CN113659365A

CN113659365A - Low-short connector

Info

Publication number: CN113659365A
Application number: CN202110744915.3A
Authority: CN
Inventors: 木青峰; 曹永泉
Original assignee: Shanghai Aerospace Science and Industry Appliance Co Ltd
Current assignee: Shanghai Aerospace Science and Industry Appliance Co Ltd
Priority date: 2021-07-01
Filing date: 2021-07-01
Publication date: 2021-11-16

Abstract

The invention discloses a low-profile connector which comprises a connector body, wherein the connector body comprises a base body PCB, a plurality of bonding pads are arranged on one side face of the base body PCB, a through signal hole is formed in one end portion of each bonding pad, a solder ball is arranged at the other end portion of each bonding pad, metal coatings are arranged on the surfaces of the bonding pads and the inner walls of the signal holes, contact terminals are inserted into the signal holes, and the contact terminals, the signal holes, the bonding pads and the solder balls form signal paths. The low-short connector provided by the invention can be applied to scenes such as signal transmission between a photoelectric conversion module and a printed board, between a chip and the printed board, between the printed board and the like, and the distance between different electronic devices can be controlled to be 1.2mm by using the connector, which is far lower than the connector commonly used in the market, so that the possibility of product refinement is provided.

Description

Low-short connector

Technical Field

The invention relates to the technical field of electric connectors, in particular to a low-profile connector.

Background

In the field of communications, devices such as photoelectric conversion modules and chips are generally used in connection with a Printed Circuit Board (PCB), and the electrical connection between the devices and the PCB is achieved by a connector, that is, a connector is provided between an electronic device and the PCB to achieve signal transmission. However, as the size of electronic products is smaller and smaller, the appearance of the connector is also reduced, and the conventional connector structure in China is to insert terminals on a base, the height of the terminals is at least 4mm, and the height still limits the use of the connector in small-sized products, so the design and manufacture of the connector with reduced height become the main research direction.

Disclosure of Invention

Based on the technical problems in the background art, the invention provides a low-dwarfing connector which solves the problem of low-dwarfing connection between an optical module and a printed board, between a chip and the printed board and between the printed boards, ensures the signal transmission quality and has lower cost.

The utility model provides a low dwarfing connector, includes the connector body, the connector body includes base member PCB, be equipped with a plurality of pads on base member PCB's a side, a tip of pad is equipped with the signal hole that link up, another tip is equipped with the tin ball, the surface of pad with the inner wall in signal hole all is equipped with the metallic coating, the downthehole contact terminal that pegs graft of signal, contact terminal, signal hole, pad and tin ball form signal path.

Preferably, one end part of the contact terminal is a tail part, the other end part of the contact terminal is a contact part, two side walls of the tail part are arc-shaped contact arc surfaces, and the tail part is provided with a lead-in hole; the contact portion is arched or C-shaped.

Preferably, the middle portion of the contact terminal is a shoulder portion protruding to both sides for limiting a distance the contact terminal enters the signal hole.

Preferably, the contact terminal is made of a copper alloy having a yield strength of 665MPa or more and has a thickness of 0.1 to 0.16 mm.

Preferably, the thickness of the contact portion is smaller than that of the tail portion, and the thickness of the contact portion is 0.06-0.12 mm.

Preferably, the same side of each bonding pad is provided with a reflow ground hole.

Preferably, the solder ball is spherical or block-shaped.

The invention has the following beneficial effects:

the invention provides a low-short connector which mainly comprises three parts: base member PCB, contact terminal and tin ball. The base body PCB is provided with a signal hole, a signal bonding pad, a reflow ground hole and other characteristics. The contact terminal is provided with a tail part, a shoulder part and a contact part, and the tail part of the contact terminal is pressed into the signal hole of the PCB; the solder ball is connected with a signal pad of the base PCB through a heat value ball process.

The tail of the contact terminal is of a compression joint structure, the outer contour of the contact terminal is in an arc shape or an oval shape, the middle of the contact terminal is provided with an oval hole, the tail is compressed and connected to a base body PCB signal to generate elastic-plastic deformation, and the contact terminal has certain holding force with the PCB signal hole by means of the elastic force of the tail and is in electrical contact with the PCB signal hole. The shoulder portions of the contact terminals provide a force bearing area for tail crimping while the shoulder portions serve as crimp stops. The contact part is in a C shape or an arc shape, the contact part is contacted with an external device or a pad of an external PCB, and the contact part is elastically compressible downwards.

The signal hole on the base PCB is used for containing the crimping area of the signal terminal, the signal hole is coated with a metal coating, and the metal coating is conducted with the contact terminal. And a plane bonding pad is arranged on the base body PCB, a plating layer of the signal hole covers the bonding pad, and the bonding pad is communicated with the signal hole. In the case of a high transmission rate, reflow holes may be provided between signal holes or between pads. The surface of the reflow bottom hole is covered with a plating layer and is not conducted with the signal hole or the bonding pad.

The solder ball is arranged on the pad of the base body PCB, the solder ball is placed on the pad, the solder ball and the pad are heated, the part of the contact part of the solder ball and the pad is locally melted, and after cooling, the solder ball is welded and fixed on the pad.

When the connector is used, the solder balls are welded, fixed and conducted with the bonding pads of external printed boards or optical modules and other devices. The contact part of the contact terminal is contacted with a pad of another external device, and the external device applies certain pressure to the contact part to elastically deform the contact part to form reliable and separable electric contact.

The low-short connector provided by the invention can be applied to scenes such as signal transmission between a photoelectric conversion module and a printed board, between a chip and the printed board, between the printed board and the like, and the distance between different electronic devices can be controlled to be 1.2mm by using the connector, which is far lower than the connector commonly used in the market, so that the possibility of product refinement is provided.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:

FIG. 1 is an overall schematic view of a low profile connector;

FIG. 2 is a view taken along line A of FIG. 1;

FIG. 3 is a cross-sectional view T-T of FIG. 2;

FIG. 4 is a schematic diagram of a base PCB;

FIG. 5 is a view from the direction B of FIG. 1;

FIG. 6 is a schematic view of a contact terminal;

FIG. 7 is a side view of FIG. 6;

FIG. 8 is an exploded illustration of the application of the present invention;

fig. 9 is an application scenario of the present invention.

In the figure: 1-connector body, 2-contact terminal, 21-tail, 211-contact arc surface, 212-lead-in hole, 22-shoulder, 221-upper surface, 222-lower surface, 23-contact part, 231-contact surface, 3-base PCB, 31-signal hole, 32-pad, 33-reflow ground hole, 4-tin ball, 5-device A, 6-device B.

Detailed Description

The present invention will be further illustrated with reference to the following specific examples.

Referring to fig. 1 to 9, a low profile connector includes a connector body 1, the connector body 1 includes a base PCB3, a plurality of pads 32 are disposed on a side surface of the base PCB3, a signal hole 31 penetrating through one end portion of each pad 32, a solder ball 4 disposed on the other end portion of each pad 32, metal plating layers are disposed on the surface of each pad 32 and the inner wall of each signal hole 31, a contact terminal 2 is inserted into each signal hole 31, and the contact terminal 2, the signal hole 31, the pad 32, and the solder ball 4 form a signal path. The base PCB3 has a fixing function for the contact terminal 2 and the solder ball 4, and simultaneously has a connecting function for the contact terminal 2 and the solder ball 4,

as shown in fig. 4, a plurality of pads 32 and signal holes 31 are arranged in an array on the base PCB3, the signal holes 31 and the pads 32 are connected into a whole, and the surface is covered with a metal plating layer, so that the conductive substrate has good conductivity. Referring to fig. 5, the solder ball 4 is in a ball or block shape, and the solder ball 4 is soldered to the pad 32 by melting with heat, so that the signal hole 31 is electrically connected to the solder ball 4.

As shown in fig. 6, one end of the contact terminal 2 is a tail portion 21, the other end is a contact portion 23, two side walls of the tail portion 21 are arc-shaped contact arc surfaces 211, and the tail portion 21 is provided with a lead-in hole 212; the contact portion 23 is formed in an arch shape or a C-shape, and a contact surface 231 is provided on the contact portion 23. The middle part of the contact terminal 2 is a shoulder part 22 protruding to both sides, and the shoulder part 22 has a lower surface 221 and an upper surface 222; the shoulder 22 serves to limit the distance the contact terminal 2 enters the signal hole 31.

Referring to fig. 3, when a force is applied to the upper surface 222 of the shoulder portion 22 of the contact terminal 2, the lead-in hole 212 is elastically deformed to press the tail portion 21 of the contact terminal 2 into the signal hole 31 of the base PCB3, and the tail portion 21 of the contact terminal 2 is elastically and plastically deformed to fix the contact terminal 2 to the signal hole 31 of the base PCB3 by the elastic force of the tail portion 21. The lower surface 221 of the shoulder 22 has a blocking effect, and the contact terminals 2 are no longer moved after the lower surface 221 hits the base PCB 3. The contact arc 211 of the tail portion 21 is in contact with the wall of the signal hole 31, and the contact terminal 2 is electrically conducted with the signal hole 31 of the base PCB 3. Thus, the signal holes 31, the contact terminals 2, and the solder balls 4 of the base PCB3 form electrical paths.

The same side of each bonding pad 32 is provided with a reflow ground hole 33, the reflow ground hole 33 has the function of improving the signal transmission quality, and the reflow ground hole 33 can be used in a scene with low requirement on signal integrity or not. Neither the signal hole 31 nor the pad 32 communicates with the return ground hole 33.

Referring to FIG. 7, the contact terminal 2 of the present invention is made of copper alloy with yield strength of 665MPa or more and electric conductivity of 45% IACS or more, the thickness of the copper alloy is 0.1-0.16mm, and the thickness of the tail 21 is 0.1-0.16 mm; in order to improve the mechanical properties of the tail portion 21 and the contact portion 23, the thickness b of the contact portion 23 is always smaller than the thickness a of the tail portion 21, and the thickness of the contact portion 23 of the contact terminal 2 can be selected to be 0.06-0.12 mm; in use, the tail portion 21 is not elastically deformed by the contact portion 23.

In this embodiment, the thickness of the contact terminal 2 is 0.12mm, that is, the thickness of the tail portion is also 0.12mm, and the thickness of the material of the contact portion 23 is thinned by the die thinning process, so that the thickness of the final contact portion 23 is 0.07 mm. On the one hand, thinning has a hardening effect on the material, increasing the elastic modulus of the contact portion 23, and on the other hand, thinning the material reduces the plastic deformation of the contact portion 23 when compressed.

As shown in fig. 8 and 9, the present invention 1 is applied to parallel interconnection of two devices, a device A5 may be a printed board, an optical module, a chip, or other types of devices, a contact portion 23 of a connector body 1 of the present invention is in contact with a conductor on the device A5, and the device A5 has a certain pressure on the contact portion 23, so that the contact portion 23 is elastically deformed to ensure reliable contact with the device 5. The device B6 can be a printed board, a chip and other devices, and the solder ball 4 is welded with the conductor on the device B6 through a reflow soldering process. Therefore, the invention plays a role of connecting the device A5 and the device B6, and the distance h between the device A5 and the device B6 is 1.2mm at least, so that the space is saved greatly. The device 5 and the invention 1 can be conveniently disassembled and separated, and the device 6 and the invention 1 can be disassembled and separated through the desoldering process, so the operation is simpler and more convenient.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims

1. The utility model provides a dwarfing connector, includes connector body (1), its characterized in that, connector body (1) includes base member PCB (3), be equipped with a plurality of pads (32) on the side of base member PCB (3), a tip of pad (32) is equipped with signal hole (31), another tip that link up and is equipped with tin ball (4), the surface of pad (32) with the inner wall of signal hole (31) all is equipped with the metallic coating, peg graft contact terminal (2) in signal hole (31), contact terminal (2), signal hole (31), pad (32) and tin ball (4) form the signal path.

2. A low profile connector as claimed in claim 1, wherein said contact terminal (2) has a tail portion (21) at one end and a contact portion (23) at the other end, both side walls of said tail portion (21) are arc contact arc surfaces (211), and said tail portion (21) is provided with an introduction hole (212); the contact portion (23) is arched or C-shaped.

3. A low profile connector as claimed in claim 2, wherein the intermediate portion of the contact terminal (2) is a shoulder (22) projecting to both sides, the shoulder (22) serving to limit the distance the contact terminal (2) enters the signal hole (31).

4. A low dwarfing connector according to claim 3, characterized in that the contact terminal (2) is made of a copper alloy having a yield strength of 665MPa or more and has a thickness of 0.1 to 0.16 mm.

5. A low dwarfing connector according to claim 4, characterized in that the thickness of the contact portion (23) is smaller than the thickness of the tail portion (21), the thickness of the contact portion (23) being 0.06-0.12 mm.

6. A low profile connector as claimed in any one of claims 1 to 5, wherein each pad (32) is provided with a reflow opening (33) on the same side.

7. A dwarfing connector according to any one of claims 1 to 5, characterized in that the solder balls (4) are in the shape of balls or blocks.