CN110804755A - Electroplating apparatus - Google Patents
Electroplating apparatus Download PDFInfo
- Publication number
- CN110804755A CN110804755A CN201910794446.9A CN201910794446A CN110804755A CN 110804755 A CN110804755 A CN 110804755A CN 201910794446 A CN201910794446 A CN 201910794446A CN 110804755 A CN110804755 A CN 110804755A
- Authority
- CN
- China
- Prior art keywords
- anode
- negative pole
- recited
- plating apparatus
- cell body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 30
- 238000007747 plating Methods 0.000 claims abstract description 21
- 210000005056 cell body Anatomy 0.000 claims abstract description 19
- 238000003756 stirring Methods 0.000 claims abstract description 18
- 230000007246 mechanism Effects 0.000 claims description 5
- KNJBQISZLAUCMG-UHFFFAOYSA-N oxygen(2-) titanium(4+) yttrium(3+) Chemical compound [O-2].[Y+3].[Ti+4] KNJBQISZLAUCMG-UHFFFAOYSA-N 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 9
- 239000003814 drug Substances 0.000 abstract description 6
- 239000007788 liquid Substances 0.000 abstract description 6
- 230000008859 change Effects 0.000 abstract description 4
- 239000007921 spray Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 210000004027 cell Anatomy 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/04—Removal of gases or vapours ; Gas or pressure control
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model provides an electroplating device, includes the cell body of plating bath, is provided with negative pole and positive pole along length direction in the cell body, and the product is hung on the negative pole, its characterized in that: the negative pole and positive pole are fixed setting, and wherein the negative pole setting is in the middle part of the cell body, and the positive pole is two, and equidistance interval parallel arrangement is respectively in the both sides of negative pole, is equipped with the pendulous device that is used for stirring the plating solution in the cell body between negative pole and the positive pole. The invention has reasonable structural design, and because the cathode and the anode are fixedly arranged, the power line can not change, and the uniformity is good; a vibration pump is additionally arranged on the cathode, and a swinging device and an ultrasonic generator are arranged in the tank body, so that the effect of eliminating bubbles is achieved, the exchange speed of the liquid medicine is increased, and the micro holes as small as 50 mu m can also obtain a good hole filling effect; the height, the size and the distance of the swing device are adjustable, and the swing device is suitable for various electroplating products; the anode shielding plate can be adjusted from left to right and up and down, so that the distribution uniformity of the electroplated power lines is further improved.
Description
Technical Field
The invention belongs to the technical field of circuit board electroplating, relates to electroplating equipment, and particularly relates to high-precision high-speed electroplating equipment.
Background
At present, two conventional electroplating devices for electroplating circuit boards are available, one is gantry electroplating, and the other is VCP electroplating, and the two devices have the following defects:
firstly, gantry electroplating: each groove is independent, the product is hung on the cathode, and in order to achieve a better hole filling effect, the product generally swings in the directions of 45 degrees of the left and right and opposite angles to increase the hole filling capacity of the liquid medicine, but along with the swinging movement of the cathode, the distance between the cathode and the anode changes, the power line changes along with the change, and the uniformity is poor;
secondly, VCP electroplating: the product on the cathode horizontally moves, the distance between the cathode and the anode is constant, the uniformity is good, if different thicknesses are electroplated, different running line speeds need to be adjusted, in order to achieve higher productivity, the line body can only be lengthened, so that the equipment investment and the occupied area can be increased, the liquid medicine loss and the maintenance cost can be increased, and one line cannot be electroplated with different specifications; and the cathode can not be vibrated mechanically when moving horizontally, so that the electroplating bubbles generated at the cathode can not be diffused rapidly, and the probability of bad holes can be increased aiming at the micro apertures less than 100 um.
According to inspection, the traditional Chinese patent CN201820147287, namely 'an electroplating bath', comprises a bath body, wherein a first group of spray pipes and a second group of spray pipes are respectively arranged on two sides of the bath body; the first group of spray pipes and the second group of spray pipes are arranged in parallel at intervals, a plurality of nozzles are respectively arranged on the inner sides of the first group of spray pipes and the inner sides of the second group of spray pipes, the nozzles are uniformly distributed along the length direction of each spray pipe, and the jet flow direction of each nozzle is vertical to the printed circuit board. The first guide bar and the second guide bar are arranged between the first group of spray pipes and the second group of spray pipes, and the first guide bar and the second guide bar are arranged in parallel and reserve a space for the printed circuit board to pass through; and the first guide bar and the second guide bar are provided with nozzles, and the jet flow direction is vertical to the printed circuit board. The electroplating bath is improved aiming at a vertical continuous electroplating bath, and is provided with a guide strip, a spray pipe and a nozzle, so that the electroplating quality of a product is improved, but the diffusion effect of bubbles generated by a cathode is not ideal enough, and further improvement is needed.
Disclosure of Invention
The invention aims to provide electroplating equipment with reasonable structure and better electroplating uniformity.
The technical scheme adopted by the invention for solving the technical problems is as follows: the utility model provides an electroplating device, includes the cell body of plating bath, is provided with negative pole and positive pole along length direction in the cell body, and the product is hung on the negative pole, its characterized in that: the negative pole and positive pole are fixed setting, and wherein the negative pole setting is in the middle part of the cell body, and the positive pole is two, and equidistance interval parallel arrangement is respectively in the both sides of negative pole, is equipped with the pendulous device that is used for stirring the plating solution in the cell body between negative pole and the positive pole.
Furthermore, the cathode is additionally provided with two vibration pumps which are respectively arranged on the front side and the rear side of the cathode, and the frequency of the vibration pumps is adjustable.
Furthermore, the swinging device is arranged along the length direction of the tank body, and the distance between the swinging device and the anode is adjustable and is as close to the cathode as possible.
Still further, the pendulous device is including swing support and actuating mechanism, and its swing support adopts the framework, and the swing support below is fixed with the fixed plate, and the side-mounting of fixed plate has the stirring body.
Furthermore, a driving mechanism of the swing device is that a swing motor is fixedly arranged on one side of the groove body, an upward output end of the swing motor is provided with an eccentric wheel, and an eccentric pin on the eccentric wheel is in inserted fit with a connecting hole on one side of the swing bracket.
Still further, the mobilizable stirring body is installed to detachably on the fixed plate, and U style of calligraphy pulley is installed to the bottom of swing support, and with the slide rail cooperation on the cell body bottom.
Preferably, the fixed plates are provided with fixed holes for fixing the stirring bodies in a row-by-row manner, so that the distance and the number of the stirring bodies can be adjusted.
Preferably, the stirring body is a triangular body.
Furthermore, the left and right side frames of the swing bracket are placed on fixed pulleys on the edge of the opening of the tank body, and the fixed pulleys are U-shaped pulleys and distributed on the left and right sides of the edge of the opening of the tank body.
And an ultrasonic generator is arranged between the anode and the inner wall surface of the tank body, is arranged along the length direction of the tank body and has adjustable frequency.
Furthermore, the anode is an insoluble anode made of yttrium oxide titanium mesh, a mesh barrier for preventing bubbles from overflowing is additionally arranged outside the anode, an anode shielding plate for improving the distribution uniformity of the electroplated power line is arranged on the anode, and the anode shielding plate can be adjusted left and right and up and down according to products with different sizes.
Finally, the cell body is the cell body that can independently manage and control, and the cell body can a plurality of combination become the product of the different specifications of a line simultaneous operation.
Compared with the prior art, the invention has the advantages that: the cathode and the anode are fixedly arranged, so that the power line change is small, the uniformity is good, and the electroplating uniformity is better under the same condition; a vibration pump is additionally arranged on the cathode, a swinging device and an ultrasonic generator are arranged in the tank body to achieve the effect of eliminating bubbles, and meanwhile, the exchange speed of the liquid medicine is increased, so that micro holes as small as 30 mu m can also obtain good hole filling effect; the height, the size and the distance of the stirring body of the swinging device are adjustable, and the swinging device is suitable for various electroplating products; the anode shielding plate can be adjusted from left to right and up and down, so that the distribution uniformity of the electroplated power lines can be further improved. The invention has reasonable structural design, good power line distribution uniformity, rapid bubble elimination, good electroplating uniformity and improved hole filling effect.
Drawings
FIG. 1 is a top view of the schematic structure of a plating cell provided by the present invention;
FIG. 2 is a front view of the schematic structure of a plating bath provided by the present invention;
FIG. 3 is a side view of the schematic structure of a plating cell provided by the present invention;
FIG. 4 is a detailed structural view of a plating tank of the present invention.
Detailed Description
The invention is described in further detail below with reference to the accompanying examples.
As shown in fig. 1-4, a high-speed electroplating apparatus, i.e. an electroplating bath, comprises a bath body 1 of the electroplating bath, wherein a cathode 2 and an anode 3 are arranged in the bath body 1 along the length direction, the cathode 2 and the anode 3 are fixedly arranged, the cathode 2 is arranged in the middle of the bath body 1, the anodes 3 are two and are respectively arranged on two sides of the cathode 2 at equal intervals in parallel, a swing device 4 for stirring electroplating solution is arranged in the bath body 1 between the cathode 2 and the anode 3, and a vibration pump 5 is additionally arranged on the cathode 2. The method specifically comprises the following steps: the number of the vibration pumps 5 is two, and the two vibration pumps are respectively arranged at the front side and the rear side of the cathode 2, the frequency of the vibration pump 5 is adjustable, and the vibration pump 5 is usually fixed on a bracket of the cathode 2 for the convenience of installation of the vibration pump. The oscillating device 4 is arranged along the length direction of the tank body 1, the distance between the oscillating device 4 and the anode 3 is adjustable and is as close to the cathode 2 as possible, the oscillating device 4 comprises an oscillating support 41 and an oscillating motor 44, the oscillating support 41 adopts a device with high strength and small diameter, the distribution of current is interfered when the oscillating device oscillates due to the large diameter, the oscillating support 41 is deformed due to low strength, the oscillating support 41 adopts a rectangular frame body, the oscillating support 41 is fixed with a fixed plate 45 through a connecting plate 46, the inner side surface of the fixed plate 45 is detachably provided with a stirring body through bolts and nuts, the stirring body can adopt a simple and easy triangular body 42 which is a basically triangular section for the convenience of production and manufacture, of course, the stirring body can be various, such as a column shape or a wave bar shape, and can be used, in order to detachably install the movable triangular body, the distance between the triangular bodies 42 is adjustable, the number of the triangular bodies is adjustable, fixing holes can be distributed on the fixing plate 45 in a row and column mode and used for bolts, the distance between the triangular bodies 42 and products on the cathode 2 is confirmed, and the products cannot be scraped. The pulley is installed to fixed plate 45 bottom under the swing support 42, and the pulley can adopt U-shaped pulley 43 and the slide rail cooperation on the tank bottom, not only can effectively keep the straightness that hangs down, prevents to warp, but also can make the swing range of top and bottom unanimous, and the swing range, the frequency of swing support 41 of this embodiment are adjustable, and the swing range of swing support 41 of this embodiment is between 10 ~ 15cm, and the frequency of swing is 1/s. In order to reduce the friction force of the swing bracket, the left and right side frames of the swing bracket 41 are placed on the fixed pulleys 47 at the opening edge of the tank body 1, the fixed pulleys 47 can be U-shaped fixed pulleys and are distributed at the left and right sides of the opening edge of the tank body 1, and two U-shaped fixed pulleys at each side are basically distributed on a straight line for placing the frames of the swing bracket 41. The driving mechanism of the swinging device 4 is that a swinging motor 44 is fixedly arranged on one side of the tank body 1, an eccentric wheel 47 is arranged at the upward output end of the swinging motor 44, and an eccentric pin 48 on the eccentric wheel 47 is in inserted fit with a connecting hole on one side of the swinging bracket 41, so that the swinging motor 44 is connected with one side of the swinging bracket 41 through the eccentric wheel 47 and can drive the swinging bracket 41 to reciprocate. The cathode 1 is fixed by copper bar, the anode 3 is insoluble anode made of yttrium oxide titanium mesh, the ultrasonic generator 6 is arranged between the anode 3 and the inner wall surface of the tank body 1, the ultrasonic generator 6 is arranged along the length direction of the tank body 1, and the frequency is adjustable. The net barrier 31 for preventing bubbles from overflowing is additionally arranged outside the anode 3, the anode 3 is provided with an anode shielding plate for improving the distribution uniformity of the electroplated power line, and the anode shielding plate 3 can be adjusted left and right and up and down according to products with different sizes.
The size of the trough body 1 of the embodiment is designed according to the range of 250 × 200 mm-250 × 250mm, and one hanging plate is suggested to be hung and plated, because two hanging plates are adopted, electric lines of force between two products can be interfered respectively, if a baffle plate is designed in the middle of the trough body 1 to avoid the interference of the electric lines of force, the middle of the baffle plate needs to be partially hollowed out due to the swing device 4 arranged in the middle, so that the current is influenced, and the swing device 4 is not easy to install; the requirements for the hanger on the cathode 2 are: the hanger has high strength and is not easy to deform, and the hanger cannot have an exposed conductor except for a clamping point, and the embedded copper core wire is suggested to be used as a special hanger.
The tank body 1 can be independently controlled, a plurality of tank bodies 1 can be combined into a line, products with different specifications can be operated simultaneously, if the thickness of the products is increased, only the copper-plated tank body needs to be prolonged/increased independently, the cost of other attached devices is low, and the cost of the devices, liquid medicine, supporting facilities and management is reduced.
During electroplating, the cathode 2 and the anode 3 are fixedly arranged, so that the power line change is small and the uniformity is good; the vibrating pump 5 is additionally arranged on the cathode 2, the swinging device 4 and the ultrasonic generator 6 are arranged in the tank body 1, so that the bubble eliminating effect can be well achieved, and meanwhile, the liquid medicine exchange speed is increased, so that micro holes as small as 50 microns can also obtain a good hole filling effect.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the technical principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (12)
1. The utility model provides an electroplating device, includes the cell body of plating bath, is provided with negative pole and positive pole along length direction in the cell body, and the product is hung on the negative pole, its characterized in that: the negative pole and positive pole are fixed setting, and wherein the negative pole setting is in the middle part of the cell body, and the positive pole is two, and equidistance interval parallel arrangement is respectively in the both sides of negative pole, is equipped with the pendulous device that is used for stirring the plating solution in the cell body between negative pole and the positive pole.
2. The plating apparatus as recited in claim 1, wherein: the cathode is additionally provided with two vibration pumps which are respectively arranged on the front side and the rear side of the cathode, and the frequency of the vibration pumps is adjustable.
3. The plating apparatus as recited in claim 1, wherein: the swinging device is arranged along the length direction of the tank body, and the distance between the swinging device and the anode is adjustable and is as close to the cathode as possible.
4. The plating apparatus as recited in claim 1, wherein: the swing device comprises a swing support and a driving mechanism, the swing support adopts a frame body, a fixed plate is fixed below the swing support, and a stirring body is installed on the side surface of the fixed plate.
5. The plating apparatus as recited in claim 4, wherein: a driving mechanism of the swing device is characterized in that a swing motor is fixedly arranged on one side of a groove body, an upward output end of the swing motor is provided with an eccentric wheel, and an eccentric pin on the eccentric wheel is in inserted fit with a connecting hole on one side of a swing support.
6. The plating apparatus as recited in claim 4, wherein: the movable stirring body is detachably mounted on the fixed plate, and the U-shaped pulley is mounted at the bottom of the swinging support and matched with the sliding rail on the bottom of the tank body.
7. The plating apparatus as recited in claim 6, wherein: the fixed plates are provided with fixed holes in a determinant way for fixing the stirring bodies, so that the distance and the number of the stirring bodies can be adjusted.
8. The plating apparatus as recited in claim 7, wherein: the stirring body adopts a triangular body.
9. The plating apparatus as recited in claim 4, wherein: the left and right side frames of the swing bracket are placed on fixed pulleys on the opening edge of the groove body, and the fixed pulleys are U-shaped pulleys and distributed on the left and right sides of the opening edge of the groove body.
10. The plating apparatus as recited in claim 1, wherein: an ultrasonic generator is arranged between the anode and the inner wall surface of the tank body, and the ultrasonic generator is arranged along the length direction of the tank body and has adjustable frequency.
11. Plating apparatus according to any one of claims 1 to 10, characterized in that: the anode is an insoluble anode made of yttrium oxide titanium mesh, a mesh screen for preventing bubbles from overflowing is additionally arranged outside the anode, an anode shielding plate for improving the distribution uniformity of an electroplated power line is arranged on the anode, and the anode shielding plate can be adjusted left and right and up and down according to products with different sizes.
12. The plating apparatus as recited in claim 11, wherein: the cell body is the cell body of independent management and control, and the cell body can a plurality of combination become the product of a line simultaneous operation different specifications.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910794446.9A CN110804755A (en) | 2019-08-27 | 2019-08-27 | Electroplating apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910794446.9A CN110804755A (en) | 2019-08-27 | 2019-08-27 | Electroplating apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
CN110804755A true CN110804755A (en) | 2020-02-18 |
Family
ID=69487448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910794446.9A Pending CN110804755A (en) | 2019-08-27 | 2019-08-27 | Electroplating apparatus |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110804755A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112593267A (en) * | 2020-11-13 | 2021-04-02 | 吴勇军 | Electroplating equipment |
WO2021190250A1 (en) * | 2020-03-27 | 2021-09-30 | 京东方科技集团股份有限公司 | Electrochemical deposition device |
CN114525554A (en) * | 2020-11-23 | 2022-05-24 | 余姚市爱迪升电镀科技有限公司 | Method for electroplating silver |
CN114525559A (en) * | 2020-11-23 | 2022-05-24 | 余姚市爱迪升电镀科技有限公司 | Plating apparatus and plating method |
CN114540929A (en) * | 2020-11-26 | 2022-05-27 | 长鑫存储技术有限公司 | Electroplating method and electroplating device |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4883575A (en) * | 1987-06-05 | 1989-11-28 | Ube Industries Ltd. | Apparatus for continuously producing a base for a printed circuit board |
CN101451264A (en) * | 2007-12-04 | 2009-06-10 | 株式会社荏原制作所 | Plating apparatus and plating method |
CN104131331A (en) * | 2013-05-03 | 2014-11-05 | 昆山雅鑫化工有限公司 | Improved structure of coppered wire hang stripping recovery groove |
CN203960384U (en) * | 2014-06-25 | 2014-11-26 | 苏州市旗腾环保科技有限公司 | A kind of negative electrode waves electroplating device |
CN205710979U (en) * | 2016-04-26 | 2016-11-23 | 浙江振有电子股份有限公司 | HDI plate becomes more meticulous copper plating device |
CN206109565U (en) * | 2016-08-29 | 2017-04-19 | 广州兴森快捷电路科技有限公司 | Electroplating device |
CN109576768A (en) * | 2019-02-15 | 2019-04-05 | 黄安琪 | Promote the electroplating device of pcb board high thickness to diameter ratio grout ability and copper facing uniformity |
CN211284593U (en) * | 2019-08-27 | 2020-08-18 | 宁波华远电子科技有限公司 | Electroplating apparatus |
-
2019
- 2019-08-27 CN CN201910794446.9A patent/CN110804755A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4883575A (en) * | 1987-06-05 | 1989-11-28 | Ube Industries Ltd. | Apparatus for continuously producing a base for a printed circuit board |
CN101451264A (en) * | 2007-12-04 | 2009-06-10 | 株式会社荏原制作所 | Plating apparatus and plating method |
CN104131331A (en) * | 2013-05-03 | 2014-11-05 | 昆山雅鑫化工有限公司 | Improved structure of coppered wire hang stripping recovery groove |
CN203960384U (en) * | 2014-06-25 | 2014-11-26 | 苏州市旗腾环保科技有限公司 | A kind of negative electrode waves electroplating device |
CN205710979U (en) * | 2016-04-26 | 2016-11-23 | 浙江振有电子股份有限公司 | HDI plate becomes more meticulous copper plating device |
CN206109565U (en) * | 2016-08-29 | 2017-04-19 | 广州兴森快捷电路科技有限公司 | Electroplating device |
CN109576768A (en) * | 2019-02-15 | 2019-04-05 | 黄安琪 | Promote the electroplating device of pcb board high thickness to diameter ratio grout ability and copper facing uniformity |
CN211284593U (en) * | 2019-08-27 | 2020-08-18 | 宁波华远电子科技有限公司 | Electroplating apparatus |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021190250A1 (en) * | 2020-03-27 | 2021-09-30 | 京东方科技集团股份有限公司 | Electrochemical deposition device |
CN112593267A (en) * | 2020-11-13 | 2021-04-02 | 吴勇军 | Electroplating equipment |
CN112593267B (en) * | 2020-11-13 | 2022-04-29 | 吴勇军 | Electroplating equipment |
CN114525554A (en) * | 2020-11-23 | 2022-05-24 | 余姚市爱迪升电镀科技有限公司 | Method for electroplating silver |
CN114525559A (en) * | 2020-11-23 | 2022-05-24 | 余姚市爱迪升电镀科技有限公司 | Plating apparatus and plating method |
CN114525554B (en) * | 2020-11-23 | 2023-06-06 | 余姚市爱迪升电镀科技有限公司 | Method for electroplating silver |
CN114540929A (en) * | 2020-11-26 | 2022-05-27 | 长鑫存储技术有限公司 | Electroplating method and electroplating device |
CN114540929B (en) * | 2020-11-26 | 2023-09-08 | 长鑫存储技术有限公司 | Electroplating method and electroplating device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN110804755A (en) | Electroplating apparatus | |
CN211284593U (en) | Electroplating apparatus | |
CN109576768B (en) | Electroplating equipment for improving high thickness-diameter ratio hole pouring capability and copper plating uniformity of PCB | |
US20080035475A1 (en) | Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during plating | |
US7553401B2 (en) | Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating | |
WO2017045252A1 (en) | Electroplating device for printed circuit board | |
CN108315808A (en) | A kind of electroplating production facility | |
CN210314551U (en) | Swinging device for electroplating | |
CN113355721B (en) | Electroplating jet system | |
CN203807581U (en) | Electroplating flow guide device and system | |
CN207672140U (en) | Electroplanting device with locomotive function jet flow bar | |
CN212476926U (en) | PCB board gilding device | |
CN210117448U (en) | Floating frame for plating copper uniformly on plate surface of vertical continuous plating bath | |
CN214694423U (en) | Continuous electroplating device | |
CN214529309U (en) | Stirring device for wafer electroplating equipment | |
CN210176952U (en) | Chemical plating bath and nickel-gold wire | |
CN210394575U (en) | Electroplating hanger capable of automatically turning sheet | |
CN209836346U (en) | PCB board electroplating device | |
CN112981507A (en) | Electroplating tank bottom box of vertical continuous electroplating equipment capable of improving electroplating performance | |
CN2685355Y (en) | Fore-and-aft treatment jetter for electroplating machine | |
CN220597669U (en) | Ceramic plate copper plating cylinder capable of being plated uniformly | |
CN211311630U (en) | Copper plating uniformity improving device | |
CN210458418U (en) | Electroplating flying bar moving device | |
CN214991970U (en) | Electroplating tank bottom box of vertical continuous electroplating equipment capable of improving electroplating performance | |
CN111647935A (en) | Scanning type electrodeposition processing method and device with multi-wire anodes arranged in parallel |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination |