CN1461517A - 压电振荡器及其制造方法 - Google Patents
压电振荡器及其制造方法 Download PDFInfo
- Publication number
- CN1461517A CN1461517A CN02801252A CN02801252A CN1461517A CN 1461517 A CN1461517 A CN 1461517A CN 02801252 A CN02801252 A CN 02801252A CN 02801252 A CN02801252 A CN 02801252A CN 1461517 A CN1461517 A CN 1461517A
- Authority
- CN
- China
- Prior art keywords
- wiring substrate
- aforementioned
- piezoelectric vibration
- piezoelectric
- cylindrical component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 34
- 239000000758 substrate Substances 0.000 claims description 230
- 239000002184 metal Substances 0.000 claims description 43
- 238000004519 manufacturing process Methods 0.000 claims description 23
- 238000007789 sealing Methods 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 13
- 230000005284 excitation Effects 0.000 claims description 3
- 230000010355 oscillation Effects 0.000 abstract description 11
- 239000010453 quartz Substances 0.000 abstract 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 3
- 239000013078 crystal Substances 0.000 description 65
- 239000000919 ceramic Substances 0.000 description 27
- 229910000679 solder Inorganic materials 0.000 description 19
- 239000000853 adhesive Substances 0.000 description 18
- 230000000994 depressogenic effect Effects 0.000 description 16
- 238000010422 painting Methods 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 11
- 230000000694 effects Effects 0.000 description 9
- 238000012545 processing Methods 0.000 description 9
- 238000001816 cooling Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000003292 diminished effect Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 239000010977 jade Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
- H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
- H03H9/0552—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the device and the other elements being mounted on opposite sides of a common substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10234—Metallic balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10242—Metallic cylinders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP119196/01 | 2001-04-18 | ||
JP119196/2001 | 2001-04-18 | ||
JP2001119196A JP4576741B2 (ja) | 2001-04-18 | 2001-04-18 | 圧電発振器 |
JP2001274632 | 2001-09-11 | ||
JP274632/2001 | 2001-09-11 | ||
JP274632/01 | 2001-09-11 | ||
JP355413/2001 | 2001-11-21 | ||
JP2001355413 | 2001-11-21 | ||
JP355413/01 | 2001-11-21 | ||
JP26018/02 | 2002-02-01 | ||
JP26018/2002 | 2002-02-01 | ||
JP2002026018A JP4045807B2 (ja) | 2001-09-11 | 2002-02-01 | 圧電発振器 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1461517A true CN1461517A (zh) | 2003-12-10 |
CN1295861C CN1295861C (zh) | 2007-01-17 |
Family
ID=27482214
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB028012526A Expired - Fee Related CN1295861C (zh) | 2001-04-18 | 2002-04-17 | 压电振荡器及其制造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7023288B2 (zh) |
EP (3) | EP2101551B1 (zh) |
KR (1) | KR100910781B1 (zh) |
CN (1) | CN1295861C (zh) |
DE (3) | DE60236790D1 (zh) |
ES (1) | ES2348024T3 (zh) |
WO (1) | WO2002087070A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103401523B (zh) * | 2007-12-06 | 2016-06-01 | 株式会社村田制作所 | 压电振动部件 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004242089A (ja) * | 2003-02-06 | 2004-08-26 | Murata Mfg Co Ltd | 水晶発振器およびそれを用いた電子装置 |
JP4244865B2 (ja) * | 2004-06-03 | 2009-03-25 | セイコーエプソン株式会社 | 圧電発振器および電子機器 |
JP2006245098A (ja) * | 2005-03-01 | 2006-09-14 | Seiko Epson Corp | 電子部品及びその製造方法、並びに電子機器 |
US7342308B2 (en) * | 2005-12-20 | 2008-03-11 | Atmel Corporation | Component stacking for integrated circuit electronic package |
US7821122B2 (en) | 2005-12-22 | 2010-10-26 | Atmel Corporation | Method and system for increasing circuitry interconnection and component capacity in a multi-component package |
JP4244053B2 (ja) * | 2006-06-16 | 2009-03-25 | エプソントヨコム株式会社 | 圧電デバイスを備えた電子モジュール |
NO326372B1 (no) * | 2006-09-21 | 2008-11-17 | Polight As | Polymerlinse |
KR100790750B1 (ko) * | 2006-12-06 | 2008-01-02 | 삼성전기주식회사 | 수정진동자 패키지 |
JP2009188633A (ja) * | 2008-02-05 | 2009-08-20 | Nippon Dempa Kogyo Co Ltd | 表面実装発振器 |
JP4788740B2 (ja) * | 2008-06-09 | 2011-10-05 | セイコーエプソン株式会社 | 圧電発振器、及びその製造方法、並びに圧電発振器を利用した携帯電話装置、電子機器 |
JP2013153412A (ja) * | 2011-12-27 | 2013-08-08 | Nippon Dempa Kogyo Co Ltd | 表面実装型圧電発振器 |
WO2013190749A1 (ja) * | 2012-06-19 | 2013-12-27 | 株式会社大真空 | 表面実装型圧電発振器 |
FI20125725L (fi) | 2012-06-26 | 2013-12-27 | Tellabs Oy | Mekaanisella suojauksella varustettu piirikorttijärjestely |
US9018753B2 (en) * | 2013-08-02 | 2015-04-28 | Stmicroelectronics Pte Ltd | Electronic modules |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5991719A (ja) * | 1982-11-17 | 1984-05-26 | Nippon Dempa Kogyo Co Ltd | 圧電振動子 |
JPH043609A (ja) | 1990-04-20 | 1992-01-08 | Victor Co Of Japan Ltd | 発振器 |
JPH0471019A (ja) | 1990-07-12 | 1992-03-05 | Brother Ind Ltd | データ処理装置 |
JPH0471019U (zh) * | 1990-10-31 | 1992-06-23 | ||
JP3128906B2 (ja) * | 1991-12-04 | 2001-01-29 | セイコーエプソン株式会社 | 圧電発振器 |
JPH06291551A (ja) * | 1993-03-31 | 1994-10-18 | Nippon Dempa Kogyo Co Ltd | 圧電発振器 |
JP3101175B2 (ja) | 1994-04-15 | 2000-10-23 | シチズン時計株式会社 | 水晶発振器 |
US5642265A (en) * | 1994-11-29 | 1997-06-24 | Sgs-Thomson Microelectronics, Inc. | Ball grid array package with detachable module |
JPH11343171A (ja) * | 1998-05-29 | 1999-12-14 | Murata Mfg Co Ltd | 圧電セラミック、圧電セラミックの製造方法、および圧電発振子 |
JPH11355047A (ja) * | 1998-06-08 | 1999-12-24 | Toyo Commun Equip Co Ltd | 圧電発振器 |
JP2000323927A (ja) | 1999-05-13 | 2000-11-24 | Toyo Commun Equip Co Ltd | 圧電発振器 |
JP2001016036A (ja) | 1999-06-29 | 2001-01-19 | Nippon Dempa Kogyo Co Ltd | 表面実装型の水晶発振器 |
JP4795602B2 (ja) * | 2000-01-31 | 2011-10-19 | 京セラキンセキ株式会社 | 発振器 |
KR20030055681A (ko) * | 2001-12-27 | 2003-07-04 | 삼성전기주식회사 | 온도보상형 수정발진기 및 그 제조방법 |
-
2002
- 2002-04-17 ES ES02764101T patent/ES2348024T3/es not_active Expired - Lifetime
- 2002-04-17 US US10/475,072 patent/US7023288B2/en not_active Expired - Lifetime
- 2002-04-17 DE DE60236790T patent/DE60236790D1/de not_active Expired - Lifetime
- 2002-04-17 CN CNB028012526A patent/CN1295861C/zh not_active Expired - Fee Related
- 2002-04-17 EP EP09164309A patent/EP2101551B1/en not_active Expired - Fee Related
- 2002-04-17 KR KR1020027015725A patent/KR100910781B1/ko not_active IP Right Cessation
- 2002-04-17 DE DE60238570T patent/DE60238570D1/de not_active Expired - Lifetime
- 2002-04-17 DE DE60238959T patent/DE60238959D1/de not_active Expired - Lifetime
- 2002-04-17 EP EP09164310A patent/EP2101406B1/en not_active Expired - Fee Related
- 2002-04-17 EP EP02764101A patent/EP1381151B1/en not_active Expired - Fee Related
- 2002-04-17 WO PCT/JP2002/003809 patent/WO2002087070A1/ja active Application Filing
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103401523B (zh) * | 2007-12-06 | 2016-06-01 | 株式会社村田制作所 | 压电振动部件 |
Also Published As
Publication number | Publication date |
---|---|
EP2101406B1 (en) | 2011-01-12 |
KR100910781B1 (ko) | 2009-08-04 |
DE60238959D1 (de) | 2011-02-24 |
EP1381151B1 (en) | 2010-06-23 |
EP2101551A1 (en) | 2009-09-16 |
CN1295861C (zh) | 2007-01-17 |
US7023288B2 (en) | 2006-04-04 |
ES2348024T3 (es) | 2010-11-26 |
EP1381151A1 (en) | 2004-01-14 |
US20040113708A1 (en) | 2004-06-17 |
EP2101551B1 (en) | 2010-12-08 |
EP2101406A1 (en) | 2009-09-16 |
DE60236790D1 (de) | 2010-08-05 |
WO2002087070A1 (fr) | 2002-10-31 |
EP1381151A4 (en) | 2008-02-06 |
DE60238570D1 (de) | 2011-01-20 |
KR20030013426A (ko) | 2003-02-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: EPSON TOYOCOM CORP. Free format text: FORMER NAME OR ADDRESS: TOYO COMMUNICATION EQUIPMENT CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: Tokyo, Japan, Japan Patentee after: Epson Toyocom Corp. Address before: Kanagawa Patentee before: Toyo Communication Equipment Co., Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: SEIKO EPSON CORP. Free format text: FORMER OWNER: EPSON TOYOCOM CORP. Effective date: 20120217 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20120217 Address after: Tokyo, Japan, Japan Patentee after: Seiko Epson Corp. Address before: Tokyo, Japan, Japan Patentee before: Epson Toyocom Corp. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070117 Termination date: 20190417 |
|
CF01 | Termination of patent right due to non-payment of annual fee |