CN1571627A - Method for solder planting of conducting terminal - Google Patents
Method for solder planting of conducting terminal Download PDFInfo
- Publication number
- CN1571627A CN1571627A CN 03133177 CN03133177A CN1571627A CN 1571627 A CN1571627 A CN 1571627A CN 03133177 CN03133177 CN 03133177 CN 03133177 A CN03133177 A CN 03133177A CN 1571627 A CN1571627 A CN 1571627A
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- CN
- China
- Prior art keywords
- conducting terminal
- scolder
- welding ends
- weld
- terminal
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Abstract
The invention discloses a plant weld solder method of conductive terminal, firstly, preparing a conductive terminal to form a weld terminal, the weld terminal has a rabbet section and connects a implement, the solder flows to the opposite weld side by a weld side's pressing and passes by rabbet section, then solder covers weld terminal by weld terminal another side pressing solder of implement whiling the solder connects the rabbet section tightly to bring interference action, accordingly, the solder is unable to deviate the weld terminal to form concretion, and it has a character that the weld terminal can plant weld conductive terminal without circle weld melting.
Description
[technical field]
The invention relates to a kind of method of conducting terminal solder planting, be meant that especially a kind of scolder that is applied to utilize a surface mount method and a circuit board one of to electrically connect the conducting terminal of electric connector plants the method for connecing.
[background technology]
Because as central processing unit integrated circuit (IC) chip such as (CPU), its processing speed and function have the development trend of becoming stronger day by day, therefore chip externally carries out signal to export the electrical contact of (I/O) will be more and more many, it is compact that yet its volume after being encapsulated but requires, event has been adopted PGA (Pin GridArray) all as the encapsulation of the integrated circuit (IC) chip of central processing unit equal altitudes densification design, BGA (Ball Grid Array), even LGA packaged types such as (Land Grid Array), but no matter which kind of packaged type is integrated circuit (IC) chip adopt, all must utilize an electric connector and a circuit board to electrically connect, therefore, in order to make electric connector cooperate the packaged type of integrated circuit (IC) chip, and steadiness and the processing procedure efficient of considering mutual electric connection between electric connector and circuit board, so generally one of each conducting terminal is held the tin ball that connects a correspondence in electric connector, utilizing surface mount method (SMT) that electric connector is welded in way on the circuit board again, is to electrically connect the method for making of often using for producing between electric connector and circuit board now.
As Fig. 1, be among expression one encapsulates in the PGA mode central processor 7 by an electric connector 8 and a circuit board 9 electric connections, wherein, central processing unit 7 in the certain area in its bottom surface, form after the encapsulation plural number uniformly-spaced distance arrange and the pin 71 of protrusion downwards, electric connector 8 then includes an insulating body 81 and plural corresponding pin 71 positions and runs through the containing hole 82 of insulating body 81 upper and lower surfaces, each containing hole 82 all can be accommodated a conducting terminal 83, on circuit board 9, then design the electrical contact 91 that corresponding conducting terminal 83 positions are arranged in addition in advance, electrically contact the corresponding pin 71 of central processing unit 7 by the upper end that is contained in the interior conducting terminal 83 of insulating body 81, the lower end then connects the electrical contact 91 that is positioned on the circuit board 9 accordingly, makes that central processing unit 7 is able to electrically connect to transmit electric signal with circuit board 9.
As Fig. 2, brought forward is described, for the lower end that makes conducting terminal 83 can utilize the surface mount method to link to each other with 9 of circuit boards, end must connect a tin ball 84 earlier under the conducting terminal 83, wherein a kind of way is that surface 811 forms a corresponding mating surface 813 that communicates with containing hole 82 and inwardly be the spherical arc shape recess under insulating body 81, conducting terminal 83 lower ends then form one with the carrier 831 of mating surface 813 applyings, make mating surface 813 constitute a recess that contacts with tin ball 84 surfaces with carrier 831, by recess with location tin ball 84, and tin ball 84 also can contact with the carrier 831 of conducting terminal 83, carry out the step of reflow afterwards, make tin ball 84 melt and be planted and be connected on the corresponding conducting terminal 83, and can be for the surface mount processing procedure of follow-up electric connector and circuit board.
Yet, above-mentioned must be on the conducting terminal 83 for tin ball 84 being planted be connected on through the tin stove to carry out the operation of reflow, but the reflow operation must possess the facility of location tin ball and carry the equipment of electric connector by the tin stove, if can reduce the production efficiency that the processing procedure of reflow will help to improve electric connector.
[summary of the invention]
Therefore, the present invention's purpose, be provide a kind of in the conducting terminal solder planting and need be through the reflow of tin stove plant the method for connecing.
The method of conducting terminal solder planting of the present invention is to prepare a conducting terminal earlier, make conducting terminal be formed with a welding ends, welding ends also has an interlocking portion, mat one facility simultaneously push a scolder by welding ends it are flowed and by interlocking portion to opposite another side again, then push scolder with facility relatively by the welding ends another side again, make scolder clad welded end, and make scolder and the driving fit of interlocking portion simultaneously, make the unlikely disengaging welding ends of scolder and form affixed to produce interference effect.
The present invention's effect is, utilizes the extruding scolder with the coated with conductive terminal, and the interference effect that scolder mat itself and the driving fit of interlocking portion of distortion back are produced, and reaches affixed and do not need the process of reflow fusing with conducting terminal.
[description of drawings]
Fig. 1 is a three-dimensional exploded view, and the example of an electronic building brick mat one electric connector and a circuit board electric connection is described;
Fig. 2 is a part of cross-sectional schematic, and the annexation of a known a kind of conducting terminal and a tin ball is described;
Fig. 3 is a schematic perspective view, illustrate preparation conducting terminal in the preferred embodiment of method of solder planting of the present invention step and with the annexation of scolder;
Fig. 4 is an IV-IV hatching cross-sectional schematic among Fig. 3, and the position relation that the welding ends of conducting terminal contacts with scolder is described;
Fig. 5 is the material flow schematic diagram that the scolder among Fig. 4 is subjected to side's extruding;
Fig. 6 is the material flow schematic diagram that the scolder among Fig. 5 further is subjected to opposite side's extruding;
Fig. 7 be the scolder among Fig. 6 extrude finish after with the annexation of conducting terminal welding ends;
Fig. 8 is a VIII-VIII hatching cross-sectional schematic among Fig. 3, the annexation of the scolder of key diagram 7 and conducting terminal welding ends;
Fig. 9 is the link system of scolder and another angle of conducting terminal welding ends in the displayed map 8;
Figure 10 is a schematic perspective view, illustrates that conducting terminal is assembled in an insulating body to constitute an electric connector;
Figure 11 is a stereogram, and the feasible welding ends form of another kind of conducting terminal is described; And
Figure 12 is a lateral plan, and the annexation after conducting terminal among Figure 11 is used the present invention's method solder planting is described.
[graphic primary clustering conventional letter explanation]
1 conducting terminal
100 metal material belts
11 contact jaws
12 welding endss
121 first
122 second
13 protruding thorns
14 flutings
141 open sides
142 closed sides
15 tortuous edges
2 scolders
3 insulating bodies
31 containing holes
7 central processing units
71 pins
8 electric connectors
81 insulating bodies
812 lower surfaces
813 mating surfaces
82 containing holes
83 conducting terminals
831 carriers
84 tin balls
9 circuit boards
91 electrical contacts
[embodiment]
About addressing other technology contents, characteristics and effect before the present invention, in the following detailed description that cooperates with reference to one of graphic preferred embodiment, can clearly understand.
One preferred embodiment step of the method for conducting terminal solder planting of the present invention is as follows:
Consult Fig. 3, earlier with diel (figure does not show) preparation one conducting terminal 1, in fact, conducting terminal 1 is progressive forming on a metal material belt 100, the metal material belt 100 of back of being shaped can become the parallel adjacent but still state of maintenance connection of complex conduction terminal 1 after removing unnecessary material, and each conducting terminal 1 all is formed with a contact jaw 11, one welding ends 12 and plural number are positioned at the protruding thorn 13 of both sides, in this example, contact jaw 11 is elastic arm forms, but also can adopt other different shape, mainly decide on the packing forms of using as electronic building bricks such as central processing units of institute's desire electric connection, because of holding within the non-pass the present invention of the form of contact jaw 11, promptly do not intend further discussion at this, welding ends 12 then is flat, make welding ends 12 have one of opposite first 121 and one second 122, and on the welding ends 12 and in the punching out process, or produce an interlocking portion with another punching out program, the interlocking portion of present embodiment one slightly is keyhole and is communicated with first 121 and second 122 of welding ends 12,14 form the less open sides of a width 141 at welding ends 12 last edge places and slot, on the contrary with open sides 141 mutually the other end then form the bigger closed side of width 142.
With reference to figure 4 to Fig. 9, get a scolder 2, in this example, scolder 2 is to get from the online intercepting suitable length of continuous tin, but be not to exceed with solder, make first 121 (shown in Figure 4) of scolder 2 contact welding endss 12, mat one facility (figure do not show) again, with scolder 2 with respect to conducting terminal 1 by first 121 of its welding ends 12 to second 122 direction extruding (shown in Figure 5), ductility because of scolder 2 materials itself, can produce distortion and phenomenon that generating material flows at the back scolder 2 that is squeezed, make scolder 2 14 to protrude from second 122 by slotting.In addition, be easy to flow, also can heat to scolder 2 earlier for making scolder 2, but only make its softening can and needn't arrive the temperature of scolder 2 fusings.
Then, protrude from scolder 2 (shown in Figure 6) second 122 outside by second 122 of welding ends 12 to first 121 direction extruding with facility again, scolder 2 is coated welding ends 12 because of the two sides is stressed, and make scolder 2 simultaneously and the 14 shape driving fits (Fig. 7, Fig. 8 and shown in Figure 9) of slotting, the mat narrower and shape of closed side 142 broads of 14 open sides 141 of slotting, can cause scolder 2 not produce interference effects, make scolder 2 and welding ends 12 form affixed by open sides 141 disengagings of fluting 14 and with welding ends 12.
With reference to Figure 10, after treating that scolder 2 is all planted the conducting terminal 1 that is connected to correspondence, conducting terminal 1 can be assembled in the set corresponding containing hole 31 of an insulating body 3, can fix to be positioned at by the protruding thorn 13 of conducting terminal 1 both sides and define within the corresponding containing hole 31 on the wall, and make each conducting terminal 1 contact jaw 11 and plant the welding ends 12 that is connected to scolder 2 to protrude from the opposite sides of insulating body 3 respectively outer to constitute an electric connector.And among the figure only with a conducting terminal 1 representative, and the containing hole 31 of insulating body 3 also only draws minority, actual containing hole 31 and conducting terminal 1 number need be decided on the I/O pin of the electronic building brick of institute's desire connection or the number of contact.
So, can not need the step of reflow fully in the processing procedure of electric connector and can reach scolder 2 and plant the effect that is connected on the conducting terminal 1, not only can simplify processing procedure, also can reduce manufacturing cost simultaneously.
Moreover as Figure 11, owing to mainly can producing to interfere with welding ends 12, the purpose of the set interlocking of welding ends 12 portion prevent the effect of disengaging mutually after scolder 2 extruding are provided, the interlocking portion that therefore can reach the different shape of this purpose also can, therefore be not as shown in Figure 3 keyhole shape necessarily, it shown in Figure 11 the kenel of another kind of interlocking portion, it is to become tortuous edge 15 in the both sides of welding ends 12 with punching out, so also can behind scolder 2 clad welded ends 12, prevent that by tortuous edge 15 scolder 2 breaks away from (as shown in figure 12) on welding ends 12.
Conclude above-mentioned, the present invention's scolder is planted the method for connecing, by the interlocking portion that forms on the conducting terminal welding ends, and scolder pushed the clad welded end and produce driving fit and interfere effect with interlocking portion, make scolder and conducting terminal under the process that does not need reflow, form affixed effect, so can reach the present invention's purpose really.
The above person of thought, only for the present invention's preferred embodiment, when the scope that can not limit the invention process with this, promptly the simple equivalent of doing according to claim of the present invention and description generally changes and modifies, and all should still belong in the scope that patent of the present invention contains.
Claims (4)
1. the method for a conducting terminal solder planting comprises following steps:
(1) preparation one conducting terminal makes this conducting terminal be formed with a welding ends, and this welding ends also has an interlocking portion;
(2) mat one facility simultaneously push a scolder by this welding ends it are flowed and this interlocking portion of passing through to opposite another side;
(3) push this scolder with these facility relatively by this welding ends another side again, make this scolder coat this welding ends, and make this scolder and this interlocking portion driving fit simultaneously, make this welding ends of the unlikely disengaging of this scolder and form affixed to produce interference effect.
2. according to the method for the described conducting terminal solder planting of claim 1, wherein the interlocking portion of this step (1) forms towards establishing a fluting at this welding ends.
3. according to the method for the described conducting terminal solder planting of claim 1, wherein the interlocking portion of this step (1) becomes meander-like with this welding ends edge punching out and forms.
4. according to the method for the described conducting terminal solder planting of claim 1, wherein this scolder of this step (2) can be heated earlier before extruding and make it softening to promote the flowability of its material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB031331777A CN100477887C (en) | 2003-07-24 | 2003-07-24 | Method for solder planting of conducting terminal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB031331777A CN100477887C (en) | 2003-07-24 | 2003-07-24 | Method for solder planting of conducting terminal |
Publications (2)
Publication Number | Publication Date |
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CN1571627A true CN1571627A (en) | 2005-01-26 |
CN100477887C CN100477887C (en) | 2009-04-08 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNB031331777A Expired - Fee Related CN100477887C (en) | 2003-07-24 | 2003-07-24 | Method for solder planting of conducting terminal |
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CN (1) | CN100477887C (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101120257B (en) * | 2005-02-18 | 2010-05-19 | 日本发条株式会社 | Conductive contactor unit and conductive contactor |
CN107093810A (en) * | 2017-05-09 | 2017-08-25 | 番禺得意精密电子工业有限公司 | Electric connector |
CN107394568A (en) * | 2017-06-29 | 2017-11-24 | 番禺得意精密电子工业有限公司 | Electric connector assembling method |
US10116079B1 (en) | 2017-11-21 | 2018-10-30 | Lotes Co., Ltd | Electrical connector and terminal thereof |
CN110800171A (en) * | 2017-04-28 | 2020-02-14 | 富加宜(美国)有限责任公司 | High frequency BGA connector |
US11337327B2 (en) | 2017-04-28 | 2022-05-17 | Fci Usa Llc | High frequency BGA connector |
-
2003
- 2003-07-24 CN CNB031331777A patent/CN100477887C/en not_active Expired - Fee Related
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101120257B (en) * | 2005-02-18 | 2010-05-19 | 日本发条株式会社 | Conductive contactor unit and conductive contactor |
CN110800171A (en) * | 2017-04-28 | 2020-02-14 | 富加宜(美国)有限责任公司 | High frequency BGA connector |
CN110800171B (en) * | 2017-04-28 | 2021-11-02 | 富加宜(美国)有限责任公司 | High frequency BGA connector |
US11337327B2 (en) | 2017-04-28 | 2022-05-17 | Fci Usa Llc | High frequency BGA connector |
CN107093810A (en) * | 2017-05-09 | 2017-08-25 | 番禺得意精密电子工业有限公司 | Electric connector |
CN107394568A (en) * | 2017-06-29 | 2017-11-24 | 番禺得意精密电子工业有限公司 | Electric connector assembling method |
US10547152B2 (en) | 2017-06-29 | 2020-01-28 | Lotes Co., Ltd | Electrical connector assembly method |
US10116079B1 (en) | 2017-11-21 | 2018-10-30 | Lotes Co., Ltd | Electrical connector and terminal thereof |
Also Published As
Publication number | Publication date |
---|---|
CN100477887C (en) | 2009-04-08 |
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