CN1637168A - Liquid conveying system for electroplating equipment, electroplating equipment with the system and its operation method - Google Patents
Liquid conveying system for electroplating equipment, electroplating equipment with the system and its operation method Download PDFInfo
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- CN1637168A CN1637168A CN 200310113050 CN200310113050A CN1637168A CN 1637168 A CN1637168 A CN 1637168A CN 200310113050 CN200310113050 CN 200310113050 CN 200310113050 A CN200310113050 A CN 200310113050A CN 1637168 A CN1637168 A CN 1637168A
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- electroplating device
- outlet
- electroplating
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- 238000009713 electroplating Methods 0.000 title claims abstract description 66
- 239000007788 liquid Substances 0.000 title claims abstract description 62
- 238000000034 method Methods 0.000 title claims abstract description 12
- 239000008151 electrolyte solution Substances 0.000 claims description 46
- 239000000758 substrate Substances 0.000 claims description 10
- 239000012530 fluid Substances 0.000 claims description 9
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 230000009471 action Effects 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 239000012777 electrically insulating material Substances 0.000 claims description 2
- -1 polypropylene Polymers 0.000 claims description 2
- 239000004800 polyvinyl chloride Substances 0.000 claims description 2
- 229920000915 polyvinyl chloride Polymers 0.000 claims 1
- 239000003792 electrolyte Substances 0.000 abstract description 21
- 230000008569 process Effects 0.000 abstract description 2
- BQENMISTWGTJIJ-UHFFFAOYSA-N 2,3,3',4,5-pentachlorobiphenyl Chemical compound ClC1=CC=CC(C=2C(=C(Cl)C(Cl)=C(Cl)C=2)Cl)=C1 BQENMISTWGTJIJ-UHFFFAOYSA-N 0.000 description 12
- 230000005684 electric field Effects 0.000 description 12
- JFIMDKGRGPNPRQ-UHFFFAOYSA-N 1,2,3,4,5-pentachloro-6-(2,3,4,5-tetrachlorophenyl)benzene Chemical compound ClC1=C(Cl)C(Cl)=CC(C=2C(=C(Cl)C(Cl)=C(Cl)C=2Cl)Cl)=C1Cl JFIMDKGRGPNPRQ-UHFFFAOYSA-N 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 238000002474 experimental method Methods 0.000 description 7
- ZGHQUYZPMWMLBM-UHFFFAOYSA-N 1,2-dichloro-4-phenylbenzene Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=CC=CC=C1 ZGHQUYZPMWMLBM-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000007747 plating Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
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Abstract
The liquid conveying system for electroplating equipment includes several nozzles fixed in certain interval to convey electrolyte into the electroplating equipment, and the nozzles can move perpendicularly. One kind of current distributor is used to control the current density of the different base board parts. One system to convey liquid to the container of the electroplating equipment includes one pipe to hold electrolyte, several outlet ports for electrolyte to pass through and enter the container, and one electrolyte outflow device. The operation process of the electroplating equipment includes the following steps: operating the electroplating equipment first to work in the first current density for the first time period; and subsequent operating the electroplating equipment to work in the second higher current density for the second time period.
Description
Technical field
The present invention is about the electroplating device of a kind of liquid conveying system of electroplating device (for example be used for delivering liquid electrolytic solution person), this liquid conveying system of tool, and the working method of electroplating device.
Background technology
In traditional galvanizing process, want galvanized substrate, a printed circuit board (PCB) (PCB) for example, can have to utilize to electroplate to fill up and hold several sulculuses (being called " little footpath ") that are transported to the metal (for example copper) in the electrolytic solution in the treatment trough of electroplating device by the number nozzles, the about 50 μ m-200 μ m of little footpath typical sizes diameter, the about 50 μ m-125 μ m of the degree of depth.
The a printed circuit board (PCB) 12 little footpaths of Fig. 1 for being filled up by layer of metal (for example copper) part, the rate a/A of filling up is always less than 1, wherein a is a distance between 10 bottoms, little footpath and a groove 16 bottoms do not filled up by copper, and A is a distance between 10 bottoms, little footpath and copper layer 14 surface, and industry always tries PCB 12 to be electroplated onto the rate of filling up as far as possible near 100%.
During electroplating, and as shown in Figure 2, one nozzle, 18 positions of conveying electrolyte 20 are between an anode 22 and PCB 12 (its effect as same negative electrode), effect is filled up in the gratifying little footpath of discovery on the practice needs a large amount of electrolytic solution impingement flow in aperture, PCB 12 little footpath, in this regard, Fig. 3 A is illustrated in the experimental result of under the state micropore being filled up shown in the table 1 to 3F.
Table 1
| Little path position | Current density | |
| Fig. 3 A | ????V | ????20ASF |
| Fig. 3 B | ????V | ????25ASF |
| Fig. 3 C | ????V | ????30ASF |
| Fig. 3 D | ????E | ????20ASF |
| Fig. 3 E | ????E | ????25ASF |
| Fig. 3 F | ????E | ????30ASF |
During discussed above-mentioned table 1 and back, " ASF " was meant " every square feet ampere ", and 1ASF equals every square centimeter and has 10.76 amperes.
As shown in Figure 2, position markers " V " is meant in the mouth of the most close nozzle 18 on the PCB 12 and the part on nozzle 18 axis, therefore the zone that is covered by the electrolytic solution injection stream, and position markers " E " is meant on PCB 12 the part away from the mouth of nozzle 18.Above-mentioned experimental result is seen Fig. 4, and wherein Y-axis is the rate of filling up (%), and X-axis is current density (is unit with ASF).Curve above among Fig. 4 fills up the result for the little footpath of Fig. 3 A-3C, and curve following among Fig. 4 fills up the result for the little footpath of Fig. 3 D-3F, and the intermediary curve is for being the arithmetical mean of upper and lower curve.
It can be found out:
(a) under same current density, little footpath is different with the rate of filling up at position E at position V;
(b) in little footpath of position V, the rate of filling up that current density heals when high is higher;
(c) in little footpath of position E, the rate of filling up when current density is lower is higher.
Also under fixed current density, experimentize to the rate of filling up with by the electrolytic solution flow rate relativeness that nozzle is carried, Fig. 5 A-5C is arranged on respect to three little footpaths of the same position of nozzle under the different electrolytes flow rate and the result who experimentizes under the 25ASF current density, generally show as Fig. 6, Y-axis is the rate of filling up (%), and X-axis is electrolytic solution flow rate (how many liters of per minute, L/min), the result shows that the flow rate rate of filling up when high that heals is higher.
Evenly fill up rate and distribution of current in order to obtain PCB, existing people's suggestion is stirred PCB in " cutter edge " mode, stir (that is the distance b (Fig. 7) of nozzle 18 and PCB 12 keeps certain) by " cutter edge ", PCB about 12 (seeing the four-headed arrow among Fig. 7) or move back and forth up and down.Yet this method has following shortcoming:
This PCB " cutter edge " stirring is only applicable to little footpath and fills up, but PCB has only little footpath, and through hole is also arranged, and it needs, and different modes is to be moved, and for example distance b (Fig. 7) moves after can changing before to some extent.
B. because fringing effect, always there is thicker plating at the PCB edge, and its method of avoiding is to adjust anode and PCB marginal position, moves with respect to electroplating machine but work as negative electrode (that is PCB), it is difficult to adjust its screening-off position and anode position, thereby also is difficult to obtain good PCB electroplating evenness.
In addition, the different current densities of little footpath needs of different size reach good little footpath and fill up the result, and generally speaking, high current density is fit to bigger little footpath; But high current density easily produces the space in less little footpath, otherwise, though low current density is fit to less little footpath, generally can cause bigger little footpath that incision is arranged, therefore when electroplating the little footpath of tool different size substrate, be difficult to obtain gratifying result.
By the electroplating device, and the working method of electroplating device that are electroplating device, the tool distributing switch of a purpose of the present invention liquid conveying system that is to provide a kind of electroplating device, this liquid conveying system of tool, alleviating above-mentioned shortcoming, or be at least masses another kind of replacement scheme is provided.
To during this purpose of the present invention and other purpose are discussed below very can be clear.
Summary of the invention
According to first viewpoint of the present invention, it provides a kind of liquid conveying system of electroplating device, this system comprises at least two liquid exits, this at least two liquid exit fixedly installs in order to action simultaneously at each interval and liquid can be sent in this equipment, wherein first liquid exit is sent into this liquid in this equipment along a path at least, and wherein these liquid exits can move on haply perpendicular to a plane in this path.
According to second viewpoint of the present invention, it provides a kind of electroplating device that is provided with liquid conveying system, this system comprises at least two liquid exits, this at least two liquid exit fixedly installs in order to action simultaneously at each interval and liquid can be sent in this equipment, wherein first liquid exit is sent into this liquid in this equipment along a path at least, and wherein these liquid exits can move on haply perpendicular to a plane in this path.
According to the 3rd viewpoint of the present invention, it provides a kind of with the galvanized electroplating device of at least one substrate, comprise anode assembly, hold an electrolytic solution vessel assembly, this is separated the device that liquid delivers into the current density of the device of this container and this basal orientation different sites of control guiding.
According to the 4th viewpoint of the present invention, it provides the system in a kind of container that a liquid is transported to an electroplating device, and this system comprises the pipe unit that holds this liquid that comes from a fluid supply, hold this liquid that comes from this pipe unit and allow this liquid that comes from this pipe unit pass through and to send at least one outlet of this container and allow this liquid in this container to enter the device of this outlet via this pipe unit path in addition between operational period.
According to the 5th viewpoint of the present invention, it provides a kind of electroplating device that is provided with the system in the container of an electroplating device that a liquid is transported to, and this system comprises the pipe unit that holds this liquid that comes from a fluid supply, hold this liquid that comes from this pipe unit and allow this liquid that comes from this pipe unit pass through and to send at least one outlet of this container and allow this liquid in this container to enter the device of this outlet via this pipe unit path in addition between operational period.
According to the 6th viewpoint of the present invention, it provides a kind of electroplating device working method, may further comprise the steps: (a) operation first period of this electroplating device under first current density; And (b) then operation second period of this electroplating device under one second higher current density.
Description of drawings
Below will example of the present invention be described with reference to the accompanying drawings with way of example, wherein:
The PCB little footpath of Fig. 1 for partly being filled up by layer of copper;
Fig. 2 shows the position of an anode, a nozzle and a PCB in the electroplating device;
Fig. 3 A-3F is for to fill up the result with respect to the different positions of nozzle and six little footpaths under different current densities;
Fig. 4 is the general diagrammatic sketch of Fig. 3 A-3F result;
Fig. 5 A-5C is under same current density but the result is filled up in three little footpaths under the effusive electrolytic solution flow rate of the nozzle difference;
Fig. 6 is the general diagrammatic sketch of Fig. 5 A-5C result;
Fig. 7 is first kind of traditional electrolyte delivery system of electroplating device;
Fig. 8 is the electrolyte delivery system of first embodiment of the invention;
Fig. 9 A and 9B show the nozzle move mode in the electrolyte delivery system among Fig. 8;
Figure 10 is the electrolyte delivery system of second embodiment of the invention;
Figure 11 is an electrolyte delivery system part enlarged view among Figure 10;
Figure 12 illustrates the distributing switch of electrolyte delivery system among Figure 10;
Figure 13 A and 13B are second kind of traditional electrolyte delivery system of electroplating device;
Figure 14 A and 14B are the third traditional electrolyte delivery system of electroplating device;
Figure 15 A and 15B are the electrolyte delivery system of third embodiment of the invention;
Figure 16 A and 16B are the electrolyte delivery system of fourth embodiment of the invention;
Figure 17 A and 17B illustrate electrolyte delivery system detail drawing among Figure 16 A and the 16B, and wherein Figure 17 A is got sectional view by the Z-Z line along Figure 17 B; And
The experimental result of Figure 18 A-18D under different current density sizes and under different operation modes, the little footpath of different size being carried out.
Embodiment
See also Fig. 8 now, it discloses the liquid conveying system of electroplating device of the present invention, and it particularly is transported to electrolytic solution the system in one groove 102 of electroplating device.Liquid conveying system comprises that electrolytic solution is transported to two in the groove 102 arranges nozzle 104a, 104b, nozzle 104a interval fixed to one another is provided with in order to moving simultaneously, is similar to this, and nozzle 104b interval fixed to one another is provided with in order to moving simultaneously, especially, nozzle 104a, a 104b and a pipe 105a, 105b is in conjunction with the electrolytic solution to accept to come from it, the row's number that is appreciated that nozzle can be a row or more than two rows, decides on particular demands and design.
As shown in Figure 8, substrate, for example several printed circuit board (PCB)s (PCB) (Fig. 8 only illustrates one of them PCB 106) can (for example be flown bar by a for example PCB loader, not shown) drop to and be positioned at number row's nozzle 104a in the groove 102, between the 104b, during electroplating, PCB 106 keeps motionless with respect to the groove 102 of electroplating machine haply, then make number row's nozzle 104a, 104b along with arrow S
A, S
BEach linear reciprocation on the vertical plane of direction moves, arrow S
A, S
BBe nozzle 104a, 104b is transported to direction in the groove 102 with electrolytic solution.Therefore, number row's nozzle 104a, 104b move back and forth as double-headed arrow R among Fig. 8 about can be for example
A, R
BShown in, or move back and forth up and down, that is the turnover paper.
Because pipe and nozzle 104a, 104b weight is much smaller than PCB 106 and fly bar (not shown) weight, and the weight of moving part significantly reduces, and therefore makes its start required drive less.
At nozzle 104a, 104b has one respectively to arrange anode 108a away from a side of PCB 106 mobile routes, 108b, during operating, anode 108a, 108b is electrically connected to a power supply, and PCB 106 effect as the same negative electrodes in the groove 102,102 in PCB 106 and anode 108a in groove, there is an electric field between the 108b, thereby electroplate in PCB 106 metal in the electrolytic solution (for example copper) and the appropriate location on the PCB 106, strength of electric field (measuring for every square metre with ASF or ampere) can optionally be adjusted.
See also Fig. 9 A and 9B, it illustrates high order end position and low order end position that a pair of adjacent nozzle 104B moves respectively, in fact find, in order to reach the most suitable electrolytic solution injection stream covering scope, d/D ratio is preferably 1/2-3/5, wherein d is the distance between the two adjacent nozzle 104a, and D is the distance between each nozzle 104a high order end position and low order end position.
Under this arranges, negative electrode (that is PCB 106) and anode 108a, the distance of 108b remains unchanged, and makes it be easy to obtain the uniformly-coating effect on PCB 106.
This kind electrolyte delivery system also can combine with other system, and for example PCB 106 can move forward and backward in case of necessity, for example as among Fig. 8 towards with away from shown in the double-headed arrow T of PCB 106, it is satisfactory that through hole is electroplated onto.
Above-mentioned arrangement is suitable for the lift electroplating machine most, in conveyer belt type electroplating machine (wherein substrate utilizes conveying belt to move through a treatment trough), not necessarily want, as mentioned above and shown in Fig. 2-4, the best of breed that (micro via filling) filled in little footpath is to make position V that higher current density be arranged, and at position E lower current densities is arranged then.
The electroplating device (indicating with label 200) of reaching this effect generally is shown among Figure 10, and equipment 200 comprises at least one treatment trough 202, and electrolytic solution can be via number nozzle 204a, and 204b imports treatment trough 202.Substrate, for example PCB (Figure 10 only illustrates one of them PCB 206) can be moved through in the groove 202 in arrow F direction by for example conveying belt (not shown).At number row's nozzle 204a, 204b has away from PCB 206 each side of mobile route in groove 202 and respectively arranges anode 208a, 208b.
Be located at anode row 208a and arrange with nozzle that the person is one first distributing switch 210a between the 204a; Be located at nozzle row 204a and PCB 206 in groove 202 between the mobile route person be one second distributing switch 210b; Be located at nozzle row 204b and PCB 206 in groove 202 between the mobile route person be one the 3rd distributing switch 210c; Be located at nozzle row 204b and arrange with anode that the person is one the 4th distributing switch 210d between the 208b.Being appreciated that to have only in one and distributing switch 210c and 210d are only arranged among distributing switch 210a and the 210b only has one, just can obtain gratifying result.Four distributing switch 210a among Figure 10,210b, 210c, 210d is for selecting arbitrarily and can reaching preferable result.
As shown in figure 11, installing under the distributing switch 210a, the electric field between anode 208a and the PCB 206 (it act on as negative electrode) changes or redistributes makes the lead position V of the most close each nozzle 204a of higher current density
1, V
2, V
3, V
4, and lower current densities guiding position E
1, E
2, E
3(on the PCB 206 with the equidistant zone of two adjacent nozzle 204a).
As Figure 12 more clearly shown in, distributing switch 210a is for by the electrically insulating material porous plate made of polypropylene (PP) or polyvinyl chloride (PVC) for example, on distributing switch 210a, be provided with array through hole 212a, 212b, wherein through hole 212a size is bigger than through hole 212b, because the insulativity of distributing switch 210a, electric field only can be via through hole 212a, and 212b is present between anode 208a and the PCB 206.Because through hole 212a, 212b has different size, and is bigger by the current density of through hole 212a, and less by the current density of through hole 212b.Though through hole 212a shown in please understanding, 212b is shaped as circle, and it can be other shape, for example elongated slotted apertures and gap, as long as can allow electricity by.
Figure 13 A and 13B illustrate the another kind of traditional electrolyte delivery system 300 of electroplating device, in this arranges, the wall 306 of one supply pipe 302 is provided with at least one hole 304 and passes through wall, allow electrolytic solution 308 can leave pipe and 302 enter in the groove of electroplating device, the flow rate Q (litre/minute) that electrolytic solution enters groove by hole 304 equals electrolytic solution from managing the 302 flow rate q that enter hole 304.Figure 14 A and 14B illustrate another traditional electrolyte delivery system 310 of electroplating device, in arranging, this is provided with a near raceway groove 312 that is positioned at the hole 314 and is communicated with hole 314 via a wall 316 of a supply pipe 318, electrolytic solution 320 advanced hand-holes 314 in the supply pipe 318, passed through raceway groove 312 before then in entering a groove of electroplating device, as example shown in Figure 13 A and the 13B and as mentioned above, the flow rate Q that electrolytic solution enters groove by raceway groove 312 equals electrolytic solution from managing the 318 flow rate q that enter hole 314.
As mentioned above, the electrolytic solution flow rate heals, and then to fill up rate higher for height, so being design, above-mentioned arrangement increases the interior flow rate of electrolytic solution inflow groove, but not necessarily to increase the flow rate that electrolytic solution flows into supply pipe, therefore not necessarily to increase electrolytic solution from the supply pipe to the supply pipe on the flow rate in each hole, its particularly advantageous because between PCB and the anode every very little and can not allow large-scale pipeline work.
See Figure 15 A and 15B according to first kind of arrangement of the present invention, in this arranges, one supply pipe 402 is provided with several holes, wherein Figure 15 A and 15B are seen in a hole 404, hole 404 is connected and is the fluid connection relation with a raceway groove 406, raceway groove 406 leads to one of tool one funnel-form mouth 410 widens space 408, in fact find during operating, when electrolytic solution enters space 408 and enters in the groove of electroplating device by raceway groove 406, the electrolytic solution that passes through that near funnel-form mouth 410 electrolytic solution is entered mouth 410 move to electrolyte outlet side in the opposite direction, and mix with the electrolytic solution that leaves.408 enter electrolytic solution total flow rate Q in the groove and equal from managing the 402 electrolytic solution flow rate q that enter hole 404 from the space
1Electrolytic solution flow rate q with the mouth 410 that is drawn into space 408 from groove
2Sum.Can find out that a part of electrolytic solution is directly to enter space 408 but not from managing 402 from groove, also can find out that raceway groove 406 is narrower and narrower than space 408 than pipe 402 internal diameters.
See Figure 16 A to 17B according to second kind of arrangement of the present invention, in this arranges, one supply pipe 502 is provided with several holes, wherein Figure 16 A and 16B are seen in a hole 504, hole 504 is communicated with a raceway groove 506 that leads to a through hole 508, and its longitudinal axis P-P is generally perpendicular to electrolytic solution enters through hole 508 from raceway groove 506 flow direction.By after the through hole 508, electrolytic solution enters one before in entering a groove of electroplating device and widens hole 510.In fact find, in this arranges, electrolytic solution near through hole 508 2 apertures 512 the groove is drawn into through hole 508 and mixes with electrolytic solution in the through hole 508, and before entering groove once again, enter hole 510, therefore, the direction that electrolytic solution enters through hole 508 from groove be generally perpendicular to electrolytic solution from raceway groove 506 to the hole 510 flow direction, and flow in the groove subsequently.Electrolytic solution 510 enters into total flow rate Q in the groove and equals electrolytic solution from managing the 502 flow rate q that enter hole 504 from the hole
1Enter the flow rate q of through hole 512 via aperture 512 from groove with electrolytic solution
2, q
3Summation.Can find out that a part of electrolytic solution is directly to enter hole 510 but not from managing 502 from groove, also can find out that raceway groove 506 is narrower and narrower than hole 510 than pipe 502 internal diameters.
Can find out that above-mentioned use discharging effect (eductor effect) increases the flow rate of electrolytic solution from the nozzle to PCB, escaper or liquid ejector add the equipment of fluid high-speed injection stream for the zone that allows mobile at a slow speed even immobilized fluid (for example liquid), its mode is to obtain the most of kinetic energy of the latter, and the result is flow rate flowing in conjunction with fluid jet than the fast several times of original kinetic energy injection stream.Yet the size of conventional exhaust device is quite big, thereby inconvenient or be not suitable for herein.Otherwise, according to the present invention and aforesaid arrangement of the present invention save the space, be easy to make and cost quite low.
As mentioned above, generally speaking, high current density is fit to bigger little footpath fills, yet high current density easily forms the space in less little footpath.On the other hand, fill though low current density is fit to less little footpath, generally can cause little footpath of large-size to form incision, these are through experiment.Figure 18 A is three little footpaths 600 of a row that the degree of depth is all 75 μ m, 602,604 filling result, the about 75 μ m of little footpath 600 diameters, the about 100 μ m of little footpath 602 diameters, the about 125 μ m of little footpath 604 diameters, apply current density and be about 55 minutes of the electric field of 25ASF, its filling the results are shown in Figure 18A, and can find out only has little footpath 600 that good result is arranged, and incision all appears in little footpath 602 and 604.
Experiment then also is to be three little footpaths 606 (diameter is about 75 μ m) of 75 μ m to the degree of depth, 608 (diameter is about 100 μ m), 610 (diameter is about 125 μ m) carried out, apply current density and be about 46 minutes of the electric field of 30ASF, thereby obtain identical amp hr size as above-mentioned first experiment, its filling the results are shown in Figure 18B, but though find out little footpath 608 and 610 good and acceptable result are arranged, but the space appears in little footpath 606.
The 3rd experiment also is to be three little footpaths 612 (diameter is about 75 μ m) of 75 μ m to the degree of depth, 614 (diameter is about 100 μ m), 616 (diameter is about 125 μ m) carried out, apply current density and be about 27.5 minutes of the electric field of 30ASF, then apply current density and be about 27.5 minutes of the electric field of 20ASF, thereby obtain identical amp hr size as above-mentioned first and second experiments, its filling the results are shown in Figure 18C, though can find out little footpath 616 acceptable result is arranged, but the space appears in little footpath 612,614.
In fact find to apply earlier first period of electric field of low current density, apply second period of electric field of high current density again, can obtain more can accepting the result, two periods are preferably identical.The 4th experiment also is to be three little footpaths 618 (diameter is about 75 μ m) of 75 μ m to the degree of depth, 620 (diameter is about 100 μ m), 622 (diameter is about 125 μ m) carried out, apply current density and be about 27.5 minutes of the electric field of 20ASF, then apply current density and be about 27.5 minutes of the electric field of 30ASF, thereby obtain identical amp hr size with the 3rd experiment as above-mentioned first, second, its filling the results are shown in Figure 18D, can find out little footpath 618,620 and 622 filling effect is not well to be exactly can accept at least.
In fact find the PCB that has more than a kind of little footpath of size is difficult to one step current density program this be filled up in the footpath slightly, program of the present invention adopts formula application gradually can prevent that less little footpath from producing the higher current density in space, electroplates enough copper in bigger little footpath simultaneously.In fact find that the number of steps of continuous higher current density can for example three even four, decide on user's particular demands more than two.
In fact also find the galvanized continuous higher current density of substrate gradually formula be applied under the identical gratifying plating result and can reduce total electroplating time, for example will avoid the maximum single stage current density in space is 25ASF, and electroplating time is 30 minutes, it is 25 * 30/60 amp hrs that total current is every square feet, that is 12.5 amp hrs/square feet.For reaching identical result, that is there is not the space, formula method gradually below can adopting:
25 ASF * 20 minute
30 ASF * 8.33 minute
It is 25 * 20/60+30 * 8.33/60 amp hr that total current is every square feet, that is 12.5 amp hrs/square feet, but electroplating time only needs 28.33 minutes.
Please understand above-mentionedly, still many modifications and/or variation can be arranged not departing under the spirit of the present invention only for can implement example of the present invention.
Also please be appreciated that ask clear so be disclosed in the special characteristic of the present invention of each embodiment can combination in single embodiment, otherwise, for the sake of clarity so be disclosed in the different characteristics of the present invention of single embodiment and also can provide dividually or provide with suitable inferior array mode.
Claims (22)
1. the liquid conveying system of an electroplating device, this system comprises at least two liquid exits, this at least two liquid exit fixedly installs in order to action simultaneously at each interval and liquid can be sent in this equipment, wherein first liquid exit is sent into this liquid in this equipment along a path at least, and wherein these liquid exits can move on haply perpendicular to a plane in this path.
2. liquid conveying system according to claim 1, wherein this outlet can be moved along a straight haply linear reciprocation on this plane.
3. liquid conveying system according to claim 2, wherein distance is 1/2 to 3/5 with the ratio of each this liquid exit running length haply between this two liquid exit.
4. one kind is provided with according to claim 1, and 2, or the electroplating device of 3 described liquid conveying systems.
5. one kind with the galvanized electroplating device of at least one substrate, comprises anode assembly, holds the vessel assembly of an electrolytic solution, this electrolytic solution is delivered into the device of the current density of the device of this container and this different base board parts of control guiding.
6. electroplating device according to claim 5, wherein this control device comprises at least one porous member of being made by electrically insulating material by at least mainly.
7. electroplating device according to claim 6, wherein this control device is by at least mainly being made by polypropylene or polyvinyl chloride.
8. electroplating device according to claim 5, wherein this control device is a board member.
9. electroplating device according to claim 5, wherein this control device has the hole of at least two group different sizes.
10. electroplating device according to claim 5 is wherein between this control device this substrate mobile route in this anode assembly and this container.
11. electroplating device according to claim 5, wherein this control device is between this anode assembly and this e Foerderanlage.
12. electroplating device according to claim 5 is wherein between this control device this substrate mobile route in this e Foerderanlage and this container.
13. the system in the container that a liquid is transported to an electroplating device, this system comprise the pipe unit that holds this liquid that comes from a fluid supply, hold this liquid that comes from this pipe unit and allow this liquid that comes from this pipe unit pass through and to send at least one outlet of this container and allow this liquid in this container to enter the device of this outlet via this pipe unit path in addition between operational period.
14. system according to claim 13 also comprises one first raceway groove that is the fluid connection relation with this pipe unit and this outlet, wherein the internal diameter of this this pipe unit of first ditch channel ratio and this outlet is narrow.
15. system according to claim 13, wherein this outlet comprises and widens mouth, allows this liquid in this container can enter this outlet.
16. system according to claim 15, wherein between operational period, this liquid in this container can leave the reverse direction that this outlet enters the direction of this container at general and this liquid and enter this outlet.
17. system according to claim 13, wherein this pipe unit is the fluid connection relation via one second raceway groove and this outlet, and wherein this second structure road has at least one aperture that allows this interior liquid of this container enter.
18. system according to claim 17, wherein this second structure road has at least two apertures that allow this interior liquid of this container enter.
19. system according to claim 17, wherein this aperture allows this liquid in this container to enter in the vertical direction of direction that general and this liquid leave this outlet.
20. electroplating device that is provided with according to each described system in the claim 13 to 19.
21. an electroplating device working method may further comprise the steps:
(a) operation first period of this electroplating device under first current density; And
(b) then under at least one second current density higher, operate second period of this electroplating device than this first current density.
22. method according to claim 21, wherein this second period equals this first period haply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101130502A CN100523309C (en) | 2003-12-25 | 2003-12-25 | Liquid conveying system for electroplating equipment, electroplating equipment with the system and its operation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101130502A CN100523309C (en) | 2003-12-25 | 2003-12-25 | Liquid conveying system for electroplating equipment, electroplating equipment with the system and its operation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1637168A true CN1637168A (en) | 2005-07-13 |
| CN100523309C CN100523309C (en) | 2009-08-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2003101130502A Expired - Lifetime CN100523309C (en) | 2003-12-25 | 2003-12-25 | Liquid conveying system for electroplating equipment, electroplating equipment with the system and its operation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100523309C (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101187052B (en) * | 2006-11-22 | 2011-09-21 | 辛永议 | Plating device |
| CN103025921A (en) * | 2010-06-11 | 2013-04-03 | Ppg工业俄亥俄公司 | Method for depositing an electrodepositable coating composition onto a substrate using a plurality of liquid streams |
| US20130081939A1 (en) * | 2011-09-29 | 2013-04-04 | Almex Pe Inc. | Serial plating system |
| CN103031587A (en) * | 2011-09-29 | 2013-04-10 | Almexpe株式会社 | Serial plating system |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3835017A (en) * | 1972-12-22 | 1974-09-10 | Buckbee Mears Co | Reusable shields for selective electrodeposition |
| JP2754891B2 (en) * | 1990-09-04 | 1998-05-20 | 三菱マテリアル株式会社 | Method and apparatus for manufacturing electrodeposited whetstone |
| US6280581B1 (en) * | 1998-12-29 | 2001-08-28 | David Cheng | Method and apparatus for electroplating films on semiconductor wafers |
-
2003
- 2003-12-25 CN CNB2003101130502A patent/CN100523309C/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101187052B (en) * | 2006-11-22 | 2011-09-21 | 辛永议 | Plating device |
| CN103025921A (en) * | 2010-06-11 | 2013-04-03 | Ppg工业俄亥俄公司 | Method for depositing an electrodepositable coating composition onto a substrate using a plurality of liquid streams |
| CN103025921B (en) * | 2010-06-11 | 2016-06-01 | Ppg工业俄亥俄公司 | Utilize the method that the coating composition of energy electro-deposition is deposited on base material by multiple liquid stream |
| US20130081939A1 (en) * | 2011-09-29 | 2013-04-04 | Almex Pe Inc. | Serial plating system |
| CN103031587A (en) * | 2011-09-29 | 2013-04-10 | Almexpe株式会社 | Serial plating system |
| JP2013082996A (en) * | 2011-09-29 | 2013-05-09 | Almex Pe Inc | Continuous plating apparatus |
| CN103031587B (en) * | 2011-09-29 | 2016-12-21 | Almexpe株式会社 | Continuous electroplating apparatus |
| JP2017122284A (en) * | 2011-09-29 | 2017-07-13 | アルメックスＰｅ株式会社 | Continuous plating apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100523309C (en) | 2009-08-05 |
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