CN1650679A - 用于处理扁平和柔韧工件的方法和设备 - Google Patents

用于处理扁平和柔韧工件的方法和设备 Download PDF

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Publication number
CN1650679A
CN1650679A CNA038100436A CN03810043A CN1650679A CN 1650679 A CN1650679 A CN 1650679A CN A038100436 A CNA038100436 A CN A038100436A CN 03810043 A CN03810043 A CN 03810043A CN 1650679 A CN1650679 A CN 1650679A
Authority
CN
China
Prior art keywords
protection carrier
carrier
workpiece
groove
process fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA038100436A
Other languages
English (en)
Chinese (zh)
Inventor
布里塔·舍勒
奥兰多·韦克斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Publication of CN1650679A publication Critical patent/CN1650679A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Shaping Metal By Deep-Drawing, Or The Like (AREA)
  • ing And Chemical Polishing (AREA)
CNA038100436A 2002-06-05 2003-05-27 用于处理扁平和柔韧工件的方法和设备 Pending CN1650679A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10224817A DE10224817B4 (de) 2002-06-05 2002-06-05 Verfahren und Vorrichtung zum vertikalen Eintauchen von folienartigem Behandlungsgut in Bädern von Galvanisier- und Ätzanlagen
DE10224817.6 2002-06-05

Publications (1)

Publication Number Publication Date
CN1650679A true CN1650679A (zh) 2005-08-03

Family

ID=29594258

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA038100436A Pending CN1650679A (zh) 2002-06-05 2003-05-27 用于处理扁平和柔韧工件的方法和设备

Country Status (10)

Country Link
US (1) US20050224357A1 (de)
EP (1) EP1510111A1 (de)
JP (1) JP2005529243A (de)
KR (1) KR20050008772A (de)
CN (1) CN1650679A (de)
AU (1) AU2003240725A1 (de)
BR (1) BR0308809A (de)
DE (1) DE10224817B4 (de)
TW (1) TW200403014A (de)
WO (1) WO2003105546A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103374744A (zh) * 2013-07-11 2013-10-30 皆利士多层线路版(中山)有限公司 Pcb电镀铜附槽

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004039632A1 (de) * 2004-08-11 2006-02-23 Atotech Deutschland Gmbh Behälter für eine galvanotechnische Vertikal-Behandlungsanlage und dessen Herstellverfahren
KR100728889B1 (ko) * 2006-06-07 2007-06-20 (주)에스엠씨 가요성 필름 에칭장치
KR100728890B1 (ko) * 2006-06-07 2007-06-20 (주)에스엠씨 가요성 필름 에칭장치
JP5481785B2 (ja) * 2007-12-19 2014-04-23 日立化成株式会社 エッチング方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1374370A (en) * 1918-11-07 1921-04-12 Herbert P Ewell Electrochemical gold-separator
US1792998A (en) * 1928-07-05 1931-02-17 Thomas G Melish Anode container
US2365202A (en) * 1941-06-14 1944-12-19 Connelly Iron Sponge & Governo Process of making ferric hydrate
US2431949A (en) * 1943-11-24 1947-12-02 Gen Motors Corp Apparatus for electroplating the inside of bearing shells and the like
US2461113A (en) * 1946-10-14 1949-02-08 Hanson Van Winkle Munning Co Fluid treatment equipment
US3607712A (en) * 1969-01-21 1971-09-21 Ionic International Inc Barrel-type processing apparatus
US3663406A (en) * 1971-03-11 1972-05-16 Ppg Industries Inc Combined electrodialysis and ultrafiltration of an electrodeposition bath
US4059493A (en) * 1976-04-29 1977-11-22 Cities Service Company Anode, anode basket and method of packaging anodes
US4680100A (en) * 1982-03-16 1987-07-14 American Cyanamid Company Electrochemical cells and electrodes therefor
JPS62222081A (ja) * 1986-03-25 1987-09-30 Toyo Giken Kogyo Kk 薄板用治具
DE3612220A1 (de) * 1986-04-11 1987-10-15 Schering Ag Haltezange
JPH0657879B2 (ja) * 1987-10-31 1994-08-03 日大工業株式会社 バスケット式電着塗装装置
US4817650A (en) * 1988-01-04 1989-04-04 Herbert Tilton Self-contained tiltable basket for plating, washing or otherwise treating hollow articles
JPH01194497A (ja) * 1988-01-29 1989-08-04 Tanaka Kikinzoku Kogyo Kk 印刷配線基板のめっき用治具
US4966672A (en) * 1988-08-26 1990-10-30 National Semiconductor Corporation Electrolytic apparatus with unequal legged basket-carrier
JPH06216496A (ja) * 1993-01-13 1994-08-05 Hitachi Ltd 薄板用治具
US5472503A (en) * 1993-06-25 1995-12-05 Lico, Inc. Vertical load transferring apparatus
DE4323698C2 (de) 1993-07-15 1995-06-14 Atotech Deutschland Gmbh Vorrichtung zum Stabilisieren von Leiterplatten
FR2715146B1 (fr) * 1994-01-19 1996-02-16 Tech Surfaces Sa Dispositif de traitement de pièces de formes spéciales.
ES2118640T3 (es) * 1994-11-15 1998-09-16 Siemens Sa Dispositivo para el tratamiento electrolitico de piezas en forma de placas, en especial placas para circuitos impresos.
US5938899A (en) * 1997-10-28 1999-08-17 Forand; James L. Anode basket for continuous electroplating
IT1296811B1 (it) * 1997-11-28 1999-08-02 Resco Srl Procedimento e macchine per la produzione di circuiti stampati flessibili e semirigidi
DE19813528A1 (de) * 1998-03-26 1999-10-07 Siemens Sa Vorrichtung zur Behandlung von plattenförmigen Werkstücken, insbesondere Leiterplatten
US6261426B1 (en) * 1999-01-22 2001-07-17 International Business Machines Corporation Method and apparatus for enhancing the uniformity of electrodeposition or electroetching
US6190530B1 (en) * 1999-04-12 2001-02-20 International Business Machines Corporation Anode container, electroplating system, method and plated object

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103374744A (zh) * 2013-07-11 2013-10-30 皆利士多层线路版(中山)有限公司 Pcb电镀铜附槽

Also Published As

Publication number Publication date
DE10224817B4 (de) 2005-04-14
TW200403014A (en) 2004-02-16
WO2003105546A1 (en) 2003-12-18
KR20050008772A (ko) 2005-01-21
US20050224357A1 (en) 2005-10-13
EP1510111A1 (de) 2005-03-02
AU2003240725A1 (en) 2003-12-22
BR0308809A (pt) 2005-01-04
JP2005529243A (ja) 2005-09-29
DE10224817A1 (de) 2003-12-24

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication