CN1653871A - 印刷布线板 - Google Patents
印刷布线板 Download PDFInfo
- Publication number
- CN1653871A CN1653871A CN03811141.1A CN03811141A CN1653871A CN 1653871 A CN1653871 A CN 1653871A CN 03811141 A CN03811141 A CN 03811141A CN 1653871 A CN1653871 A CN 1653871A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- pad
- wiring board
- printed wiring
- conductive pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 239000011810 insulating material Substances 0.000 claims description 23
- 239000000203 mixture Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 5
- 239000012774 insulation material Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 description 20
- 239000010410 layer Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/099—Coating over pads, e.g. solder resist partly over pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP143530/2002 | 2002-05-17 | ||
JP2002143530 | 2002-05-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1653871A true CN1653871A (zh) | 2005-08-10 |
CN100482041C CN100482041C (zh) | 2009-04-22 |
Family
ID=29545023
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN03811141.1A Expired - Fee Related CN100482041C (zh) | 2002-05-17 | 2003-05-19 | 印刷布线板 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7180005B2 (zh) |
JP (1) | JP4341552B2 (zh) |
CN (1) | CN100482041C (zh) |
TW (1) | TW591981B (zh) |
WO (1) | WO2003098983A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101626002B (zh) * | 2008-07-07 | 2012-11-14 | 联发科技股份有限公司 | 集成电路的接合焊盘结构 |
CN104105340A (zh) * | 2014-07-22 | 2014-10-15 | 华进半导体封装先导技术研发中心有限公司 | 一种封装基板导通孔结构及制作方法 |
CN108235568A (zh) * | 2018-01-19 | 2018-06-29 | 华南理工大学 | 一种将pth通孔去除内层非功能pad的pcb板 |
CN108735705A (zh) * | 2017-04-24 | 2018-11-02 | 台湾积体电路制造股份有限公司 | 半导体装置、半导体结构及其形成方法 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE47600E1 (en) * | 2003-11-10 | 2019-09-10 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming electrical interconnect with stress relief void |
JP4618260B2 (ja) * | 2007-02-21 | 2011-01-26 | 日本テキサス・インスツルメンツ株式会社 | 導体パターンの形成方法、半導体装置の製造方法、並びに半導体装置 |
JP5331371B2 (ja) * | 2007-04-24 | 2013-10-30 | パナソニック株式会社 | 電子部品パッケージ、回路基板、電子部品実装装置、およびそれらの接合部の検査方法 |
JP2009105139A (ja) * | 2007-10-22 | 2009-05-14 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法と半導体装置 |
FR2924302B1 (fr) * | 2007-11-23 | 2010-10-22 | St Microelectronics Grenoble | Procede de fabrication de plots de connexion electrique d'une plaque |
JP5053919B2 (ja) * | 2008-03-07 | 2012-10-24 | パナソニック株式会社 | 表面実装デバイスの実装構造体 |
JP2014049608A (ja) * | 2012-08-31 | 2014-03-17 | Ibiden Co Ltd | プリント配線板及びプリント配線板の製造方法 |
JP2014072370A (ja) * | 2012-09-28 | 2014-04-21 | Ibiden Co Ltd | プリント配線板及びプリント配線板の製造方法 |
JP2014072371A (ja) * | 2012-09-28 | 2014-04-21 | Ibiden Co Ltd | プリント配線板及びプリント配線板の製造方法 |
KR102419900B1 (ko) * | 2015-09-02 | 2022-07-13 | 삼성전자주식회사 | 인쇄회로기판 장치 및 이를 포함하는 전자 장치 |
JP2017103367A (ja) * | 2015-12-02 | 2017-06-08 | ローム株式会社 | 実装基板およびその製造方法、ならびに、実装基板および電子部品を備えた実装構造 |
CN105979716A (zh) * | 2016-05-20 | 2016-09-28 | 泉州三宝电子有限公司 | 一种柔性电路板及其制造方法 |
JP6750872B2 (ja) | 2016-09-01 | 2020-09-02 | キヤノン株式会社 | プリント配線板、プリント回路板及び電子機器 |
CA3076753A1 (en) | 2017-10-01 | 2019-04-04 | Space Foundry Inc. | Modular print head assembly for plasma jet printing |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4064357A (en) * | 1975-12-02 | 1977-12-20 | Teledyne Electro-Mechanisms | Interconnected printed circuits and method of connecting them |
JPS5849637Y2 (ja) | 1978-07-14 | 1983-11-12 | 株式会社日立製作所 | 厚膜配線板 |
JPS6453493A (en) * | 1987-08-24 | 1989-03-01 | Ibiden Co Ltd | Wiring board for surface packaging |
JPS6453493U (zh) | 1987-09-30 | 1989-04-03 | ||
US4859808A (en) * | 1988-06-28 | 1989-08-22 | Delco Electronics Corporation | Electrical conductor having unique solder dam configuration |
JPH04101496A (ja) | 1990-08-20 | 1992-04-02 | Nec Corp | 印刷配線板 |
JPH04263491A (ja) | 1991-02-19 | 1992-09-18 | Fujitsu Ltd | プリント基板 |
JPH04354398A (ja) * | 1991-05-31 | 1992-12-08 | Internatl Business Mach Corp <Ibm> | 配線基板及びその製造方法 |
US5523920A (en) * | 1994-01-03 | 1996-06-04 | Motorola, Inc. | Printed circuit board comprising elevated bond pads |
JPH08340170A (ja) | 1995-06-12 | 1996-12-24 | Ibiden Co Ltd | プリント配線板 |
US6774474B1 (en) * | 1999-11-10 | 2004-08-10 | International Business Machines Corporation | Partially captured oriented interconnections for BGA packages and a method of forming the interconnections |
-
2003
- 2003-05-19 JP JP2004506327A patent/JP4341552B2/ja not_active Expired - Fee Related
- 2003-05-19 WO PCT/JP2003/006192 patent/WO2003098983A1/ja active Application Filing
- 2003-05-19 CN CN03811141.1A patent/CN100482041C/zh not_active Expired - Fee Related
- 2003-05-19 US US10/514,657 patent/US7180005B2/en not_active Expired - Fee Related
- 2003-05-19 TW TW092113445A patent/TW591981B/zh not_active IP Right Cessation
-
2007
- 2007-01-09 US US11/621,273 patent/US20080190654A1/en not_active Abandoned
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101626002B (zh) * | 2008-07-07 | 2012-11-14 | 联发科技股份有限公司 | 集成电路的接合焊盘结构 |
CN104105340A (zh) * | 2014-07-22 | 2014-10-15 | 华进半导体封装先导技术研发中心有限公司 | 一种封装基板导通孔结构及制作方法 |
CN108735705A (zh) * | 2017-04-24 | 2018-11-02 | 台湾积体电路制造股份有限公司 | 半导体装置、半导体结构及其形成方法 |
CN108735705B (zh) * | 2017-04-24 | 2023-03-31 | 台湾积体电路制造股份有限公司 | 半导体装置、半导体结构及其形成方法 |
CN108235568A (zh) * | 2018-01-19 | 2018-06-29 | 华南理工大学 | 一种将pth通孔去除内层非功能pad的pcb板 |
Also Published As
Publication number | Publication date |
---|---|
US20050167154A1 (en) | 2005-08-04 |
US20080190654A1 (en) | 2008-08-14 |
US7180005B2 (en) | 2007-02-20 |
JPWO2003098983A1 (ja) | 2005-09-22 |
TW200308188A (en) | 2003-12-16 |
JP4341552B2 (ja) | 2009-10-07 |
TW591981B (en) | 2004-06-11 |
WO2003098983A1 (fr) | 2003-11-27 |
CN100482041C (zh) | 2009-04-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1653871A (zh) | 印刷布线板 | |
CN2879422Y (zh) | 格栅阵列封装体上的导电垫配置 | |
CN200953345Y (zh) | 具有指叉结构的内嵌式电容器 | |
JP3111053B2 (ja) | 一次スルー・ホールおよび二次スルー・ホールを有する多層回路板 | |
CN1418374A (zh) | 叠层中的垂直电互连 | |
CN1714442A (zh) | 半导体器件 | |
CN1463454A (zh) | 低电感格栅阵列电容器 | |
CN1951161A (zh) | 区域阵列零件的共用通路退耦 | |
CN1496213A (zh) | 用于减少多层电路板的层数的技术 | |
CN1048359C (zh) | 具有端子排的弹性接线板及其与电路板的连接结构 | |
CN1977365A (zh) | 贯通基板、内插器以及贯通基板的制造方法 | |
CN1959425A (zh) | 半导体设备测试装置及半导体设备测试方法 | |
CN101044801A (zh) | 具有降低的电容耦合的电路板组件 | |
EP2888745A1 (de) | Elektrische bauelementanordnung | |
CN1568543A (zh) | 半导体元件 | |
CN1558710A (zh) | 具有阻止变形部件的电路板及电路板的形成方法 | |
CN1309066C (zh) | 半导体装置 | |
CN1541414A (zh) | 具有侧向连接的电容器的电子组件及其制造方法 | |
CN1624912A (zh) | 器件封装件和印刷电路板及电子装置 | |
TW200531611A (en) | Method and apparatus for increasing routing density for a circuit board | |
CN1809974A (zh) | 用于处理封装/母板的谐振的电容器相关的*** | |
CN1956179A (zh) | 芯片封装结构及凸块制程 | |
CN1242663C (zh) | 呈电子宏元件形式的无线通信印刷电路板和相应的接口结构以及向母板转移的方法 | |
CN1525559A (zh) | 布线基板 | |
US20090174072A1 (en) | Semiconductor system having bga package with radially ball-depopulated substrate zones and board with radial via zones |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: LENOVO INNOVATION CO., LTD. (HONGKONG) Free format text: FORMER OWNER: NEC CORP. Effective date: 20141126 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; TO: HONG KONG, CHINA |
|
TR01 | Transfer of patent right |
Effective date of registration: 20141126 Address after: Hongkong, China Patentee after: LENOVO INNOVATIONS Co.,Ltd.(HONG KONG) Address before: Tokyo, Japan Patentee before: NEC Corp. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090422 Termination date: 20170519 |