CN1655668A - Method and device for detecting mounting error of electronic device mounting apparatus - Google Patents
Method and device for detecting mounting error of electronic device mounting apparatus Download PDFInfo
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- CN1655668A CN1655668A CN 200510007552 CN200510007552A CN1655668A CN 1655668 A CN1655668 A CN 1655668A CN 200510007552 CN200510007552 CN 200510007552 CN 200510007552 A CN200510007552 A CN 200510007552A CN 1655668 A CN1655668 A CN 1655668A
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Abstract
To automatically and simply detect a mounting error in an electronic component packaging device to facilitate the maintenance when the mounting error is detected. A component is mounted on one of a plurality of component positioning mark locations serving as a targeted mounting location formed on a substrate, and its image is picked up (step S204). The mounting error of the mounted component is calculated based on the image (S205 and S206). After the mounted component is sucked from the substrate and returned to a component supply device (S207), the component is mounted on another mark location, the mounting error on the location is calculated, and these operations are repeated until the component is mounted on all of the mark locations (S208). In such a configuration, the mounting errors for the respective targeted locations can be calculated by using only one component, thereby simplifying the maintenance when detecting the mounting error.
Description
Technical field
The present invention relates to rigging error detection method and device that a kind of detection is assembled to electronic device the device rigging error of the apparatus for mounting electronic component on the substrate.
Background technology
The apparatus for mounting electronic component of prior art, because the scale error of its each component part or variation in time etc., exist the rigging error of the target rigging position of the device that will assemble on the relative substrate, therefore measure this margin of error in advance and, carry out error correction when mounted its corrected value parameter storage as rigging error.
As the adquisitiones of corrected value, for example, go up a plurality of device telltale marks that become the target rigging position of formation in reference substrate (anchor clamps), device is assemblied on the position of each mark.Then, can critically carry out the analyzer of position instrumentation by 3 dimension testers etc., the center of the device that instrumentation is assembled and gradient, obtain and the former target rigging position that should assemble between error, the mean value of obtaining whole rigging position errors is as interim corrected value.Then, should be input to apparatus for mounting electronic component by interim corrected value, proofread and correct rigging error with this corrected value, once more device is assembled to each marked locations on the reference substrate, obtain error then with the target rigging position, if confirming this error is the feasible value of apparatus for mounting electronic component, then described corrected value is set at formal corrected value.
; there are the following problems in such a way for profit: when the rigging error of instrumentation apparatus for mounting electronic component is set corrected value; carry out instrumentation owing to need manually to move to tester place such as 3 dimension testers, waste very much time and time with the reference substrate that apparatus for mounting electronic component has assembled device.In addition, because the device of assembling does not re-use after instrumentation finishes, so must pull down each device, this operation also consumes time and time.Also have,, then can not correctly assemble affirmation, must implement assembling once more, measure, set rigging error if when the interim corrected value with rigging error is input to apparatus for mounting electronic component, make a mistake.In addition, also has such problem: carry out the maintenance of apparatus for mounting electronic component in the customers' place, in the time of must confirming assembly precision again, if there are not accurate testers such as 3 dimension analyzers, the reference substrate that then must will be equipped with device is transported to the local image data of tester, set rigging error, have to a large amount of time and time of waste on safeguarding.
Therefore, in order to address these problems, for example following Patent Document 1 grade discloses a kind of apparatus for mounting electronic component with function of automatic detector spare rigging error.The device of this structure in the such inspection of above-mentioned reference substrate with the whole fit-up inspections in a plurality of target rigging positions place on the substrate with device (chip), the image of each device that is assembled with camera then calculates the rigging error of device according to its view data.
No. 3015144 communique of [patent documentation 1] patent
, structure shown in the above-mentioned Patent Document 1 after the inspection that rigging error detects finishes, must will be assembled in inspection and unload (being 2304 among the embodiment of Patent Document 1) with a plurality of inspections on the substrate with device, so this operation is loaded down with trivial details.And must prepare, manage a plurality of inspection devices that are used to detect rigging error, though than the described mode efficient height that utilizes tester, but exist and to implement rigging error easily and detect, also need to carry out the problem of the maintenance of a large amount of apparatus for mounting electronic component.
Summary of the invention
So the objective of the invention is: address these problems, can automatically and carry out the rigging error detection of apparatus for mounting electronic component easily, easily carry out the maintenance of apparatus for mounting electronic component.
In order to address the above problem, the 1, the 6th of the present invention, a kind of detection is assembled to the rigging error detection method and the device of the apparatus for mounting electronic component on the substrate with electronic device, it is characterized in that,
By adsorption head device is picked up from unit supplying unit, be assembled to then on the target rigging position of substrate.Then,
Shooting is mounted to the device on the target rigging position, goes out rigging error at target rigging position place according to the image calculation of this device that is taken,
After the device on the substrate being sent back to unit supplying unit, the described rigging error that calculates is proofreaied and correct and once more this device is assembled on the target rigging position, and calculate this rigging error once more by adsorption head.
In addition, the 2, the 7th of the present invention, a kind of detection is assembled to the rigging error detection method and the device of the apparatus for mounting electronic component on the substrate with electronic device, it is characterized in that,
On substrate, form a plurality of target rigging positions.And,
At every turn to each target rigging position assembly ware the time, take the device that is assembled,
After the shooting, pick up this assembly ware from substrate and be assembled to then on other target rigging positions.Then,
Go out the rigging error at each target rigging position place according to the image calculation of the device that is taken at each target rigging position.
This structure, the same device of assembling on each target rigging position of substrate, in this case, the device that picks up from substrate is sent back to unit supplying unit, pick up the device that this quilt sends back to from unit supplying unit again and be assembled on other target rigging positions.
Above-mentioned rigging error is obtained as the mean value of the rigging error of each the target rigging position on the substrate, proofreaies and correct the rigging error of practical set position according to this mean value.For the rigging error of practical set position, also can obtain the rigging error of each target rigging position earlier, then according to proofreading and correct with the rigging error at the immediate target rigging position in practical set position place.Perhaps, also substrate can be divided into a plurality of zones, rigging error according to each regional target rigging position place is obtained this regional rigging error, according to the rigging error in the zone under the practical set position, carries out the correction of the rigging error of actual rigging position.
According to the present invention, can reach following good result, promptly, the rigging error that can carry out apparatus for mounting electronic component automatically detects, and can simplify for the management of employed electronic device in detection and can calculate rigging error accurately and carry out maintenance to apparatus for mounting electronic component easily.
Description of drawings
Fig. 1 is the integrally-built stereogram of apparatus for mounting electronic component that expression has the rigging error measuring ability of embodiments of the invention
Fig. 2 is the vertical view that expression is used for the reference substrate that the rigging error of apparatus for mounting electronic component detects
Fig. 3 is the block diagram of structure of the control system of expression apparatus for mounting electronic component
Fig. 4 is the flow chart of the controlled step that detects of the rigging error of expression embodiment 1
Fig. 5 is the flow chart of the controlled step that detects of the rigging error of expression embodiment 2
Fig. 6 is the flow chart of the controlled step that detects of the rigging error of expression embodiment 3
Among the figure: 1 apparatus for mounting electronic component; 2-X axle travel mechanism; 3-Y axle travel mechanism; The 12-unit supplying unit; The 13-adsorption head; The 13a-suction nozzle; The 15-substrate transfer passage; 16-device identification camera; 17-substrate identification camera; The 18-monitor; The 19-control part; The 20-reference substrate; 22-device telltale mark; The 28-device; The 30-image processing apparatus; The 32-keyboard; The 33-mouse.
Embodiment
Below, with reference to the description of drawings embodiments of the invention.Here, as the electronic device of the function of rigging error checkout gear the embodiment that puts is installed and describes having.
(embodiment 1)
Fig. 1 is the integrally-built skeleton diagram of apparatus for mounting electronic component, as shown in the drawing, apparatus for mounting electronic component 1 has: the unit supplying unit 12 that is configured in front portion (illustrated lower left), be used for supplying with the electronic device 28 (being designated hereinafter simply as device) of being installed on the circuit substrate 40 (being designated hereinafter simply as substrate) with reference to Fig. 3; Slightly locate the substrate transfer passage 15 of extension to the left and right at central portion by the rear; X-axis travel mechanism 2 and y-axis shift actuation mechanism 3 with the top that is configured in these devices.X-axis travel mechanism 2 makes the adsorption head 13 of suction nozzle 13a with absorption device 28 move along the x direction of principal axis, and y-axis shift actuation mechanism 3 makes X-axis travel mechanism 2 and adsorption head 13 move along Y direction.
In addition, though not shown, adsorption head 13 has can make suction nozzle 13a along the Z axle travel mechanism of vertical direction (Z-direction) lifting with can to make suction nozzle be the θ axle rotating mechanism of center rotation with suction nozzle axle (θ axle).
In addition,, the substrate identification camera 17 as image unit is installed, is used to take the substrate orientation mark and the device 28 that is mounted on the substrate of substrate as described later in a side of adsorption head 13.The flank of unit supplying unit 12 is provided with device identification camera 16 in addition, is used to take the device 28 that is adsorbed 13 suction nozzle 13a absorption as described later.
In addition, the top of apparatus for mounting electronic component 1 is provided with the various monitoring of information devices 18 of demonstration to operator's prompting, and the bottom is provided with the control part 19 as the assembling control unit of control device integral body.Necessary all controls of device assembling that the rigging error of the present invention that comprises this control part 19 detects and proofreaies and correct.
And, carry out rigging error described later used substrate when detecting, what adopt is reference substrate 20 shown in Figure 2, this reference substrate 20, form with actual substrate 40 and have same shape and size, 3 bights above reference substrate rectangular are formed with the substrate orientation mark 21 of the position that is used for detection reference substrate 20, and wait each device telltale mark 22 that is formed with a plurality of dot matrix arrangements by printing.Each device telltale mark 22 is positioned at the target rigging position of each device 28, and control part 19 carries out device 28 is assembled to the position of each device telltale mark 22 in order to detect rigging error, i.e. control on the target rigging position.
Fig. 3 represents the structure of the control system of apparatus for mounting electronic component 1.As shown in the figure, the control part 19 to above-mentioned device integral body is controlled is made of the microcomputer that comprises CPU, ROM, RAM etc., has the travel mechanism 2,3 that drives X-axis and Y-axis respectively, the drive source of Z axle travel mechanism and θ axle rotating mechanism.And, adsorption head 13 and substrate identification camera 17 is moved along X-axis, Y direction by the driving of control as X-axis, Y-axis, Z axle and the θ axle motor 24,25,26,27 separately of drive source, make the control of suction nozzle 13a lifting and rotation.In addition, control is to the not shown vacuum mechanism of the suction nozzle 13a of adsorption head 13 importing negative pressure of vacuum, and control suction nozzle 13a carries out absorption, the release to device 28.
In addition, control part 19 is connected with the image processing apparatus of handling from the picture signal of device identification camera 16 and 17 inputs of substrate identification camera 30.Image processing apparatus 30 has the A/D converter 30a that the analog picture signal from camera 16 and camera 17 inputs is converted to the digital signal of view data; Storage is by the video memory 30b of the view data of A/D converter 30a conversion; CPU30c as the computing unit of handling the view data of storing.CPU30c calculates the center and the gradient of assembly ware and absorption device according to the view data from device identification camera 16 and 17 inputs of substrate identification camera.In addition, CPU30c is according to the view data from 17 inputs of substrate identification camera, the position offset of reference position that calculates relative substrate with rigging error, be the side-play amount of the relative target rigging position in practical set position.
In addition, control part 19 is connected with keyboard 32 and the mouse 33 that is used for entering apparatus data etc., by they entering apparatus data, and can be stored in the device data of input in the storage device 29 that is made of the hard disk that is connected with control part 19, flash memory etc.In addition, this storage device 29 is also stored the various data that obtain such as rigging error.
Also have, control part 19 is connected with monitor 18, can show described device data and by the image of camera 16 and 17 devices of taking 28 and substrate 40 and and the data of the result of calculation of CPU30c etc. by this monitor 18.
Below, about said structure, to utilizing reference substrate 20, the rigging error of detection means 28 and the action of setting the corrected value of rigging error describe.
At first, and device 28 is assembled to the situation of substrate 40 when carrying out substrate production in the same manner, sets or make the device linkage editor at apparatus for mounting electronic component 1.The information such as position that comprise overall dimension, substrate orientation mark 21 and the device telltale mark 22 of the reference substrate 20 of assembly ware 28 in this program, the information such as size of devices of the device 28 of assembling, and the absorption position information of device 28 etc.After setting this program, reference substrate 20 is placed into substrate transfer passage 15, the device 28 that should assemble is placed into unit supplying unit 12.In addition, be assembled to the device 28 of reference substrate 20, the device that will assemble in the time of can being actual substrate production, and practical devices wherein preferably to produce than higher precision.
Then, control part 19 begins rigging error with the controlled step shown in the flow chart of Fig. 4 and detects action, reference substrate 20 is transplanted on the assigned position (step S101) of answering assembly ware 28 on substrate transfer passage 15.
Then, substrate is discerned the top position that camera 17 and adsorption head 13 move to each substrate orientation mark 21 of reference substrate 20 together, take each substrate orientation mark 21.The CPU30c of image processing apparatus 30, deposit this image that is taken in video memory 30b, calculate the side-play amount (S102) of reference substrate 20 relative datum positions according to the picture position of substrate orientation mark 21, according to the position (S103) of all device telltale marks 22 of this offset correction.
Then, in the position of all device telltale marks 22, i.e. a target rigging position device 28 of each self-assembly (S104).In addition, when device 28 is assembled to the position of each device telltale mark 22, the error during correcting device absorption.That is, suction nozzle 13a moves to adsorption head 13 position of device identification camera 16 tops behind unit supplying unit 12 absorption devices 28.Then, take the absorption device, calculate the center of device 28 and the skew and the absorption gradient of absorption position, it is proofreaied and correct, then device 28 is assembled on the position of each device telltale mark 22 at image processing apparatus 30.
Device 28 is assembled to after the position of whole device telltale marks 22, substrate is discerned the top position that camera 17 and adsorption head 13 move to each device that is assembled 28 together, take each device.CPU30c is according to the image of each device, calculate the device center and the gradient (S105) of each device telltale mark 22 position, calculate the error (offset error) of each device telltale mark 22 position and heeling error (following abbreviate two errors as error) (S106).Thus, in the practical set position of each target rigging position difference calculating device and the rigging error between the target rigging position.
And the calculating of error also can be whenever taking device 28 and calculate when each device telltale mark 22 respectively having assembled a device 28.
After calculating the rigging error of whole devices 28, obtain the mean value (mean value of offset error and the mean value of heeling error) of this error, store it (S107) such as RAM of control part 19 into as the corrected value of rigging error temporarily.
Then, drive adsorption head 13, the whole devices 28 that utilize suction nozzle 13a will be assemblied in reference substrate 20 one by one adsorb and return to unit supplying unit 12 (S108).When adsorbing the device 28 that has assembled here,, be stored in control part 19, so need not to set in advance because the position that should adsorb is the rigging position of apparatus for mounting electronic component 1.
Whole devices 28 are returned to after the unit supplying unit 12, carry out the detection (S109) of substrate orientation mark 21 of the reference substrate 20 the same and the position correction (S110) of all device telltale marks 22 at step S109～S113 with step S102～S106.Then, carry out to the position of all device telltale marks 22 assembly ware 28 (S111), take and all be assembled device, calculating central position and gradient (S112), and the error (S113) between the position of the practical set position of whole assembly wares and device telltale mark 22.Only, at step S111 during, utilize at the corrected value of the rigging error of the interim storage of step S107 and proofread and correct, assemble to the position of device telltale mark 22 assembly ware 28.
Then, at step S114, the mean value of the rigging error of whole devices that will calculate at step S113 is shown in monitor 18.
Then, whether the mean value that makes the operator import shown error is the judgement (S115) of feasible value, if feasible value, then formally stores each mean value into storage device 29 (S116) as the corrected value of rigging error.Drive adsorption head 13 usefulness suction nozzle 13a then and one by one adsorb all devices that are assemblied in reference substrate 20 28 and return to unit supplying unit 12 (S117), round-off error detects to be handled.
And, if not feasible value, then do not carry out the storage of corrected value, whole assembly wares are returned to unit supplying unit 12 (S117), round-off error detects and handles then.
As mentioned above, according to present embodiment, can automatically carry out rigging error and detect, and when the error-detecting release, whole devices 28 that can also carry out automatically being assemblied in reference substrate 20 return to the action of unit supplying unit 12.Therefore, the device 28 that the operator does not need to be assemblied in reference substrate 20 all unloads to be handled, and by this point, can carry out rigging error easily and detect, and easily carries out the maintenance of apparatus for mounting electronic component.And, because after rigging error is calculated, can automatically device 28 be returned to unit supplying unit, and the rigging error that calculates for the first time proofreaied and correct, once more device 28 is assembled to the target rigging position, carry out the calculating of rigging error once more, so can check the good degree (quality) of the rigging error of being obtained easily.
(embodiment 2)
Among the embodiment 1, in order to detect rigging error, utilize the device 28 with device telltale mark 22 equivalent amounts, the position that these devices one by one are assembled to whole device telltale marks 22 is carried out rigging error and is detected.In addition as additive method, also can only utilize a device 28 successively it to be assembled to each position of device telltale mark 22, when this device 28 being assembled to the position of a device telltale mark 22 at every turn, take device 28 and obtain rigging error, then device 28 is returned to unit supplying unit 12, repeat above-mentioned action and carry out the rigging error detection.
This illustration is shown in Fig. 5, at first carry out the detection of moving of the reference substrate 20 the same and substrate orientation mark 21, proofread and correct the position of a device telltale mark 22 thereafter at step S203 according to the testing result of substrate orientation mark 21 with step S101, the S102 of Fig. 4 at step S201, S202.
Then, pick up the device 28 that rigging error detects usefulness from unit supplying unit 12, be assembled to the position of a device telltale mark 22 that detected, and utilize substrate identification camera 17 to take assembly ware 28 (S204), then, go out to be assembled the center and the gradient (S205) of device 28 according to this image calculation, and then calculate the error (S206) of the position of the position of assembly ware 28 and device telltale mark 22.
Then, absorption is assembled device 28 and returns to unit supplying unit 12 (S207), judges subsequently whether the device assembling to the position of whole device telltale marks 22 finishes (S208).Then, if that not do not finish then repeat the processing of step S203～step S207, same processing is carried out in the position that a device 28 that returns is assembled to other device telltale marks 22.
If the device assembling to the position of whole device telltale marks 22 finishes, then obtain the mean value of rigging error of the position of each device telltale mark 22, its corrected value as rigging error is stored (S209) temporarily.
Then, in the processing (S109) that step S210～step S216 carries out with step S202～step S208 is the same, then, repeat following action: the position that an above-mentioned device 28 is assembled to successively all device telltale marks 22, at every turn to 22 assemblings of a device telltale mark time, take and the calculating rigging error, return device 28 again.Only, during assembly ware 28, assemble then proofreading and correct in the rigging error of the interim storage of step S209.
If the processing of step S210～S216 finishes, then obtain the mean value of rigging error of the position of each device telltale mark 22.Then, judge whether the mean value of this rigging error is the judgement (S217) of feasible value,, finish rigging error and detect processing if feasible value is then formally stored (S218) with this mean value as the corrected value of rigging error.In addition, if not feasible value, then do not carry out the storage of corrected value, end process.
According to above-mentioned present embodiment, detect in order to carry out rigging error, only use a device 28, and be returned to unit supplying unit 12 when finishing automatically, so handle very easy the preparation of this device and management etc. because this device detects in rigging error.In addition, the operator can not take time and energy, and implements rigging error easily and detects, and can easily carry out the maintenance of apparatus for mounting electronic component 1.
In addition, owing to only use a device 28,, can carry out more high-precision rigging error and detect so do not produce the discrete influence of size that the foozle by device causes etc. to rigging error.
(embodiment 3)
In the controlled step of Fig. 5 of embodiment 2, will be used for a device 28 that rigging error detects at step S204～S206 and step S212～S214 and be assembled to the position of a device telltale mark 22 and take.Then, carry out after the calculating of rigging error, be assembled after device 28 temporarily returns to unit supplying unit 12, repeat error detection process in step S207 and S215 absorption.But, also can not return to unit supplying unit 12, directly be assembled to the position of other a device telltale mark 22, repeat error detection process.
At this moment, controlled step S207 and the S215 of Fig. 5 changed to step S207 ' shown in Figure 6 and S215 ', be assembled device 28, do not return to unit supplying unit 12 but be assembled to the position of next device telltale mark 22 from reference substrate 20 absorption.And, append step S219 this moment, at last device 28 is returned to unit supplying unit 12 what handle.
According to such embodiment 3,, can in the shorter time, carry out the processing that rigging error detects owing to can save the action that device 28 is returned to unit supplying unit 12 of embodiment 2.
(other embodiment)
Embodiment 1～3 is the mean value of the rigging error at whole device telltale marks 22 places on the reference substrate 20, as the corrected value of actual rigging error when carrying out each device assembling.As additive method, also the Zone Full of reference substrate 20 can be divided into a plurality of zones in addition,, obtain the mean value of rigging error of the position of the device telltale mark 22 in this zone in each zone.Then, can be with it as this regional corrected value, at actual corrected value according to the rigging error of the rigging position affiliated area of this device when carrying out the device assembling, carry out error correction to the practical set position.Like this, can proofread and correct rigging error more accurately than embodiment 1～3.
In addition, press the rigging error of the position of each device telltale mark memory device telltale mark 22, rather than store above-mentioned mean value.And, when the assembling of the device of reality, also the rigging error apart from the position of the nearest device telltale mark 22 in the practical set position of this device can be used as corrected value, proofread and correct the rigging error of practical devices rigging position according to this corrected value.
Perhaps, also can carry out device when assembling actual, the mean value of the rigging error of the position of a plurality of device telltale marks 22 that will be adjacent with the practical set position of this device (for example at 4 adjacent marks of four direction) uses as corrected value.Then, proofread and correct the rigging error of actual device rigging position according to this corrected value.
In addition, the reference substrate of using among superincumbent each embodiment 20 also can not used the high-precision substrate of being made by glass etc., and be used for the printed circuit board (PCB) of actual installation electronic device, and, the device of assembling can be actual electronic device, also can be to aim at the device of measuring rigging error and making.
In addition, among the embodiment,, take the device that is adsorbed by suction nozzle 13a with the device identification camera 16 of the flank that is fixed on unit supplying unit 12 in order to carry out device identification., camera head also can be configured in the position that is fixed with adsorption head 13.And this camera head is not limited to camera, also can be the laser recognition device that can carry out device identification by the laser of long and narrow seam shape.
Claims (10)
1. the rigging error detection method of an apparatus for mounting electronic component is used to detect the rigging error that electronic device is assembled to the apparatus for mounting electronic component on the substrate, it is characterized in that,
By adsorption head device is picked up from unit supplying unit, is assembled to then on the target rigging position of substrate,
Shooting is assemblied in the device on the target rigging position, goes out rigging error at target rigging position place according to the image calculation of this device that is taken,
After the device on the substrate being sent back to unit supplying unit, the described rigging error that calculates is proofreaied and correct and once more this device is assembled on the target rigging position, and calculate this rigging error once more by adsorption head.
2. the rigging error detection method of an apparatus for mounting electronic component is used to detect the rigging error that electronic device is assembled to the apparatus for mounting electronic component on the substrate, it is characterized in that,
On substrate, form a plurality of target rigging positions,
At every turn to each target rigging position assembly ware the time, take the device that is assembled,
After the shooting, be assembled to then on other target rigging positions from this assembly ware of substrate absorption,
Go out the rigging error at each target rigging position place according to the image calculation of the device that is taken at each target rigging position.
3. the rigging error detection method of apparatus for mounting electronic component as claimed in claim 1 or 2 is characterized in that, the identical device of assembling on each target rigging position.
4. as the rigging error detection method of apparatus for mounting electronic component as described in the claim 2, it is characterized in that, device from substrate absorption is sent back to unit supplying unit, and the device that this quilt is sent back to picks up from unit supplying unit then, and is assembled on other target rigging positions.
5. as the rigging error detection method of apparatus for mounting electronic component as described in the claim 3, it is characterized in that, device from substrate absorption is sent back to unit supplying unit, and the device that this quilt is sent back to picks up from unit supplying unit then, and is assembled on other target rigging positions.
6. the rigging error checkout gear of an apparatus for mounting electronic component is used to detect the rigging error that electronic device is assemblied in the apparatus for mounting electronic component on the substrate, it is characterized in that having:
Be formed with the substrate of a plurality of target rigging positions;
The assembling control unit makes adsorption head that device is picked up from unit supplying unit and this device is assembled to the target rigging position;
Image unit is taken the device that is mounted on the described substrate;
Computing unit, the image of the device that is taken that obtains according to the device that is mounted to by shooting on the target rigging position calculates the rigging error at target rigging position place,
Described assembling control unit, after calculating rigging error, make adsorption head that the device on the substrate is sent back to unit supplying unit, once more this device is assembled to the target rigging position after the described rigging error that calculates is proofreaied and correct, and makes described computing unit calculate this rigging error once more.
7. the rigging error checkout gear of an apparatus for mounting electronic component is used to detect the rigging error that electronic device is assemblied in the apparatus for mounting electronic component on the substrate, it is characterized in that having:
Be formed with the substrate of a plurality of target rigging positions;
Image unit is taken the device that is mounted on the described substrate;
The assembling control unit at every turn to each target rigging position assembly ware the time, is taken the device that is assembled by described image unit, is picking up this assembly ware after the shooting from substrate and is being assembled on other target rigging positions;
Computing unit, the image calculation of the device of taking according to described image unit is in the rigging error at each target rigging position place.
8. as the rigging error checkout gear of claim 6 or 7 described apparatus for mounting electronic component, it is characterized in that, at the identical device of each target rigging position assembling.
9. the rigging error checkout gear of apparatus for mounting electronic component as claimed in claim 7, it is characterized in that, the device that picks up from described substrate is sent back to unit supplying unit, and the device that this quilt is sent back to picks up and is assembled on other target rigging positions from unit supplying unit then.
10. as the rigging error checkout gear of apparatus for mounting electronic component as described in the claim 8, it is characterized in that, the device that picks up from described substrate is sent back to unit supplying unit, and the device that this quilt is sent back to picks up and is assembled on other target rigging positions from unit supplying unit then.
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| JP2004034386 | 2004-02-12 | ||
| JP2004034386A JP4391846B2 (en) | 2004-02-12 | 2004-02-12 | Method and apparatus for detecting mounting error of electronic component mounting apparatus |
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| CN1655668A true CN1655668A (en) | 2005-08-17 |
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| CN 200510007552 Pending CN1655668A (en) | 2004-02-12 | 2005-02-05 | Method and device for detecting mounting error of electronic device mounting apparatus |
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| CN101336073B (en) * | 2007-06-26 | 2013-01-16 | 先进装配***有限责任两合公司 | Device and method for assembling a component for a substrate |
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2004
- 2004-02-12 JP JP2004034386A patent/JP4391846B2/en not_active Expired - Fee Related
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2005
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| CN110708946A (en) * | 2018-07-09 | 2020-01-17 | Juki株式会社 | Mounting device and mounting method |
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| CN114557151A (en) * | 2019-10-18 | 2022-05-27 | 株式会社富士 | Component mounting machine |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2005228842A (en) | 2005-08-25 |
| JP4391846B2 (en) | 2009-12-24 |
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