CN1669140A - 堆叠微电子封装 - Google Patents

堆叠微电子封装 Download PDF

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CN1669140A
CN1669140A CNA038168553A CN03816855A CN1669140A CN 1669140 A CN1669140 A CN 1669140A CN A038168553 A CNA038168553 A CN A038168553A CN 03816855 A CN03816855 A CN 03816855A CN 1669140 A CN1669140 A CN 1669140A
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M·莱瓦多
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Abstract

一种微电子组件包括具有第一表面和第二表面的柔性基板，它还具有微电子管芯部分和外部互连部分。基板具有与其集成的导电轨迹。第一微电子管芯具有有效表面，该有效表面电连接到基板微电子管芯部分中的基板第一表面。第二微电子管芯通过其有效表面电连接到基板微电子管芯部分中的基板第二表面。外部互连垫设置于基板外部互连部分中的基板第二表面上，其中至少一个导电轨迹与至少一个外部互连垫以及第一微电子管芯和第二微电子管芯中的任一个或两者电接触。基板被折叠且外部互连部分中的第一表面的一部分被附着到第一微电子管芯的背面。

Description

堆叠微电子封装
发明背景
发明领域
本发明涉及堆叠小片封装及其制造方法。特别是，本发明涉及用于堆叠小片封装的制造的柔性基板的使用。
技术发展水平
计算机产业的当前目标正趋于集成电路元件的高性能、低成本、小型化以及微电子器件的更大的封装密度。增加微电子器件封装的密度的一种方法是在封装内堆叠个别微电子小片。
各种方法已用于堆叠小片封装的制造中。一种方法是简单地将第一微电子管芯(诸如微处理器、芯片集、存储器件、ASIC等等)附着到载体基板(诸如***体、主板、其它微电子管芯的背面等等)。可以通过其有效表面(即通过倒转芯片附着)或者通过具有由线路结合形成的电接触的其背面将第一微电子管芯附着到载体基板上，如本技术领域内熟练技术人员可以理解的。随后，第二微电子管芯通过第一微电子管芯上的其背面被堆叠并通过粘合层(并可以包括合适的间隔器件)被固定。第二微电子管芯通过多个结合线路与载体基板电接触，这多个结合线路在第二微电子管芯的有效表面上的结合垫与基板上的接合垫之间延伸。虽然该方法显得简单，但制造工艺相对复杂且该方法需要载体基板上的接合垫，它采取其上有价值的“不动产”。
另一种方法包括使用柔性基板将电轨迹从第二微电子管芯路由到第一微电子管芯和基板之间的位置以便与载体基板电接触。图10示出了这种结构，其中第一微电子管芯202和第二微电子管芯204分别通过附着互连212和214被附着到柔性基板206的第一表面208上并与其电接触。密封材料216分散于第一微电子管芯202和第二微电子204中每一个之下和附近。
柔性基板206包括导电轨迹(未示出)，它设置于其中、其上和/或通过其与接近第一微电子管芯202的柔性基板206的第二表面226上设置的外部互连224(诸如，焊料球)的阵列222接触。因此，第一微电子管芯202和和第二微电子管芯204都具有阵列222内的外部互连224。弯曲柔性基板206，从而第一微电子管芯202的背面232可以用粘合层236被附着到第二微电子管芯204的背面234上。外部互连224使用C4(受控塌陷芯片连接)工艺附着到载体基板238上。
虽然这种方法形成有效的堆叠封装，但由于第一微电子管芯背面232和第二微电子管芯背面234必须提供适当的表面用于相互附着，它就需要没有尺寸或高度失配或者被密封的和没有被密封的半导体管芯之间失配的微电子小片。这些缺陷大大地降低了这种堆叠封装的效用。
此外，采用这种堆叠封装会产生钝化损害。钝化损害是微电子管芯的缺点，其中电路的表面涂层由暴露微电子管芯轨迹的任何材料撕破、刮擦或刺破或者甚至破坏集成电路，导致电路“开路(open)”，如本技术领域内熟练技术人员已知的。在使用相对灵敏的粘合材料的微电子管芯附着过程中通常引起高结合力需要，以及采用大量在周围浮动的颗粒暴露给环境。骨线(boneline)厚度控制也是使用糊粘合剂的薄微电子管芯处理的一个问题。微电子管芯述评扭曲是薄化微电子管芯(例如硅)的效果，其被研磨后使得晶片上的机械应力变得可见。它还变得足够影响粘合骨线厚度的平直度。需要特定的变平过程来解决该问题。
因此，开发一种堆叠封装是有利的，它使用各种微电子管芯尺寸和类型并降低钝化损害的可能性。
附图概述
虽然以权利要求书结束的说明书特别地指出和清楚地要求了被认为是本发明的内容，但在接合附图阅读时，本发明的优点可以更方便地从以下本发明的详细描述中确定，其中：
图1是根据本发明的柔性基板的第一表面的平面图；
图2是根据本发明的柔性基板的第二表面的平面图；
图3是根据本发明的柔性基板的侧剖视图；
图4-7是根据本发明的制造微电子封装的方法的侧剖视图；
图8的根据本发明的微电子封装的另一个实施例的侧剖视图；
图9是根据本发明的计算机***的示意图；以及
图10是现有技术已知的堆叠小片组件的侧剖视图。
具体实施方式
在以下的详细描述中，参考附图，它通过说明示出可以实施本发明的具体实施例。充分详细地描述了这些实施例以使本技术领域内的熟练技术人员能够实施本发明。可以理解，虽然不同，但本发明的各种实施例不必相互排他。例如，与一个实施例相接合的这里描述的特定特点、结构或特征也可以在其它实施例中实现而不背离本发明的精神和范围。此外，可以理解，每个所揭示的实施例内个别元件的位置或安排都可以进行修改而不背离本发明的精神和范围。因此，以下的详细描述不是限制性的，且本发明的范围仅通过适当揭示的所附权利要求书与权利要求书所赋予的等效物的全部范围限定。图中，贯穿几个示图，相同的标号表示相同或相似的功能。
图1说明了柔性基板102的第一表面104，其上具有至少一个第一表面附着垫106，其中至少一个柔性基板第一表面附着垫106设置于柔性基板102的微电子管芯部分108中。柔性基板102优选是聚合材料，诸如聚酰亚胺带或其它这种柔性带，如本技术领域内已知的。
图2说明了柔性基板102的第二表面112(与所述柔性基板第一表面104相对)，它具有至少一个柔性基板第二表面附着垫114位于柔性基板102的微电子管芯部分108中。至少一个导电轨迹116从至少一个柔性基板第二表面附着垫114延伸到至少一个外部互连垫118，其设置于柔性基板102的外部互连部分122中。导电轨迹116、柔性基板第一表面附着垫106(图1示出)以及柔性基板第二表面附着垫114优选是金属，诸如铜(优选)、铝、银、金、其合金等等，但也可以由导电聚合物构成，诸如填充铜的环氧树脂等等。
如图3所示，柔性基板102可以是多个层(示作元件124、124’、124”)，其中导电轨迹116可以与柔性基板层124、124’和/或124”集成(即，设置于其上、其中或穿过)。导电轨迹116也延伸通过柔性基板102以实现至少一个第一表面附着垫106和至少一个外部互连垫118之间的接触。
图4说明了第一微电子管芯126(诸如有源器件，包括微处理器、芯片集、存储器件、ASIC等等，或无源器件，包括电阻器、电容器等)，它通过其有效表面128并通过第一粘合层132附着到柔性基板第一表面104上，包括但不限于环氧树脂、，氨基甲酸酯、聚亚安酯和硅树脂弹性体。第一微电子管芯有效表面128还通过至少一个互连136电连接到柔性基板102，该至少一个互连136在第一微电子管芯有效表面128上的至少一个结合垫138和至少一个柔性基板第一表面附着垫106(图1示出)之间延伸。当然，可以理解，第一微电子管芯126可以通过任何已知的芯片附着技术电气附着到柔性基板102上，其中包括但不限于倒装芯片互连(焊料或导电聚合物)、表面安装技术、TAB结合等等，如本技术领域内熟练技术人员可以理解的。密封材料140可以设置于第一微电子管芯126之下和/或附近。密封材料140向第一微电子管芯126提供保护并向最终的微电子封装提供机械稳定性。密封材料可以包括但不限于塑料、树脂、环氧树脂等等。
如图5所示，第二微电子管芯142(诸如有源器件，包括微处理器、芯片集、存储器件、ASIC等等，或者无源器件，包括电阻器、电容器等等)通过其有效表面144被电气附着到柔性基板第二表面112上，诸如通过第二微电子管芯有效表面144的结合垫146和柔性基板第二表面附着垫114(图2示出)之间的焊料连接148(即，表面安装技术工艺)。第二微电子管芯142不需要具有设置于其下和/或附近的密封材料，因为通过第一微电子管芯密封材料140提供足够的机械稳定性。此外，第二微电子管芯142可以是不需要密封的不连续器件，并可以用导电糊或焊料贴附被附着到柔性基板第二表面112上。因此，本发明可以实现更薄的封装。
如图6所示，将柔性基板102折叠且柔性基板第一表面104的外部互连部分122(图1和2中示出)的一部分通过粘合剂152附着到第一微电子管芯126的背面154上(即，与第一微电子管芯有效表面128相对)。诸如焊料球的多个外部互连156可以设置于外部互连垫118上以形成微电子组件160，如图7所示。
如图8所示，不同高度和尺寸的各种微电子管芯(示作元件162和164)可以电气附着到柔性基板第二表面112上以形成微电子组件170。在一个实施例中，第一微电子管芯126是闪存器件而元件162是微芯片电阻器，且元件164是电容器或电感器。
通过本发明形成的微电子封装(诸如，图7的微电子组件160)可以用于计算机***180中，如图9所示。计算机***180可以在机架184内包括其上附着有微电子组件160的主板182。主板182可以被附着到各种周边设备，包括键盘186、鼠标188和监视器190。
因此，已详细描述了本发明的实施例，可以理解，所附权利要求书限定的本发明不限于以上描述中阐述的特定细节，因为许多明显的变化都是可能的而不会背离其精神和范围。

Claims (21)

1.一种微电子组件，其特征在于，包括：
柔性基板，具有第一表面和相对的第二表面，并具有微电子管芯部分和外部互连部分，所述柔性基板具有与其集成的至少一个导电轨迹；
至少一个第一微电子管芯，具有有效表面和相对的背面，其中所述有效表面电连接到所述柔性基板微电子管芯部分中的所述柔性基板第一表面；
至少一个第二微电子管芯，通过有效表面电连接到所述柔性基板微电子管芯部分中的所述柔性基板第二表面；
至少一个外部互连垫，设置于所述柔性基板外部互连部分中的所述柔性基板第二表面上，其中所述至少一个导电轨迹与至少一个外部互连垫以及所述第一微电子管芯和所述第二微电子管芯中的至少一个电接触；以及
其中，所述外部互连部分中的所述柔性基板第一表面的至少一部分被附着到所述第一微电子管芯背面。
2.如权利要求1所述的微电子组件，其特征在于，进一步包括至少一个外部互连，其被电气附着到所述至少一个外部互连垫。
3.如权利要求1所述的微电子组件，其特征在于，进一步包括密封材料，其被分散于第一微电子管芯附近。
4.如权利要求1所述的微电子组件，其特征在于，所述至少一个导电轨迹的至少一部分被设置于所述柔性基板上。
5.如权利要求1所述的微电子组件，其特征在于，所述柔性基板包括多个柔性基板层。
6.如权利要求5所述的微电子组件，其特征在于，所述至少一个导电轨迹的至少一部分被设置于所述多个柔性基板层的相邻层之间。
7.如权利要求1所述的微电子组件，其特征在于，所述至少一个导电轨迹由选自铜、铝、银、金或其合金的材料构成。
8.一种制造微电子封装的方法，其特征在于，包括：
提供柔性基板，它具有第一表面和相对的第二表面，并具有微电子管芯部分和外部互连部分，所述柔性基板具有与其集成的至少一个导电轨迹，所述柔性基板进一步包括多个外部互连垫，它们被设置于所述柔性基板外部互连部分中的所述柔性基板第二表面上；
将至少一个第一微电子管芯的有效表面电连接到所述柔性基板微电子管芯部分中的所述柔性基板第一表面上；
将所述至少一个第二微电子管芯的有效表面电连接到所述柔性基板微电子管芯部分中的所述柔性基板第二表面上；
在所述多个外部互连垫中的至少一个以及所述第一微电子管芯和所述第二微电子管芯中的至少一个之间通过至少一个所述导电轨迹提供电接触；以及
将所述外部互连部分中所述柔性基板第一表面的至少一部分附着到所述第一微电子管芯背面。
9.如权利要求8所述的方法，其特征在于，进一步包括将至少一个外部互连电气附着到所述至少一个外部互连垫。
10.如权利要求8所述的方法，其特征在于，进一步包括将密封材料分散于所述第一微电子管芯附近。
11.如权利要求8所述的方法，其特征在于，提供具有与其集成的至少一个导电轨迹的所述柔性基板的步骤包括提供所述柔性基板，它具有设置于所述柔性基板上的至少一个导电轨迹的至少一部分。
12.如权利要求8所述的方法，其特征在于，提供所述柔性基板的步骤包括提供多个柔性基板层。
13.如权利要求12所述的方法，其特征在于，提供具有与其集成的至少一个导电轨迹的所述柔性基板的步骤包括提供所述柔性基板，它具有设置于所述多个柔性基板层的相邻层之间的所述至少一个导电轨迹的至少一部分。
14.如权利要求8所述的方法，其特征在于，提供具有与其集成的至少一个导电轨迹的所述柔性基板的步骤包括提供具有至少一个导电轨迹的所述柔性基板，该至少一个导电轨迹由选自铜、铝、银、金或其合金的材料构成。
15.一种计算机***，其特征在于，包括：
主板；
微电子封装，被电气附着到所述主板上，其包括：
柔性基板，具有第一表面和相对的第二表面，并具有微电子管芯部分和外部互连部分，所述柔性基板具有与其集成的至少一个导电轨迹；
至少一个第一微电子管芯，具有有效表面和相对的背面，其中所述有效表面电连接到所述柔性基板微电子管芯部分中的所述柔性基板第一表面；
至少一个第二微电子管芯，通过有效表面电连接到所述柔性基板微电子管芯部分中的所述柔性基板第二表面；
至少一个外部互连垫，设置于所述柔性基板外部互连部分中的所述柔性基板第二表面上，其中所述至少一个导电轨迹与至少一个外部互连垫以及所述第一微电子管芯和所述第二微电子管芯中的至少一个电接触；以及
其中，所述外部互连部分中的所述柔性基板第一表面的至少一部分被附着到所述第一微电子管芯背面。
16.如权利要求15所述的计算机***，其特征在于，进一步包括电气附着到所述至少一个外部互连垫的至少一个外部互连。
17.如权利要求15所述的计算机***，其特征在于，进一步包括分散于第一微电子管芯附近的密封材料。
18.如权利要求15所述的计算机***，其特征在于，所述至少一个导电轨迹的至少一部分被设置于所述柔性基板上。
19.如权利要求15所述的计算机***，其特征在于，所述柔性基板包括多个柔性基板层。
20.如权利要求19所述的计算机***，其特征在于，所述至少一个导电轨迹的至少一部分被设置于所述多个柔性基板层的相邻层之间。
21.如权利要求15所述的计算机***，其特征在于，所述至少一个导电轨迹由选自铜、铝、银、金或其合金的材料构成。
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US6600222B1 (en) 2003-07-29
KR20050029213A (ko) 2005-03-24
MY122959A (en) 2006-05-31
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AU2003247448A1 (en) 2004-02-09

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