CN1461977A - Projection exposure device, position alignment device and position alignment method - Google Patents
Projection exposure device, position alignment device and position alignment method Download PDFInfo
- Publication number
- CN1461977A CN1461977A CN03123736A CN03123736A CN1461977A CN 1461977 A CN1461977 A CN 1461977A CN 03123736 A CN03123736 A CN 03123736A CN 03123736 A CN03123736 A CN 03123736A CN 1461977 A CN1461977 A CN 1461977A
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- mask
- mark
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7007—Alignment other than original with workpiece
- G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7019—Calibration
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7065—Production of alignment light, e.g. light source, control of coherence, polarization, pulse length, wavelength
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The present invention provides a projection aligner which permits exact alignment. When a mask mark 90 is illuminated by a UV light source 60 of a UV illuminator 6 in the state that a printed wiring board 76 is placed on a transfer stage 70, the image of the mask mark 90 is reflected by a UV reflecting surface mirror 10 through a half mirror 11, and is imaged to a charge coupled device(CCD) 30 further through a beam splitter 34 and an imaging lens 32 and the central coordinates thereof are measured by an image recognizer 2. Next, substrate marks 91 on the board 76 are illuminated by an IR ray source 50 of an IR illuminator 5 and the image thereof is formed on a CCD 40 through the mirror 10, the half mirror 11, the beam splitter 34, a reflecting mirror 43, an imaging lens 42, and a beam splitter 52. The alignment is performed by controlling a transfer mechanism 81 so as to match the central coordinates of the substrate marks 91 on the CCD 40 for IR rays to rotationally move the transfer stage 70 in X-Y directions and a theta direction.
Description
Technical field
The present invention relates to a kind of projection aligner and position alignment device and position alignment method.
Background technology
With draw on mask fixed pattern, burn attached (imprint) on the printed circuit board surface of photosensitive materials such as coating photoresist by exposure device, on printed circuit board (PCB), form the shadow etching method of pattern afterwards by etch process, be widely used in the various fields, printed circuit board (PCB) is also used recent exposure device manufacturing.
Projection aligner is the circuit pattern with mask, do projection exposure through optical systems such as projection exposure lens, by this pattern is used with the same or certain multiplying power of mask and drawn on printed circuit board (PCB), become known for the manufacturing of integrated circuit, try out manufacturing with these projection aligners recently in printed circuit board (PCB).
When doing exposure with exposure device, mask must be aimed at the position of printed circuit board (PCB), usually mask side and printed circuit board side both sides all dispose the mark that aligned position is used, position alignment mark on the mask is projected on the printed circuit board (PCB), with the position alignment mark on the printed circuit board (PCB), it is coincide by viewing microscope etc.At this moment, when the mark of projection print plate side, used exposure wavelength light, because the meeting of the photoresist on printed circuit board (PCB) sensitization, it is common using exposure wavelength light wavelength in addition.Usually only use ultraviolet ray as exposure wavelength, the mark projection is to use infrared ray.
But, on projection aligner, because the optical system via projection exposure lens that cooperate exposure wavelength etc. is done projection with the mark of mask, to use with the different wavelength light of exposure wavelength and do under the situation of projection, the image space of mark has the problem that can't be aligned to the tram to produce.Be head it off, must have and revise camera lens and do the device of position control that the problem that increases installation cost is arranged for revising camera lens.
Purpose of the present invention is for solving above-mentioned prior art problems.
Summary of the invention
For reaching above-mentioned purpose, the inventive system comprises: mask, described circuit pattern etc.; Platform, support are done the exposure object of exposure to the pattern of this mask; The position alignment device is used for adjusting position relation between described mask and the described exposure object by moving described mask or platform or the two; Optical projection system, the exposure that utilizes exposure wavelength that the pattern of this mask is amplified/dwindles with respect to exposure object; The mask mark is located on the described mask, is used for position alignment; The exposure object mark is located on the described exposure object, is used for position alignment; Mask mark light source is with the described mask mark of rayed of the wavelength identical with exposure wavelength; The object tag light source is used the described object tag of rayed with different second wavelength of exposure wavelength; Dismountable exposure wavelength reflecting body is located between this optical projection system and this exposure object, and the reflection and the light of the same wavelength of this exposure wavelength, and can make with different second wavelength light of exposure wavelength and see through; Mask mark camera is photographed to this mask mark by the light that this exposure wavelength reflecting body is reflected; The object tag camera is to being photographed by the object tag that light shone of this second wavelength that penetrates this exposure wavelength reflecting body; And control device, according to this mask mark and object tag of being photographed, this mask is aimed at exposure object by controlling this position alignment device.
In above structure, because by with the light of the same wavelength of exposure wavelength the mark of mask being done projection, can not produce the site error (distortion deviation) that produces by the projection exposure lens, the dislocation of image space etc.Therefore accurate position alignment becomes possibility.
And by being located at the light of exposure wavelength reflecting body reflection and the same wavelength of exposure wavelength between this projection optical system and this exposure object, owing to can't arrive exposure object, the evils of therefore not having the photoresist sensitization etc. of exposure object take place.
And, because this object tag is to use light-struck with the different wavelength of exposure wavelength,, or makes to see outside the position alignment mark to worsen and alleviated by what absorption that photoresist produced etc. caused by the sensitization of the photoresist of exposure object.
The present invention can also realize the photomask position alignment, and the mask position that wherein becomes the position alignment benchmark is aimed at the reference position of device.
And the present invention can be used as projection aligner, also can be used as the position alignment device.
Description of drawings
Fig. 1 represents the skeleton diagram of one of the present invention example.
Fig. 2 represents the part enlarged drawing of one of the present invention example.
Fig. 3 represents the part amplification key diagram of the action of one of the present invention example.
Fig. 4 represents in one of the present invention example, the position alignment key diagram of mark.
Fig. 5 represents in one of the present invention example, the position alignment key diagram of mark.
Embodiment
Below with reference to the accompanying drawings the present invention's example is done explanation.
Fig. 1 is the projection aligner for the manufacturing printed circuit board (PCB), and the printed circuit board (PCB) 76 that applies photoresist is arranged on the mobile platform 70, and is removable in XYZ and θ direction by the travel mechanism 81 that control device is controlled.
And control device 80 is not only controlled travel mechanism 81, and it is all to go back control device.
Describe the mask 75 of pattern such as exposure circuit, across projection exposure lens 71, be provided with in opposite directions with printed circuit board (PCB) 76, this adjustable positions is whole.By exposure from the ultraviolet ray of exposure light source 72, with the pattern of circuit etc. make projection amplify, dwindle with the multiplying power of the appointment of projection exposure lens 71 decisions or etc. doubly burning on printed circuit board (PCB) 76.
And mask 75 and printed circuit board (PCB) 76 are to be disposed at above-below direction among Fig. 1, but to this and indefinite, vice versa, or mask 75 also can with the configuration of printed circuit board (PCB) 76 vertical stand-ups.
And, also may printed circuit board (PCB) 76 do not move, but mask 75 moves, even may be that both are all mobile.
Mask mark 90 is located on the mask 75, and printed circuit board (PCB) 76 is provided with printed circuit board (PCB) mark 91.And mobile platform 70 is provided with platform mark 92.Thus, mask mark 90, printed circuit board (PCB) mark 91 and platform mark 92 are used to do position alignment.
Mark recognition device 1 has pattern recognition device 2, ultraviolet imaging viewing optical system 3, infrared imaging viewing optical system 4, infrared illumination device 5 and black light lamp 6.Black light lamp 6 has ultraviolet light source 60, condenser 61 and catoptron 62.Mask mark 90 parts are only shone in the ultraviolet ray of exposure wavelength, and the picture of mask mark 90 that will be shown in the 3rd figure by projection exposure lens 71 is reflected on the image planes 13 in mask with reflecting surface mirror 10 catoptric imagings.Being discerned of this mask mark 90 via ultraviolet imaging viewing optical system 3 and by pattern recognition device 2.Because this mask mark 90 is by the exposure wavelength imaging, can not produce the problem of image space dislocation.Again by the cause of ultraviolet reflection surface mirror 10 reflection, can be to the photoresist sensitization on the printed circuit board (PCB) 76 yet.
At its structure and effect, more detailed description can be done in the back.
On the other hand, the mark 91 of printed circuit board (PCB) 76 is by the infrared radiation from infrared illumination device 5, discerns via infrared imaging observing system 4 and by pattern recognition device 2.Because irradiates light is an infrared ray, the photoresist on the printed circuit board (PCB) 76 can sensitization.
The structure of this mark recognition device 1 is done more detailed description by Fig. 2 and Fig. 3.
Light from projection exposure lens 71 looks like to be reflected into image planes 13 by the mask that half-reflecting mirror 11 images in as shown in Figure 3 as imaging surface 12 or mask.Mask is the surface of mobile platform 70 or printed circuit board (PCB) 76 as imaging surface 12.This mask as imaging surface 12 above, be parallel to mobile platform 70 planes, ultraviolet reflection face mirror 10 is set, this ultraviolet reflection face mirror 10 is detachably maybe can be provided with advancing and retreat.Ultraviolet reflection face mirror 10 have make infrared penetration and ultraviolet reflection character.When having this ultraviolet reflection face mirror 10, do reflection from the ultraviolet ray of projection exposure lens 71 with ultraviolet reflection face mirror 10, the picture of mask mark 90 images in and is reflected on the image planes 13.
Ultraviolet reflection face mirror 10 is to be arranged in parallel apart from d as imaging surface 12 from mask.The picture that is reflected by this ultraviolet reflection face mirror 10 and mask of imaging looks like to be reflected into image planes 13, the surface from ultraviolet reflection face mirror 10 be arranged in parallel apart from d similarly.That is, the mask that mask looks like to be reflected into image planes 13 and has position relation apart from 2d, mask to look like to be reflected into image planes 13 as imaging surface 12 and mask similarly be by ultraviolet ray with imaging len 32, image in ultraviolet ray with the ultraviolet ray on the CCD30 as imaging surface 31.
Revise mirror 33 and keep making mask to look like to be reflected into image planes 13 and mask being fit to the effect of imaging surface 31, and constitute by single or multiple lens as imaging surface 12.This correction mirror 33 also is detachably maybe can advance and retreat, and position that must corresponding icon is inserted and constituted.
This mask mark 90 similarly be from half-reflecting mirror 11, by spectroscope 34, via revising mirror 33, imaging len 32, image on the imaging surface 31 of CCD30 again, this picture signal is by pattern recognition device 2 identifications.
Half-reflecting mirror 11 is served as reasons influences the half-reflecting mirror that the little member of imaging degree is made, and makes the light penetration of projection exposure lens 71, and will import spectroscope 34 with the light of ultraviolet reflection face mirror 10 reflections.Spectroscope 34 is the light paths of separating ultraviolet ray picture and infrared ray picture, and ultraviolet ray is looked like to reflex to ultraviolet viewing optical system 3 sides, and infrared ray then penetrates and infrared ray viewing optical system 4 sides that arrive.
With the ultraviolet ray of spectroscope 34 reflection, behind the correction mirror 33 of revising usefulness via this focal position and the imaging len 32 of ultraviolet usefulness, image on the imaging surface 31 of CCD30, mask mark 90 is by pattern recognition device 2 identifications, and stores its position.
Infrared ray is done explanation as viewing optical system 4.
Infrared ray is the marks 91 that are used to discern on the printed circuit board (PCB) 76 as viewing optical system 4, comprises CCD40 and imaging len 42 and catoptron 43.The infrared ray of infrared illumination device 5, radiates via condenser 51 from the infrared light of infrared light sources 50 between CCD40 and imaging len 42 with spectroscope 52.
Using spectroscope 52 to roll on the direction of imaging len 42 from the infrared light of infrared light sources 50 bends, again via catoptron 43, spectroscope 34, catoptron 43 and imaging len 42, behind spectroscope 52, shines on printed circuit board (PCB) mark 91.The picture of this printed circuit board (PCB) mark 91, via half-reflecting mirror 11, spectroscope 34, catoptron 43 and imaging len 42, and by on the imaging surface 41 that images in CCD40 behind the spectroscope 52.This printed circuit board (PCB) mark 91 is also discerned by pattern recognition device 2, and stores its position.
From the above mentioned, under the state that ultraviolet reflection face mirror 10 inserts, mask is the relation of optical conjugate as the imaging surface 41 of imaging surface 12 and infrared ray picture.
And the mark recognition device 1 of above-mentioned structure corresponding to the quantity of mask mark 90 with printed circuit board (PCB) mark 91 and platform mark 92, can suitably increase and decrease.
Fig. 4 is the amplification module figure of one of mask mark 90 on mask 75 and this mask 75 example.In this example, adding mask 75 is after 90s with the mask mark that the position alignment of printed circuit board (PCB) 76 is used, and to the position alignment of mask 75 with mobile platform 70, that is, is provided with the reference position to mutatis mutandis mask mark 90.By this, this mark in fact is, corresponding circuits drafting department 78, the thing of very little, several millimeters angles.In this, figure marks the shape of this mark circularly again, and this shape is as long as be suitable for doing position finding by image recognition, Any shape all can, and indefinite.
Fig. 5 is that modular figure is in the configuration of being located at the mark of mobile platform 70 sides.The 5th figure does the plural number exposure with big printed circuit board (PCB) 76 same circuit patterns, and burns attached and moulding.On the mobile platform 70, be provided with the platform mark 92 that a pair of or plural right platform datum position alignment is used, and become the benchmark of position alignment.Platform mark 92 is to be depicted in figure on the printed circuit board (PCB) 76.In fact, the obstacle when this platform mark 92 can not become printed circuit board (PCB) 76 and is assemblied on the mobile platform 70, and be located on the mobile platform 70.
And printed circuit board (PCB) mark 91 is formed at by last technology and is burnt in the attached circuit pattern portion 78.
And 80 pairs of mark recognition devices of this control device 1 are all done control with exposure device.
Its action of explanation now.
The order that the mask reference position is aimed at first is described.
At first mobile platform 70 is disposed on the predetermined reference position.
Next lights the ultraviolet light source 60 of black light lamp 6, irradiation platform mark 92.At this moment, except that ultraviolet reflection surface mirror 10, insert and revise lens 33.Thus, platform mark 92 images on the imaging surface 31 of CCD30 by behind the imaging len 32.The heart among its summary is concerned by platform mark 92 decision mark recognition devices 1 position all and mobile platform 70.The imaging of CCD30 is by recognition device 2 identifications.
It is inferior to this state, and the infrared light sources 50 of conducting infrared illumination device 5 behind the insertion ultraviolet reflection face mirror 10, is done illumination to platform mark 92, by imaging len 42, images on the imaging surface 41 of CCD40.At this state, after pattern recognition device 2 identification, the ultraviolet ray picture of the platform mark 92 that images in CCD30 and CCD40 is stored respectively with each centre coordinate of infrared ray picture.This is the ultraviolet ray picture that makes platform mark 92 and each centre coordinate of infrared ray picture reaches identical in pattern recognition device 2, will be disposed on the reference position as the mask 75 of benchmark, and realizes the location of circuit pattern.
Secondly, revise beyond the lens 33, under the state after inserting ultraviolet reflection face mirror 10, light the ultraviolet light source 60 of black light lamp 6, and with ultraviolet ray irradiation mask mark 90.Is that catoptric imaging looks like to be reflected on the image planes 13 in mask by projection exposure lens 71 with ultraviolet reflection face mirror 10 mask marks 90, makes this picture by imaging len 32, images on the imaging surface of CCD30.Do instrumentation via pattern recognition device 2, its center position coordinates and the centre coordinate that is stored in the platform mark 92 of leading portion are matched, adjust the position of mask 75 by this.Thus, mask 75 is arranged at the position of benchmark corresponding to platform 70.
By above result, the centre coordinate of platform mark 92 is taken in the CCD30 of mark recognition device 1 and CCD40, be stored in pattern recognition device 2, also make mask mark 90 also be fit to platform mark 92, this mobile platform 70 of the determining positions of mask 75 is with as benchmark.
Secondly, at the order that the position cooperates, mask 75 and printed circuit board (PCB) 76 are done explanation.
At first, printed circuit board (PCB) 76 places under the state on the mobile platform 70, ultraviolet light source 60 irradiation mask marks 90 by black light lamp 6, the picture of mask mark 90 is by projection exposure lens 71, half-reflecting mirror 11, in 10 reflections of ultraviolet reflection face, image on the CCD30 by spectroscope 34 and imaging len 32 again.Therefore the picture of this mask mark 90 does not have the location dislocation that mobile platform 70 is caused owing to be the cause that is formed by exposure wavelength light.Do instrumentation by the centre coordinate that 2 pairs of pattern recognition devices should picture.
Secondly, mark 91 on the printed circuit board (PCB) 76 is by infrared illumination light source 50 illuminations of infrared illumination device 5, and this picture images on the CCD40 by ultraviolet reflection face mirror 10, half-reflecting mirror 11, spectroscope 34, catoptron 43, imaging len 42 and spectroscope 52.Because printed circuit board (PCB) mark 91 is by the infrared radiation different with exposure wavelength, the not sensitization of photoresist of printed circuit board (PCB) 76.Can't help photoresist again absorbs, and printed circuit board (PCB) mark 91 can not produce deterioration yet.
At this moment, because guaranteeing the CCD30 of mark recognition device 1 and the centre coordinate of CCD40 in advance coincide in pattern recognition device 2, centre coordinate for the last mask mark 90 of the CCD30 of ultraviolet ray usefulness, the centre coordinate of the printed circuit board (PCB) mark 91 on the CCD40 that infrared ray uses is coincide with it, after controlling travel mechanism 81, mobile platform 70 is moved in XY direction and the rotation of θ direction, realize position alignment.
After above explanation, projection aligner of the present invention has the effect that the exact position is aimed at.
Claims (10)
1. projection aligner comprises:
Mask has been described circuit pattern;
Platform, support are done the exposure object of exposure to the pattern of this mask;
The position alignment device is used for adjusting position relation between described mask and the described exposure object by moving described mask or platform or the two;
Optical projection system, the exposure that utilizes exposure wavelength that the pattern of this mask is amplified/dwindles with respect to exposure object;
The mask mark is located on the described mask, is used for position alignment;
The exposure object mark is located on the described exposure object, is used for position alignment;
Mask mark light source is with the described mask mark of rayed of the wavelength identical with exposure wavelength;
The object tag light source is used the described object tag of rayed with different second wavelength of exposure wavelength;
The exposure wavelength reflecting body is located between this optical projection system and this exposure object, and the reflection and the light of the same wavelength of this exposure wavelength, and can make with different second wavelength light of exposure wavelength and see through;
Mask mark camera is photographed to this mask mark by the light that this exposure wavelength reflecting body is reflected;
The object tag camera is to being photographed by the object tag that light shone of this second wavelength that penetrates this exposure wavelength reflecting body; And
Control device according to this mask mark and object tag of being photographed, is aimed at this mask by controlling this position alignment device with exposure object.
2. projection aligner according to claim 1, wherein this exposure wavelength reflecting body be arranged in parallel with this platform substantially.
3. projection aligner according to claim 1, wherein this exposure wavelength reflecting body is removably installed, and this projection aligner also comprises:
The platform mark is located on this platform, is used for position alignment; And
Be used under the situation that this exposure wavelength reflecting body is removed, the position of the image of the platform mark of obtain to utilize this mask mark light source respectively, taking by mask mark camera and utilize this object tag light source, the position of the image of the platform mark taken by the object tag camera.
4. as the projection aligner as described in the claim 3, it also comprises focus correction lens, and these lens removably are located between this platform mark and this platform mark camera, is used in the focus correction of taking between this platform mark phase.
5. position alignment device in projection aligner, this projection aligner comprises: mask, described circuit pattern etc.; Platform, support are done the exposure object of exposure to the pattern of this mask; The position alignment device is used for adjusting position relation between described mask and the described exposure object by moving described mask or platform or the two; Optical projection system, the exposure that utilizes exposure wavelength that the pattern of this mask is amplified/dwindles with respect to exposure object; The mask mark is located on the described mask, is used for position alignment; The exposure object mark is located on the described exposure object, is used for position alignment; This position alignment device comprises:
Mask mark light source is with the described mask mark of rayed of the wavelength identical with exposure wavelength;
The object tag light source is used the described object tag of rayed with different second wavelength of exposure wavelength;
The exposure wavelength reflecting body is located between this optical projection system and this exposure object, and the reflection and the light of the same wavelength of this exposure wavelength, and can make with different second wavelength light of exposure wavelength and see through;
Mask mark camera is photographed to this mask mark by the light that this exposure wavelength reflecting body is reflected;
The object tag camera is to being photographed by the object tag that light shone of this second wavelength that penetrates this exposure wavelength reflecting body; And
Control device according to this mask mark and object tag of being photographed, is aimed at this mask by controlling this position alignment device with exposure object.
6. as the position alignment device as described in the claim 5, wherein this exposure wavelength reflecting body is removably installed, and this position alignment device also comprises:
The platform mark is located on this platform, is used for position alignment; And
Be used under the situation that this exposure wavelength reflecting body is removed, the position of the image of the platform mark of obtain to utilize this mask mark light source respectively, taking by mask mark camera and utilize this object tag light source, the position of the image of the platform mark taken by the object tag camera.
7. as the position alignment device as described in the claim 5, wherein this exposure wavelength reflecting body be arranged in parallel with this platform substantially.
8. as the position alignment device as described in the claim 5, it also comprises focus correction lens, and these lens removably are located between this platform mark and this platform mark camera, is used in the focus correction of taking between this platform mark phase.
9. one kind is used for the method for mask and exposure object aligning is comprised the following steps: in the projection aligner as described in claim 3
According to the position of the image of this platform mark, the mask position that decision and this picture position have the assigned address relation;
Behind above-mentioned steps decision mask position, realize the position alignment between this mask and the exposure object.
10. a method of in the projection aligner as described in claim 3 mask and exposure object being aimed at comprises the following steps:
Take this platform mark by mask mark camera, be set to certain position relation by using the position relation between this platform of this image, mask mark filming apparatus and the object tag filming apparatus, and the position of storing this image;
Then, take this platform mark, and store this picture position by the object tag camera;
Mobile mask is to aim at one of described memory location of this mask mark and platform marking image.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP158614/2002 | 2002-05-31 | ||
| JP2002158614A JP3643572B2 (en) | 2002-05-31 | 2002-05-31 | Projection exposure apparatus and alignment apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1461977A true CN1461977A (en) | 2003-12-17 |
| CN1278190C CN1278190C (en) | 2006-10-04 |
Family
ID=29417242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031237363A Expired - Lifetime CN1278190C (en) | 2002-05-31 | 2003-05-20 | Projection exposure device, position alignment device and position alignment method |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6927854B2 (en) |
| EP (1) | EP1367447A3 (en) |
| JP (1) | JP3643572B2 (en) |
| KR (1) | KR20040002495A (en) |
| CN (1) | CN1278190C (en) |
| TW (1) | TW200307180A (en) |
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| US20070238027A1 (en) * | 2006-04-06 | 2007-10-11 | Han-Tung Hsu | Method for generating alignment marks and related masks thereof |
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| JP2014053510A (en) * | 2012-09-07 | 2014-03-20 | Toshiba Corp | End face processing method and end face processing device |
| US9304403B2 (en) * | 2013-01-02 | 2016-04-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for lithography alignment |
| CN105988305B (en) * | 2015-02-28 | 2018-03-02 | 上海微电子装备（集团）股份有限公司 | Wafer pre-alignment method |
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| JPH08264427A (en) * | 1995-03-23 | 1996-10-11 | Nikon Corp | Method and device for alignment |
| JP2994232B2 (en) * | 1995-07-28 | 1999-12-27 | ウシオ電機株式会社 | Mask-to-mask or mask-to-work alignment method and apparatus |
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- 2002-05-31 JP JP2002158614A patent/JP3643572B2/en not_active Expired - Lifetime
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- 2003-04-11 TW TW092108355A patent/TW200307180A/en not_active IP Right Cessation
- 2003-04-16 US US10/414,966 patent/US6927854B2/en not_active Expired - Lifetime
- 2003-04-17 KR KR1020030024336A patent/KR20040002495A/en not_active Application Discontinuation
- 2003-05-20 CN CNB031237363A patent/CN1278190C/en not_active Expired - Lifetime
- 2003-05-26 EP EP03011165A patent/EP1367447A3/en not_active Withdrawn
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| CN100440929C (en) * | 2006-11-30 | 2008-12-03 | 华南理工大学 | T-type double lens image acquisition apparatus for full-automatic stencil printing machine |
| CN100573337C (en) * | 2007-10-11 | 2009-12-23 | 上海微电子装备有限公司 | A kind of circle center locating method |
| US9366976B2 (en) | 2009-09-08 | 2016-06-14 | Carl Zeiss Smt Gmbh | Optical element with low surface figure deformation |
| CN102152608A (en) * | 2010-12-02 | 2011-08-17 | 杭州奥普特光学有限公司 | Lens pad printer with visual invisible mark |
| CN102152608B (en) * | 2010-12-02 | 2012-11-21 | 杭州奥普特光学有限公司 | Lens pad printer with visual invisible mark |
| CN102929111A (en) * | 2011-08-10 | 2013-02-13 | 无锡华润上华科技有限公司 | Developed photoresist layer aligning detection method |
| CN102929111B (en) * | 2011-08-10 | 2016-01-20 | 无锡华润上华科技有限公司 | The aligning detection method of the photoresist layer after a kind of development |
| TWI489573B (en) * | 2012-09-12 | 2015-06-21 | Motech Ind Inc | Detecting device |
| CN102865815A (en) * | 2012-09-24 | 2013-01-09 | 上海功源电子科技有限公司 | Novel positioning compensation method for PCB by single vision camera |
| CN102865815B (en) * | 2012-09-24 | 2015-01-07 | 上海功源电子科技有限公司 | Novel positioning compensation method for PCB by single vision camera |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1278190C (en) | 2006-10-04 |
| US20030224264A1 (en) | 2003-12-04 |
| JP2004004215A (en) | 2004-01-08 |
| KR20040002495A (en) | 2004-01-07 |
| EP1367447A2 (en) | 2003-12-03 |
| EP1367447A3 (en) | 2008-06-25 |
| TWI316649B (en) | 2009-11-01 |
| TW200307180A (en) | 2003-12-01 |
| JP3643572B2 (en) | 2005-04-27 |
| US6927854B2 (en) | 2005-08-09 |
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