CN1561535A - 通用模块化晶片输送*** - Google Patents
通用模块化晶片输送*** Download PDFInfo
- Publication number
- CN1561535A CN1561535A CNA028193121A CN02819312A CN1561535A CN 1561535 A CN1561535 A CN 1561535A CN A028193121 A CNA028193121 A CN A028193121A CN 02819312 A CN02819312 A CN 02819312A CN 1561535 A CN1561535 A CN 1561535A
- Authority
- CN
- China
- Prior art keywords
- wafer
- shuttle
- wafer transport
- container
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Non-Mechanical Conveyors (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US31672201P | 2001-08-31 | 2001-08-31 | |
US60/316,722 | 2001-08-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1561535A true CN1561535A (zh) | 2005-01-05 |
CN1288714C CN1288714C (zh) | 2006-12-06 |
Family
ID=23230354
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2007100079333A Pending CN1996553A (zh) | 2001-08-31 | 2002-08-30 | 用于半导体材料处理***的一体化机架 |
CN2007100079329A Expired - Lifetime CN1996552B (zh) | 2001-08-31 | 2002-08-30 | 晶片机 |
CNB028193121A Expired - Fee Related CN1288714C (zh) | 2001-08-31 | 2002-09-03 | 通用模块化晶片输送*** |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2007100079333A Pending CN1996553A (zh) | 2001-08-31 | 2002-08-30 | 用于半导体材料处理***的一体化机架 |
CN2007100079329A Expired - Lifetime CN1996552B (zh) | 2001-08-31 | 2002-08-30 | 晶片机 |
Country Status (6)
Country | Link |
---|---|
US (3) | US7293950B2 (zh) |
JP (1) | JP2005508085A (zh) |
KR (1) | KR20050026371A (zh) |
CN (3) | CN1996553A (zh) |
TW (1) | TWI272665B (zh) |
WO (1) | WO2003038869A2 (zh) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102569016A (zh) * | 2010-12-28 | 2012-07-11 | 株式会社日立高新技术 | 真空处理装置 |
CN103238379A (zh) * | 2010-10-11 | 2013-08-07 | Ekra自动化***有限公司 | 特别用于处理和/或检查基底的加工机 |
CN104894527A (zh) * | 2015-06-11 | 2015-09-09 | 科瑞自动化技术(苏州)有限公司 | 硬盘盘片真空溅射镀膜夹持工装 |
CN106103011A (zh) * | 2014-01-17 | 2016-11-09 | 布鲁克斯自动化公司 | 衬底运输设备 |
CN106915609A (zh) * | 2015-11-17 | 2017-07-04 | 株式会社大福 | 容器输送设备 |
CN112654426A (zh) * | 2018-07-17 | 2021-04-13 | 鲍施+施特勒贝尔机械伊尔斯霍芬有限两合公司 | 运输*** |
CN112736000A (zh) * | 2020-12-31 | 2021-04-30 | 上海广川科技有限公司 | 一种真空传送装置及传送方法 |
CN113707585A (zh) * | 2021-08-23 | 2021-11-26 | 上海引万光电科技有限公司 | 一种磁悬浮式衬底传送腔及传送方法 |
CN114025926A (zh) * | 2019-02-14 | 2022-02-08 | 柿子技术公司 | 模块化材料处理机器人平台 |
CN115315795A (zh) * | 2020-03-20 | 2022-11-08 | 应用材料公司 | 基板传送***和基板传送***的使用方法 |
Families Citing this family (104)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6918731B2 (en) | 2001-07-02 | 2005-07-19 | Brooks Automation, Incorporated | Fast swap dual substrate transport for load lock |
US7988398B2 (en) * | 2002-07-22 | 2011-08-02 | Brooks Automation, Inc. | Linear substrate transport apparatus |
US7959395B2 (en) | 2002-07-22 | 2011-06-14 | Brooks Automation, Inc. | Substrate processing apparatus |
EP1535313B1 (en) * | 2002-07-22 | 2018-10-31 | Brooks Automation, Inc. | Substrate processing apparatus |
US20070183871A1 (en) * | 2002-07-22 | 2007-08-09 | Christopher Hofmeister | Substrate processing apparatus |
US8960099B2 (en) * | 2002-07-22 | 2015-02-24 | Brooks Automation, Inc | Substrate processing apparatus |
FR2844258B1 (fr) * | 2002-09-06 | 2005-06-03 | Recif Sa | Systeme de transport et stockage de conteneurs de plaques de semi-conducteur, et mecanisme de transfert |
FR2851946B1 (fr) * | 2003-03-05 | 2005-05-27 | Airbus France | Dispositif pour le deplacement d'une machine |
JP4648190B2 (ja) * | 2003-03-28 | 2011-03-09 | 平田機工株式会社 | 基板搬送システム |
US8696298B2 (en) * | 2003-11-10 | 2014-04-15 | Brooks Automation, Inc. | Semiconductor manufacturing process modules |
US20070269297A1 (en) * | 2003-11-10 | 2007-11-22 | Meulen Peter V D | Semiconductor wafer handling and transport |
US8313277B2 (en) * | 2003-11-10 | 2012-11-20 | Brooks Automation, Inc. | Semiconductor manufacturing process modules |
US10086511B2 (en) | 2003-11-10 | 2018-10-02 | Brooks Automation, Inc. | Semiconductor manufacturing systems |
US7458763B2 (en) | 2003-11-10 | 2008-12-02 | Blueshift Technologies, Inc. | Mid-entry load lock for semiconductor handling system |
JP4122521B2 (ja) * | 2005-01-17 | 2008-07-23 | 村田機械株式会社 | 天井走行車システム |
US9457442B2 (en) * | 2005-06-18 | 2016-10-04 | Futrfab, Inc. | Method and apparatus to support process tool modules in a cleanspace fabricator |
US9339900B2 (en) * | 2005-08-18 | 2016-05-17 | Futrfab, Inc. | Apparatus to support a cleanspace fabricator |
WO2006136187A1 (de) * | 2005-06-22 | 2006-12-28 | Applied Materials Gmbh & Co. Kg | Vorrichtung für die sukzessive beschichtung mehrerer substrate |
KR20070008192A (ko) * | 2005-07-13 | 2007-01-17 | 삼성전자주식회사 | 평판 표시 장치 제조용 반송 시스템 |
US7826924B2 (en) * | 2006-05-10 | 2010-11-02 | Vinpower, Inc. | Standalone intelligent autoloader with modularization architectures and self-adaptive motion control ability for mass optical disks duplication |
US8398355B2 (en) * | 2006-05-26 | 2013-03-19 | Brooks Automation, Inc. | Linearly distributed semiconductor workpiece processing tool |
US7925380B2 (en) * | 2006-07-19 | 2011-04-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated transportation control for wafer fabrication facility |
US9524896B2 (en) | 2006-09-19 | 2016-12-20 | Brooks Automation Inc. | Apparatus and methods for transporting and processing substrates |
US8293066B2 (en) * | 2006-09-19 | 2012-10-23 | Brooks Automation, Inc. | Apparatus and methods for transporting and processing substrates |
US8419341B2 (en) | 2006-09-19 | 2013-04-16 | Brooks Automation, Inc. | Linear vacuum robot with Z motion and articulated arm |
US7901539B2 (en) * | 2006-09-19 | 2011-03-08 | Intevac, Inc. | Apparatus and methods for transporting and processing substrates |
DE102006054846C5 (de) * | 2006-11-20 | 2012-05-03 | Permatecs Gmbh | Produktionsanlage zur Herstellung von Solarzellen im Inline-Verfahren, sowie Verfahren zur Integration eines Batch-Prozesses in eine mehrspurige Inline-Produktionsanlage für Solarzellen |
US8950998B2 (en) * | 2007-02-27 | 2015-02-10 | Brooks Automation, Inc. | Batch substrate handling |
US20080219806A1 (en) * | 2007-03-05 | 2008-09-11 | Van Der Meulen Peter | Semiconductor manufacturing process modules |
US20090022572A1 (en) * | 2007-07-19 | 2009-01-22 | Thomas Pass | Cluster tool with a linear source |
US20090065995A1 (en) * | 2007-09-11 | 2009-03-12 | Atmel Corporation | Ambidexturous Shuttle Spoon |
JP5247094B2 (ja) * | 2007-09-14 | 2013-07-24 | インテヴァック インコーポレイテッド | 基板処理システム |
JP5330721B2 (ja) * | 2007-10-23 | 2013-10-30 | オルボテック エルティ ソラー,エルエルシー | 処理装置および処理方法 |
JP5419384B2 (ja) * | 2008-05-20 | 2014-02-19 | 東京エレクトロン株式会社 | 真空処理装置 |
KR20110050423A (ko) * | 2008-06-11 | 2011-05-13 | 인테벡, 인코포레이티드 | 솔라 셀 제작에서 사용을 위한 애플리케이션 특정 주입 시스템 및 방법 |
US8374420B2 (en) * | 2008-07-23 | 2013-02-12 | Daifuku Co., Ltd. | Learning device and learning method for article transport facility |
JP5470770B2 (ja) * | 2008-08-07 | 2014-04-16 | シンフォニアテクノロジー株式会社 | 真空処理装置 |
EP2161826B1 (de) * | 2008-09-09 | 2011-03-16 | Siemens Aktiengesellschaft | Transfervorrichtung mit dynamisch veränderbaren Antriebsbereichen |
EP2187433B1 (en) * | 2008-11-12 | 2018-10-24 | Intevac, Inc. | Apparatus and method for transporting and processing substrates |
CN101740439B (zh) * | 2008-11-14 | 2014-05-07 | 布鲁克斯自动技术公司 | 用于传输和处理衬底的装置和方法 |
US8367565B2 (en) * | 2008-12-31 | 2013-02-05 | Archers Inc. | Methods and systems of transferring, docking and processing substrates |
US7897525B2 (en) * | 2008-12-31 | 2011-03-01 | Archers Inc. | Methods and systems of transferring, docking and processing substrates |
US8110511B2 (en) * | 2009-01-03 | 2012-02-07 | Archers Inc. | Methods and systems of transferring a substrate to minimize heat loss |
US20100162955A1 (en) * | 2008-12-31 | 2010-07-01 | Lawrence Chung-Lai Lei | Systems and methods for substrate processing |
US20100162954A1 (en) * | 2008-12-31 | 2010-07-01 | Lawrence Chung-Lai Lei | Integrated facility and process chamber for substrate processing |
US8317934B2 (en) * | 2009-05-13 | 2012-11-27 | Lam Research Corporation | Multi-stage substrate cleaning method and apparatus |
DE102009038756A1 (de) * | 2009-05-28 | 2010-12-09 | Semilev Gmbh | Vorrichtung zur partikelfreien Handhabung von Substraten |
US8749053B2 (en) | 2009-06-23 | 2014-06-10 | Intevac, Inc. | Plasma grid implant system for use in solar cell fabrications |
US8602706B2 (en) * | 2009-08-17 | 2013-12-10 | Brooks Automation, Inc. | Substrate processing apparatus |
EP2293321A1 (en) * | 2009-09-08 | 2011-03-09 | Applied Materials, Inc. | Mechanical modularity chambers |
TWI485799B (zh) | 2009-12-10 | 2015-05-21 | Orbotech Lt Solar Llc | 自動排序之直線型處理裝置 |
TWI377162B (en) * | 2010-04-19 | 2012-11-21 | Gudeng Prec Industral Co Ltd | Reticle pod |
TWI451521B (zh) * | 2010-06-21 | 2014-09-01 | Semes Co Ltd | 基板處理設備及基板處理方法 |
SG180034A1 (en) * | 2010-10-14 | 2012-05-30 | Rokko Ventures Pte Ltd | System and method for offloading ic units |
CN102054910B (zh) * | 2010-11-19 | 2013-07-31 | 理想能源设备(上海)有限公司 | Led芯片工艺集成***及其处理方法 |
US8459276B2 (en) | 2011-05-24 | 2013-06-11 | Orbotech LT Solar, LLC. | Broken wafer recovery system |
US9027739B2 (en) | 2011-09-16 | 2015-05-12 | Persimmon Technologies Corporation | Wafer transport system |
EP2777069A4 (en) | 2011-11-08 | 2015-01-14 | Intevac Inc | SUBSTRATE PROCESSING SYSTEM AND METHOD |
CN104094394A (zh) * | 2012-02-08 | 2014-10-08 | 应用材料公司 | 用于分散的基板的具有蜂巢式结构的动态负载锁定 |
US20130218518A1 (en) * | 2012-02-21 | 2013-08-22 | International Business Machines Corporation | Automated, three dimensional mappable environmental sampling system and methods of use |
JP2014036025A (ja) * | 2012-08-07 | 2014-02-24 | Hitachi High-Technologies Corp | 真空処理装置または真空処理装置の運転方法 |
US9558974B2 (en) | 2012-09-27 | 2017-01-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor processing station and method for processing semiconductor wafer |
US20140119858A1 (en) * | 2012-10-31 | 2014-05-01 | Sandisk 3D Llc | Semiconductor Device Manufacturing Line |
MY178951A (en) | 2012-12-19 | 2020-10-23 | Intevac Inc | Grid for plasma ion implant |
US10424498B2 (en) | 2013-09-09 | 2019-09-24 | Persimmon Technologies Corporation | Substrate transport vacuum platform |
TWI560125B (en) | 2013-10-15 | 2016-12-01 | Inotera Memories Inc | Overhead hoist transport system |
CN103523555A (zh) * | 2013-10-31 | 2014-01-22 | 京东方科技集团股份有限公司 | 一种基板反转装置 |
JP6215785B2 (ja) * | 2014-06-30 | 2017-10-18 | ファナック株式会社 | ワーク搬送システム |
US9818633B2 (en) | 2014-10-17 | 2017-11-14 | Lam Research Corporation | Equipment front end module for transferring wafers and method of transferring wafers |
US9673071B2 (en) | 2014-10-23 | 2017-06-06 | Lam Research Corporation | Buffer station for thermal control of semiconductor substrates transferred therethrough and method of transferring semiconductor substrates |
EP3016136B1 (en) * | 2014-10-27 | 2021-07-21 | Robert Bosch GmbH | Transport system with magnetically driven transport elements and according transportation method |
EP3029723B1 (en) | 2014-12-05 | 2020-09-16 | Robert Bosch GmbH | Transport device and transport method for transporting a fragile object |
TWI732285B (zh) * | 2015-01-23 | 2021-07-01 | 美商應用材料股份有限公司 | 半導體處理設備 |
EP3167493A4 (en) * | 2015-02-17 | 2017-10-04 | Sierra Solar Power (Hangzhou) Co., Ltd. | Method and system for improving solar cell manufacturing yield |
US20160359080A1 (en) | 2015-06-07 | 2016-12-08 | Solarcity Corporation | System, method and apparatus for chemical vapor deposition |
AT517532B1 (de) * | 2015-07-28 | 2017-06-15 | Bernecker + Rainer Industrie-Elektronik Ges M B H | Aufnahme |
US20170194181A1 (en) * | 2016-01-04 | 2017-07-06 | Micron Technology, Inc. | Overhead traveling vehicle, transportation system with the same, and method of operating the same |
CN105483619B (zh) * | 2016-01-26 | 2018-01-02 | 京东方科技集团股份有限公司 | 移动靶镀膜装置及镀膜方法 |
US9633878B1 (en) | 2016-04-21 | 2017-04-25 | Texas Instuments Incorporated | Conveyor apparatus and method for transporting leadframe |
US9748434B1 (en) | 2016-05-24 | 2017-08-29 | Tesla, Inc. | Systems, method and apparatus for curing conductive paste |
US9954136B2 (en) | 2016-08-03 | 2018-04-24 | Tesla, Inc. | Cassette optimized for an inline annealing system |
US10115856B2 (en) | 2016-10-31 | 2018-10-30 | Tesla, Inc. | System and method for curing conductive paste using induction heating |
US10014201B1 (en) | 2016-12-16 | 2018-07-03 | Solarcity Corporation | Magnetic wafer gripper |
WO2019208337A1 (ja) * | 2018-04-27 | 2019-10-31 | 東京エレクトロン株式会社 | 基板処理システム、および基板処理方法 |
KR101892129B1 (ko) * | 2018-05-25 | 2018-10-04 | 주식회사 디엠티 | 진공 챔버 이송 장치 |
CN109192687B (zh) * | 2018-08-16 | 2022-05-27 | 北京华卓精科科技股份有限公司 | 一种传输硅片的机械装置 |
KR102531483B1 (ko) * | 2018-10-04 | 2023-05-10 | 어플라이드 머티어리얼스, 인코포레이티드 | 이송 시스템 |
JP7261000B2 (ja) * | 2018-12-03 | 2023-04-19 | キヤノン株式会社 | 容器、処理装置、異物除去方法、および物品の製造方法 |
KR20210104134A (ko) * | 2018-12-21 | 2021-08-24 | 어플라이드 머티어리얼스, 인코포레이티드 | 자기 부상 시스템, 자기 부상 시스템을 위한 캐리어, 진공 시스템, 및 캐리어를 이송하는 방법 |
WO2020147929A1 (en) * | 2019-01-15 | 2020-07-23 | Applied Materials, Inc. | Transport system for transporting a carrier, vacuum processing system and method for transportation of a carrier |
WO2020167939A1 (en) * | 2019-02-14 | 2020-08-20 | Persimmon Technologies Corporation | Magnetically guided material handling robot |
EP3699953B1 (en) * | 2019-02-21 | 2024-08-21 | FEI Company | Transport apparatus and method for transferring a sample between two devices, and system for sample manipulation |
KR102211252B1 (ko) * | 2019-06-26 | 2021-02-04 | 세메스 주식회사 | 기판 처리 장치 |
US20220346294A1 (en) * | 2019-09-20 | 2022-10-27 | Fuji Corporation | Storage |
US11049740B1 (en) * | 2019-12-05 | 2021-06-29 | Applied Materials, Inc. | Reconfigurable mainframe with replaceable interface plate |
TW202137866A (zh) | 2020-02-20 | 2021-10-01 | 美商布魯克斯自動機械公司 | 基板處理裝置 |
KR102515863B1 (ko) | 2020-03-24 | 2023-03-31 | 주식회사 히타치하이테크 | 진공 처리 장치 |
US11521870B2 (en) | 2020-07-08 | 2022-12-06 | Applied Materials, Inc. | Annealing chamber |
DE102020212223A1 (de) * | 2020-09-29 | 2022-03-31 | Robert Bosch Gesellschaft mit beschränkter Haftung | Berührungslose Beförderungsvorrichtung |
JP2022142568A (ja) * | 2021-03-16 | 2022-09-30 | 東京エレクトロン株式会社 | 基板を処理する装置及び基板を搬送する方法 |
DE102021202915A1 (de) * | 2021-03-25 | 2022-09-29 | Robert Bosch Gesellschaft mit beschränkter Haftung | Berührungslose Beförderungsvorrichtung |
US20230085667A1 (en) * | 2021-09-22 | 2023-03-23 | Applied Materials, Inc. | Substrate transfer systems and methods of use thereof |
DE102021211428A1 (de) | 2021-10-11 | 2023-04-13 | Robert Bosch Gesellschaft mit beschränkter Haftung | Anlage zur Durchführung von Arbeitsprozessen an Werkstücken oder dgl. |
US20240153801A1 (en) * | 2022-11-07 | 2024-05-09 | Applied Materials, Inc. | Semiconductor process equipment |
Family Cites Families (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4604020A (en) * | 1984-03-26 | 1986-08-05 | Nanometrics Incorporated | Integrated circuit wafer handling system |
JPS6162739A (ja) * | 1984-09-03 | 1986-03-31 | Sanki Eng Co Ltd | クリ−ントンネル |
US4624617A (en) * | 1984-10-09 | 1986-11-25 | David Belna | Linear induction semiconductor wafer transportation apparatus |
US4826360A (en) * | 1986-03-10 | 1989-05-02 | Shimizu Construction Co., Ltd. | Transfer system in a clean room |
US4770590A (en) * | 1986-05-16 | 1988-09-13 | Silicon Valley Group, Inc. | Method and apparatus for transferring wafers between cassettes and a boat |
CA1271239A (en) * | 1986-12-26 | 1990-07-03 | Shunsuke Fujiwara | Levitation-propulsion mechanism for inductive repulsion type magnetically levitated railway |
US4805761A (en) * | 1987-07-14 | 1989-02-21 | Totsch John W | Magnetic conveyor system for transporting wafers |
US4913059A (en) * | 1988-02-25 | 1990-04-03 | Railway Technical Research Institute | Levitation, propulsion and guidance mechanism for inductive repulsion-type magnetically levitated railway |
JPH0496204A (ja) * | 1990-08-06 | 1992-03-27 | Toshiba Corp | 超電導磁気浮上車の地上コイル |
US5180048A (en) * | 1990-10-12 | 1993-01-19 | Mitsubishi Jukogyo Kabushiki Kaisha | Magnetic levitating transportation system |
US20020040657A1 (en) * | 1990-10-23 | 2002-04-11 | Kent Davey | Pulsed linear induction motors for Maglev applications |
US5215420A (en) * | 1991-09-20 | 1993-06-01 | Intevac, Inc. | Substrate handling and processing system |
JP2867194B2 (ja) | 1992-02-05 | 1999-03-08 | 東京エレクトロン株式会社 | 処理装置及び処理方法 |
JP3030160B2 (ja) | 1992-04-28 | 2000-04-10 | 東京エレクトロン株式会社 | 真空処理装置 |
KR100230694B1 (ko) * | 1992-05-18 | 1999-11-15 | 다카시마 히로시 | 기판세정처리장치 |
KR940006241A (ko) | 1992-06-05 | 1994-03-23 | 이노우에 아키라 | 기판이재장치 및 이재방법 |
JPH07508617A (ja) * | 1992-06-26 | 1995-09-21 | マティリアルズ リサーチ コーポレイション | ウエハ処理工程ラインのための輸送装置 |
DE69316214T2 (de) * | 1992-07-07 | 1998-08-13 | Ebara Corp | Durch magnetische wirkung schwebende transportvorrichtung |
JP3251654B2 (ja) * | 1992-08-25 | 2002-01-28 | 株式会社東芝 | 磁気力により物体を浮上及び案内するシステム |
US5417537A (en) * | 1993-05-07 | 1995-05-23 | Miller; Kenneth C. | Wafer transport device |
US5518542A (en) * | 1993-11-05 | 1996-05-21 | Tokyo Electron Limited | Double-sided substrate cleaning apparatus |
JPH0936198A (ja) * | 1995-07-19 | 1997-02-07 | Hitachi Ltd | 真空処理装置およびそれを用いた半導体製造ライン |
US5953591A (en) * | 1995-12-28 | 1999-09-14 | Nippon Sanso Corporation | Process for laser detection of gas and contaminants in a wafer transport gas tunnel |
US5746565A (en) * | 1996-01-22 | 1998-05-05 | Integrated Solutions, Inc. | Robotic wafer handler |
TW317644B (zh) * | 1996-01-26 | 1997-10-11 | Tokyo Electron Co Ltd | |
US6091498A (en) | 1996-07-15 | 2000-07-18 | Semitool, Inc. | Semiconductor processing apparatus having lift and tilt mechanism |
TW376542B (en) * | 1997-03-04 | 1999-12-11 | Canon Kk | Exposure unit, exposure system and device manufacturing method |
WO1999028952A2 (en) | 1997-11-28 | 1999-06-10 | Fortrend Engineering Corporation | Wafer-mapping load port interface |
US6155768A (en) * | 1998-01-30 | 2000-12-05 | Kensington Laboratories, Inc. | Multiple link robot arm system implemented with offset end effectors to provide extended reach and enhanced throughput |
JPH11220001A (ja) | 1998-01-30 | 1999-08-10 | Hitachi Ltd | 半導体基板処理装置におけるロードポート及びロードポート搬送台車 |
US6039316A (en) * | 1998-03-02 | 2000-03-21 | Xerox Corporation | Multi-hierarchical control system for controlling object motion with smart matter |
US7269475B1 (en) * | 1998-03-02 | 2007-09-11 | Xerox Corporation | Distributed control system with global contraints for controlling object motion with smart matter |
FR2778496B1 (fr) | 1998-05-05 | 2002-04-19 | Recif Sa | Procede et dispositif de changement de position d'une plaque de semi-conducteur |
US6517303B1 (en) * | 1998-05-20 | 2003-02-11 | Applied Komatsu Technology, Inc. | Substrate transfer shuttle |
US6206176B1 (en) * | 1998-05-20 | 2001-03-27 | Applied Komatsu Technology, Inc. | Substrate transfer shuttle having a magnetic drive |
US6142722A (en) | 1998-06-17 | 2000-11-07 | Genmark Automation, Inc. | Automated opening and closing of ultra clean storage containers |
US6281516B1 (en) | 1998-07-13 | 2001-08-28 | Newport Corporation | FIMS transport box load interface |
US6220808B1 (en) | 1998-07-13 | 2001-04-24 | Asyst Technologies, Inc. | Ergonomic, variable size, bottom opening system compatible with a vertical interface |
JP2000286318A (ja) * | 1999-01-27 | 2000-10-13 | Shinko Electric Co Ltd | 搬送システム |
JP2000294615A (ja) * | 1999-04-09 | 2000-10-20 | Miyagi Oki Electric Co Ltd | 搬送システムおよび搬送方法 |
JP4230642B2 (ja) * | 1999-07-08 | 2009-02-25 | 株式会社荏原製作所 | 基板搬送治具及び基板搬送装置 |
JP2001031211A (ja) | 1999-07-26 | 2001-02-06 | Murata Mach Ltd | 搬送システム |
AU6763000A (en) | 1999-08-11 | 2001-03-05 | Multilevel Metals, Inc. | Load lock system for foups |
US6305500B1 (en) | 1999-08-25 | 2001-10-23 | Maxtor Corporation | Material delivery system for clean room-like environments |
US6354781B1 (en) * | 1999-11-01 | 2002-03-12 | Chartered Semiconductor Manufacturing Company | Semiconductor manufacturing system |
US6298685B1 (en) * | 1999-11-03 | 2001-10-09 | Applied Materials, Inc. | Consecutive deposition system |
US6271606B1 (en) * | 1999-12-23 | 2001-08-07 | Nikon Corporation | Driving motors attached to a stage that are magnetically coupled through a chamber |
JP2002026108A (ja) * | 2000-07-12 | 2002-01-25 | Tokyo Electron Ltd | 被処理体の移載機構、処理システム及び移載機構の使用方法 |
US6629503B2 (en) * | 2001-06-29 | 2003-10-07 | The Regents Of The University Of California | Inductrack configuration |
US6824613B2 (en) * | 2002-05-30 | 2004-11-30 | Ebara Corporation | Substrate processing apparatus |
JP4767641B2 (ja) * | 2005-09-27 | 2011-09-07 | 大日本スクリーン製造株式会社 | 基板処理装置および基板搬送方法 |
-
2002
- 2002-08-30 CN CNA2007100079333A patent/CN1996553A/zh active Pending
- 2002-08-30 CN CN2007100079329A patent/CN1996552B/zh not_active Expired - Lifetime
- 2002-09-02 TW TW091119950A patent/TWI272665B/zh not_active IP Right Cessation
- 2002-09-03 CN CNB028193121A patent/CN1288714C/zh not_active Expired - Fee Related
- 2002-09-03 WO PCT/US2002/027979 patent/WO2003038869A2/en active Application Filing
- 2002-09-03 KR KR1020047003145A patent/KR20050026371A/ko not_active Application Discontinuation
- 2002-09-03 US US10/234,640 patent/US7293950B2/en not_active Expired - Lifetime
- 2002-09-03 JP JP2003541027A patent/JP2005508085A/ja active Pending
-
2007
- 2007-11-09 US US11/938,236 patent/US7841820B2/en not_active Expired - Fee Related
-
2010
- 2010-11-10 US US12/943,198 patent/US8851817B2/en not_active Expired - Lifetime
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CN106103011A (zh) * | 2014-01-17 | 2016-11-09 | 布鲁克斯自动化公司 | 衬底运输设备 |
US11273558B2 (en) | 2014-01-17 | 2022-03-15 | Brooks Automation Us, Llc | Substrate transport apparatus |
CN104894527A (zh) * | 2015-06-11 | 2015-09-09 | 科瑞自动化技术(苏州)有限公司 | 硬盘盘片真空溅射镀膜夹持工装 |
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CN115315795A (zh) * | 2020-03-20 | 2022-11-08 | 应用材料公司 | 基板传送***和基板传送***的使用方法 |
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CN112736000A (zh) * | 2020-12-31 | 2021-04-30 | 上海广川科技有限公司 | 一种真空传送装置及传送方法 |
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KR20050026371A (ko) | 2005-03-15 |
US20120213614A1 (en) | 2012-08-23 |
WO2003038869A9 (en) | 2004-02-26 |
CN1996553A (zh) | 2007-07-11 |
US8851817B2 (en) | 2014-10-07 |
TWI272665B (en) | 2007-02-01 |
US20030129045A1 (en) | 2003-07-10 |
CN1288714C (zh) | 2006-12-06 |
CN1996552A (zh) | 2007-07-11 |
US7293950B2 (en) | 2007-11-13 |
WO2003038869A3 (en) | 2003-11-27 |
US7841820B2 (en) | 2010-11-30 |
JP2005508085A (ja) | 2005-03-24 |
US20080101892A1 (en) | 2008-05-01 |
WO2003038869A2 (en) | 2003-05-08 |
CN1996552B (zh) | 2012-09-05 |
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