tester table.
The spacing that interface panel 230 comprises upper surface 232, approximate the test contacts 222 on the printed circuit board (PCB) 220 greatly with spacing several signal contacts 234, lower surface 236 are set and with spacing less than being arranged at several signal contacts 238 that upper surface 232 signal contacts 234 spacings are provided with.
As shown in figure 13, probe base 150 comprises several probe member 10 and several weld pads 30 that is electrically connected electric signal lead 28 as shown in Figure 1.
The position of the weld pad 30 of probe base 150 is corresponding to the signal contact 238 of interface panel 230 lower surfaces 236, with electric signal lead 28 and the signal contact 238 that is electrically connected probe member 10.Compared to probe base shown in Figure 6 140, the shared space of probe base 150 is less significantly.
In addition, test card 200 also can be organized the probe base of establishing as shown in Figure 9 140 and substitute probe base 150.The position of the weld pad 144 of probe base 140 is corresponding to the signal contact 238 of interface panel 230 lower surfaces 236, with electric signal lead 28 and the signal contact 238 that is electrically connected probe member 10.
Test card 200 also can be organized the probe base of establishing as shown in figure 14 240, and probe base 240 is made of the probe member 40A of several probe member embodiment two of the present invention as shown in Figure 2.The arrangement mode of several probe members 40A can design with the weld pad corresponding to integrated circuit elements to be measured.Probe base 240 also can by several as shown in Figure 3 probe member 40B or probe member 40C as shown in Figure 4 constitute.Probe base 240 optionally adopts as shown in Figure 9 or design shown in Figure 13 with engaging of circuit board, to be electrically connected the weld pad of electric signal lead 58 to circuit board.
Test card 200 also can be organized the probe base of establishing as shown in figure 15 250, and probe base 250 is made of several probe member 60A as shown in Figure 5.The arrangement mode of several probe members 60A can design with the weld pad corresponding to integrated circuit elements to be measured.In addition, probe base 250 can also constitute by probe member 60B as shown in Figure 6, that is is adopted as the bearing carrier 70B that volute spring constitutes.Probe base 250 also optionally adopts as shown in Figure 9 or design shown in Figure 13 with engaging of circuit board, to be electrically connected the weld pad of electric signal lead 78 to circuit board.
Test card 200 also can be organized the probe base of establishing as shown in figure 16 260, and probe base 240 is made of several probe members 80 as shown in Figure 7, and the arrangement mode of several probe members 80 also can design with the weld pad corresponding to integrated circuit elements to be measured.Probe base 260 also optionally adopts as shown in Figure 6 or design shown in Figure 9 with engaging of circuit board, to be electrically connected the weld pad of electric signal lead 98 to circuit board.
Compared to prior art, the present invention has following advantages:
1, because the transverse elasticity of bearing carrier restriction probe in fact only can vertically move to avoid spy The transverse shifting of pin, therefore probe member of the present invention can guarantee that the lateral stability degree of probe is so that probe is automatic Centrally aligned, and the probe of probe base can not contact each other and is short-circuited and can not produce each other the starts such as collision Disturb.
2, because the longitudinal elasticity that bearing carrier provides can make each probe vertically move independently to compensate The level height difference of the weld pad of IC, and the probe of avoiding probe base moment of contact pad because of pin Press unequal and cause the damage of weld pad.
3, bearing carrier vertically and transverse elasticity can absorb torsional stress that probe produces in motion process and Bending stress is to reduce fatigue and the buckling deformation of probe. Therefore, exist compared to known vertical probe The needle body distortion that produces during the contact measured integrated circuit elements, probe member of the present invention can by bearing carrier Promote the life-span of probe.
4, the elasticity owing to bearing carrier can individually design, so the probe of probe base can be pressed by differing needles Put on the integrated circuit elements to be measured. For example, integrated circuit elements to be measured can be designed to have on every side Little pin is pressed, and the center then has than large needle presses to reduce injustice between probe and integrated circuit elements to be measured The weighing apparatus contact.
Claims (37)
1, a kind of probe member, it comprises probe; It is characterized in that it also comprises insulating body, at least one is arranged at the bearing carrier in the insulating body and is arranged in the insulating body and is electrically connected in the electric signal lead of bearing carrier; Probe is arranged at the center of bearing carrier.
2, probe member according to claim 1 is characterized in that described bearing carrier is a volute spring.
3, probe member according to claim 1 it is characterized in that it is the cantilever that the center is radial setting with the probe that described bearing carrier comprises several, and the angle between two adjacent cantilevers is identical.
4, probe member according to claim 3 is characterized in that described bearing carrier also comprises the abutment ring of at least one each cantilever of connection.
5, probe member according to claim 1 is characterized in that described insulating body has the opening that is provided with for bearing carrier.
6, probe member according to claim 5 is characterized in that the opening on the described insulating body is triangular in shape; Bearing carrier is made of the abutment ring that three cantilevers and at least one connect each cantilever, and the angle between two adjacent cantilevers is 120 °.
7, probe member according to claim 5 is characterized in that the opening on the described insulating body is quadrangle; Bearing carrier is a volute spring.
8, probe member according to claim 5 is characterized in that the opening on the described insulating body is quadrangle; Bearing carrier is made of four cantilevers, and the angle between two adjacent cantilevers is 90 °.
9, probe member according to claim 5 is characterized in that the opening on the described insulating body is sexangle; Bearing carrier is a volute spring.
10, probe member according to claim 5 is characterized in that the opening on the described insulating body is sexangle; Bearing carrier is made of six cantilevers, and the angle between two adjacent cantilevers is 60 °.
11, probe member according to claim 1 is characterized in that the material of described probe and bearing carrier is selected from the group that copper, nickel, cobalt, tin, boron, phosphorus, chromium, tungsten, molybdenum, bismuth, indium, caesium, antimony, gold, silver, rhodium, palladium, platinum, ruthenium and alloy thereof are formed.
12, a kind of test card, it comprises the probe base that the circuit board that is provided with at least one test contacts and group are established at least one probe member; Probe member comprises probe; It is characterized in that being provided with interface panel between described circuit board and the probe base; Probe member also comprises insulating body, at least one is arranged at the bearing carrier in the insulating body and is arranged in the insulating body and is electrically connected in the electric signal lead of bearing carrier; Probe is arranged at the center of bearing carrier; The upper and lower surface of interface panel is respectively equipped with at least one and can be electrically connected in test contacts on the circuit board and be electrically connected in power on first and second signal contact of Communication signal wire of probe base.
13, test card according to claim 12 is characterized in that described bearing carrier is a volute spring.
14, test card according to claim 12 it is characterized in that it is the cantilever that the center is radial setting with the probe that described bearing carrier comprises several, and the angle between two adjacent cantilevers is identical.
15, test card according to claim 14 is characterized in that described bearing carrier also comprises the abutment ring of at least one each cantilever of connection.
16, test card according to claim 12 is characterized in that described insulating body has the opening that is provided with for bearing carrier.
17, test card according to claim 16 is characterized in that the opening on the described insulating body is triangular in shape; Bearing carrier is made of the abutment ring that three cantilevers and at least one connect each cantilever, and the angle between two adjacent cantilevers is 120 °.
18, test card according to claim 16 is characterized in that the opening on the described insulating body is quadrangle; Bearing carrier is a volute spring.
19, test card according to claim 16 is characterized in that the opening on the described insulating body is quadrangle; Bearing carrier is made of four cantilevers, and the angle between two adjacent cantilevers is 90 °.
20, test card according to claim 16 is characterized in that the opening on the described insulating body is sexangle; Bearing carrier is a volute spring.
21, test card according to claim 16 is characterized in that the opening on the described insulating body is sexangle; Bearing carrier is made of six cantilevers, and the angle between two adjacent cantilevers is 60 °.
22, test card according to claim 12 is characterized in that described probe member comprises the weld pad that is electrically connected electric signal lead and the interface panel second signal contact.
23, test card according to claim 12 is characterized in that described probe base comprises the weld pad that several are electrically connected the electricity number of reading lead and the interface panel second signal contact.
24, test card according to claim 12 is characterized in that the material of described probe and bearing carrier is selected from the group that copper, nickel, cobalt, tin, boron, phosphorus, chromium, tungsten, molybdenum, bismuth, indium, caesium, antimony, gold, silver, rhodium, palladium, platinum, ruthenium and alloy thereof are formed.
25, a kind of test card, it comprises the probe base that the circuit board that is provided with several test contacts and group are established several probe members; Probe member comprises probe; It is characterized in that described circuit board is provided with the conductive path that several are electrically connected several test contacts and circuit board lower surface; Probe member also comprises insulating body, at least one is arranged at the bearing carrier in the insulating body and is arranged in the insulating body and is electrically connected in bearing carrier and the electric signal lead of circuit board conductive path; Probe is arranged at the center of bearing carrier.
26, test card according to claim 25 is characterized in that described bearing carrier is a volute spring.
27, test card according to claim 25 it is characterized in that it is the cantilever that the center is radial setting with the probe that described bearing carrier comprises several, and the angle between two adjacent cantilevers is identical.
28, test card according to claim 27 is characterized in that described bearing carrier also comprises the abutment ring of at least one each cantilever of connection.
29, test card according to claim 25 is characterized in that described insulating body has the opening that is provided with for bearing carrier.
30, test card according to claim 29 is characterized in that the opening on the described insulating body is triangular in shape; Bearing carrier is made of the abutment ring that three cantilevers and at least one connect each cantilever, and the angle between two adjacent cantilevers is 120 °.
31, test card according to claim 29 is characterized in that the opening on the described insulating body is quadrangle; Bearing carrier is a volute spring.
32, test card according to claim 29 is characterized in that the opening on the described insulating body is quadrangle; Bearing carrier is made of four cantilevers, and the angle between two adjacent cantilevers is 90 °.
33, test card according to claim 29 is characterized in that the opening on the described insulating body is sexangle; Bearing carrier is a volute spring.
34, test card according to claim 29 is characterized in that the opening on the described insulating body is sexangle; Bearing carrier is made of six cantilevers, and the angle between two adjacent cantilevers is 60 °.
35, test card according to claim 25 is characterized in that described probe member comprises the weld pad that is electrically connected electric signal lead and circuit board conductive path.
36, test card according to claim 25 is characterized in that described probe base comprises the weld pad that several are electrically connected the electricity number of reading lead and circuit board conductive path.
37, test card according to claim 25 is characterized in that the material of described probe and bearing carrier is selected from the group that copper, nickel, cobalt, tin, boron, phosphorus, chromium, tungsten, molybdenum, bismuth, indium, caesium, antimony, gold, silver, rhodium, palladium, platinum, ruthenium and alloy thereof are formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410031698 CN1683933A (en) | 2004-04-13 | 2004-04-13 | Probe element and its test card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410031698 CN1683933A (en) | 2004-04-13 | 2004-04-13 | Probe element and its test card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1683933A true CN1683933A (en) | 2005-10-19 |
Family
ID=35263346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410031698 Pending CN1683933A (en) | 2004-04-13 | 2004-04-13 | Probe element and its test card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1683933A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104808030A (en) * | 2015-05-18 | 2015-07-29 | 深圳市泰斯电子有限公司 | Test probe and test fixture provided with same |
| CN105723225A (en) * | 2013-11-07 | 2016-06-29 | 贺利氏德国有限两合公司 | Probe pin and method for producing a probe pin |
| CN109870658A (en) * | 2019-02-14 | 2019-06-11 | 株洲福德轨道交通研究院有限公司 | Needle bed mechanism |
| CN109870658B (en) * | 2019-02-14 | 2024-05-24 | 株洲福德轨道交通研究院有限公司 | Needle bed mechanism |
-
2004
- 2004-04-13 CN CN 200410031698 patent/CN1683933A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105723225A (en) * | 2013-11-07 | 2016-06-29 | 贺利氏德国有限两合公司 | Probe pin and method for producing a probe pin |
| CN105723225B (en) * | 2013-11-07 | 2019-01-11 | 贺利氏德国有限两合公司 | The method of testing needle and manufacture testing needle |
| CN104808030A (en) * | 2015-05-18 | 2015-07-29 | 深圳市泰斯电子有限公司 | Test probe and test fixture provided with same |
| CN109870658A (en) * | 2019-02-14 | 2019-06-11 | 株洲福德轨道交通研究院有限公司 | Needle bed mechanism |
| CN109870658B (en) * | 2019-02-14 | 2024-05-24 | 株洲福德轨道交通研究院有限公司 | Needle bed mechanism |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5374568B2 (en) | Probe head with membrane suspension probe | |
| CN1305181C (en) | Connecting component and its assembling mechanism | |
| CN1906493A (en) | Electrically connecting apparatus and contactor | |
| TWI333547B (en) | ||
| US7352196B2 (en) | Probe card assembly and kit | |
| CN1041253C (en) | Probe-type test handler, IC test method using the same, and IC | |
| CN1150605C (en) | Probe card for testing integrated circuit chip | |
| CN1846138A (en) | Contact pin, probe card using same and electronic part testing device | |
| CN1779935A (en) | Apparatus and method for testing conductive bumps | |
| CN1809757A (en) | Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object | |
| CN209028108U (en) | A kind of wafer is same to survey probe card | |
| US20210190822A1 (en) | Multi-layer mems spring pin | |
| CN1896749A (en) | Inspection device for display panel and interface used therein | |
| JP2004340617A (en) | Electrical connection burn-in apparatus | |
| US20120068726A1 (en) | Electrical test probe and probe assembly | |
| CN1766649A (en) | Apparatus for detecting electronic element, circuit and circuit board | |
| CN1148581C (en) | Connector apparatus | |
| CN1683933A (en) | Probe element and its test card | |
| CN110531125A (en) | Space convertor, probe card and its manufacturing method | |
| CN1714294A (en) | Adapter for testing conductor arrangements | |
| CN1204613C (en) | Adaptive probe device | |
| CN1265505C (en) | Contact structure with silicone grease contact point and general laminated structure using same | |
| CN1821789A (en) | Vertical probe carb | |
| CN1574513A (en) | Contact-connection device for electronic circuit units and production method | |
| CN211318635U (en) | Testing device for chip electrolytic capacitor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |