CN1622715A - 有机发光显示器及其制造方法 - Google Patents
有机发光显示器及其制造方法 Download PDFInfo
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- CN1622715A CN1622715A CNA2004100953653A CN200410095365A CN1622715A CN 1622715 A CN1622715 A CN 1622715A CN A2004100953653 A CNA2004100953653 A CN A2004100953653A CN 200410095365 A CN200410095365 A CN 200410095365A CN 1622715 A CN1622715 A CN 1622715A
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- 238000004519 manufacturing process Methods 0.000 title claims description 28
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 238000000034 method Methods 0.000 claims abstract description 46
- 239000010409 thin film Substances 0.000 claims abstract description 23
- 238000003466 welding Methods 0.000 claims description 61
- 230000015572 biosynthetic process Effects 0.000 claims description 17
- 229910001182 Mo alloy Inorganic materials 0.000 claims description 13
- 229910001080 W alloy Inorganic materials 0.000 claims description 6
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 claims description 6
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- MGRWKWACZDFZJT-UHFFFAOYSA-N molybdenum tungsten Chemical group [Mo].[W] MGRWKWACZDFZJT-UHFFFAOYSA-N 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 5
- VVTQWTOTJWCYQT-UHFFFAOYSA-N alumane;neodymium Chemical compound [AlH3].[Nd] VVTQWTOTJWCYQT-UHFFFAOYSA-N 0.000 claims description 4
- 239000005355 lead glass Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 190
- 238000005260 corrosion Methods 0.000 description 15
- 230000007797 corrosion Effects 0.000 description 15
- 238000009413 insulation Methods 0.000 description 14
- 238000000465 moulding Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 11
- 238000005530 etching Methods 0.000 description 10
- 230000007423 decrease Effects 0.000 description 7
- 239000000565 sealant Substances 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 5
- 238000010276 construction Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 238000002161 passivation Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 229920001621 AMOLED Polymers 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/06—Electrode terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
- H10K2102/3023—Direction of light emission
- H10K2102/3026—Top emission
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/818—Reflective anodes, e.g. ITO combined with thick metallic layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8051—Anodes
- H10K59/80518—Reflective anodes, e.g. ITO combined with thick metallic layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
示例 | 比较例 | |
故障率 | 0%(0/5) | 100%(5/5) |
Claims (35)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030083792A KR100579184B1 (ko) | 2003-11-24 | 2003-11-24 | 유기전계발광표시장치 |
KR83792/2003 | 2003-11-24 | ||
KR83792/03 | 2003-11-24 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008101087793A Division CN101299895B (zh) | 2003-11-24 | 2004-11-24 | 有机发光显示器及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1622715A true CN1622715A (zh) | 2005-06-01 |
CN100511755C CN100511755C (zh) | 2009-07-08 |
Family
ID=34588036
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100953653A Active CN100511755C (zh) | 2003-11-24 | 2004-11-24 | 有机发光显示器及其制造方法 |
CN2008101087793A Active CN101299895B (zh) | 2003-11-24 | 2004-11-24 | 有机发光显示器及其制造方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008101087793A Active CN101299895B (zh) | 2003-11-24 | 2004-11-24 | 有机发光显示器及其制造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7247881B2 (zh) |
KR (1) | KR100579184B1 (zh) |
CN (2) | CN100511755C (zh) |
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101271919B (zh) * | 2007-03-22 | 2010-06-09 | 乐金显示有限公司 | 显示基板、有机发光二极管显示器件及其制造方法 |
US7948177B2 (en) | 2006-01-27 | 2011-05-24 | Samsung Mobile Display Co., Ltd. | Flat panel display device with protective layer structure and method of making the same |
US8035300B2 (en) | 2006-01-27 | 2011-10-11 | Samsung Mobile Display Co., Ltd. | Flat panel display device and method of making the same |
CN102456849A (zh) * | 2010-10-27 | 2012-05-16 | 三星移动显示器株式会社 | 有机发光显示装置及其制造方法 |
CN101814522B (zh) * | 2009-02-24 | 2013-04-03 | 乐金显示有限公司 | 顶部发光倒置型有机发光二极管显示设备及其制造方法 |
CN103187430A (zh) * | 2011-12-28 | 2013-07-03 | 三星显示有限公司 | 显示装置 |
CN103514815A (zh) * | 2012-06-15 | 2014-01-15 | 三星显示有限公司 | 显示装置 |
CN104091891A (zh) * | 2014-06-03 | 2014-10-08 | 京东方科技集团股份有限公司 | 柔性基板及其制造方法、显示装置 |
CN104103669A (zh) * | 2013-04-11 | 2014-10-15 | 乐金显示有限公司 | 柔性显示面板 |
CN104183602A (zh) * | 2013-05-24 | 2014-12-03 | 三星显示有限公司 | 薄膜晶体管阵列衬底、其制造方法以及包括薄膜晶体管阵列衬底的有机发光显示装置 |
CN104218061A (zh) * | 2013-05-30 | 2014-12-17 | 三星显示有限公司 | 有机发光显示设备及其制造方法 |
CN104218058A (zh) * | 2013-05-30 | 2014-12-17 | 三星显示有限公司 | 有机发光显示装置 |
CN104425550A (zh) * | 2013-08-30 | 2015-03-18 | 乐金显示有限公司 | 柔性有机电致发光装置及其制造方法 |
TWI487159B (zh) * | 2012-07-24 | 2015-06-01 | ||
CN104733471A (zh) * | 2013-12-23 | 2015-06-24 | 昆山国显光电有限公司 | 一种有机发光显示器件的阵列基板及其制备方法 |
WO2016074241A1 (zh) * | 2014-11-14 | 2016-05-19 | 深圳市柔宇科技有限公司 | 一种基于oled的tft阵列基板结构 |
CN106206655A (zh) * | 2015-05-29 | 2016-12-07 | 乐金显示有限公司 | 有机发光显示装置及其制造方法 |
CN106206648A (zh) * | 2015-05-28 | 2016-12-07 | 乐金显示有限公司 | 有机发光显示装置及其制造方法 |
CN107275335A (zh) * | 2016-04-07 | 2017-10-20 | 三星显示有限公司 | 显示设备 |
US9923174B2 (en) | 2012-05-04 | 2018-03-20 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing light-emitting device |
CN110164912A (zh) * | 2018-07-18 | 2019-08-23 | 京东方科技集团股份有限公司 | 一种透明显示面板及显示装置 |
CN111092087A (zh) * | 2018-10-24 | 2020-05-01 | 三星显示有限公司 | 显示设备 |
CN113871545A (zh) * | 2020-06-30 | 2021-12-31 | 乐金显示有限公司 | 显示装置 |
Families Citing this family (49)
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KR100686345B1 (ko) * | 2004-10-27 | 2007-02-22 | 삼성에스디아이 주식회사 | 평판표시소자 및 그 제조방법 |
KR100731750B1 (ko) * | 2005-06-23 | 2007-06-22 | 삼성에스디아이 주식회사 | 박막트랜지스터 및 이를 이용한 유기전계발광표시장치의제조방법 |
US7635947B2 (en) * | 2005-08-29 | 2009-12-22 | Chunghwa Picture Tubes, Ltd. | Organic electro-luminescence device comprising uniform thickness light-emitting layer |
KR100776480B1 (ko) | 2005-08-30 | 2007-11-16 | 삼성에스디아이 주식회사 | 유기 발광 표시장치 및 그 제조 방법 |
KR100730151B1 (ko) * | 2005-09-30 | 2007-06-19 | 삼성에스디아이 주식회사 | 평판 표시 장치 |
KR100708740B1 (ko) * | 2005-12-12 | 2007-04-17 | 삼성에스디아이 주식회사 | 유기 발광 표시장치 |
KR101271850B1 (ko) | 2006-06-09 | 2013-06-07 | 삼성디스플레이 주식회사 | 유기 발광 표시장치의 제조방법 |
JP5117001B2 (ja) * | 2006-07-07 | 2013-01-09 | 株式会社ジャパンディスプレイイースト | 有機el表示装置 |
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Also Published As
Publication number | Publication date |
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KR20050049999A (ko) | 2005-05-27 |
US20050110023A1 (en) | 2005-05-26 |
KR100579184B1 (ko) | 2006-05-11 |
CN101299895A (zh) | 2008-11-05 |
US7247881B2 (en) | 2007-07-24 |
CN100511755C (zh) | 2009-07-08 |
CN101299895B (zh) | 2010-06-09 |
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