CN1485694A - Step-by-step projection photo-etching machine double set shifting exposure ultra-sophisticated positioning silicon chip bench system - Google Patents
Step-by-step projection photo-etching machine double set shifting exposure ultra-sophisticated positioning silicon chip bench system Download PDFInfo
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- CN1485694A CN1485694A CNA031564364A CN03156436A CN1485694A CN 1485694 A CN1485694 A CN 1485694A CN A031564364 A CNA031564364 A CN A031564364A CN 03156436 A CN03156436 A CN 03156436A CN 1485694 A CN1485694 A CN 1485694A
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 107
- 239000010703 silicon Substances 0.000 title claims abstract description 107
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 103
- 238000001259 photo etching Methods 0.000 title abstract description 8
- 230000033001 locomotion Effects 0.000 claims description 38
- 230000036316 preload Effects 0.000 claims description 11
- 230000008859 change Effects 0.000 claims description 5
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- 230000008569 process Effects 0.000 description 8
- 230000002146 bilateral effect Effects 0.000 description 6
- 238000009434 installation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000007781 pre-processing Methods 0.000 description 2
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- 230000001684 chronic effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000004556 laser interferometry Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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Abstract
A step-by-step projection photo-etching machine double shift exposure ultra precise positioning silicon chip bench system, comprising a silicon chip bench positioning unit operating in the exposure station, and a silicon chip bench positioning unit operating in the preliminary treatment station, each positioning unit includes a silicon chip carrying device. The system can increase the exposure efficiency without the problem of overlapping and interference in the working space. It also realizes simplified structure, and high reliability and positioning precision.
Description
Technical field
The present invention relates to a kind of ultraprecise motion locating system that is used for silicon chip in photoetching process, this system both can be used for the sweep type litho machine, also can be used for the stepping type litho machine.
Background technology
In the production run of integrated circuit (IC) chip, the exposure transfer printing (photoetching) of the design configuration of chip on the silicon chip surface photoresist is one of most important operation wherein, and the used equipment of this operation is called litho machine (exposure machine).The resolution of litho machine and exposure efficiency affect the characteristic line breadth (resolution) and the throughput rate of integrated circuit (IC) chip greatly.And, determined the resolution and the exposure efficiency of litho machine again to a great extent as the kinematic accuracy and the work efficiency of the silicon chip ultraprecise motion locating system of litho machine chief component.
Litho machine can be divided into stepping type litho machine (STEPPER) and sweep type litho machine (SCANNER) according to the different motion form of its silicon chip motion locating system.The key distinction of the two is that the sweep type litho machine has the mask motion locating system that can carry out the large area scanning motion positions, and the stepping type litho machine does not have.Simultaneously, the characteristics of motion of the silicon chip motion locating system of the two when exposure is also different, the stepping type photo-etching machine silicon chip platform has only step motion, and the sweep type photo-etching machine silicon chip platform also carries out the scanning motion in the Chip except that the step motion that carries out between different chips (Chip).
With the sweep type litho machine that occupy main flow at present is example, and its ultimate principle as shown in Figure 1.From the laser of light source see through mask 47, diaphragm 48, lens 49 with a part of pattern imaging on the mask on certain Chip of silicon chip 50.Mask and silicon chip oppositely or in the same way are synchronized with the movement (as 4: 1 or 5: 1, deciding on the reduction magnification of lens) by certain speed proportional, and the whole pattern imagings on the mask are on the certain chip (Chip) of silicon chip the most at last.
The basic role of silicon chip motion locating system (abbreviate down silicon chip platform) is exactly to carry silicon chip and by speed of setting and direction motion, to realize the accurate transfer in mask pattern each zone on silicon chip in exposure process.Because the live width of chip very little (minimum feature has reached 90nm at present) for guaranteeing the alignment precision and the resolution of photoetching, just requires the silicon chip platform to have high motion positions precision; Because the movement velocity of silicon chip platform affects the throughput rate of photoetching to a great extent, from the angle of boosting productivity, requires the movement velocity of silicon chip platform to improve constantly again.
Traditional silicon chip platform, described as patent EP 0729073 and patent US 5996437, have only a silicon chip motion positions unit in the litho machine, i.e. a silicon chip platform.All to finish in the above such as preliminary work.Required chronic of these work particularly aimed at, because the high low-velocity scanning of precision (typical alignment scanning speed is 1mm/s) is carried out in its requirement, so required time is very long.And it is very difficult to reduce its working time.Like this, in order to improve the production efficiency of litho machine, just must improve constantly the movement velocity of the stepping and the exposure scanning of silicon chip platform.And the raising of speed will unavoidably cause the deterioration of dynamic performance, need take the kinematic accuracy of a large amount of technical measures guarantees and raising silicon chip platform.To improve greatly for keeping existing precision even reaching the cost that high precision more will pay.
Patent WO98/40791 (open date: 1998.9.17; Country origin: Holland) described structure adopts two silicon chip platform structures, and exposure preliminary works such as sheet, prealignment, aligning are transferred on second silicon chip platform up and down, and with the while self-movement of exposure silicon chip platform.Under the prerequisite that does not improve silicon chip platform movement velocity, a large amount of preliminary work of exposure silicon chip platform is shared by second silicon chip platform, thereby has shortened the every working time of silicon chip on exposure silicon chip platform greatly, has increased substantially production efficiency.
Yet also there are some problems in this pair of platform structure: the one, when two silicon chip platforms exchange, two silicon chip platforms will be in free state in one very short period, this can affect to the bearing accuracy of system undoubtedly, and will make structure complicated for addressing this problem.Two is that the range of movement of two silicon chip platforms exists the overlapping region, and this can cause two platforms to bump in motion process, and its consequence will be catastrophic.Just must increase anticollision control device and pick-up unit for this reason, equally also can make complex system, reliability also can descend.The 3rd, because the silicon chip platform inevitably can have the cable of One's name is legion, this structure will compare difficulty to the processing of cable in the process that realizes exchange.
Summary of the invention
The purpose of this invention is to provide the two chaptrels of a kind of stepping projection mask aligner and change exposure ultraprecise location silicon wafer stage system, it can make the exposure process of silicon chip and preprocessing process carry out simultaneously, and further simplied system structure improves reliability of operation and bearing accuracy.
Technical scheme of the present invention is as follows: the two chaptrels of a kind of stepping projection mask aligner change exposure ultraprecise location silicon wafer stage system, this system contains silicon chip platform positioning unit that runs on the exposure station and the silicon chip platform positioning unit that runs on the pre-service station, each silicon chip platform positioning unit contains the silicon chip bogey, described two silicon chip platform positioning units are arranged on the base station, it is characterized in that: be provided with confession silicon chip bogey and become the X of H type layout to line slideway to the double-side straight-line guide rail that docks that moves and exchange and with the double-side straight-line guide rail along Y on described base station; Linear electric motors and air-bearing all are equipped with in the two ends of described double-side straight-line guide rail, can make the friction free step motion to guide rail along X, and its bottom surface also is supported on the upper surface of described base station by air-bearing; Two silicon chip bogeys are separately positioned on the both sides of double-side straight-line guide rail, and link with the double-side straight-line guide rail by linear electric motors and air-bearing.
Technical characterictic of the present invention also is: be provided with a bridge-set that can the time play bridging functionality for the exchange of silicon chip bogey on base station, this device is made up of the air supporting guide pin bushing, bridging board and the drive unit that are arranged in the base station central slot.
Each silicon chip bogey of the present invention is equipped with a cable stage respectively, each cable stage by Y to guide rail, Y to slide block, be arranged on the X of Y in slide block and form to drive unit to drive unit and X to slide block, Y; X links to each other to the cable of slide block with the silicon chip bogey.
Drive unit in the bridge-set of the present invention adopts friction pulley or air cylinder driven.
Air-bearing described in the present invention adopts the air-bearing or the permanent magnetism preload air-bearing of vacuum preload.
The drive unit of cable stage can adopt linear motor driving, the air-float guide rail guiding, and striated pattern is as position feedback; Or adopt the spherical guide guiding, rotating servo motor drives, ball-screw or be with transmission synchronously, by the circle grating as position feedback.
The present invention also all is equipped with the striated pattern that is used for silicon chip platform positioning unit position feedback at the X of base station on the spigot surface of line slideway and each double-side straight-line guide rail.
The present invention also comprises the two-frequency laser interferometer that is used for silicon chip positioning unit position feedback.
The present invention compared with prior art, have the following advantages and the high-lighting effect: two chaptrels proposed by the invention change exposure silicon chip ultraprecise motion locating system owing to adopted the concurrent working principle, make the exposure process and the preprocessing process of silicon chip carry out simultaneously, can under the prerequisite of movement velocity that keeps existing separate unit exposure silicon chip motion locating system and acceleration, promote exposure efficiency significantly; This pair platform structure does not exist overlapping on work space, thereby can not interfere, and needn't adopt extra crash protection device, has reduced the complexity of system, has improved reliability.The present invention has simultaneously adopted the cable stage structure, effectively reduces the harmful effect to the system motion bearing accuracy that the cable distortion causes.
Description of drawings
Fig. 1 a, 1b are the principle of work of litho machine.
Fig. 2 is the shaft side figure that waits of total system.
Fig. 3 has represented that system is in the situation of swap status.
Fig. 4 is the duty of silicon chip bogey exchange back system.
Fig. 5, Fig. 6 have represented that Y is to the structure that can dock double-side straight-line guide rail, silicon chip bogey and cable stage.
Fig. 7 is the structural representation of bridge-set.
Fig. 8 is the structure of the space mounting position of laser interferometer.
Among the figure: the 1-base station;
Exposure station on the 2-base station;
Pre-service station on the 3-base station;
4, the 5-bilateral can dock line slideway;
6,7-silicon chip bogey;
Spigot surface on the 8a-exposure station;
Spigot surface on the 8b-pre-service station;
9a, 9b-cable stage (comprise cable, guide rail, X to slide block and Y to slide block);
10a, 10b-bridge-set (comprising bridging board, air supporting guide pin bushing and drive unit);
11a, 11b, 12a, 12b-bilateral can dock be used on the line slideway unit drive the silicon chip bogey along Y to the linear electric motors that move;
13a, 13b, 14a, 14b-bilateral can dock be used on the line slideway unit drive self along X to the linear electric motors that move;
15a, 15b, 16a, 16b-bilateral can dock be used on the line slideway unit silicon chip bogey along Y to the line slideway face that moves;
17, the air-bearing of 18-silicon chip bogey side installation;
19, the air-bearing of 20-silicon chip bogey bottom surface installation;
21, the 22-bilateral can dock the air-bearing that install bottom surface, line slideway unit;
23a, 23b-exposure is installed on the station is used for bilateral and can docks the line slideway that line slideway 4 moves along directions X;
That installs on 24a, the 24b-pre-service station is used for bilateral and can docks the line slideway that line slideway 5 moves along directions X;
25a, 25b, 26a, 26b-bilateral can dock the air-bearing of installing on the line slideway;
27a, 27b, 28a, 28b-bilateral can dock the striated pattern of installing on the line slideway that Y detects to movement position that is used for;
That installs on the 29-exposure station is used for bilateral and can docks the striated pattern that line slideway 4 detects to movement position along X;
That installs on the 30-pre-service station is used for bilateral and can docks the striated pattern that line slideway 4 detects to movement position along X;
31a, 31b-cable; 32a, 32b-cable stage X are to slide block; 33a, 33b-cable stage Y are to slide block;
34a, 34b-cable stage Y are to guide rail; The drive unit of 35a, 35b, 38a, 38b-bridge-set;
36,40-bridging board; 37,39-air supporting guide pin bushing; 41,42,43,44,45,46-two-frequency laser interferometer
The 47-mask; The 48-diaphragm; The 49-lens; The 50-silicon chip; The groove at 51-base station middle part
52a, 52b-boss.
Embodiment
Fig. 2 has shown the state of total system when work.This moment, bilateral can dock line slideway 4,5 and silicon chip bogey 6,7 are finished setting together respectively at exposure station and silicon chip pre-service station action, and bridge- set 10a, 10b are in non-bridge joint position, can not interfere with the line slideway unit.Cable stage 9a, 9b are driven by its drive unit, make the cable on the silicon chip bogey keep being synchronized with the movement with the silicon chip bogey.
Fig. 3 has shown the sight of system works when swap status.At first bilateral can dock line slideway unit 4,5 and silicon chip bogey 6,7 enters switch P together
1, P
2, at this moment, double-side straight-line guide rail 4,5 accurately docks.Bridge-set is driven by its drive unit and enters the bridge joint position along the X-direction move toward one another then. Silicon chip bogey 6,7 is by Y the opposite side move toward one another to double-side straight-line rail unit on of linear motor driving in butt joint afterwards, silicon chip bogey 7 moves to the exposure station by the pre-service station, silicon chip bogey 6 moves to the pre-service station by the exposure station, thereby realizes the exchange of silicon chip bogey with respect to exposure station and pre-service station.Exchange back bridge- set 10a, 10b move dorsad along directions X and withdraw the bridge joint position, and at this moment the silicon chip bogey again can be by the action operation of setting, and new working cycle begins.Fig. 4 is the duty of silicon chip bogey exchange back system.
Fig. 5,6 has shown that Y is to the mutual relationship that can dock between double-side straight-line guide rail 4,5, silicon chip bogey 6,7 and exposure station and the pre-service station.The lower surface of silicon chip bogey 6,7 is equipped with the air-bearing 19,20 of vacuum preload, by air bearings support on spigot surface 8a, the 8b of exposure station and pre-service station (as shown in Figure 2), and can be along x, y direction frictionless motion.The side of silicon chip bogey 6,7 also is supported on Y respectively on the side guide face 15a that can dock double-side straight-line guide rail 4,5,15b, 16a, 16b by vacuum preload air-bearing 17,18 simultaneously, and is driven along y to frictionless motion by linear electric motors 11a, 11b, 12a, 12b respectively.Double-side straight-line guide rail 4 is supported on guide rail 23a, the 23b of exposure station by vacuum preload air-bearing 21 and air-bearing 25a, the 25b of bottom surface, and is driven along x to frictionless motion by linear electric motors 13a, 13b; On guide rail 24a, the 24b that vacuum preload air-bearing 22 and air-bearing 26a, the 26b of line slideway unit 5 by the bottom surface is supported on the pre-service station, and drive along x to frictionless motion by linear electric motors 14a and 14b.
The top of two spigot surfaces of each the double-side straight-line guide rail described in the present invention all is equipped with the stator of linear electric motors, and Dui Ying linear motor rotor is installed in a side of silicon chip bogey with it; The mover of the linear electric motors at the two ends of each double-side straight-line guide rail is installed on the double-side straight-line guide rail, and Dui Ying stator is installed on the base station with it.
On exposure station and pre-service station, striated pattern 29,30 is installed, can be respectively as line slideway unit 4,5 along X to the position feedback device that moves.Striated pattern 27a, the 27b that installs on the line slideway unit 4,5, the position feedback device that 28a, 28b then move along the Y direction as the silicon chip bogey respectively.But when higher, then adopt double-frequency laser interferometry as feedback assembly to the requirement of precision.
All adopted the friction free air-bearing for reaching high position precision among the present invention, adopted the preload mode of vacuum preload as air bearing at some position, this mode also can be replaced by the permanent magnetism preload.
Structure of the present invention also can work in vacuum environment through simple adjustment, as the air-bearing that air bearing is replaced with magnetic suspension bearing or can work under vacuum.
Fig. 5 and Fig. 6 have also shown the working condition and the structure of cable stage.To slide block 32a, 32b, Y is to slide block 33a, 33b by X, cable 31a, 31b, and two cable stages that cable stage guide rail 34a, 34b form correspond respectively to silicon chip bogey 6 and 7, guarantee that cable is synchronized with the movement with the silicon chip bogey.Wherein, Y is installed in respectively on cable stage guide rail 34a, the 34b to slide block 33a, 33b, can be along Y to moving; X installs respectively at Y in slide block 33a, 33b to slide block 32a, 32b, can move along directions X; X links to each other with cable 31a, 31b to slide block 32a, 32b.Because the kinematic accuracy of cable stage is not high, but its drive scheme flexible configuration.Can adopt linear motor driving, the air-float guide rail guiding, striated pattern is as position feedback; Also can adopt spherical guide guiding, rotating servo motor drives, ball-screw or be with transmission synchronously, by the circle grating as position feedback.
Fig. 7 has shown the structure of bridge-set.By bridging board 36,40, the two cover bridge-sets that air supporting guide pin bushing 37,39, friction drive device constitute lay respectively at the both sides of base station.Wherein air supporting guide pin bushing 37,39 is installed on the boss of base station central slot 51 both sides, and its effect is to provide motion guide for bridging board 36,40.Bridging board 36,40 is installed in the air supporting guide pin bushing 37,39; Friction drive device 35a, 35b, 38a, 38b also are installed in boss 52a, and on the 52b, its friction pulley is pressed on the both sides of bridging board.
When silicon chip bogey 6,7 was in running order, bridging board was positioned at non-bridge joint position, and as shown in Figure 2, when the silicon chip bogey was in swap status, bridging board then entered the bridge joint position, as shown in Figure 3.Friction drive device is to drive friction pulley drive axle fishplate bar by servomotor to seesaw, and also can adopt cylinder as driving element.
Fig. 8 has shown the installation site of the present invention when adopting two-frequency laser interferometer as position feedback.Because in litho machine, laser interferometer all is to be installed together with the optics system, isolate by isolation mounting physically with positioning system, so the locus of only expressing laser interferometer among this figure, do not relate to its installation form.This measurement scheme can be done six degree of freedom to the silicon chip bogey and measure.
Claims (8)
1. the two chaptrels of stepping projection mask aligner change exposure ultraprecise location silicon wafer stage system, this system contains silicon chip platform positioning unit that runs on the exposure station and the silicon chip platform positioning unit that runs on the pre-service station, each silicon chip platform positioning unit contains silicon chip bogey (6,7), described two silicon chip platform positioning units are arranged on the base station (1), it is characterized in that: be provided with on described base station for the silicon chip bogey along Y to the double-side straight-line guide rail (4 that docks that moves and exchange, 5) X that becomes H type layout and with the double-side straight-line guide rail is to line slideway (23a, 23b, 24a, 24b); Linear electric motors (13a, 13b, 14a, 14b) and air-bearing (25a, 25b, 26a, 26b) all are equipped with in the two ends of described double-side straight-line guide rail, can make the friction free step motion to guide rail along X, its bottom surface also is supported on the upper surface (8a, 8b) of described base station by air-bearing (19,20); Two silicon chip bogeys are separately positioned on the both sides of double-side straight-line guide rail, and link with the double-side straight-line guide rail by linear electric motors (11a, 11b, 12a, 12b) and air-bearing (17,18).
2. according to the described location of claim 1 silicon wafer stage system, it is characterized in that: be provided with the bridge-set (10a, 10b) that plays bridging functionality in the time of can exchanging for the silicon chip bogey on base station (1), this device is made up of the air supporting guide pin bushing (37,39), bridging board (36,40) and the drive unit (35a, 35b, 38a, 38b) that are arranged in the base station central slot (51).
3. according to claim 1 or 2 described location silicon wafer stage systems, it is characterized in that: described each silicon chip bogey (6,7) is equipped with a cable stage (9a, 9b) respectively, each cable stage by Y to guide rail (34a, 34b), Y to slide block (33a, 33b), be arranged on the X of Y in slide block and form to drive unit to drive unit and X to slide block (32a, 32b), Y; X links to each other to the cable of slide block with the silicon chip bogey.
4. according to the described location of claim 2 silicon wafer stage system, it is characterized in that: the drive unit in the described bridge-set adopts friction pulley or air cylinder driven.
5. according to the described location of claim 1 silicon wafer stage system, it is characterized in that: described air-bearing is the air-bearing or the permanent magnetism preload air-bearing of vacuum preload.
6. according to the described location of claim 3 silicon wafer stage system, it is characterized in that: the drive unit of cable stage adopts linear motor driving, the air-float guide rail guiding, and striated pattern is as position feedback; Or adopt the spherical guide guiding, rotating servo motor drives, ball-screw or be with transmission synchronously, by the circle grating as position feedback.
7. according to the described location of claim 1 silicon wafer stage system, it is characterized in that: the X at described base station all is equipped with the striated pattern (27a, 27b, 28a, 28b, 29,30) that is used for silicon chip platform positioning unit position feedback on the spigot surface (15a, 15b, 16a, 16b) of line slideway and each double-side straight-line guide rail.
8. according to claim 1 or 7 described location silicon wafer stage systems, it is characterized in that: this system also comprises the two-frequency laser interferometer (41,42,43,44,45,46) that is used for silicon chip positioning unit position feedback.
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| CN 03156436 CN1200321C (en) | 2003-08-29 | 2003-08-29 | Step-by-step projection photo-etching machine double set shifting exposure ultra-sophisticated positioning silicon chip bench system |
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| CN 03156436 CN1200321C (en) | 2003-08-29 | 2003-08-29 | Step-by-step projection photo-etching machine double set shifting exposure ultra-sophisticated positioning silicon chip bench system |
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